PPS11001000G [TTELEC]
Metal Glaze Power Pack Surface Mount High Power Density Ceramic Package; 金属釉配电板表面贴装高功率密度陶瓷封装
| 型号： | PPS11001000G |
| 厂家： | 
TT Electronics |
| 描述： | Metal Glaze Power Pack Surface Mount High Power Density Ceramic Package |
| 文件： | 总2页 (文件大小：210K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Metal Glaze™ Power Pack
Surface Mount High Power
Density Ceramic Package
PPS-1 Series
• Low inductance
• 0.1Ω to 348KΩ range
• Superior surge handling capability
• 150°C maximum operating temperature
• 1 Watt performance - standard 2010 footprint
• Flameproof ceramic package provides superior temperature rise profile
Electrical Data
IRC
Type
Maximum
Power Rating
Working
Voltage¹
Maximum
Voltage
Resistance Range
(ohms)
Tolerance
(±%)²
TCR
(ppm/°C)²
Size
0.1 to 0.99
1.0 to 348K
1, 2, 5
1, 2, 5
100
2010
PPS-1
1W
350
700
50, 100
½
¹Not to exceed ( √ P x R ) . ²Consult factory for tighter tolerances and TCRs.
Applications
The PPS-1 will dissipate 1 watt at 70°C on a 2010 footprint. The PPS-1 is recommended for applications where
board real estate or component/board TCE mismatch is a major concern. It is also recommended in circuits
where a standard 2010 resistor exhibits marginal or unacceptable performance due to high power density/surge
handling demands.
Environmental Data
Characteristic
Maximum Change
Test Method
Thermal Shock
±(0.5% + 0.01 ohm)
±(0.25% + 0.01 ohm)
±(1.0% + 0.01 ohm)
±(0.5% + 0.01 ohm)
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
Low Temperature Operation
Short Time Overload
½
MIL-R-55342E Par 4.7.5 (2.5 x (PxR)
High Temperature Exposure
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board @ 260°C
for 10 seconds)
Resistance to Bonding Exposure
±(0.25% + 0.01 ohm)
Solderability
Moisture Resistance
Life Test
95% minimum coverage MIL-STD-202, Method 208 (245°C for 5 seconds)
±(0.5% + 0.01 ohm)
±(1.0% + 0.01 ohm)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip for 60
seconds
Terminal Adhesion Strength
Resistance to Board Bending
±(1% + 0.01 ohm)
±(1% + 0.01 ohm)
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
A subsidiary of
TT electronics plc
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
PPS-1 Series Issue December 2008 Sheet 1 of 2
Metal Glaze™ Power Pack
Surface Mount High Power
Density Ceramic Package
Physical Data (Inches and (mm))
Top View:
0.170 ± 0.010
(4.32 ± 0.25)
0.130 ± 0.005
(3.30 ± 0.13)
0.079 ± 0.006
(2.01 ± 0.15)
0.200 ± 0.010
(5.08 ± 0.25)
Side View:
0.105 ± 0.005
(2.67 ± 0.13)
0.130 ± 0.005
(3.30 ± 0.13)
Ordering Data
Sample Part No.
PPS1 100 1000
F
IRC Type
(PPS1)
Temperature Coefficient
Resistance Value
Tolerance
F = 1%, G = 2%, J = 5%
Wire and Film Technologies Division • 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
PPS-1 Series Issue December 2008 Sheet 2 of 2
相关型号：
©2020 ICPDF网 联系我们和版权申明