WBC-B0202AG-01-1002-C [TTELEC]

Wire Bondable Chip Resistors; 线可粘接贴片电阻


型号：	WBC-B0202AG-01-1002-C
厂家：	TT Electronics
描述：	Wire Bondable Chip Resistors 线可粘接贴片电阻
文件：	总3页 (文件大小：379K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

Wire Bondable

Chip Resistors

IRC Advanced Film Division

WBC Series

• Discrete or tapped schematics

• MIL inspection available

• High resistor density

IRC’s WBC series wire bondable chip resistors are ideally suited for

the most demanding hybrid application. The WBC combines IRC’s

TaNSil^®tantalum nitride thin ﬁlm technology with silicon substrate processing to produce an extremely small

footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil^®resistor ﬁlm.

Available in a wide range of tolerances and temperature coefﬁcients to ﬁt a variety of hybrid circuit applica-

tions. Custom resistance values, sizes and schematics are available on request from the factory.

Electrical Data

Physical Data

R0202 - Discrete

Absolute Tolerance

to ±0.1%

to ±25ppm/°C

250mW

Absolute TCR

Package Power Rating

(@ 70°C)

0.004˝ min bond pad size

Rated Operating Voltage

0.020˝ ±0.001

100V

-55°C to +150°C

<-30dB

(not to exceed P x R )

√

(0.508mm ±0.025)

Operating Temperature

Noise

B0202 - Discrete back contact

tact

Oxidized Silicon

(10KÅ SiO₂min)

Substrate Material

Top contact

pad chamfered

Top contact

0.004˝ min bond pad size

0.010˝ ±0.001

(0.254mm ±0.025)

Substrate Thickness

0.020˝ ±0.001

(0.508mm ±0.025)

Aluminum

10KÅ minimum

15KÅ minimum

T0303 - Tapped network ½R + ½R

Bond Pad

Metallization

Gold

R0202 and

Silicon

T0303

(Gold available)

Backside

Gold

3KÅ minimum

B0202

½R

Silicon Dioxide or

Silicon Nitride

Passivation

0.030˝ ±0.001

0.004˝ min bond pad size

(0.762mm ±0.025)

General Note

IRC reserves the right to make changes in product speciﬁcation without notice or liability.

All information is subject to IRC’s own data and is considered accurate at time of going to print.

A subsidiary of

TT electronics plc

• Corpus Christi Texas 78411 USA

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com

WBC Series Issue April 2006

Wire Bondable

Chip Resistors

IRC Advanced Film Division

Power Derating Data

TCR/Inspection Code Table

Commercial

MIL Inspection

Absolute TCR

Code

Code*

±300ppm/°C

±100ppm/°C

±50ppm/°C

±25ppm/°C

*Notes: Product supplied to Class H of MIL-PRF 38534 includes 100% visual inspection

Manufacturing Capabilities Data

Available Absolute

Resistance Range

Available Ratio

Tolerances (T0303 only)

Tracking TCR

Best Absolute TCR

Tolerances

(T0303 only)

±50ppm/°C

Ω

-20

Ω

21Ω−50Ω

G J K

F G J

±100ppm/°C

±50ppm/°C

F G J K

Ω

-100

Ω

101Ω−200Ω

C D F G J K

C D F G J

±25ppm/°C

±10ppm/°C

201

Ω−

500

Ω

501Ω-999Ω

1.0K

Ω

-1.0M

Ω

B C D F G J K

B C D F G J

A B C D F G J

±50ppm/°C

±25ppm/°C

±5ppm/°C

±2ppm/°C

WBC Series Issue April 2006

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com

Wire Bondable

Chip Resistors

IRC Advanced Film Division

Environmental Data

Method

Max ∆R

±0.1%

Typical ∆R

±0.02%

MIL-STD-202

Method 107

Test condition F

Thermal Shock

MIL-STD-883

Method 1008

High Temperature Exposure

Low Temperature Storage

Life

±0.05%

150°C, 1000 hours

-55°C, 1000 hours

±0.03%

±0.5%

±0.01%

±0.05%

MIL-STD-202

Method 108

70°C, 1000 hours

MIL-STD-202

Method 108

Life at Elevated Temperature

125°C, 1000 hours

Ordering Data

Preﬁx

WBC

RO2O2

1002

Style

R0202 = Discrete Element

B0202 = Discrete Element with Back Contact

T0303 = Tapped Network

Bonding pads

A = Aluminum; G = Gold

Backside

G = Gold; S = Silicon

TCR/Inspection Code

Reference TCR/Inspection Code Table

Total Resistance (R)

4-Digit Resistance Code Ex: 1002 = 10KΩ; 50R1 = 50.1Ω

Absolute Tolerance Code

K = ±10%; J = ±5%; G = ±2%; F = ±1%; D = ±0.5%; C = ±0.25%; B = ±0.1%

Ratio Tolerance Code (T0303 Only)

J = ±5%; G = ±2%; F = ±1%; D = 0.5%; C = ±0.25%; B = ±0.1%; A = ±0.05%

Packaging

Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your

specific requirements, please contact our Applications Team using the contact details below.

WBC Series Issue April 2006

Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com

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