UM4803 [UNITPOWER]

N-Ch and P-Ch Fast Switching MOSFETs; N沟道和P沟道快速开关MOSFET
UM4803
型号: UM4803
厂家: ShenZhen XinDeYi Electronics Co., Ltd.    ShenZhen XinDeYi Electronics Co., Ltd.
描述:

N-Ch and P-Ch Fast Switching MOSFETs
N沟道和P沟道快速开关MOSFET

开关
文件: 总7页 (文件大小:1126K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
UM4803  
N-Ch and P-Ch Fast Switching MOSFETs  
General Description  
Product Summery  
The UM4803 is the highest performance trench  
N-ch and P-ch MOSFETs with extreme high cell  
density , which provide excellent RDSON and gate  
charge for most of the synchronous buck converter  
applications .  
BVDSS  
40V  
RDS(ON)  
26m  
40mΩ  
ID  
7.2A  
-6.5A  
-40V  
The UM4803 meet the RoHS and Green Product  
requirement 100% EAS guaranteed with full  
function reliability approved.  
Applications  
z High Frequency Point-of-Load Synchronous  
Buck Converter for MB/NB/UMPC/VGA  
z Networking DC-DC Power System  
z CCFL Back-light Inverter  
Features  
z Advanced high cell density Trench technology  
z Super Low Gate Charge  
SOP8 Pin Configuration  
z Excellent CdV/dt effect decline  
z 100% EAS Guaranteed  
z Green Device Available  
Absolute Maximum Ratings  
Rating  
Symbol  
Parameter  
Units  
N-Ch  
40  
P-Ch  
-40  
VDS  
Drain-Source Voltage  
Gate-Source Voltage  
Continuous Drain Current, VGS @ 10V1  
Continuous Drain Current, VGS @ 10V1  
Pulsed Drain Current2  
V
V
VGS  
ID@TC=25℃  
ID@TC=100℃  
IDM  
±20  
7.2  
±20  
-6.5  
A
5.6  
-5.1  
A
14.5  
-13  
A
EAS  
Single Pulse Avalanche Energy3  
28  
66  
mJ  
A
IAS  
Avalanche Current  
Total Power Dissipation4  
17.8  
-27.2  
3.1  
PD@TC=25℃  
TSTG  
2.5  
W
Storage Temperature Range  
Operating Junction Temperature Range  
-55 to 150  
-55 to 150  
-55 to 150  
-55 to 150  
TJ  
Thermal Data  
Symbol  
RθJA  
Parameter  
Typ.  
---  
Max.  
85  
Unit  
/W  
/W  
Thermal Resistance Junction-Ambient 1  
Thermal Resistance Junction-Case1  
RθJC  
---  
50  
1
UM4803  
N-Ch and P-Ch Fast Switching MOSFETs  
N-Channel Electrical Characteristics (TJ=25 , unless otherwise noted)  
Symbol  
Parameter  
Conditions  
VGS=0V , ID=250uA  
Min.  
40  
---  
---  
---  
1.0  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
Typ.  
---  
Max.  
---  
Unit  
V
BVDSS  
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
BVDSS/△TJ  
Reference to 25, ID=1mA  
VGS=10V , ID=6A  
0.034  
22  
---  
V/℃  
26  
35  
2.5  
---  
RDS(ON)  
Static Drain-Source On-Resistance2  
mΩ  
VGS=4.5V , ID=4A  
28  
VGS(th)  
Gate Threshold Voltage  
1.5  
-4.56  
---  
V
VGS=VDS , ID =250uA  
VGS(th)  
V
GS(th) Temperature Coefficient  
mV/℃  
VDS=32V , VGS=0V , TJ=25℃  
VDS=32V , VGS=0V , TJ=55℃  
1
IDSS  
Drain-Source Leakage Current  
uA  
---  
5
VGS=±20V , VDS=0V  
IGSS  
gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
---  
±100  
---  
nA  
S
VDS=5V , ID=12A  
14  
Rg  
VDS=0V , VGS=0V , f=1MHz  
2.6  
5.5  
1.25  
2.5  
8.9  
2.2  
41  
5.2  
---  
Ω
Qg  
Total Gate Charge (4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
VDS=20V , VGS=4.5V , ID=6A  
nC  
ns  
Qgs  
Qgd  
Td(on)  
Tr  
---  
---  
---  
VDD=20V , VGS=10V , RG=3.3Ω  
---  
ID=1A  
Td(off)  
Tf  
Turn-Off Delay Time  
Fall Time  
---  
2.7  
593  
76  
---  
Ciss  
Coss  
Crss  
Input Capacitance  
---  
VDS=15V , VGS=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
---  
56  
---  
Guaranteed Avalanche Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
EAS  
Single Pulse Avalanche Energy5  
9
---  
---  
mJ  
VDD=25V , L=0.1mH , IAS=10A  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
---  
Typ.  
