UD4001 [UNITPOWER]
P-Ch 40V Fast Switching MOSFETs; P沟道40V的快速开关MOSFET型号: | UD4001 |
厂家: | ShenZhen XinDeYi Electronics Co., Ltd. |
描述: | P-Ch 40V Fast Switching MOSFETs |
文件: | 总4页 (文件大小:767K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
UD4001
P-Ch 40V Fast Switching MOSFETs
General Description
Product Summery
The UD4001 is the highest performance trench
P-ch MOSFETs with extreme high cell density ,
which provide excellent RDSON and gate charge
for most of the synchronous buck converter
applications .
BVDSS
RDS(ON)
ID
-40V
65mΩ
-16A
Applications
The UD4001 meet the RoHS and Green Product
requirement , 100% EAS guaranteed with full
function reliability approved.
z High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
z Networking DC-DC Power System
z Load Switch
Features
TO252 Pin Configuration
z Advanced high cell density Trench technology
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Absolute Maximum Ratings
Symbol
Parameter
Rating
-40
Units
V
VDS
Drain-Source Voltage
VGS
ID@TC=25℃
ID@TC=100℃
IDM
Gate-Source Voltage
±20
-16
V
Continuous Drain Current, -VGS @ -10V1
Continuous Drain Current, -VGS @ -10V1
Pulsed Drain Current2
A
-12
A
-32
A
EAS
Single Pulse Avalanche Energy3
39
mJ
A
IAS
Avalanche Current
Total Power Dissipation4
-20.5
25
PD@TC=25℃
TSTG
W
℃
℃
Storage Temperature Range
Operating Junction Temperature Range
-55 to 150
-55 to 150
TJ
Thermal Data
Symbol
RθJA
Parameter
Typ.
---
Max.
62
Unit
℃/W
℃/W
Thermal Resistance Junction-Ambient 1
Thermal Resistance Junction-Case1
RθJC
---
5
1
UD4001
P-Ch 40V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
Parameter
Conditions
VGS=0V , ID=-250uA
Min.
-40
---
Typ.
---
Max.
---
Unit
V
BVDSS
Drain-Source Breakdown Voltage
BVDSS Temperature Coefficient
△BVDSS/△TJ
Reference to 25℃, ID=-1mA
VGS=-10V , ID=-8A
-0.015
52
---
V/℃
---
65
100
-2.5
---
RDS(ON)
Static Drain-Source On-Resistance2
mΩ
VGS=-4.5V , ID=-4A
---
80
VGS(th)
Gate Threshold Voltage
-1.0
---
-1.6
3.52
---
V
VGS=VDS , ID =-250uA
△VGS(th)
V
GS(th) Temperature Coefficient
V/℃
VDS=-32V , VGS=0V , TJ=25℃
VDS=-32V , VGS=0V , TJ=55℃
---
1
IDSS
Drain-Source Leakage Current
uA
---
---
5
V
GS=±20V , VDS=0V
IGSS
gfs
Gate-Source Leakage Current
Forward Transconductance
Total Gate Charge (-4.5V)
Gate-Source Charge
Gate-Drain Charge
---
---
±100
---
nA
S
VDS=-10V , ID=-10A
---
6
Qg
---
5.8
1.18
2.12
13.2
8
---
VDS=-20V , VGS=-4.5V , ID=-8A
nC
Qgs
Qgd
Td(on)
Tr
---
---
---
---
Turn-On Delay Time
Rise Time
---
---
VDD=-12V , VGS=-10V , RG=3.3Ω,
---
---
ns
ID=-1A
Td(off)
Tf
Turn-Off Delay Time
Fall Time
---
40.4
3.5
620
69
---
---
---
Ciss
Coss
Crss
Input Capacitance
---
---
VDS=-15V , VGS=0V , f=1MHz
pF
Output Capacitance
Reverse Transfer Capacitance
---
---
---
52
---
Guaranteed Avalanche Characteristics
Symbol
Parameter
Conditions
Min.
Typ.
Max.
Unit
EAS
Single Pulse Avalanche Energy5
9.4
---
---
mJ
VDD=-25V , L=0.1mH , IAS=-10A
Diode Characteristics
Symbol
Parameter
Conditions
Min.
---
Typ.
---
Max.
-16
Unit
A
IS
Continuous Source Current1,6
Pulsed Source Current2,6
Diode Forward Voltage2
VG=VD=0V , Force Current
ISM
VSD
---
---
-32
A
VGS=0V , IS=-1A , TJ=25℃
---
---
-1.2
V
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is VDD=-25V,VGS=-10V,L=0.1mH,IAS=-20.5A
4.The power dissipation is limited by 150℃ junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
2
UD4001
P-Ch 40V Fast Switching MOSFETs
Typical Characteristics
250
210
170
130
90
12
ID=-8A
10
8
VGS=-10V
VGS=-7V
VGS=-5V
VGS=-4.5V
6
4
2
VGS=-3V
1.5
0
50
0
0.5
1
2
2
4
6
8
10
-VDS Drain-to-Source Voltage (V)
-VGS (V)
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance v.s Gate-Source
10
8
10
VDS=-20V
ID=-8A
7.5
5
6
4
T =150
T =25
℃
J
℃
J
2.5
0
2
0
0.2
0.4
0.6
0.8
1
0
4
8
12
-VSD , Source-to-Drain Voltage (V)
QG , Total Gate Charge (nC)
Fig.3 Forward Characteristics Of Reverse
Fig.4 Gate Charge Characteristics
2.0
1.5
1.5
1.0
0.5
1
0.5
0
-50
0
50
100
150
-50
0
J
50
100
150
T ,Junction Temperature (
)
T , Junction Temperature ( )
℃
J
℃
Fig.5 Normalized VGS(th) v.s TJ
Fig.6 Normalized RDSON v.s TJ
3
UD4001
P-Ch 40V Fast Switching MOSFETs
1000
100
10
100.00
10.00
1.00
F=1.0MHz
Ciss
100us
1ms
10ms
Coss
Crss
100ms
DC
0.10
Tc=25oC
Single Pulse
0.01
0.1
1
10
100
1
5
9
13
17
21
25
-VDS Drain to Source Voltage(V)
-VDS (V)
Fig.7 Capacitance
Fig.8 Safe Operating Area
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
PDM
TON
T
D = TON/T
TJpeak = TC + PDM x RθJC
0.01
SINGLE PULSE
0.01
0.00001
0.0001
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
Fig.10 Switching Time Waveform
Fig.11 Unclamped Inductive Waveform
4
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