WBC-T0303AG-01-1002-G

更新时间:2024-10-29 07:45:59
品牌:TTELEC
描述:Wire Bondable Chip Resistors

WBC-T0303AG-01-1002-G 概述

Wire Bondable Chip Resistors 线可粘接贴片电阻

WBC-T0303AG-01-1002-G 数据手册

通过下载WBC-T0303AG-01-1002-G数据手册来全面了解它。这个PDF文档包含了所有必要的细节,如产品概述、功能特性、引脚定义、引脚排列图等信息。

PDF下载
Wire Bondable  
Chip Resistors  
IRC Advanced Film Division  
WBC Series  
Discrete or tapped schematics  
MIL inspection available  
High resistor density  
IRC’s WBC series wire bondable chip resistors are ideally suited for  
the most demanding hybrid application. The WBC combines IRC’s  
TaNSil® tantalum nitride thin film technology with silicon substrate processing to produce an extremely small  
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil® resistor film.  
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-  
tions. Custom resistance values, sizes and schematics are available on request from the factory.  
Electrical Data  
Physical Data  
R0202 - Discrete  
Absolute Tolerance  
to ±0.1%  
to ±25ppm/°C  
250mW  
Absolute TCR  
R
Package Power Rating  
(@ 70°C)  
0.004˝ min bond pad size  
Rated Operating Voltage  
0.020˝ ±0.001  
100V  
-55°C to +150°C  
<-30dB  
(not to exceed P x R )  
(0.508mm ±0.025)  
Operating Temperature  
Noise  
B0202 - Discrete back contact  
tact  
Oxidized Silicon  
(10KÅ SiO2 min)  
R
Substrate Material  
Top contact  
pad chamfered  
Top contact  
0.004˝ min bond pad size  
0.010˝ ±0.001  
(0.254mm ±0.025)  
Substrate Thickness  
0.020˝ ±0.001  
(0.508mm ±0.025)  
Aluminum  
10KÅ minimum  
15KÅ minimum  
T0303 - Tapped network ½R + ½R  
Bond Pad  
Metallization  
Gold  
R0202 and  
Silicon  
T0303  
(Gold available)  
Backside  
Gold  
3KÅ minimum  
B0202  
½R  
½R  
Silicon Dioxide or  
Silicon Nitride  
Passivation  
0.030˝ ±0.001  
0.004˝ min bond pad size  
(0.762mm ±0.025)  
General Note  
IRC reserves the right to make changes in product specification without notice or liability.  
All information is subject to IRC’s own data and is considered accurate at time of going to print.  
A subsidiary of  
TT electronics plc  
Corpus Christi Texas 78411 USA  
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com  
© IRC Advanced Film Division  
WBC Series Issue April 2006  
Wire Bondable  
Chip Resistors  
IRC Advanced Film Division  
Power Derating Data  
TCR/Inspection Code Table  
Commercial  
MIL Inspection  
Absolute TCR  
Code  
Code*  
±300ppm/°C  
±100ppm/°C  
±50ppm/°C  
±25ppm/°C  
00  
01  
02  
03  
04  
05  
06  
07  
*Notes: Product supplied to Class H of MIL-PRF 38534 includes 100% visual inspection  
Manufacturing Capabilities Data  
Available Absolute  
Resistance Range  
Available Ratio  
Tolerances (T0303 only)  
Tracking TCR  
Best Absolute TCR  
Tolerances  
(T0303 only)  
±50ppm/°C  
±50ppm/°C  
10
-20
Ω  
21Ω−50Ω  
G J K  
F G J  
F G J  
±100ppm/°C  
±100ppm/°C  
±100ppm/°C  
±50ppm/°C  
F G J K  
51
-100
Ω  
101Ω−200Ω  
C D F G J K  
C D F G J K  
C D F G J  
C D F G J  
±25ppm/°C  
±10ppm/°C  
201
Ω−
500
Ω  
501-999Ω  
1.0K
-1.0M
Ω  
B C D F G J K  
B C D F G J K  
B C D F G J K  
B C D F G J  
B C D F G J  
A B C D F G J  
±50ppm/°C  
±25ppm/°C  
±25ppm/°C  
±5ppm/°C  
±2ppm/°C  
±2ppm/°C  
WBC Series Issue April 2006  
© IRC Advanced Film Division • Corpus Christi Texas 78411 USA  
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com  
Wire Bondable  
Chip Resistors  
IRC Advanced Film Division  
Environmental Data  
Method  
Max R  
±0.1%  
±0.1%  
Typical R  
±0.02%  
MIL-STD-202  
Method 107  
Test condition F  
Thermal Shock  
MIL-STD-883  
Method 1008  
High Temperature Exposure  
Low Temperature Storage  
Life  
±0.05%  
150°C, 1000 hours  
-55°C, 1000 hours  
±0.03%  
±0.5%  
±0.5%  
±0.01%  
±0.01%  
±0.05%  
MIL-STD-202  
Method 108  
70°C, 1000 hours  
MIL-STD-202  
Method 108  
Life at Elevated Temperature  
125°C, 1000 hours  
Ordering Data  
Prefix  
WBC  
-
RO2O2  
A
S
-
01  
-
1002  
-
F
B
Style  
R0202 = Discrete Element  
B0202 = Discrete Element with Back Contact  
T0303 = Tapped Network  
Bonding pads  
A = Aluminum; G = Gold  
Backside  
G = Gold; S = Silicon  
TCR/Inspection Code  
Reference TCR/Inspection Code Table  
Total Resistance (R)  
4-Digit Resistance Code Ex: 1002 = 10K; 50R1 = 50.1Ω  
Absolute Tolerance Code  
K = ±10%; J = ±5%; G = ±2%; F = ±1%; D = ±0.5%; C = ±0.25%; B = ±0.1%  
Ratio Tolerance Code (T0303 Only)  
J = ±5%; G = ±2%; F = ±1%; D = 0.5%; C = ±0.25%; B = ±0.1%; A = ±0.05%  
Packaging  
Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your  
specific requirements, please contact our Applications Team using the contact details below.  
WBC Series Issue April 2006  
© IRC Advanced Film Division • Corpus Christi Texas 78411 USA  
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Email: afdsales@irctt.com • Website: www.irctt.com  