---  
Max.  
7.2  
Unit  
A
IS  
Continuous Source Current1,6  
Pulsed Source Current2,6  
Diode Forward Voltage2  
VG=VD=0V , Force Current  
ISM  
VSD  
---  
---  
14.5  
1.2  
A
VGS=0V , IS=1A , TJ=25℃  
---  
---  
V
Note :  
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width 300us , duty cycle 2%  
3.The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=17.8A  
4.The power dissipation is limited by 150junction temperature  
5.The Min. value is 100% EAS tested guarantee.  
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.  
2
UM4803  
N-Ch and P-Ch Fast Switching MOSFETs  
P-Channel Electrical Characteristics (TJ=25 , unless otherwise noted)  
Symbol  
Parameter  
Conditions  
VGS=0V , ID=-250uA  
Min.  
-40  
---  
---  
Typ.  
---  
Max.  
---  
Unit  
V
BVDSS  
Drain-Source Breakdown Voltage  
BVDSS Temperature Coefficient  
BVDSS/△TJ  
Reference to 25, ID=-1mA  
VGS=-10V , ID=-6A  
-0.012  
32  
---  
V/℃  
40  
65  
-2.5  
---  
RDS(ON)  
Static Drain-Source On-Resistance2  
mΩ  
VGS=-4.5V , ID=-4A  
---  
55  
VGS(th)  
Gate Threshold Voltage  
-1.0  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
---  
-1.6  
4.32  
---  
V
VGS=VDS , ID =-250uA  
VGS(th)  
V
GS(th) Temperature Coefficient  
mV/℃  
VDS=-32V , VGS=0V , TJ=25℃  
VDS=-32V , VGS=0V , TJ=55℃  
1
IDSS  
Drain-Source Leakage Current  
uA  
---  
5
VGS=±20V , VDS=0V  
IGSS  
gfs  
Gate-Source Leakage Current  
Forward Transconductance  
Gate Resistance  
---  
±100  
---  
nA  
S
VDS=-5V , ID=-6A  
12  
Rg  
VDS=0V , VGS=0V , f=1MHz  
13  
16  
---  
Ω
Qg  
Total Gate Charge (-4.5V)  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
9
VDS=-20V , VGS=-4.5V , ID=-6A  
nC  
ns  
Qgs  
Qgd  
Td(on)  
Tr  
2.54  
3.1  
19.2  
12.8  
48.6  
4.6  
1004  
108  
80  
---  
---  
---  
VDD=-15V , VGS=-10V , RG=3.3Ω,  
---  
ID=-1A  
Td(off)  
Tf  
Turn-Off Delay Time  
Fall Time  
---  
---  
Ciss  
Coss  
Crss  
Input Capacitance  
---  
VDS=-15V , VGS=0V , f=1MHz  
pF  
Output Capacitance  
Reverse Transfer Capacitance  
---  
---  
Guaranteed Avalanche Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
Typ.  
Max.  
Unit  
EAS  
Single Pulse Avalanche Energy5  
20  
---  
---  
mJ  
VDD=-25V , L=0.1mH , IAS=-15A  
Diode Characteristics  
Symbol  
Parameter  
Conditions  
Min.  
---  
Typ.  
---  
Max.  
-6.5  
-13  
-1  
Unit  
A
IS  
Continuous Source Current1,6  
Pulsed Source Current2,6  
Diode Forward Voltage2  
VG=VD=0V , Force Current  
ISM  
VSD  
---  
---  
A
VGS=0V , IS=-1A , TJ=25℃  
---  
---  
V
Note :  
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.  
2.The data tested by pulsed , pulse width 300us , duty cycle 2%  
3.The EAS data shows Max. rating . The test condition is VDD=-25V,VGS=-10V,L=0.1mH,IAS=-27.2A  
4.The power dissipation is limited by 150junction temperature  
5.The Min. value is 100% EAS tested guarantee.  
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.  
