US5587 [UPI]

Low-Power, 8-bit Analog to Digital Converters;
US5587
型号: US5587
厂家: uPI Semiconductor Corp.    uPI Semiconductor Corp.
描述:

Low-Power, 8-bit Analog to Digital Converters

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uS5587  
Low-Power, 8-bit Analog to Digital Converters  
Features  
General Description  
The uS5587 is a set of precision analog-to-digital converters † TDFN2x1.5-10L Packag2m1.5mmx0.6mm  
(ADCs) with 8 bits of resolution offered in a TDFN2x1.5-  
10L package.  
† Supply Range: 2.8V to 3.6
† Power Consumptio
The uS5587 is designed with precision, low power, and  
ease of implementation in mind.Data are transferred via an  
I2C-compatible serial interface.  
„ Continuous oe: 150u
„ Stand-by Mode: A  
† EN Pin: InterPull Down 700kΩ  
„ VIH: 1.8V  
The uS5587 operates from a single power supply ranging  
from 2.8V to 3.6V  
„ VIL: 0.4V  
Ordering Information  
† Internaerence Voltage: 1.2V  
† I2C Ince  
Order Number  
uS5587ADLA  
Package  
Top Marking  
FN  
TDFN2x1.5-10L  
ed Addss: 0x70  
„ 4V  
address: 0x70  
address: 0x72 (TBD)  
Remark  
4V  
Note:  
Applications  
(1) Please check the sample/product availability with I  
representatives.  
† Temperature Measurement  
† ortable Instrumentation  
(2) uPI products are compatible with the current IPC/JEDEC  
J-STD-020 requirements. They are halogen-free, RHS † Consumer Goods  
compliant and 100% matte tin (Sn) plating that are suiable  
for use in SnPb or Pb-free soldering processes.  
Ponfiguration & Typical Application Circuit  
SCL  
10  
NC  
NC  
ON  
OFF  
3.3V  
EN  
SDA  
SCL  
VDD  
1
2
3
4
NC  
NC  
9
8
7
6
S
VD
EN  
330K  
1K  
R5  
VIN
VIN  
R1  
AIN1  
AIN2  
AIN3  
1.25V  
1.75V  
2.25V  
R2  
GND  
AIN2  
R6  
AIN3  
5
GND  
AIN1  
uS5587-DS-F0000, May 2016  
www.upi-semi.com  
1
uS5587  
Functional Block Diagram  
VDD  
AIN1  
AIN
A
POR  
Reference  
Timing  
control  
Control  
Logic  
EN  
GND  
8bit A/
Convr  
I2C Interface  
SCL SDA  
Functional Pin Description  
No.  
1
Pin Name Pin Function  
Not Internally Connected.  
Not Internally Connected.  
NC  
NC  
2
Signal and Power Ground r e IC. All voltage levels are measured with respect to this  
pin. Tie this pin to the ground land/ple through the lowest impedance connection available.  
3
GND  
Analog Voltage Input 2. The cnnel 2 voltage input pin.  
Analog Voltage Input hannel 1 voltage input pin.  
Analog Voltage Inpuhannel 3 voltage input pin.  
4
5
6
AIN2  
AIN1  
AIN3  
Enable Inpuulling this pin below 0.4V turns the regulator off and reduces the quiescent  
current. Pull his pin higer than 1.8V for normal operation. The resistance is Internally pulled  
down from 0Kto GD. I2C will be none-ACK when the EN drops below 0.4V.  
7
8
EN  
Supply Input fhe . Connect this pin to a 2.8V to3.6V power supply and decouple using  
a 0.1uF ceramic capacitor.  
VDD  
Data I2C Interface. Connect SDA to the data signal for the I2C bus.  
Clk for Interface. Connect SCL to the clock signal for the I2C bus.  
9
SDA  
SCL  
10  
2
uS5587-DS-F0000, May 2016  
www.upi-semi.com  
uS5587  
Functional Description  
Supply Inputs and POR  
I2C Start and Stop Conditions  
The uS5578 works with supply inputs: VDDfor other control ASTART(S) condition is a HIGH LOW transition of SDA  
circuits. Inputs are continuously monitored for power on while SCL is HIGH. The STOP(P) cdition is a LOW to  
reset (POR). The POR threshold level is typically 2.5V for HIGH transition of SDA while SCL is IGH. A STOP  
VDDrising.  
condition must be sent before eacTART condition.  
