L4863-S18-T [UTC]
DUAL 2.2W AUDIO AMPLIFIER PLUS STEREO HEADPHONE FUNCTION; 双2.2W音频放大器加上立体声耳机功能
| 型号： | L4863-S18-T |
| 厂家： | 
Unisonic Technologies |
| 描述： | DUAL 2.2W AUDIO AMPLIFIER PLUS STEREO HEADPHONE FUNCTION |
| 文件： | 总10页 (文件大小：450K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
UNISONIC TECHNOLOGIES CO., LTD
L4863
CMOS IC
DUAL 2.2W AUDIO AMPLIFIER
PLUS STEREO HEADPHONE
FUNCTION
SOP-16
SOP-18
DESCRIPTION
The UTC L4863 is a dual bridge-connected audio power
DIP-16
amplifier. It combines dual bridge speaker amplifiers and stereo
headphone amplifiers on one chip to simplify audio system design.
In addition, the headphone input pin allows the amplifiers to
operate in single-ended mode when driving stereo headphones.
The IC could deliver different power by packages as below (when
connected to a 5V supply with less than 1.0% THD+N.):
HTSSOP-20
-
-
-
HTSSOP-20, 4Ω load: 2.2W
HTSSOP-20, 3Ω load: 2.5W(with forced-air cooled)
*Pb-free plating product number: L4863L
SOP/DIP
, 8Ω load: 1.1W.
The UTC L4863 features an externally controlled, low-power
consumption shutdown mode, a stereo headphone amplifier mode,
and thermal shutdown protection. It also utilizes circuitry to reduce
“clicks and pops” during device turn-on.
FEATURES
* “Click and pop” suppression
* Thermal shutdown protection
* Unity-gain stable
* Stereo headphone amplifier mode
ORDERING INFORMATION
Order Number
Package
Packing
Normal
Lead Free Plating
L4863L-D16-T
L4863L-S16-R
L4863L-S16-T
L4863L-S18-R
L4863L-S18-T
L4863L-N20-R
L4863L-N20-T
L4863-D16-T
L4863-S16-R
L4863-S16-T
L4863-S18-R
L4863-S18-T
L4863-N20-R
L4863-N20-T
DIP-16
SOP-16
SOP-16
SOP-18
SOP-18
Tube
Tape Reel
Tube
Tape Reel
Tube
HTSSOP-20 Tape Reel
HTSSOP-20 Tube
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Copyright © 2005 Unisonic Technologies Co., Ltd
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CMOS IC
PIN CONFIGURATION
THERMAL DATA
PARAMETER
SYMBOL
RATINGS
UNIT
SOP-16
SOP-18
80
90
63
90
20
2
℃/W
℃/W
℃/W
℃/W
℃/W
℃/W
℃/W
℃/W
Thermal resistance (Junction to Ambient)
Thermal resistance (Junction to Case)
θJA
DIP-16
HTSSOP-20
SOP-16
SOP-18
θJC
DIP-16
20
2
HTSSOP-20
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L4863
CMOS IC
ABSOLUTE MAXIMUM RATING
PARAMETER
SYMBOL
VDD
RATINGS
6.0
UNIT
Supply Voltage
V
V
V
Recommended Supply Voltage Range
Input Voltage
VDD
2.0 ~ 5.5
VIN
-0.3 ~ VDD+0.3
Internally limited
+125
Power Dissipation
PD
Junction Temperature
Operating Temperature
Storage Temperature
TJ
℃
℃
℃
TOPR
TSTG
-40 ~ +85
-65 ~ +150
Note Absolute maximum ratings are those values beyond which the device could be permanently damaged.
Absolute maximum ratings are stress ratings only and functional device operation is not implied.
ELECTRICAL CHARACTERISTICS (Notes 1)(VDD=5V, Ta =25℃, unless otherwise specified)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN TYP MAX UNIT
FOR ENTIRE IC
Supply Voltage
VDD
IDD
2
6
5.5
11.5 20
5.8
V
Quiescent Power Supply Current
(Note 2)
VIN=0V, IOUT=0A, HP-IN=0V
VIN=0V, IOUT=0A, HP-IN=4V
VDD applied to the SHUTDOWN pin
mA
Shutdown Current
ISD
VIH
VIL
2
4
0.7
μA
V
High
Low
Headphone Input Voltage
0.8
V
FOR BRIDGED-MODE OPERATION
Output Offset Voltage
VO(OFF) VIN=0V
5
50
mV
W
RL=3Ω
2.5
2.2
3.2
2.7
THD=1%, f=1kHz
RL=4Ω
RL=3Ω
RL=4Ω
RL=8Ω
RL=8Ω
HTSSOP-20
Output Power
(measured at the device
terminals)
THD+N=10%, f=1kHz
POUT
THD=1%, f=1kHz
1.0 1.1
1.5
W
W
%
SOP/DIP
THD+N=10%, f=1kHz
THD+N=1%, f=1kHz, RL=32Ω
0.34
0.3
Total
Harmonic HTSSOP-20
20Hz≤f≤20kHz,
RL=4Ω, POUT=2W
RL=8Ω, POUT=1W
DD=5V, VRIPPLE=200mVRMS, RL=8Ω,
THD+N
PSRR
Distortion + Noise
AVD=2
SOP/DIP
0.3
V
Power Supply Rejection Ratio
67
dB
CB=1.0μF
Channel Separation
XTALK f=1kHz, CB=1.0μF
90
98
dB
dB
Signal To Noise Ratio
SNR VDD=5V, POUT=1.1W, RL=8Ω
FOR SINGLE-ENDED OPERATION
Output Offset Voltage
VO(OFF) VIN=0V
5
50
mV
THD=0.5%, f=1kHz, RL=32Ω
75
85
Output Power
POUT
mW
THD+N=1%, f=1kHz, RL=8Ω
THD+N=10%, f=1kHz, RL=8Ω
AV=-1, POUT=75mW,20Hz≤f≤20kHz,
RL=32Ω
340
440
Total Harmonic Distortion + Noise
THD+N
0.2
%
Power Supply Rejection Ratio
Channel Separation
PSRR CB=1.0μF, VRIPPLE=200mVRMS, f=1kHz
XTALK f=1kHz, CB=1.0μF
52
60
95
dB
dB
dB
Signal To Noise Ratio
SNR VDD=5V, POUT=340mW, RL=8Ω
Note:1. All voltages are measured with respect to the ground (GND) pins, unless otherwise specified.
