WBDDQSC-A-01-50R1-B-D [TTELEC]

Wire Bondable Resistor Network Arrays;
WBDDQSC-A-01-50R1-B-D
型号: WBDDQSC-A-01-50R1-B-D
厂家: TT Electronics    TT Electronics
描述:

Wire Bondable Resistor Network Arrays

文件: 总4页 (文件大小:484K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Resistors  
Wire Bondable  
Resistor Network Arrays  
Chip Network Array Series  
Absolute tolerances to ±0.1%  
Tight TCR tracking to ±5ppm/°C  
ꢀ Raꢁoꢀmatchꢀtolerancesꢀtoꢀ±0.05%  
Ultra-stable tantalum nitride resistors  
AllꢀpartsꢀareꢀPb-freeꢀandꢀcomplyꢀwithꢀEUꢀDirecꢁveꢀ2011/65/EUꢀ(RoHS2)  
IRC’s TaNSil®ꢀnetworkꢀarrayꢀresistorsꢀareꢀideallyꢀsuitedꢀforꢀapplicaꢁonsꢀthatꢀdemandꢀaꢀsmallꢀfootprint.ꢀTheꢀsmallꢀwireꢀbondableꢀchipꢀ  
package provides higher component density, lower resistor cost and high reliability.  
Theꢀtantalumꢀnitrideꢀfilmꢀsystemꢀonꢀsiliconꢀprovidesꢀprecisionꢀtolerance,ꢀexcepꢁonalꢀTCRꢀtrackingꢀandꢀlowꢀcost.  
Excellentꢀperformanceꢀinꢀharsh,ꢀhumidꢀenvironmentsꢀisꢀaꢀtrademarkꢀofꢀIRC’sꢀself-passivaꢁngꢀTaNSil®ꢀresistorꢀfilm.  
Forꢀapplicaꢁonsꢀrequiringꢀhighꢀperformanceꢀresistorꢀnetworksꢀinꢀaꢀlowꢀcost,ꢀwireꢀbondableꢀpackage,ꢀspecifyꢀIRC  
network array die.  
Electrical Data  
TCRmIns5ection Code Table  
Isolated  
Bussed  
Commercial  
Code  
MIL Inspection  
Code*  
Absolute TCR  
Resistance Range  
Absolute Tolerance  
Ratio Tolerance to R1  
Absolute TCR  
to 20ꢀMΩ  
to .02ꢀMΩ  
±ꢁ±±55pm/C  
±.±±55pm/C  
±ꢀ±55pm/C  
±2ꢀ55pm/C  
±±  
±.  
±2  
±ꢁ  
±4  
±ꢀ  
±6  
±7  
to ±±0.1  
to ±±0±ꢀ1  
to ±±0.1  
to ±2ꢀ55pm/C  
to ±ꢀ55pm/C  
.±±pW @ 7±/C ꢀ±pW @ 7±/C  
Tracking TCR  
Element Power Rating  
*Notes: Product supplied to Class H of MIL-PRF 38534 include 100% visual inspection  
8-Pad 4±±pW @ 7±/C  
.6-Pad 8±±pW @ 7±/C  
24-Pad .0±W @ 7±/C  
Package Power Rating  
Rated Operating Voltage  
Power Derating Data  
.±±V  
(not to exceed P x R)  
Operating Temperature  
-ꢀꢀ/C to +.ꢀ±/C  
<-ꢁ±dB  
Noise  
Substrate Material  
Oxidized Silicon (.±KÅ SiO2 pinipup)  
±0±.6˝ ±±0±±.  
(±04±6pp ±±0±.)  
Substrate Thickness  
Alupinup  
.±KÅ pinipup  
.ꢀKÅ pinipup  
Bond Pad  
Metallization  
Gold.  
Silicon  
Backside  
(gold available.)  
Passivation  
Silicon Dioxide or Silicon Nitride  
Note 1: Not recommended for new designs  
General Note  
BI Technologies IRC Welwyn  
TT Electronics reserves the right to make changes in product specification without notice or liability.  
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.  
http://www.ttelectronics.com/resistors  
© TT Electronics plc  
11.17  
Wire Bondable  
Resistor Network Arrays  
Chip Network Array Series  
Manufacturing Capabilities Data  
Isolated schematic A  
Bussed schematic B  
Absolute  
TCR  
(±ppm/°C)  
Best TCR  
tracking  
(±ppm/°C)  
Best TCR  
tracking  
(±ppm/°C)  
Ohmic  
range  
()  
Available  
ratio  
tolerances  
Ohmic  
range  
()  
Available  
Available  
Available  
tolerances  
ratio  
tolerances  
tolerances  
10 - 25  
26 - 50  
51 - 200  
F G J  
D F G J  
C D F G J  
F G  
50  
10  
5
10 - 25  
26 - 50  
F G J  
F G J  
F G  
200  
100  
50  
25  
20  
5
C D F  
D F G  
C D F G  
51 - 100  
101 - 200  
201 - 500  
D F G J  
D F G J  
C D F G  
B C D F G  
300  
201 - 2.5M B C D F G J A B C D F G  
5
B C D F G J B C D F G  
501 - 1.25M B C D F G J A B C D F G  
26 - 50  
D F G J  
C D F G  
C D F G  
A B F G  
10  
5
26 - 50  
51 - 100  
101 - 200  
201 - 500  
F G J  
D F G  
C D F G  
B C D F G  
100  
50  
25  
20  
5
51 - 200  
C D F G J  
D F G J  
D F G J  
100  
201 - 2.5M B C D F G J  
5
B C D F G J B C D F G  
501 - 350K B C D F G J A B C D F G  
26 - 50  
D F G J  
C D F G  
C D F G  
A B F G  
10  
5
51 - 100  
101 - 200  
201 - 500  
D F G J  
D F G J  
C D F G  
50  
25  
20  
51 - 200  
C D F G J  
B C D F G  
50  
25  
