BCM3814V60E15A3CN2 [VICOR]

Isolated Fixed-Ratio DC-DC Converter;
BCM3814V60E15A3CN2
型号: BCM3814V60E15A3CN2
厂家: VICOR CORPORATION    VICOR CORPORATION
描述:

Isolated Fixed-Ratio DC-DC Converter

输入元件 输出元件
文件: 总41页 (文件大小:1405K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
BCM® in a VIA Package  
Bus Converter  
BCM3814x60E15A3yzz  
S
®
C
NRTL US  
C
US  
Isolated Fixed-Ratio DC-DC Converter  
Features & Benefits  
Product Ratings  
Up to 130A continuous low voltage side current  
Fixed transformation ratio (K) of 1/4  
Up to 1000W/in3 power density  
97.4% peak efficiency  
VHI = 54V (36 – 60V)  
ILO = up to 130A  
K = 1/4  
VLO = 13.5V (9 – 15V)  
(no load)  
Product Description  
Integrated ceramic capacitance filtering  
Parallel operation for multi-kW arrays  
OV, OC, UV, short circuit and thermal protection  
3814 package  
The BCM3814x60E15A3yzz in a VIA package is a high efficiency  
Bus Converter, operating from a 36 to 60VDC high voltage bus to  
deliver an isolated 9 to 15VDC unregulated, low voltage.  
This unique ultra-low profile module incorporates DC-DC  
conversion, integrated filtering and PMBus™ commands and  
controls in a chassis or PCB mount form factor.  
High MTBF  
Thermally enhanced VIA package  
PMBus™ management interface  
The BCM offers low noise, fast transient response and industry  
leading efficiency and power density. A low voltage side referenced  
PMBus compatible telemetry and control interface provides access  
to the BCM’s configuration, fault monitoring and other  
telemetry functions.  
Typical Applications  
DC Power Distribution  
Information and Communication  
Technology (ICT) Equipment  
Leveraging the thermal and density benefits of Vicor’s VIA  
packaging technology, the BCM module offers flexible thermal  
management options with very low top and bottom side  
thermal impedances.  
High End Computing Systems  
Automated Test Equipment  
Industrial Systems  
When combined with downstream Vicor DC-DC conversion  
components and regulators, the BCM allows the Power Design  
Engineer to employ a simple, low-profile design, which will  
differentiate the end system without compromising on cost or  
performance metrics.  
High Density Energy Systems  
Transportation  
Size:  
3.76 x 1.40 x 0.37in  
[95.59 x 35.54 x 9.40mm]  
Part Ordering Information  
High  
Side  
Voltage  
Range  
Ratio  
Max  
High  
Side  
Max  
Low  
Side  
Max  
Low  
Product  
Function  
Package  
Length  
Package  
Width  
Package  
Type  
Product Grade  
Option Field  
Side (Case Temperature)  
Voltage  
Voltage Current  
BCM  
38  
14  
x
60  
E
15 A3  
y
zz  
02 = Chassis/PMBus/Positive Logic [b]  
06 = Short Pin/PMBus/Positive Logic  
10 = Long Pin/PMBus/Positive Logic  
N2 = Chassis/PMBus/Negative Logic [b]  
N6 = Short Pin/PMBus/Negative Logic  
NX = Long Pin/PMBus/Negative Logic  
BCM =  
Bus  
Length in  
Width in  
B = Board VIA  
C = –20 to 100°C [a]  
T = –40 to 100°C [a]  
Internal Reference  
Converter Inches x 10 Inches x 10 V = Chassis VIA  
Module  
[a] High temperature current derating may apply; See Figure 1, specified thermal operating area.  
[b] Positive Logic = Part is default ON, Negative Logic = Part is default OFF  
BCM® in a VIA Package  
Page 1 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Typical Applications  
BCM in a VIA package  
+HI  
+LO  
EXT_BIAS  
SCL  
5V  
SDA  
SGND  
ADDR  
R1  
-HI  
-LO  
SCL  
ISOLATION BOUNDARY  
Host PMBus™  
SDA  
SGND  
L
O
A
D
+
DC  
BCM in a VIA package  
+HI  
-HI  
+LO  
EXT_BIAS  
SCL  
5V  
SDA  
SGND  
ADDR  
R2  
-LO  
ISOLATION BOUNDARY  
Paralleling PMBus BCM in a VIA package – connection to Host PMBus  
BCM® in a VIA Package  
Page 2 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Typical Applications (Cont.)  