2. Depends on the offset voltage when a practical load is connected to the amplifier.
3. When driving 3Ω or 4Ω and operating on a 5V supply, the HTSSOP-20 package must be mounted to the
circuit board that has a minimum of 2.5 in2 of exposed, uninterrupted copper area connected to the
exposed-DAP.
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L4863
CMOS IC
TYPICAL APPLICATION CIRCUIT
VDD
CS
0.1µF
TANT
+
CI
1μF
RF
20KΩ
CO
100µF
4,13
Audio
Input
6
8
- IN A
-
+
-OUT A
20KΩ
5
3
+
AMP 1A
+IN A
CONTROL PIN
RI
20KΩ
RL
8Ω
RING
20KΩ
1kΩ
50KΩ
20KΩ
AMP 2A
Bypass
10
-
+
To HP-IN Circuit
VDD/2
CB
(CB size)
+OUT A
CI
1μF
CO
100µF
+
0.33μF
SLEEVE
50KΩ
TIP
RI
Audio
Input
11
9
-IN B
+IN B
-OUT B
-
+
HEADPHONE JACK
12
14
AMP 1B
20KΩ
20KΩ
20KΩ
RL
20KΩ
VDD
RF
20KΩ
1kΩ
8Ω
-
+
AMP 2B
100kΩ
To Control Pin on
Headphone jack
1
Shutdown
HP-IN
+OUT B
16
100KΩ
2,7,15
GND
Note: Pin out shown for DIP-16 and SOP-16 packages. Refer to the PIN CONFIGURATION for the pin out of other
packages.
Figure 1.Typical Audio Amplifier Application Circuit
EXTERNAL COMPONENTS DESCRIPTION
Components
Functional Description
The inverting input resistance, along with RF, set the closed-loop gain. RI, along with CI form a high
pass filter with fc=1/(2πRICI)
RI
CI
The input coupling capacitor blocks DC voltage at the amplifier’s input terminals. CI, along with RI,
create a high pass filter with fc=1/(2πRICI). Refer to the section. Selecting Proper External
Components, for an explanation of determine the value of CI.
RF
CS
The feedback resistance, along with RI, set the closed-Ioop gain.
The supply bypass capacitor. Refer to the Power Supply Bypassing section for information about
properly placing and selecting the value of, this capacitor.
The capacitor, CB, filters the half-supply voltage present on the Bypass pin. Refer to the Selecting
Proper External Components section for information concerning proper placement and selecting
CB’S value.
CB
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L4863
CMOS IC
TYPICAL CHARACTERISTICS
(For HTSSOP-20)
THD+N vs Frequency
THD+N vs Output Power
10
1
10
1
VDD=5V, RL=4Ω
POUT=2.0W, BW<80kHz
VDD=5V, RL=4Ω
BW<80kHz
20Hz
20KHz
0.1
0.1
1KHz
0.01
0
0.01
0
10m
0.1
Level (W)
1
3
20
100
1k
10k 20k
Frequency (Hz)
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CMOS IC
TYPICAL CHARACTERISTICS(Cont.)
(For DIP-16, SOP-16 and SOP-18)
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TYPICAL CHARACTERISTICS(Cont.)
THD+N vs Output Power
THD+N vs Frequency
10
10
1
VDD=-3.3V, AVD= -2
RL=4Ω
VDD=3.3V, AVD=-2
OUT=750mW, RL=4Ω
P
f=20kHz
f=20Hz
1
0.1
0.01
0.1
f=1kHz
0.01
10m
20k
10k
0.1
1
2
20
100
1k
Level (W)
Frequency (Hz)
Power Dissipation vs Supply Voltage
Output Power vs Load Resistance
1000
800
600
400
200
0
800
600
400
200
0
VDD=3.3V, AV= -1
f=1kHz, BW<80kHz
VDD=3.3V
Single-ended
4Ω
8Ω
THD+N=10%
THD+N=1%
16Ω
0
20
Load Resistance (Ω)
10
30
40
250
500
750
0
1000
Power Out (mW)
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CMOS IC
TYPICAL CHARACTERISTICS(Cont.)
Output Power vs Load resistance
Output Power vs Supply Voltage
1
0.8
0.6
0.4
0.2
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
VDD=5V
f=1kHz
AV=-1
Single Ended
BW<80kHz
RL=8Ω
RL=16Ω
VDD=5V
f=1kHz
10% THD+N
1% THD+N
THD+N∞1.0%
Bridged Load
BW<80kHz
RL=32Ω
0
2
0
20
Load Resistance (Ω)
2.5
0.5 0.75
Output Power (W)
1
10
30 40 50 60 70
1.25
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CMOS IC
TYPICAL CHARACTERISTICS(Cont.)
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CMOS IC
TYPICAL CHARACTERISTICS(Cont.)
Supply Current vs Supply Voltage
15
12
9
VIN=0V
No Load
BRIDGED
(HP-IN=GND)
6
3
SINGLE-ENDED
(HP-IN=VDD
)
0
3.5
4
4.5
5
5.5
2
2.5
3
Supply Voltage (V)
UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.
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