201 - 2.5M B C D F G J  
5
B C D F G J B C D F G  
501 - 1.25M B C D F G J A B C D F G  
201 - 500 B C D F G J B C D F G  
501 - 1.25M B C D F G J A B C D F G  
5
20  
5
51 - 200  
C D F G J  
C D F G  
A B F G  
5
5
201 - 2.5M B C D F G J  
General Note  
BI Technologies IRC Welwyn  
TT Electronics reserves the right to make changes in product specification without notice or liability.  
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.  
http://www.ttelectronics.com/resistors  
© TT Electronics plc  
11.17  
Wire Bondable  
Resistor Network Arrays  
Chip Network Array Series  
Physical Data  
DSS4A  
DSS4X  
8
7
6
5
0.070˝ ±0.001  
(1.778mm ±0.025)  
R1  
1
8
2
3
4
5
DSS4B  
7
6
Pad 1  
R1  
0.004˝ min Bond Pads  
1
2
3
4
DSS8X  
DSS8A  
0.140˝ ±0.001  
(3.556mm ±0.025)  
16  
15  
14  
13  
12  
11  
10  
9
R1  
1
2
3
4
5
6
7
8
9
DSS8B  
16  
15  
14  
13  
12  
11  
10  
0.004˝ min Bond Pads  
R1  
1
2
3
4
5
6
7
8
General Note  
BI Technologies IRC Welwyn  
TT Electronics reserves the right to make changes in product specification without notice or liability.  
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.  
http://www.ttelectronics.com/resistors  
© TT Electronics plc  
11.17  
Wire Bondable  
Resistor Network Arrays  
Chip Network Array Series  
Physical Data  
DQSCX  
DQSCA  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
0.115˝ ±0.001  
(2.921mm ±0.025)  
R1  
1
2
3
4
5
6
7
8
9
10  
15  
11  
14  
12  
13  
DQSCB  
24  
23  
22  
21  
20  
19  
18  
17  
16  
Pad 1  
R1  
0.004˝ min Bond Pads  
1
2
3
4
5
6
7
8
9
10  
11  
12  
Environmental Data  
Ordering Data  
Prefix  
WBD DSS8 - B - 01 - 1002 - F - B  
Style  
Test  
Method  
Max R Typical R  
DSS4 = 8-pad Network  
DSS8 = 6-pad Network  
DQSC = 24-pad Network  
MIL-STD-202  
Method 107  
Test condition F  
Schematic and Termination  
Thermal Shock  
±0.1%  
±0.1%  
±0.03%  
±0.5%  
±0.5%  
±0.02%  
±0.05%  
±0.01%  
±0.01%  
±0.05%  
A = Isolated; B = Bussed  
TCR/Inspection Code  
Reference TCR/Inspection Code Table  
MIL-STD-883  
Method 1008  
150°C, 1000 hours  
High Temperature  
Exposure  
Resistance Code  
4-Digit Resistance Code  
Ex: 1002 = 10K, 50R1 = 50.1Ω  
Absolute Tolerance Code  
J = ±5%; G = ±2%; F = ±1%;  
D = ±0.5%; C = ±0.25%; B = ±0.1%  
Low Temperature  
Storage  
-55°C, 1000 hours  
Ratio Tolerance Code (optional)  
G = ±2%; F = ±1%; D = ±0.5%;  
C = ±0.25%; B = ±0.1%; A = 0.05%  
MIL-STD-202  
Method 108  
70°C, 1000 hours  
Life  
Packaging  
Standard packaging is 2˝ x 2˝ chip tray. For additional information  
or to discuss your specific requirements, please contact our Applications  
Team using the contact details below.  
MIL-STD-202  
Method 108  
125°C, 1000 hours  
Life at Elevated  
Temperature  
General Note  
BI Technologies IRC Welwyn  
TT Electronics reserves the right to make changes in product specification without notice or liability.  
All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.  
http://www.ttelectronics.com/resistors  
© TT Electronics plc  
11.17  

相关型号:

WBDDQSC-A-01-50R1-B-F

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-B-G

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-C-A

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-C-B

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-C-C

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-C-D

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-C-F

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-C-G

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-D-A

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-D-B

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-D-C

Wire Bondable Resistor Network Arrays
TTELEC

WBDDQSC-A-01-50R1-D-D

Wire Bondable Resistor Network Arrays
TTELEC