Host PMBus™  
PMBus  
+
V
EXT  
SGND  
SGND  
SGND  
BCM in a VIA Package  
EXT_BIAS  
SCL  
3
SDA  
}
SGND  
ADDR  
SGND  
FUSE  
+HI  
–HI  
+LO  
–LO  
Non-Isolated  
Point of Load  
Regulators  
V
C
LOAD  
HI  
HI  
HV  
LV  
ISOLATION BOUNDARY  
SOURCE_RTN  
BCM3814x60E15A3yzz at point of load – connection to Host PMBus  
Host PMBus™  
PMBus  
+
V
EXT  
SGND  
SGND  
SGND  
BCM in a VIA Package  
EXT_BIAS  
SCL  
3
SDA  
}
SGND  
ADDR  
SGND  
FUSE  
+HI  
–HI  
+LO  
–LO  
C
LOAD  
V
HI  
HI  
HV  
LV  
ISOLATION BOUNDARY  
SOURCE_RTN  
BCM3814x60E15A3yzz direct to load – connection to Host PMBus  
BCM® in a VIA Package  
Page 3 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Pin Configuration  
10  
1
TOP VIEW  
3
12  
+HI  
–HI  
–LO  
–LO  
+LO  
5
6
7
8
9
EXT BIAS  
SCL  
PMBus™  
SDA  
SGND  
ADDR  
–LO  
–LO  
+LO  
11  
2
4
13  
BCM in a 3814 VIA Package - Chassis (Lug) Mount  
11  
13  
2
TOP VIEW  
4
–HI  
+HI  
–LO  
–LO  
+LO  
9
8
7
6
5
ADDR  
SGND  
SDA  
PMBus™  
SCL  
EXT BIAS  
+LO  
–LO  
–LO  
10  
1
3
12  
BCM in a 3814 VIA Package - Board (PCB) Mount  
Note: The dot on the VIA housing indicates the location of the signal pin 9.  
Pin Descriptions  
Pin Number  
Signal Name  
Type  
Function  
High voltage side positive power terminal  
1
2
+HI  
–HI  
HIGH SIDE POWER  
HIGH SIDE POWER  
RETURN  
High voltage side negative power terminal  
Low voltage side positive power terminal  
LOW SIDE  
POWER  
3, 4  
+LO  
5
6
7
EXT BIAS  
SCL  
INPUT  
INPUT  
5V supply input  
I2C™ Clock, PMBus™ Compatible  
I2C Data, PMBus Compatible  
SDA  
INPUT/OUTPUT  
LOW SIDE  
SIGNAL RETURN  
8
SGND  
ADDR  
–LO  
Signal Ground  
9
INPUT  
Address assignment – Resistor based  
Low voltage side negative power terminal  
LOW SIDE  
POWER RETURN  
10, 11, 12, 13  
Notes: All signal pins (5, 6, 7, 8, 9) are referenced to the low voltage side and isolated from the high voltage side.  
Keep SGND signal separated from the low voltage side power return terminal (–LO) in electrical design.  
BCM® in a VIA Package  
Page 4 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Absolute Maximum Ratings  
The absolute maximum ratings below are stress ratings only. Operation at or beyond these maximum ratings can cause permanent damage to the device.  
Parameter  
Comments  
Min  
Max  
80  
Unit  
V
+HI to –HI  
–1  
HI_DC or LO_DC Slew Rate  
+LO to –LO  
1
V/µs  
V
–1  
20  
–0.3  
10  
V
EXT BIAS to SGND  
0.15  
5.5  
5.5  
3.6  
A
SCL to SGND  
SDA to SGND  
ADDR to SGND  
–0.3  
–0.3  
–0.3  
1500  
1500  
N/A  
V
V
V
Basic insulation (high voltage side to case)  
VDC  
VDC  
VDC  
Isolation Voltage /  
Dielectric Withstand  
Basic insulation (high voltage side to low voltage side) [c]  
Functional insulation (low voltage side to case)  
[c] The absolute maximum rating listed above for the dielectric withstand (high voltage side to the low voltage side) refers to the VIA package. The internal  
safety approved isolating component (ChiP) provides basic insulation (2250V) from the high voltage side to the low voltage side. However, the VIA package  
itself can only be tested at a basic insulation value (1500V).  
BCM® in a VIA Package  
Page 5 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Electrical Specifications  
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of  
–40°C TCASE 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.  