I2C Interface Data Validity  
The data on the SDA line must be stable during the HIGH  
period of the SCL, unless generating a START or STOP  
condition. The HIGH or LOW state of the data line can  
only change when the clock signal on the SCLline is LOW.  
SDA  
SCL  
S
P
start  
stop  
condition  
condition  
SDA  
SCL  
I2C Acknowledge  
Each addredata transmission uses 9 clock pulses.  
The ninth is e acknowledge bit(A). After the start  
condition, tmasr sends 7 slave address bits and a R/  
W bit ing the next 8 clock pulses. During the ninth clock  
pulse, vice that recognizes its own address pulls  
SDAnowledge. The acknowledge bit is also used  
by boaster and the slave to acknowledge receipt of  
rgister addresses and data.  
SDA stable  
Data Valid  
Change of  
SDA allowed  
Read and Write Protocol  
Write to a Single Register  
slave_addr  
S
0
(W)  
reg_addr (dex
[I7 : I
reg_data  
[D7 : D0]  
AS  
AS  
AS  
P
[A7 : A1]  
Read from a Single Register  
slave_addr  
[A7 : A1]  
0
(W)  
reg_addr (ind
[I7 : I0]  
slave_addr + R  
[A7 : A1]  
1
(R)  
reg_data1  
[D7 : D0]  
S
AS  
RS  
AS  
NA  
P
S = Start, P = Stop, AS = ACK from sle, AS = K from slave, NA = No ACK, RS = Repeat Start  
I2C Address Programming  
Voltage Monitoring  
TheAIN1,AIN2 andAIN3 pin voltages are directly digitalized  
byA/Dconverters and interfaced with microprocessors by  
I2C bus.  
When the VDD=2.8V to 3.6V, the A/D converters have  
resolution of 4.6875mV and full scale from 0V to 1.2V.  
TheA/Dsensed the voltage byAIN1,AIN2 andAIN3 in turn  
every cycle, and the cycle repeat about every 1.2 mSec.  
TheA/Dconverter outputs for output and input voltages are  
stored in Reg0x03, Reg0x04 and Reg0x05 respectively.  
The 0111_000X addresses could be apped ding  
power on period. The X indicates that tht action is  
data read (X = 1) from slave or data write (X = 0) to slave  
till transaction stop.  
8 bit Address Form
(X=0:Write/X=1:R
01_000X  
(70h/71h)  
0111_000  
(38h)  
7 bit Address For
I2C Programming Inface  
The uS5587 owns a 8-bitsconverter that it can  
provide a high resoon othe voltage sensing that are  
programmed by Reg0x0Reg0x04 and Reg0x05  
respectively.  
uS5587-DS-F0000, May 2016  
www.upi-semi.com  
3
uS5587  
Functional Description  
Parameter  
Symbol Register  
AIN1 A/D Data Store  
AIN2 A/D Data Store  
AIN3 A/D Data Store  
TD1  
TD2  
TD3  
Reg0x03[7](MSB) - Reg0x03[0](LSB)  
Reg0x04[7](MSB) - Reg0x04[0](LSB)  
Reg0x05[7](MSB) - Reg0x05[0](LSB)  
Hex  
Data  
Reg_addr  
0x00  
Bit7  
Bit6  
Bit5  
Bit4  
Reserved  
Bit3  
Bi
Bit1  
Bit0  
0x01  
Reserved  
Reserved  
0x02  
0x03  
TD1_Bit7  
TD2_Bit7  
TD3_Bit7  
TD1_Bit6  
TD2_Bit6  
TD3_Bit6  
TD1_Bit5  
TD2_Bit5  
TD3_Bit5  
TD1_Bit4 TD1
TD2_Bit4 TD3  
TD3_Bit4 TD3_
Reser
TD1_Bit2  
TD2_Bit2  
TD3_Bit2  
TD1_Bit1 TD1_Bit0  
TD2_Bit1 TD2_Bit0  
TD3_Bit1 TD3_Bit0  
0x04  
0x05  
0x06  
0xB2  
Chip ID
Reg_addr Bit Value Register_Name  
Funct
eserved  
Resved  
eserved  
Description  
0x00  
0x01  
0x02  
ADC conversion code for AIN1 input  
voltage  
0x03  
0x04  
0x05  
7:0  
7:0  
7:0  
00h  
00h  
00h  
TD1[7:0]  
TD2[7:0]  
TD3[7:]  
AIN1'DC Conversion Code  
ADC Conversion Code  
As ADC Conversion Code  
ADC conversion code for AIN2 input  
voltage  
ADC conversion code for AIN3 input  
voltage  
0x06  
0xB2  
Reserved  
3:0  
1Dh  
Chi[7:0]  
ChipID[7:0]  
Read-only.  
