UNC-201M [UNSEMI]
Spark Gap Protectors (SPG);
| 型号： | UNC-201M |
| 厂家： | 
UN Semiconducctor INC |
| 描述： | Spark Gap Protectors (SPG) |
| 文件： | 总5页 (文件大小：338K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Spark Gap Protectors (SPG)
UNC Series
Features
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Approximately zero leaking current before clamping voltage
Less decay at on/off state.
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High capability to withstand repeated lightning strikes.
Low electrode capacitance (≤1.0pF) and high isolation
(≥100MΩ).
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RoHS compliant.
Bilateral symmetrical.
Temperature, humidity and lightness insensitive.
Working temperature: -40℃~ +85 ℃
Storage temperature: -40℃~+125℃
Meets MSL level 1, per J-STD-020
Applications
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Power Supplies
Motor sparks eliminating
Relay switching spark absorbing
Data line pulse guarding
Electronic devices requiring UL497A and UL497B compliant
Telephone/Fax/Modem
High frequency signal transmitters/receivers
Satellite antenna
Radio amplifiers
Alarm systems
Cathode ray tubes in Monitors/TVs
Part Numbering
UNC - 201
M
(1)
(2)
(3)
(1) Series
(2) VS Voltage, e.g. 201=20X101=200V
(3) VS Voltage tolerance: L - ±15%, M - ±20%, N - ±30%
Dimensions
Symbol
Inches
Millimeters
L1
L
1.102±0.079
0.252±0.039
0.020±0.002
0.122±0.020
28.0±2.0
6.7±1.0
0.5±0.05
3.1±0.5
d
D
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Revision January 06, 2014
1 / 5
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNC Series
Electrical Characteristics
Minimum
Insulation
Resistance
IR(OHM)/DC
Maximum
Capacitance
1KHZ-6Vmax
C (pF)
DC Spark-over
Surge Current
Capacity
Part Number
Voltage
Vs(V)
Surge Life Test
8/20 μS
UNC-141N
UNC-181N
UNC-201M
UNC-251M
UNC-301M
UNC-401M
UNC-471M
UNC-501M
UNC-601M
UNC-102M
UNC-152M
UNC-242M
UNC-272M
UNC-302M
140(98~182)
180(126~234)
200(160~240)
250(200~300)
300(240~360)
400(320~480)
470(400~560)
500(400~600)
600(480~720)
1000(800~1200)
1500(1200~1800)
2400(1920~2880)
2700(2250~3240)
3000(2400~3600)
100M / 50V
100M / 50V
100M /100V
100M /100V
100M /100V
100M / 250V
100M / 250V
100M / 250V
100M / 250V
100M / 500V
100M / 500V
100M / 500V
100M / 500V
100M / 500V
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
1.0
3000A
3000A
3000A
3000A
3000A
3000A
3000A
3000A
3000A
3000A
3000A
3000A
3000A
3000A
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
10KV / 150A , >300T
Color Code
Part Number
UNC-141N
UNC-201M
UNC-301M
UNC-401M
UNC-501M
UNC-601M
UNC-102M
UNC-152M
UNC-242M
UNC-272M
UNC-302M
Color Code1
Color Code2
Color Code3
White
White
White
White
Red
Brown
Red
Red
Brown
Red
Orange
Yellow
Green
Blue
Brown
Orange
Red
Orange
Red
Black
Black
Red
Black
Green
Purple
Red
Red
Red
Red
Purple
Black
Orange
Red
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Revision January 06, 2014
2 / 5
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNC Series
Test Methods and Results
Items
Test Method
Standard
Measure starting discharge voltage (Vs) by gradually
increasing applied DC voltage. Test current is 0.5mA
max. And the DC voltage ascends up within
100V/s(Vs＜1000V) or 500V/s(Vs≥1000V).
DC Spark-over Voltage
Rate-of-change, within±30%
insulation resistance & capacitance,
conformed to rated spec.
Measure the insulation resistance across the terminal
at regular voltage. But the test voltage doesn’t over
the DC spark-over voltage.
Insulation Resistance
Capacitance
Measure the electrostatic capacitance by applying a
voltage of less than 6V (at 1KHz) between terminals.
∣△Vs/Vs∣≤30%
10KV with 1500pf condenser is discharged through
Static Life
Characteristics of other items must meet
the specified value
2KΩ resistor. 200 times at an interval of 10sec.
1.2/50μs & 8/20μs, 3000A, electrically connected with
a resistor (1~2 Ω), ±5 times, each time interval 60
seconds. Thereafter, outer appearance shall be
visually examined.
Surge Current
Capacity
No crack and no failures
Measurement after -40 ℃ /1000 HRS & normal
temperature/2 HRS.
Cold Resistance
Heat Resistance
Humidity Resistance
Measurement after 125 ℃ /1000 HRS & normal
temperature/2 HRS.
Features are conformed to rated spec
Measurement after humidity 90~95℃(45℃ ) /1000
HRS & normal temperature/2 HRS.
10 times repetition of cycle -40℃ /30min →normal,
temp/2 min →125℃/30min, measurement after
normal temp/2 HRS.
Temperature Cycle
Solder Ability
Apply flux and immerse in molten solder 230±5℃
for 3sec up to the point of 1.5mm from body. Check Lead wire is evenly covered by solder
for solder adhesion.
Measurement after lead wire is dipped up to the point
Conformed to rated spec
Solder Heat
of 1.5mm from body into 260±5℃
solder for 10sec
Pull Strength
Flexural Strength
Apply 0.5kg load for 10sec
Lead shall not pull out to snap
Bend lead wire at the point of 2mm from body under
0.25 load and back to its original point. Repeat 1 time.
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Revision January 06, 2014
3 / 5
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNC Series
Recommended Soldering Conditions
Flow Soldering Conditions
Reflow Soldering Conditions
Air Preheat
Soldering
Cooling
Air Preheat
Soldering
Cooling
260℃
260℃
250
200
250
200
ΔT
ΔT
150
100
150~180℃
150
100
50
150~180℃
50
0
0
10 sec. or less
60~120 sec
60~120 sec
3~4 sec
60 sec. or less
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110℃ .
3) After soldering, do not force cool, allow the parts to cool gradually.
Hand Soldering
Solder iron temperature: 350±5℃
Heating time: 3 seconds max.
General attention to soldering
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High soldering temperatures and long soldering times can cause leaching of the termination, decrease in adherence
strength, and the change of characteristic may occur.
For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures exceeding
200℃ to fewer than 50 seconds.
Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash thoroughly to
remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration can cause cracking or
a decrease in the adherence of the termination, we recommend that you use the conditions below:
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Revision January 06, 2014
4 / 5
Please refer to www.unsemi.com.tw for current information.
Spark Gap Protectors (SPG)
UNC Series
Packaging
Tape
Symbol
Dimension (mm)
52+2.0/-1.0
5.0±0.5
W
P
T
6.0±1.0
Z
1.2 Max
L1-L2
1.0 Max
S
t
0.8 Max
3.2 Max
L
6.7±1.0
D1
D
R
Φ0.5±0.05
Φ3.1±0.5
1.0 Max
Inner Box
Item
Length
Width
Description
A=255 mm
B=75 mm
C=68 mm
1500 PCS
Height
Quantity
There are upper and bottom
board to protect the parts
from damage.
Package
UN Semiconductor Co., Ltd.
www.unsemi.com.tw
@ UN Semiconductor Co., Ltd. 2014
Specifications are subject to change without notice.
Revision January 06, 2014
5 / 5
Please refer to www.unsemi.com.tw for current information.
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