Attribute  
Symbol  
Conditions / Notes  
Min  
Typ  
Max  
Unit  
General Powertrain Specification – Forward Direction Operation (High Voltage Side to Low Voltage Side)  
HI Side Voltage Range  
(Continuous)  
VHI_DC  
36  
60  
V
V
HI Side Voltage Initialization  
Threshold  
HI side voltage where internal controller is initialized,  
(powertrain inactive)  
VµC_ACTIVE  
14  
Disabled, VHI_DC = 54V  
TCASE 100ºC  
5
HI Side Quiescent Current  
No Load Power Dissipation  
IHI_Q  
mA  
10  
21.6  
35.2  
25  
VHI_DC = 54V, TCASE = 25ºC  
VHI_DC = 54V  
14.7  
7.5  
PHI_NL  
W
VHI_DC = 36V to 60V, TCASE = 25ºC  
VHI_DC = 36V to 60V  
38  
VHI_DC = 60V, CLO_EXT = 1000µF, RLOAD_LO = 20% of full  
load current  
40  
HI Side Inrush Current Peak  
IHI_INR_PK  
A
TCASE 100ºC  
45  
33  
DC HI Side Current  
Transformation Ratio  
IHI_IN_DC  
K
At ILO_OUT_DC = 130A, TCASE 90ºC  
A
High voltage to low voltage, K = VLO_DC / VHI_DC  
at no load  
,
1/4  
V/V  
LO Side Current (Continuous)  
LO Side Current (Pulsed)  
ILO_OUT_DC  
TCASE 90ºC  
130  
143  
A
A
10ms pulse, 25% duty cycle, ILO_OUT_AVG 50% rated  
ILO_OUT_DC  
ILO_OUT_PULSE  
VHI_DC = 54V, ILO_OUT_DC = 130A  
96.1  
95.1  
96.3  
95.6  
94  
97  
Efficiency (Ambient)  
ηAMB  
VHI_DC = 36V to 60V, ILO_OUT_DC = 130A  
VHI_DC = 54V, ILO_OUT_DC = 65A  
%
97.3  
96.2  
Efficiency (Hot)  
ηHOT  
η20%  
VHI_DC = 54V, ILO_OUT_DC = 130A TCASE = 90°C  
26A < ILO_OUT_DC < 130A  
%
%
Efficiency (Over Load Range)  
RLO_COLD  
RLO_AMB  
RLO_HOT  
FSW  
VHI_DC = 54V, ILO_OUT_DC = 130A, TCASE = –40°C  
VHI_DC = 54V, ILO_OUT_DC = 130A  
1.2  
1.9  
2.4  
2.3  
2.8  
3.3  
1.0  
LO Side Output Resistance  
1.6  
mΩ  
VHI_DC = 54V, ILO_OUT_DC = 130A, TCASE = 90°C  
Low side voltage ripple frequency = 2x FSW  
2.2  
2.8  
Switching Frequency  
LO Side Voltage Ripple  
0.9  
0.95  
MHz  
mV  
CLO_EXT = 0µF, ILO_OUT_DC = 130A, VHI_DC = 54V,  
20MHz BW  
120  
VLO_OUT_PP  
TCASE 100ºC  
250  
BCM® in a VIA Package  
Page 6 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Electrical Specifications (Cont.)  
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of  
–40°C TCASE 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.  
Attribute  
Symbol  
Conditions / Notes  
Min  
Typ  
Max  
Unit  
General Powertrain Specification – Forward Direction Operation (High Voltage Side to Low Voltage Side), Cont.  
Effective HI Side Capacitance  
(Internal)  
CHI_INT  
CLO_INT  
CLO_OUT_EXT  
CLO_OUT_AEXT  
Effective value at 54VHI_DC  
Effective value at 13.5VLO_DC  
11.2  
140  
µF  
µF  
µF  
Effective LO Side Capacitance  
(Internal)  
Rated LO Side Capacitance  
(External)  
Excessive capacitance may drive module into short  
circuit protection  
1000  
Rated LO Side Capacitance (External),  
Parallel Array Operation  
CLO_OUT_AEXT Max = N * 0.5 * CLO_OUT_EXT MAX, where  
N = the number of units in parallel  
Powertrain Hardware Protection Specification – Forward Direction Operation (High Voltage Side to Low Voltage Side)  
• These built-in powertrain protections are fixed in hardware and cannot be configured through PMBus™.  
• When duplicated in supervisory limits, hardware protections serve a secondary role and become active when supervisory limits are  
disabled through PMBus.  
