UM3016 [UNITPOWER]

N-Ch 30V Fast Switching MOSFETs; N-CH 30V的快速开关MOSFET
UM3016
型号: UM3016
厂家: ShenZhen XinDeYi Electronics Co., Ltd.    ShenZhen XinDeYi Electronics Co., Ltd.
描述:

N-Ch 30V Fast Switching MOSFETs
N-CH 30V的快速开关MOSFET

开关
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中文:  中文翻译
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UM3016  
N-Ch 30V Fast Switching MOSFETs  
General Description  
Product Summery  
The UM3016 is the highest performance trench  
N-ch MOSFETs with extreme high cell density ,  
which provide excellent RDSON and gate charge  
for most of the synchronous buck converter  
applications .  
S(ON)  
BVDSS  
RD  
ID  
30V  
4m  
15A  
Applications  
The UM3016 meet the RoHS and Green Product  
requirement 100% EAS guaranteed with full  
function reliability approved.  
z High Frequency Point-of-Load Synchronous  
Buck Converter for MB/NB/UMPC/VGA  
z Networking DC-DC Power System  
z Load Switch  
Features  
S0P8 Pin Configuration  
z Advanced high cell density Trench technology  
z Super Low Gate Charge  
z Excellent CdV/dt effect decline  
z 100% EAS Guaranteed  
z Green Device Available  
Absolute Maximum Ratings  
Symbol  
Parameter  
Rating  
30  
Units  
V
VDS  
VGS  
Drain-Source Voltage  
Gate-Source Voltage  
±20  
15  
V
ID@TA=25℃  
ID@TA=70℃  
IDM  
Continuous Drain Current, VGS @ 10V1  
Continuous Drain Current, VGS @ 10V1  
Pulsed Drain Current2  
A
12  
A
75  
A
EAS  
Single Pulse Avalanche Energy3  
317  
mJ  
A
IAS  
Avalanche Current  
53.8  
PD@TA=25℃  
TSTG  
Total Power Dissipation4  
1.5  
W
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 175  
-55 to 175  
TJ  
Thermal Data  
Symbol  
RθJA  
Parameter  
Typ.  
---  
Max.  
85  
Unit  
/W  
/W  
Thermal Resistance Junction-Ambient 1  
Thermal Resistance Junction-Case1  
RθJC  
---  
24  
A n n i e w a n g : y u e - y u e 0 5 0 8 @ 1 6 3 . c o m  
1 3 7 1 4 4 7 0 6 2 1  
1
UM3016  
N-Ch 30V Fast Switching MOSFETs  
Electrical Characteristics (TJ=25 , unless otherwise noted)  
Symbol  
Parameter  
Conditions  
VGS=0V , ID=250uA  
Min.  
30  
---  
---  
---  
1.0  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
Typ.  
---  
Max.  
---  
Unit  
V
BVDSS  
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
BVDSS/△TJ  
Reference to 25, ID=1mA  
VGS=10V , ID=15A  
0.021  
3.4  
---  
V/℃  
4
RDS(ON)  
Static Drain-Source On-Resistance2  
mΩ  
VGS=4.5V , ID=10A  
5.2  
6
VGS(th)  
Gate Threshold Voltage  
1.5  
2.5  
---  
V
VGS=VDS , ID =250uA  
VGS(th)  
V
GS(th) Temperature Coefficient  
-5.73  
---  
mV/℃  
VDS=24V , VGS=0V , TJ=25℃  
VDS=24V , VGS=0V , TJ=55℃  
1
IDSS  
Drain-Source Leakage Current  
uA  
---  
5
VGS=±20V , VDS=0V  
IGSS  
gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
---  
±100  
---  
nA  
S
VDS=5V , ID=15A  
26.5  
1.4  
Rg  
VDS=10V , VGS=0V , f=1MHz  
2.8  
Ω
Qg  
Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
31.6  
6.1  
VDS=20V , VGS=4.5V , ID=12A  
nC  
ns  
Qgs  
Qgd  
Td(on)  
Tr  
13.8  
11.2  
49  
VDD=15V , VGS=10V , RG=1.5Ω  
ID=15A  
Td(off)  
Tf  
Turn-Off Delay Time  
Fall Time  
35  
7.8  
Ciss  
Coss  
Crss  
Input Capacitance  
3075  
400  
315  
VDS=15V , VGS=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
Guaranteed Avalanche Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
EAS  
Single Pulse Avalanche Energy5  
98  
---  
---  
mJ  
VDD=25V , L=0.1mH , IAS=30A  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
---  
Typ.  
---  
Max.  
15  
Unit  
A
IS  
Continuous Source Current1,6  
Pulsed Source Current2,6  
Diode Forward Voltage2  
VG=VD=0V , Force Current  
ISM  
VSD  
---  
---  
75  
A
VGS=0V , IS=1A , TJ=25℃  
---  
---  
1
V
Note :  
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width 300us , duty cycle 2%  
3.The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=53.8A  
4.The power dissipation is limited by 150junction temperature  
5.The Min. value is 100% EAS tested guarantee.  
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.  
A n n i e w a n g : y u e - y u e 0 5 0 8 @ 1 6 3 . c o m  
1 3 7 1 4 4 7 0 6 2 1  
2
UM3016  
N-Ch 30V Fast Switching MOSFETs  
Typical Characteristics  
120  
5.0  
4.5  
4.0  
3.5  
3.0  
ID=12A  
100  
80  
60  
40  
20  
0
VGS=10V  
VGS=7V  
VGS=5V  
VGS=4.5V  
VGS=3V  
0
0.25  
0.5  
0.75  
1
2
4
6
8
10  
VDS , Drain-to-Source Voltage (V)  
VGS (V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance vs. G-S Voltage  
10  
8
12  
10  
8
ID=12A  
6
6
T =175  
T =25  
J
4
J
4
2
2
0
0
0
20  
40  
60  
80  
0
0.3  
0.6  
0.9  
1.2  
VSD , Source-to-Drain Voltage (V)  
QG , Total Gate Charge (nC)  
Fig.3 Forward Characteristics of Reverse  
Fig.4 Gate-charge Characteristics  
2.0  
1.5  
1.0  
0.5  
1.5  
1
0.5  
0
-50  
25  
100  
175  
-50  
25  
100  
175  
T ,Junction Temperature (  
)
T , Junction Temperature (  
)
J
J
Fig.5 Normalized VGS(th) vs. TJ  
Fig.6 Normalized RDSON vs. TJ  
A n n i e w a n g : y u e - y u e 0 5 0 8 @ 1 6 3 . c o m  
1 3 7 1 4 4 7 0 6 2 1  
3
UM3016  
N-Ch 30V Fast Switching MOSFETs  
10000  
1000  
100  
100.00  
10.00  
1.00  
F=1.0MHz  
Ciss  
100us  
1ms  
Coss  
Crss  
10ms  
100ms  
0.10  
DC  
TA=25oC  
Single Pulse  
0.01  
10  
0.01  
0.1  
1
10  
100  
1
1
5
9
13  
17  
21  
25  
VDS Drain to Source Voltage(V)  
VDS (V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
DUTY=0.5  
0.2  
0.1  
0.1  
0.01  
0.05  
0.01  
PDM  
TON  
T
D = TON/T  
SINGLE  
TJpeak = TA+PDMXRθJA  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Switching Waveform  
A n n i e w a n g : y u e - y u e 0 5 0 8 @ 1 6 3 . c o m  
1 3 7 1 4 4 7 0 6 2 1  
4

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