4
uS5587-DS-F0000, May 2016  
www.upi-semi.com  
uS5587  
Absolute Maximum Rating  
Supply InputVoltageVDD (Note 1) ---------------------------------------------------------------------------------------------------- -0.3V to +4V  
Other Pins ---------------------------------------------------------------------------------------------------------------------------------- -0.3VtoVDD  
StorageTemperature Range -------------------------------------------------------------------------------------------------------- -65oC to +150oC  
JunctionTemperature ----------------------------------------------------------------------------------------------------------------------------- 150oC  
LeadTemperature (Soldering, 10 sec) ------------------------------------------------------------------------------------------------ 260oC  
ESD Rating (Note 2)  
HBM (Human Body Mode) ----------------------------------------------------------------------------------------------------------------- 2kV  
MM (Machine Mode) --------------------------------------------------------------------------------------------------------------------- 200V  
Trmal Information  
Package Thermal Resistance (Note 3)  
TDFN2x1.5-10LθJA ----------------------------------------------------------------------------------------------------------------- 115oC/W  
TDFN2x1.5-10LθJC --------------------------------------------------------------------------------------------------------------------- 25oC/W  
Power Dissipation, PD @ TA = 25°C  
TDFN2x1.5-10L-------------------------------------------------------------------------------------------------------------------------- 0.87W  
Recmmended Operation Conditions  
Operating Junction Temperature Range (Note 4) ---------------------------------------------------------- -40°C to +125°C  
OperatingAmbient Temperature Range ------------------------------------------------------------------------- -40°C to +85°C  
Supply Input Voltage, VDD ------------------------------------------------------------------------------------------------- +2.8V to +3.6V  
Electrical Characteristics  
(VDD = 3.3V, TA = 25oC, unless otherwise specified)  
Parameter  
Symbol est Conditions  
Min  
Typ  
Max Unit  
Supply Input Voltage  
VDD Supply Input Voltage Range  
VDD POR Threshold  
VDD POR Hysteresis  
Supply Input Current  
Shutdown Current  
V
VDD_
VDD_HS  
IDD  
2.8  
2.4  
--  
--  
2.5  
0.16  
150  
--  
3.6  
2.6  
--  
V
V
V
--  
--  
uA  
uA  
ISD  
EN < 0.4V  
--  
1
Voltage Monitoring (AIN1, AIN2, and AIN3)  
A/D Resolution  
4.6875  
1LSB = 4.6875mV  
--  
0
--  
1.2  
3
mV  
V
A/D Full Scale Range  
--  
--  
Differential Nonlinea
Integral Nonlinearity  
--  
--  
--  
LSB  
LSB  
nA  
--  
3
Input Bias Current  
AIN1,AIN2 and AIN3 = 0 to VDD  
10  
--  
Every AIN1, AIN2 and AIN3  
monitor time in rotation  
AIN1,AIN2,AIN3 nitor Tme  
TMT  
--  
1.2  
--  
ms  
uS5587-DS-F0000, May 2016  
www.upi-semi.com  
5
uS5587  
Electrical Characteristics  
Parameter  
Symbol Test Conditions  
M
Typ  
Max Unit  
EN  
Input Low Voltage  
Input High Voltage  
EN Pull Low Resistance  
I2C Interface  
VIL  
VIH  
.8  
--  
--  
-  
0.4  
--  
V
V
700k  
--  
I2C Clock Rate Range  
I2C Input Low Voltage  
I2C Input High Voltage  
SCL Clock Period  
SDA Data Setup Time  
SDA Data Hold Time  
Start Setup Time  
Stop Setup Time  
fI2C  
VIL_I2C  
VIH_I2C  
tSCL  
--  
--  
--  
400  
0.4  
--  
kHz  
V
1.4  
--  
--  
V
2.5  
--  
--  
us  
ns  
us  
ns  
ns  
tSU  
100  
0
--  
tHD  
--  
0.9  
--  
tST  
tSP  
For Start Co
For Stop Con
600  
600  
--  
--  
--  
Note 1. Stresses beyond those listed as the above Abolute Mmum Ratings may cause permanent damage to  
the device. These are for stress ratings only. Fonal opeation of the device at these or any other  
conditions beyond those indicated in the Recommee Operation Condition section of the specifications is  
not implied. Exposure to absolute maximum rating condions for extended periods may remain possibility  
to affect device reliability.  