Start up into a persistent fault condition. Non-latching  
fault detection given VHI_DC > VHI_UVLO+  
Auto Restart Time  
tAUTO_RESTART  
VHI_OVLO+  
VHI_OVLO–  
490  
63  
560  
71  
ms  
V
HI Side Overvoltage  
Lockout Threshold  
67  
65  
2
HI Side Overvoltage  
Recovery Threshold  
61  
69  
V
HI Side Overvoltage  
Lockout Hysteresis  
VHI_OVLO_HYST  
tHI_OVLO  
V
HI Side Overvoltage  
Lockout Response Time  
100  
1
µs  
ms  
A
From powertrain active. Fast current limit protection  
disabled during soft start  
HI Side Soft-Start Time  
tHI_SOFT-START  
ILO_OUT_OCP  
tLO_OUT_OCP  
ILO_OUT_SCP  
tLO_OUT_SCP  
tOTP+  
LO Side Overcurrent Trip Threshold  
143  
195  
125  
180  
3
225  
LO Side Overcurrent  
Response Time Constant  
Effective internal RC filter  
ms  
A
LO Side Short Circuit  
Protection Trip Threshold  
LO Side Short Circuit  
Protection Response Time  
1
µs  
°C  
Overtemperature  
Shutdown Threshold  
Internal  
BCM® in a VIA Package  
Page 7 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Electrical Specifications (Cont.)  
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of  
–40°C TCASE 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.  
Attribute  
Symbol  
Conditions / Notes  
Min  
Typ  
Max  
Unit  
Powertrain Supervisory Limits Specification – Forward Direction Operation (High Voltage Side to Low Voltage Side)  
• These supervisory limits are set in the internal controller and can be reconfigured or disabled through PMBus™.  
• When disabled, the powertrain protections presented in the previous table will intervene during fault events.  
HI Side Overvoltage  
Lockout Threshold  
VHI_OVLO+  
VHI_OVLO–  
VHI_OVLO_HYST  
tHI_OVLO  
64  
60  
66  
64  
2
68  
66  
V
V
HI Side Overvoltage  
Recovery Threshold  
HI Side Overvoltage  
Lockout Hysteresis  
V
HI Side Overvoltage  
Lockout Response Time  
100  
28  
30  
2
µs  
V
HI Side Undervoltage  
Lockout Threshold  
VHI_UVLO–  
26  
28  
30  
32  
HI Side Undervoltage  
Recovery Threshold  
VHI_UVLO+  
VHI_UVLO_HYST  
tHI_UVLO  
V
HI Side Undervoltage  
Lockout Hysteresis  
V
HI Side Undervoltage  
Lockout Response Time  
100  
µs  
From VHI_DC = VHI_UVLO+ to powertrain active (i.e., one  
HI Side Undervoltage Start-Up Delay tHI_UVLO+_DELAY time start-up delay from application of VHI_DC  
to VLO_DC  
20  
ms  
)
LO Side Overcurrent  
Trip Threshold  
ILO_OUT_OCP  
tLO_OUT_OCP  
tOTP+  
167  
176  
3
185  
A
LO Side Overcurrent  
Response Time Constant  
Effective internal RC filter  
Internal  
ms  
°C  
°C  
Overtemperature  
Shutdown Threshold  
125  
Overtemperature  
Recovery Threshold  
tOTP–  
Internal  
105  
110  
115  
C-Grade  
T-Grade  
–25  
–45  
Undertemperature Shutdown  
Threshold (Internal)  
tUTP  
°C  
s
Start up into a persistent fault condition. Non-latching  
fault detection given VHI_DC > VHI_UVLO+  
Undertemperature Restart Time  
tUTP_RESTART  
3
BCM® in a VIA Package  
Page 8 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
160  
140  
120  
100  
80  
60  
40  
20  
0
-60  
-40  
-20  
0
20  
40  
60  
80  
100  
120  
Case Temperature (°C)  
36 – 60V  
Figure 1 — Specified thermal operating area  
1. The BCM in a VIA package is cooled through the bottom case (bottom housing).  
2. The thermal rating is based on typical measured device efficiency.  
3. The case temperature in the graph is the measured temperature of the bottom housing, such that the internal operating temperature  
does not exceed 125°C.  
2200  
2000  
1800  
1600  
1400  
1200  
1000  
800  
200  
180  
160  
140  
120  
100  
80  
60  
600  
400  
40  
20  
200  
0
0
36 38 40 42 44 46 48 50 52 54 56 58 60  
36 38 40 42 44 46 48 50 52 54 56 58 60  
HI Side Voltage (V)  
HI Side Voltage (V)  
ILO_OUT_DC  
ILO_OUT_PULSE  
PLO_OUT_DC  
PLO_OUT_PULSE  
Figure 2 — Specified electrical operating area using rated RLO_HOT  
110  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
20  
40  
60  
80  
100  
LO Side Current (% ILO_DC  
)
Figure 3 — Specified HI side start up into load current and external capacitance  
BCM® in a VIA Package  
Page 9 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
PMBus™ Reported Characteristics  
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of  
–40°C TCASE 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted.  
Monitored Telemetry  
• The current telemetry is only available in forward operation. The input and output current reported value is not supported in reverse operation.  