3
UM4803  
N-Ch and P-Ch Fast Switching MOSFETs  
N-Channel Typical Characteristics  
12  
40  
ID=6A  
10  
8
VGS=10V  
VGS=7V  
VGS=5V  
35  
30  
25  
20  
6
VGS=4.5V  
4
VGS=3V  
2
0
2
4
6
8
10  
0
0.5  
1
1.5  
2
VDS Drain-to-Source Voltage (V)  
VGS (V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance vs. G-S Voltage  
10  
8
12  
VDS=20V  
ID=6A  
8
4
0
6
T =150  
T =25  
J
J
4
2
0
0
4
8
12  
16  
0.00  
0.25  
0.50  
0.75  
1.00  
QG , Total Gate Charge (nC)  
VSD , Source-to-Drain Voltage (V)  
Fig.3 Forward Characteristics of Reverse  
Fig.4 Gate-Charge Characteristics  
2.0  
1.7  
1.4  
1.1  
0.8  
0.5  
0.2  
1.8  
1.4  
1
0.6  
0.2  
-50  
0
50  
100  
150  
-50  
0
50  
100  
150  
T ,Junction Temperature (  
)
T , Junction Temperature ( )  
J
J
Fig.5 Normalized VGS(th) vs. TJ  
Fig.6 Normalized RDSON vs. TJ  
4
UM4803  
N-Ch and P-Ch Fast Switching MOSFETs  
1000  
100  
10  
100.00  
F=1.0MHz  
Ciss  
10us  
10.00  
100us  
1.00  
Coss  
Crss  
10ms  
100ms  
0.10  
T =25  
C
DC  
Single Pulse  
0.01  
1
5
9
13  
17  
21  
25  
0.1  
1
10  
100  
VDS Drain to Source Voltage (V)  
VDS (V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
0.01  
PDM  
TON  
0.01  
T
D = TON/T  
0.001  
TJpeak = TC+PDMXRθJC  
0.001  
0.0001  
0.001  
0.01  
0.1  
1
10  
100  
1000  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Switching Wave  
5
UM4803  
N-Ch and P-Ch Fast Switching MOSFETs  
P-Channel Typical Characteristics  
60  
12  
ID=-6A  
VGS=-10V  
10  
55  
50  
45  
40  
35  
30  
VGS=-7V  
VGS=-5V  
8
6
4
2
0
VGS=-4.5V  
VGS=-3V  
0
0.5  
1
1.5  
2
2
4
6
8
10  
-VDS Drain-to-Source Voltage (V)  
-VGS (V)  
Fig.1 Typical Output Characteristics  
Fig.2 On-Resistance v.s Gate-Source  
12  
10  
8
10  
VDS=-20V  
ID=-6A  
8
6
4
2
0
6
T =150  
T =25  
J
J
4
2
0
0
6
12  
18  
0.2  
0.4  
0.6  
0.8  
1
-VSD , Source-to-Drain Voltage (V)  
QG , Total Gate Charge (nC)  
Fig.3 Forward Characteristics of Reverse  
Fig.4 Gate-Charge Characteristics  
2.0  
1.5  
1.0  
0.5  
1.5  
1
0.5  
0
-50  
0
50  
100  
150  
-50  
0
J
50  
100  
150  
T ,Junction Temperature (  
)
T , Junction Temperature ( )  
J
Fig.5 Normalized VGS(th) v.s TJ  
Fig.6 Normalized RDSON v.s TJ  
6
UM4803  
N-Ch and P-Ch Fast Switching MOSFETs  
10000  
1000  
100  
100.00  
F=1.0MHz  
Ciss  
10.00  
1.00  
0.10  
0.01  
100us  
1ms  
Coss  
Crss  
10ms  
100ms  
DC  
Tc=25oC  
Single Pulse  
10  
1
5
9
13  
17  
21  
25  
0.1  
1
10  
100  
-VDS Drain to Source Voltage(V)  
-VDS (V)  
Fig.7 Capacitance  
Fig.8 Safe Operating Area  
1
DUTY=0.5  
0.3  
0.1  
0.1  
0.05  
PDM  
TON  
T
0.02  
0.01  
D = TON/T  
TJpeak = TC + PDM x RθJC  
SINGLE PULSE  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
10  
t , Pulse Width (s)  
Fig.9 Normalized Maximum Transient Thermal Impedance  
Fig.10 Switching Time Waveform  
Fig.11 Unclamped Inductive Waveform  
7

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