50N06L-X-TF3-T [UTC]
50 Amps, 60 Volts N-CHANNEL POWER MOSFET; 50安培, 60伏特N沟道功率MOSFET型号: | 50N06L-X-TF3-T |
厂家: | Unisonic Technologies |
描述: | 50 Amps, 60 Volts N-CHANNEL POWER MOSFET |
文件: | 总8页 (文件大小:146K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
UNISONIC TECHNOLOGIES CO., LTD
50N06
MOSFET
50 Amps, 60 Volts
N-CHANNEL POWER MOSFET
1
ꢀ
DESCRIPTION
TO-220
The UTC 50N06 is three-terminal silicon device with current
conduction capability of about 50A, fast switching speed. Low
on-state resistance, breakdown voltage rating of 60V, and max
threshold voltages of 4 volt.
It is mainly suitable electronic ballast, and low power switching
mode power appliances.
1
TO-220F
ꢀ
FEATURES
*Pb-free plating product number: 50N06L
* RDS(ON) = 23mΩ@VGS = 10 V
* Ultra low gate charge ( typical 30 nC )
* Low reverse transfer Capacitance ( CRSS = typical 80 pF )
* Fast switching capability
* 100% avalanche energy specified
* Improved dv/dt capability
ꢀ
SYMBOL
2.Drain
1.Gate
3.Source
ꢀ
ORDERING INFORMATION
Order Number
Pin Assignment
Packing
Package
Normal
Lead Free Plating
1
2
D
D
3
S
S
50N06-TA3-T
50N06-TF3-T
50N06L-x-TA3-T
50N06L-x-TF3-T
TO-220
G
G
Tube
Tube
TO-220F
50N06L-TA3-T
(1)Packing Type
(2)Package Type
(3)Lead Plating
(1) T: Tube
(2) TA3: TO-220, TF3: TO-220F
(3) L: Lead Free Plating, Blank: Pb/Sn
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Copyright © 2005 Unisonic Technologies Co., Ltd
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50N06
MOSFET
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ABSOLUTE MAXIMUM RATINGS
PARAMETER
SYMBOL
VDSS
RATINGS
UNIT
V
Drain-Source Voltage
Gate to Source Voltage
60
VGSS
±20
V
TC = 25℃
50
A
Continuous Drain Current
ID
TC = 100℃
35
200
A
Drain Current Pulsed (Note 1)
Single Pulsed Avalanche Energy (Note 2)
Repetitive Avalanche Energy (Note 1)
Peak Diode Recovery dv/dt (Note 3)
Total Power Dissipation (TC = 25℃)
Derating Factor above 25℃
IDM
EAS
A
480
mJ
mJ
V/ns
W
EAR
13
dv/dt
7
130
PD
0.9
W/℃
℃
Operation Junction Temperature
Storage Temperature
TJ
-55 ~ +150
-55 ~ +150
TSTG
℃
Note: Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
ꢀ
THERMAL DATA
PARAMETER
SYMBOL
θJC
MIN
TYP
0.5
MAX
1.15
UNIT
°C/W
°C/W
°C/W
Thermal Resistance, Junction-to-Case
Thermal Resistance, Case-to-Sink
θCS
Thermal Resistance, Junction-to-Ambient
θJA
62.5
ꢀ
ELECTRICAL CHARACTERISTICS TC = 25℃ unless otherwise specified
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
0.07
MAX
UNIT
Off Characteristics
Drain-Source Breakdown Voltage
Breakdown Voltage Temperature
Coefficient
BVDSS
VGS = 0 V, ID = 250 µA
ID = 250 µA,
60
V
△BVDSS/△TJ
V/℃
Referenced to 25℃
VDS = 60 V, VGS = 0 V
VDS = 48 V, TC = 125℃
VGS = 20V, VDS = 0 V
VGS = -20V, VDS = 0 V
µA
µA
nA
nA
Drain-Source Leakage Current
IDSS
IGSS
1
Gate-Source Leakage Current
Gate-Source Leakage Reverse
On Characteristics
100
-100
Gate Threshold Voltage
Static Drain-Source On-State
Resistance
VGS(TH)
RDS(ON)
VDS = VGS, ID = 250 µA
VGS = 10 V, ID = 25 A
2.0
4.0
23
V
18
mΩ
Dynamic Characteristics
Input Capacitance
CISS
COSS
CRSS
900
430
80
1220
550
pF
pF
pF
V
GS = 0 V, VDS = 25 V
Output Capacitance
f = 1MHz
Reverse Transfer Capacitance
Dynamic Characteristics
Turn-On Delay Time
Rise Time
100
tD(ON)
tR
tD(OFF)
tF
40
100
90
60
200
180
160
40
ns
ns
VDD = 30V, ID =25 A,
RG = 50Ω (Note 4, 5)
Turn-Off Delay Time
Fall Time
ns
80
ns
Total Gate Charge
QG
30
nC
nC
nC
VDS = 48V, VGS = 10 V
ID = 50A, (Note 4, 5)
Gate-Source Charge
Gate-Drain Charge (Miller Charge)
QGS
QGD
9.6
10
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50N06
MOSFET
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ELECTRICAL CHARACTERISTICS(Cont.)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
Source-Drain Diode Ratings and Characteristics
Diode Forward Voltage
VSD
IS
IS = 50A, VGS = 0 V
1.5
50
Integral Reverse p-n Junction Diode in the
Continuous Source Current
MOSFET
D
A
Pulsed Source Current
ISM
200
G
S
Reverse Recovery Time
Reverse Recovery Charge
tRR
IS = 50A, VGS = 0 V
dIF / dt = 100 A/µs
54
81
ns
QRR
µC
Note 1. Repeativity rating: pulse width limited by junction temperature
2. L=5.6mH, IAS=50A, VDD=25V, RG=0Ω, Starting TJ=25℃
3. ISD≤50A, di/dt≤300A/µs, VDD≤BVDSS, Starting TJ=25℃
4. Pulse Test: Pulse Width≤300µs,Duty Cycle≤2%
5. Essentially independent of operating temperature.
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MOSFET
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TEST CIRCUITS AND WAVEFORMS
+
D.U.T.