ACCURACY  
(RATED RANGE)  
FUNCTIONAL  
REPORTING RANGE  
UPDATE  
RATE  
ATTRIBUTE  
REPORTED UNITS  
PMBus™ READ COMMAND  
(88h) READ_VIN  
HI Side Voltage  
HI Side Current  
LO Side Voltage [d]  
LO Side Current  
LO Side Resistance  
Temperature [e]  
5% (LL – HL)  
28 to 66V  
–1 to 44A  
100µs  
100µs  
100µs  
100µs  
100ms  
100ms  
VACTUAL = VREPORTED x 10–1  
IACTUAL = IREPORTED x 10–2  
VACTUAL = VREPORTED x 10–1  
IACTUAL = IREPORTED x 10–2  
RACTUAL = RREPORTED x 10–5  
TACTUAL = TREPORTED  
20% (10 – 20% of FL)  
5% (20 – 133% of FL)  
(89h) READ_IIN  
(8Bh) READ_VOUT  
5% (LL – HL)  
7.0 to 16.55V  
–4 to 176A  
20% (10 – 20% of FL)  
5% (20 – 133% of FL)  
(8Ch) READ_IOUT  
5% (50 – 100% of FL) at NL  
10% (50 – 100% of FL) (LL – HL)  
(D4h) READ_ROUT  
500 to 3000µΩ  
–55 to 130ºC  
(8Dh) READ_TEMPERATURE_1  
7°C (Full Range)  
[d] Default READ LO Side Voltage returned when unit is disabled = –300V.  
[e] Default READ Temperature returned when unit is disabled = –273°C.  
Variable Parameters  
• Factory setting of all Thresholds and Warning limits listed below are 100% of specified protection values.  
• Variables can be written only when module is disabled with VHI < VHI_UVLO– and external bias (VDDB) applied.  
• Module must remain in a disabled mode for 3ms after any changes to the variables below to allow sufficient time to commit changes to EEPROM.  
FUNCTIONAL  
REPORTING  
RANGE  
ACCURACY  
(RATED RANGE)  
DEFAULT  
ATTRIBUTE  
PMBusTM COMMAND  
CONDITIONS / NOTES  
VALUE  
100%  
100%  
100%  
100%  
100%  
100%  
100%  
0ms  
HI Side Overvoltage  
Protection Limit  
VHI_OVLO– is automatically 3%  
lower than this set point  
(55h) VIN_OV_FAULT_LIMIT  
(57h) VIN_OV_WARN_LIMIT  
(D7h) DISABLE_FAULTS  
(5Bh) IIN_OC_FAULT_LIMIT  
(5Dh) IIN_OC_WARN_LIMIT  
(4Fh) OT_FAULT_LIMIT  
5% (LL – HL)  
5% (LL – HL)  
5% (LL – HL)  
28 – 66V  
28 – 66V  
14 – 36V  
0 – 44A  
HI Side Overvoltage  
Warning Limit  
HI Side Undervoltage  
Protection Limit  
Can only be disabled to a preset  
default value  
HI Side Overcurrent  
Protection Limit  
20% (10 – 20% of FL)  
5% (20 – 133% of FL)  
HI Side Overcurrent  
Warning Limit  
20% (10 – 20% of FL)  
5% (20 – 133% of FL)  
0 – 44A  
Overtemperature  
Protection Limit  
Internal temperature  
Internal temperature  
7°C (Full Range)  
7°C (Full Range)  
50µs  
0 – 125°C  
0 – 125°C  
0 – 100ms  
Overtemperature  
Warning Limit  
(51h) OT_WARN_LIMIT  
(60h) TON_DELAY  
Additional time delay to the  
undervoltage start-up delay  
Turn On Delay  
BCM® in a VIA Package  
Page 10 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Signal Characteristics  
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of  
–40°C TCASE 100°C (T-Grade); all other specifications are at TCASE = 25ºC unless otherwise noted. Please note: For chassis mount model, Vicor part  
number 42550 will be needed for applications requiring the use of the signal pins. Signal cable 42550 is rated up to five insertions and extractions. To avoid  
unnecessary stress on the connector, the cable should be appropriately strain relieved.  
EXT. BIAS (VDDB) Pin  
• VDDB powers the internal controller.  
• VDDB needs to be applied to enable and disable the BCM through PMBus™ control (using OPERATION COMMAND), and to adjust warning and  
protection thresholds.  
• VDDB voltage not required for telemetry; however, if VDDB is not applied, telemetry information will be lost when VIN is removed.  
