WBCT0303AG0150R1CC [TTELEC]

Wire Bondable Chip Resistors;
WBCT0303AG0150R1CC
型号: WBCT0303AG0150R1CC
厂家: TT Electronics    TT Electronics
描述:

Wire Bondable Chip Resistors

文件: 总3页 (文件大小:359K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Resistors  
Wire Bondable  
Chip Resistors  
WBC Series  
ꢀ Discreteꢀorꢀtappedꢀschemaꢁcs  
ꢀ MILꢀinspecꢁonꢀavailable  
High resistor density  
AllꢀpartsꢀareꢀPb-freeꢀandꢀcomplyꢀwithꢀEUꢀDirecꢁveꢀ2011/65/EUꢀ(RoHS2)  
The WBC combines IRC’s TaNSil® tantalum nitride thin film technology with silicon substrate processing to  
produce an extremely small tantalum nitride thin film technology with silicon substrate processing to produce  
an extremely small footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil®  
resistor film.  
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-  
tions. Custom resistance values, sizes and schematics are available on request from the factory.  
Electrical Data  
Physical Data  
R0202 - Discrete  
Absolute Tolerance  
to ±±.ꢀ1  
to ±ꢁ2ppmꢂ/C  
ꢁ2±mW  
Absolute TCR  
R
Package Power Rating  
(@ 70°C)  
0.004˝ min bond pad size  
0.020˝ 0.001  
Rated Operating Voltage  
(0.508mm 0.025)  
ꢀ±±V  
-22/C to +ꢀ2±/C  
<-3±dB  
(not to exceed P x R )  
B0202 - Discrete back contact1  
Operating Temperature  
Noise  
Back contact  
R
Oxidized Silicon  
(ꢀ±KÅ SiOmin)  
Top contact  
pad chamfered  
Substrate Material  
Top contact  
0.004˝ min bond pad size  
0.020˝ 0.001  
±.±ꢀ±˝ ±±.±±ꢀ  
(±.ꢁ24mm ±±.±ꢁ2)  
(0.508mm 0.025)  
Substrate Thickness  
T0303 - Tapped network ½R + ½R  
Aluminum  
ꢀ±KÅ minimum  
ꢀ2KÅ minimum  
Bond Pad  
Metallization  
Gold1  
R±ꢁ±ꢁ and  
Silicon  
½R  
½R  
T±3±3  
(Al ꢂ Au optional)  
Backside  
3KÅ Au minimum  
ꢀ±KÅ Al minimum  
B±ꢁ±ꢁꢀ  
0.030˝ 0.001  
Silicon Dioxide or  
Silicon Nitride  
0.004˝ min bond pad size  
Passivation  
(0.762mm 0.025)  
Note 1: Not recommended for new designs  
General Note  
BI Technologies IRC Welwyn  
TT Electronics reserves the right to make changes in product specification without notice or liability.  
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.  
http://www.ttelectronics.com/resistors  
© TT Electronics plc  
05.17  
Wire Bondable  
Chip Resistors  
WBC Series  
Power Derating Data  
TCRmInspection Code Table  
Commercial  
Code  
MIL Inspection  
Absolute TCR  
Code*  
±±33ppꢀm/C  
±ꢁ33ppꢀm/C  
±53ppꢀm/C  
±25ppꢀm/C  
33  
3ꢁ  
32  
3±  
34  
35  
36  
37  
*Notes: Product supplied to Class H of MIL-PRF 38534 includes 100% visual inspection  
Manufacturing Capabilities Data  
AvailableꢀAbsꢀ  
Tolerances  
AvailableꢀRaꢁoꢀTolꢀ  
(T0303ꢀonly)  
BestꢀAbsoluteꢀ  
TCR  
TrackingꢀTCRꢀ  
(T0303ꢀonly)  
ResistanceꢀRangeꢀ  
Package  
10Ωꢀ-ꢀ20Ω  
21Ωꢀ-ꢀ50Ω  
0202ꢀonly  
G J K  
N/A  
+-100ppm/C  
+-100ppm/C  
+-100ppm/C  
+-50ppm/C  
+-50ppm/C  
+-25ppm/C  
+-25ppm/C  
+-25ppm/C  
N/A  
0202ꢀandꢀ0303  
0202ꢀandꢀ0303  
0202ꢀandꢀ0303  
0202ꢀandꢀ0303  
0202ꢀandꢀ0303  
0202ꢀandꢀ0303  
0303ꢀonly  
F G J K  
F G J  
+-50ppm/C  
+-25ppm/C  
+-10ppm/C  
+-5ppm/C  
+-2ppm/C  
+-2ppm/C  
+-2ppm/C  
51Ωꢀ-ꢀ100Ω  
C D F G J K  
C D F G J K  
B C D F G J K  
B C D F G J K  
B C D F G J K  
B C D F G J K  
C D F G J  
101Ωꢀ-ꢀ200Ω  
201Ωꢀ-ꢀ500Ω  
501Ωꢀ-ꢀ999Ω  
1.0KΩꢀ-ꢀ400KΩ  
401KΩꢀ-ꢀ800KΩ  
C D F G J  
B C D F G J  
B C D F G J  
A B C D F G J  
A B C D F G J  
General Note  
BI Technologies IRC Welwyn  
TT Electronics reserves the right to make changes in product specification without notice or liability.  
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.  
http://www.ttelectronics.com/resistors  
© TT Electronics plc  
05.17  
Wire Bondable  
Chip Resistors  
WBC Series  
Environmental Data  
Test  
Method  
Max  
R
Typical  
R
MIL-STD-202  
Method 107  
Thermal Shock  
0.1ꢀ  
0.02ꢀ  
Test condition F  
MIL-STD-883  
Method 1008  
150°C, 1000 hours  
HighTemperature Exposure  
LowTemperature Storage  
Life  
0.1ꢀ  
0.03ꢀ  
0.5ꢀ  
0.5ꢀ  
0.05ꢀ  
0.01ꢀ  
0.01ꢀ  
0.05ꢀ  
-55°C, 1000 hours  
MIL-STD-202  
Method 108  
70°C, 1000 hours  
MIL-STD-202  
Method 108  
Life at ElevatedTemperature  
125°C, 1000 hours  
Ordering Data  
WBC  
R0202  
A
S
01  
1002  
F
B
Prefix  
Style  
R0202 = Discrete Element  
B0202 = Discrete Element with Back Contact  
T0303 = Tapped Network  
1
Bonding pads  
1
A = Aluminum; G = Gold  
Backside  
A = Aluminum; G = Gold; S = Silicon  
TCR/Inspection Code  
Reference TCR/Inspection Code Table  
Total Resistance (R)  
4-Digit Resistance Code Ex: 1002 = 10K  
Ω
Ω
; 50R1 = 50.1  
AbsoluteTolerance Code  
K = 10ꢀ; J = 5ꢀ; G = 2ꢀ; F = 1ꢀ; D = 0.5ꢀ; C = 0.25ꢀ; B = 0.1ꢀ  
RatioTolerance Code (T0303 Only)  
J = 5ꢀ; G = 2ꢀ; F = 1ꢀ; D = 0.5ꢀ; C = 0.25ꢀ; B = 0.1ꢀ; A = 0.05ꢀ  
Packaging  
Standard packaging is 2˝ x 2˝ chip tray. For additional information or to discuss your  
specific requirements, please contact our Applications Team using the contact details below.  
Note 1: Not recommended for new designs  
General Note  
BI Technologies IRC Welwyn  
TT Electronics reserves the right to make changes in product specification without notice or liability.  
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.  
http://www.ttelectronics.com/resistors  
© TT Electronics plc  
05.17  

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