Note 2. Devices are ESDsensitive. Handling precaon recommended.  
Note 3. θJA is measured in the natural convection at TA = °C on a low effective thermal conductivity test board of  
JEDEC 51-3 thermal measurement stan
Note 4. The device is not guaranteed to funce its operating conditions.  
SCL  
SCL  
tST  
tSP  
tHD  
tSU  
SDA  
ART  
STOP  
I2C Timing Table  
6
uS5587-DS-F0000, May 2016  
www.upi-semi.com  
uS5587  
Typical Operation Characteristics  
AIN1,AIN2,AIN3 vs. Input Voltage  
Supply Input Current vs. VDD  
240  
230  
220  
210  
200  
190  
180  
170  
160  
150  
140  
130  
120  
110  
100  
288  
256  
224  
192  
160  
128  
96  
AIN1  
AIN2  
AIN3  
64  
32  
0
0
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
2.5  
2.9  
3.1  
3.3  
3.5  
3.7  
3.9  
4.1  
AINVoltage (V)  
VDD= 3.3V  
VDD(V)  
DD= 2.5V - 4.1V, EN = 1.8V  
Input Supply Current vs. Temperature  
Shutdown Current vs. Temperature  
250  
200  
150  
100  
50  
0.8  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
0
-40 -20  
0
20 40 60 80 100 120 140  
Temperature (oC)  
-40 -20  
0
20 40 60 100 140  
Temperature C)  
VDD= 3V  
VDD= 3.3V, EN= 0V  
Shutdown Current . VDD  
1
0.9  
0.8  
0.7  
0.6  
0.5  
0.4  
0.3  
0.2  
0.1  
0
2.5  
2.7  
2.9  
3.1  
3.3  
3.5  
3.7  
3.9  
4.1  
VDD(V)  
VDD = 2.6V - 4V, EN = 0V  
uS5587-DS-F0000, May 2016  
www.upi-semi.com  
7
uS5587  
Package Information  
TDFN2x1.5-10LPackage  
0.30 - 0.50  
1.90 - 2.10  
0.15 - 0
0.25 - 0.45  
0.50 BSC  
0.20 - 0.30  
.35  
1.5
0.50 - 0.60  
0.63  
0.15 REF  
0.00 - 0.05  
0.20 - 0.30  
0.15 - 0.25  
Recommended Solder Pad Layout  
Note  
1.Package Outline UnitDescription:  
BSC: Basic. Represents theoretical exact dor dimension target  
MIN: Minimum dimension specified.  
MAX: Maximum dimension specifie
REF: Reference. Represents dimnsion for reference use only. This value is not a device specification.  
TYP. Typical. Provided as a genel value. Thvalue is not a device specification.  
2.Dimensions in Millimeters.  
3.Drawing not to scale.  
4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm.  
8
uS5587-DS-F0000, May 2016  
www.upi-semi.com  
uS5587  
Important Notice  
uPI and its subsidiaries reserve the right to make corrections, modifications, enhancements, improments, and other  
changes to its products and services at any time and to discontinue any product or service hout notice. Customers  
should obtain the latest relevant information before placing orders and should verify that suh intion is current and  
complete.  
uPI products are sold subject to the terms and conditions of sale supplied at the tme of er acknowledgment.  
However, no responsibility is assumed by uPI or its subsidiaries for its use or application any product or circuit; nor  
for any infringements of patents or other rights of third parties which may result frs use or pplication, including but  
not limited to any consequential or incidental damages. No uPI components are desed, intended or authorized for  
use in military, aerospace, automotive applications nor in systems for surgical implantation or life-sustaining. No license  
is granted by implication or otherwise under any patent or patent rights of uPr itubsidiaries.  
COPYRIGHT (C) 2015, UPI SEMICONDUCTOR CORP.  
uS5587-DS-F0000, May 2016  
www.upi-semi.com  
9

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