SIGNAL TYPE  
STATE  
ATTRIBUTE  
VDDB Voltage  
SYMBOL  
VVDDB  
CONDITIONS / NOTES  
MIN  
TYP  
MAX UNIT  
4.5  
5
9
V
mA  
A
Regular  
Operation  
VDDB Current Consumption  
Inrush Current Peak  
Turn On Time  
IVDDB  
50  
INPUT  
IVDDB_INR  
tVDDB_ON  
VVDDB slew rate = 1V/µs  
From VVDDB_MIN to PMBus active  
3.5  
1.5  
Start Up  
ms  
SGND Pin  
• All PMBus interface signals (SCL, SDA, ADDR) are referenced to SGND pin.  
• SGND pin also serves as return pin (ground pin) for VDDB.  
• Keep SGND signal separated from the low voltage side power return terminal (–LO) in electrical design.  
Address (ADDR) Pin  
• This pin programs the address using a resistor between ADDR pin and signal ground.  
• The address is sampled during start up and is stored until power is reset. This pin programs only a Fixed and Persistent address.  
• This pin has an internal 10kΩ pullup resistor to 3.3V.  
• 16 addresses are available. The range of each address is 206.25mV (total range for all 16 addresses is 0V to 3.3V).  
SIGNAL TYPE  
STATE  
ATTRIBUTE  
ADDR Input Voltage  
ADDR Leakage Current  
ADDR Registration Time  
SYMBOL  
VSADDR  
ISADDR  
CONDITIONS / NOTES  
See address section  
MIN  
TYP  
MAX UNIT  
0
3.3  
1
V
Regular  
Operation  
MULTI–LEVEL  
INPUT  
Leakage current  
From VVDDB_MIN  
µA  
ms  
Start Up  
tSADDR  
1
BCM® in a VIA Package  
Page 11 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Serial Clock input (SCL) AND Serial Data (SDA) Pins  
• High power SMBus specification and SMBus physical layer compatible. Note that optional SMBALERT# is not supported.  
• PMBusTM command compatible.  
SIGNAL TYPE  
STATE  
ATTRIBUTE  
SYMBOL  
CONDITIONS / NOTES  
MIN  
TYP  
MAX UNIT  
Electrical Parameters  
VIH  
VIL  
2.1  
3
V
Input Voltage Threshold  
Output Voltage Threshold  
0.8  
V
V
VOH  
VOL  
0.4  
10  
V
Leakage Current  
ILEAK_PIN  
ILOAD  
Unpowered device  
µA  
mA  
Signal Sink Current  
VOL = 0.4V  
4
Total capacitive load of  
one device pin  
Signal Capacitive Load  
CI  
10  
pF  
Signal Noise Immunity  
Timing Parameters  
Operating Frequency  
VNOISE_PP  
10MHz to 100MHz  
300  
mV  
FSMB  
tBUF  
tHD:STA  
tSU:STA  
Idle state = 0Hz  
10  
400  
kHz  
µs  
Free Time Between  
Stop and Start Condition  
1.3  
DIGITAL  
Regular  
Hold Time After Start or  
Repeated Start Condition  
First clock is generated  
after this hold time  
INPUT/OUTPUT  
Operation  
0.6  
0.6  
µs  
µs  
Repeat Start Condition  
Setup Time  
Stop Condition Setup Time  
Data Hold Time  
tSU:STO  
tHD:DAT  
tSU:DAT  
tTIMEOUT  
tLOW  
0.6  
300  
100  
25  
µs  
ns  
ns  
ms  
µs  
µs  
Data Setup Time  
Clock Low Time Out  
Clock Low Period  
35  
1.3  
0.6  
Clock High Period  
tHIGH  
50  
25  
Cumulative Clock Low  
Extend Time  
tLOW:SEXT  
ms  
ns  
ns  
Clock or Data Fall Time  
Clock or Data Rise Time  
tF  
20  
20  
300  
300  
tR  
tLOW tR  
tF  
SCL  
VIH  
VIL  
tHIGH  
tSU,DAT  
tHD,STA  
tHD,DAT  
tSU,STA  
tSU,STO  
SDA  
VIH  
VIL  
tBUF  
P
S
S
P
BCM® in a VIA Package  
Page 12 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Timing Diagram (Forward Direction)  
BCM® in a VIA Package  
Page 13 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Application Characteristics  
Temperature controlled via top side cold plate, unless otherwise noted. All data presented in this section are collected from units processing power in the  
forward direction (high voltage side to low voltage side). See associated figures for general trend data.  