VDS
-
+
-
L
RG
Driver
VDD
* dv/dt controlled by RG
* ISD controlled by pulse period
* D.U.T.-Device Under Test
Same Type
as D.U.T.
VGS
Fig. 1A Peak Diode Recovery dv/dt Test Circuit
P. W.
VGS
(Driver)
Period
D=
P.W.
Period
10V
VGS=
IFM, Body Diode Forward Current
ISD
(D.U.T.)
di/dt
IRM
Body Diode Reverse Current
Body Diode Recovery dv/dt
VDS
(D.U.T.)
VDD
Body Diode
Forward Voltage Drop
Fig. 1B Peak Diode Recovery dv/dt Waveforms
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MOSFET
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TEST CIRCUITS AND WAVEFORMS (Cont.)
RL
VDS
VDS
90%
VDD
VGS
RG
10%
VGS
D.U.T.
10V
tD(ON )
tD(OFF)
Pulse Width ≤ 1μs
Duty Factor ≤0.1%
tF
tR
Fig. 2A Switching Test Circuit
Fig. 2B Switching Waveforms
Same Type
as D.U.T.
50kΩ
QG
12V
10V
0.3μF
0.2μF
VDS
QGS
QGD
VGS
DUT
VG
1mA
Charge
Fig. 3A Gate Charge Test Circuit
Fig. 3B Gate Charge Waveform
L
VDS
BVDSS
RG
VDD
10V
D.U.T.
tp
IAS
Time
tp
Fig. 4A Unclamped Inductive Switching Test Circuit
Fig. 4B Unclamped Inductive Switching Waveforms
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MOSFET
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TYPICAL CHARACTERISTICS
Transfer Characteristics
On-State Characteristics
V
GS
Top: 15V
10 V
102
102
8 V
7 V
6 V
5 .5V
5V
℃
0
Bottorm : 4.5V
5
1
101
4.5V
101
℃
5
2
Note:
1. VDS=50V
2. 250µs Pulse Test
100
100
101
Drain-Source Voltage, VDS (V)
10-1
100
2
3
4
5
6
7
8
9 10
Gate-Source Voltage, VGS (V)
On State Current vs. Allowable Case
Temperature
On-Resistance Variation vs. Drain Current
and Gate Voltage
2.5
102
2.0
1.5
150℃
101
25℃
1.0
VGS=10V
*Note:
1. VGS=0V
2. 250µs Test
VGS=20V
0.5
0.0
100
0 20 40 60 80 100120140160180 200
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6
Source-Drain Voltage, VSD (V)
Drain Current, ID (A)
Capacitance Characteristics
(Non-Repetitive)
Gate Charge Characteristics
3000
12
CISS=CGS+CGD (CDS=shorted)
COSS=CDS+CGD
CRSS=CGD
2500
10
VDS=30V
CISS
2000
1500
8
6
4
*Note:
1. VGS=0V
2. f = 1MHz
VDS=48V
COSS
1000
500
0
*Note: ID=50A
2
CRSS
10
0
10 15
0
5
20 25 30 35 40 45
5
15 20 25 30 35
Total Gate Charge, QG (nC)
Drain-Source Voltage, VDC (V)
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MOSFET
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TYPICAL CHARACTERISTICS(Cont.)
Breakdown Voltage Variation vs. Junction
Temperature
On-Resistance Variation vs.
Junction Temperature
3.0
2.5
2.0
1.5
1.0
1.2
1.1
1.0
*Note:
1. VGS=0V
2. ID=250µA
*Note:
1. VGS=10V
2. ID=25A
0.9
0.8
0.5
0.0
200
-100 -50
0
50 100 150
-50
0
50
100
150
Junction Temperature, TJ (℃)
Junction Temperature, TJ (℃)
Maximum Drain Current vs. Case Temperature
50
Maximum Safe Operating
103
Operation in This
Area by RDS (on)
40
30
100µs
102
101
1ms
10ms
10ms
20
10
0
*Note:
100
1. Tc=25℃
2. TJ=150℃
3.Single Pulse
10-1
101
100
101
102
150
25
50
75
100
125
Drain-Source Voltage, VDS (V)
Case Temperature, TC (℃)
Transient Thermal
Response Curve
100
D=0.5
0.2
0.1
0.05
10-1
0.02
*Note:
1. θJC (t ) = 1.42℃/W Max.
2. Duty Factor , D=t1/t2
Z
0.01
3. TJ -TC=PDM×ZθJC (t)
Single pulse
10-2
100 101
10-5 10-4 10-3 10-2 10-1
Square Wave Pulse Duration, t1 (sec)
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50N06
MOSFET
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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