WBC-T0303AG-01-1002-G 相关器件

型号 制造商 描述 价格 文档
WBC-T0303AG-01-1002-J TTELEC Wire Bondable Chip Resistors 获取价格
WBC-T0303AG-01-1002-K TTELEC Wire Bondable Chip Resistors 获取价格
WBC-T0303AS-01-1002-B TTELEC Wire Bondable Chip Resistors 获取价格
WBC-T0303AS-01-1002-C TTELEC Wire Bondable Chip Resistors 获取价格
WBC-T0303AS-01-1002-D TTELEC Wire Bondable Chip Resistors 获取价格
WBC-T0303AS-01-1002-F TTELEC Wire Bondable Chip Resistors 获取价格
WBC-T0303AS-01-1002-G TTELEC Wire Bondable Chip Resistors 获取价格
WBC-T0303AS-01-1002-J TTELEC Wire Bondable Chip Resistors 获取价格
WBC-T0303AS-01-1002-K TTELEC Wire Bondable Chip Resistors 获取价格
WBC-T0303CRAG-01-2004-GD TTELEC Wire Bondable High Range Chip Resistors 获取价格

WBC-T0303AG-01-1002-G 相关文章

  • HARTING(浩亭)圆形连接器产品选型手册
    2024-10-31
    6
  • HYCON(宏康科技)产品选型手册
    2024-10-31
    6
  • GREEGOO整流二极管和晶闸管产品选型手册
    2024-10-31
    7
  • 西门子豪掷106亿美元,战略收购工程软件巨头Altair
    2024-10-31
    8