30  
27  
24  
21  
18  
15  
12  
9
98.0  
97.0  
96.0  
95.0  
94.0  
6
3
0
-40  
-20  
0
20  
40  
60  
80  
100  
36 38 40 42 44 46 48 50 52 54 56 58 60  
HI Side Voltage (V)  
Case Temperature (ºC)  
TCASE  
:
VHI_DC:  
-40°C  
25°C  
85°C  
36V  
54V  
60V  
Figure 4 — No load power dissipation vs. VHI_DC  
Figure 5 — Full load efficiency vs. temperature  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
99  
97  
95  
93  
91  
89  
87  
85  
83  
81  
79  
0
13  
26  
39  
52  
65  
78  
91 104 117 130  
60V  
0
13  
26  
39  
52  
65  
78  
91 104 117 130  
LO Side Current (A)  
LO Side Current (A)  
VHI_DC  
:
36V  
54V  
VHI_DC  
:
36V  
54V 60V  
Figure 6 — Efficiency at TCASE = –40°C  
Figure 7 — Power dissipation at TCASE = –40°C  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
99  
97  
95  
93  
91  
89  
87  
85  
83  
81  
79  
0
13  
26  
39  
52  
65  
78  
91 104 117 130  
60V  
0
13  
26  
39  
52  
65  
78  
91 104 117 130  
LO Side Current (A)  
LO Side Current (A)  
VHI_DC  
:
36V  
54V  
VHI_DC  
:
36V  
54V 60V  
Figure 8 — Efficiency at TCASE = 25°C  
Figure 9 — Power dissipation at TCASE = 25°C  
BCM® in a VIA Package  
Page 14 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
99  
97  
95  
93  
91  
89  
87  
85  
83  
81  
79  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
13  
26  
39  
52  
65  
78  
91 104 117 130  
60V  
0
13  
26  
39  
52  
65  
78  
91 104 117 130  
LO Side Current (A)  
LO Side Current (A)  
VHI_DC  
:
36V  
54V  
VHI_DC  
:
36V  
54V 60V  
Figure 10 — Efficiency at TCASE = 85°C  
Figure 11 — Power dissipation at TCASE = 85°C  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0.0  
300  
270  
240  
210  
180  
150  
120  
90  
60  
30  
0
0
13  
26  
39  
52  
65  
78  
91 104 117 130  
-40  
-20  
0
20  
40  
60  
80  
100  
LO Side Current (A)  
Case Temperature (°C)  
VHI_DC  
:
54V  
ILO_DC  
:
130A  
Figure 12 — RLO vs. temperature; Nominal VHI_DC  
Figure 13 — VLO_OUT_PP vs. ILO_DC ; No external CLO_OUT_EXT Board  
.
ILO_DC = 130A at TCASE = 85°C  
mounted module, scope setting: 20MHz analog BW  
BCM® in a VIA Package  
Page 15 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Figure 14 — Full load LO side voltage ripple, 300µF CHI_IN_EXT  
;
Figure 15 — 0A – 130A transient response:  
no external CLO_OUT_EXT Board mounted module,  
CHI_IN_EXT = 300µF, no external CLO_OUT_EXT  
.
scope setting: 20MHz analog BW  
Figure 16 — 130A – 0A transient response:  
Figure 17 — Start up from application of VHI_DC = 54V, 20% ILO_DC  
CHI_IN_EXT = 300µF, no external CLO_OUT_EXT  
100% CLO_OUT_EXT  
Figure 18 — Start up from application of OPERATION COMMAND  
with pre-applied VHI_DC = 54V, 20% ILO_DC  
,
100% CLO_OUT_EXT  
BCM® in a VIA Package  
Page 16 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
General Characteristics  
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of  
–40°C TCASE 100°C (T-Grade); All other specifications are at TCASE = 25ºC unless otherwise noted.  
Attribute  
Symbol  
Conditions / Notes  
Min  
Typ  
Max  
Unit  
Mechanical  
Length  
L
L
Lug (Chassis) Mount  
95.34 [3.75]  
97.55 [3.84]  
35.29 [1.39]  
9.019 [0.355]  
95.59 [3.76]  
97.80 [3.85]  
35.54 [1.40]  
9.40 [0.37]  
31.93 [1.95]  
130.4 [4.6]  
95.84 [3.77]  
98.05 [3.86]  
35.79 [1.41]  
9.781 [0.385]  
mm [in]  
mm [in]  
mm [in]  
mm [in]  
cm3 [in3]  
g [oz]  
Length  
PCB (Board) Mount  
Width  
W
H
Height  
Volume  
Weight  
Vol  
W
Without heatsink  
Pin Material  
Underplate  
C145 copper  
Low stress ductile Nickel  
Palladium  
50  
0.8  
100  
6
µin  
µin  
µin  
Pin Finish (Gold)  
Pin Finish (Tin)  
Soft Gold  
0.12  
200  
2
Whisker resistant matte Tin  
400  
Thermal  
BCM3814x60E15A3yzz (T-Grade)  
BCM3814x60E15A3yzz (C-Grade)  
–40  
–20  
125  
125  
Operating Internal Temperature  
Operating Case Temperature  
TINT  
BCM3814x60E15A3yzz (T-Grade),  
derating applied, see safe thermal  
operating area  
–40  
–20  
100  
100  
°C  
TCASE  
BCM3814x60E15A3yzz (C-Grade),  
derating applied, see safe thermal  
operating area  
Estimated thermal resistance to  
maximum temperature internal  
component from isothermal top  
Thermal Resistance Top Side  
θINT_TOP  
0.97  
0.58  
°C/W  
°C/W  
Estimated thermal resistance of thermal  
coupling between the top and bottom  
case surfaces  
Thermal Resistance Coupling Between  
Top Case and Bottom Case  
θHOU  
Estimated thermal resistance to  
maximum temperature internal  
component from isothermal bottom  
Thermal Resistance Bottom Side  
Thermal Capacity  
θINT_BOT  
0.59  
52  
°C/W  
Ws/°C  
Assembly  
BCM3814x60E15A3yzz (T-Grade)  
BCM3814x60E15A3yzz (C-Grade)  
–40  
–40  
125  
125  
°C  
°C  
Storage Temperature  
ESD Withstand  
TST  
Human Body Model,  
“ESDA / JEDEC JDS-001-2012” Class I-C  
(1kV to < 2kV)  
ESDHBM  
1000  
200  
Charge Device Model,  
“JESD 22-C101-E” Class II (200V to  
< 500V)  
ESDCDM  
BCM® in a VIA Package  
Page 17 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
General Characteristics (Cont.)  
Specifications apply over all line and load conditions, unless otherwise noted; boldface specifications apply over the temperature range of  
–40°C TCASE 100°C (T-Grade); All other specifications are at TCASE = 25ºC unless otherwise noted.  
Attribute  
Symbol  
Conditions / Notes  
Safety  
Min  
Typ  
Max  
Unit  
Isolation Capacitance  
CHI_LO  
RHI_LO  
Unpowered unit  
620  
10  
780  
940  
pF  
Isolation Resistance  
At 500VDC  
MΩ  
MIL-HDBK-217Plus Parts Count - 25°C  
Ground Benign, Stationary, Indoors /  
Computer  
2.2  
3.6  
MHrs  
MHrs  
MTBF  
Telcordia Issue 2 - Method I Case III;  
25°C Ground Benign, Controlled  
cTÜVus EN 60950-1  
cURus UL60950-1  
Agency Approvals / Standards  
CE Marked for Low Voltage Directive and RoHS Recast Directive, as applicable  
BCM® in a VIA Package  
Page 18 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
BCM in a VIA Package  
IHI  
ILO  
RLO  
+
+
V•I  
K
K ILO  
K VHI  
+
+
VHI  
VLO  
IHI_Q  
Figure 19 — BCM DC model (Forward Direction)  
The BCM uses a high frequency resonant tank to move energy  
from the high voltage side to the low voltage side and vice versa.  
The resonant LC tank, operated at high frequency, is amplitude  
modulated as a function of the HI side voltage and the LO side  
current. A small amount of capacitance embedded in the high  
voltage side and low voltage side stages of the module is sufficient  
for full functionality and is key to achieving high power density.  
The effective DC voltage transformer action provides additional  
interesting attributes. Assuming that RLO = 0Ω and IHI_Q = 0A,  
Equation 3 now becomes Equation 1 and is essentially load  
independent, resistor R is now placed in series with VHI.  
R
The BCM3814x60E15A3yzz can be simplified into the model  
shown in Figure 19.  
BCM  
V
LO
+
K = 1/4  
VHI  
At no load:  
VLO = VHI • K  
(1)  
K represents the “turns ratio” of the BCM.  
Rearranging Eq (1):  
Figure 20 — K = 1/4 BCM with series HI side resistor  
The relationship between VHI and VLO becomes:  
V = V – I • R • K  
VLO  
K =  
(2)  
VHI  
(5)  
(
)
LO  
HI  
HI  
In the presence of a load, VLO is represented by:  
Substituting the simplified version of Equation 4  
(IHI_Q is assumed = 0A) into Equation 5 yields:  
VLO = VHI • K – ILO • RLO  
(3)  
VLO = VHI • K – ILO • R • K2  
(6)  
and ILO is represented by:  
This is similar in form to Equation 3, where RLO is used to represent  
the characteristic impedance of the BCM. However, in this case a  
real resistor, R, on the high voltage side of the BCM is effectively  
scaled by K2 with respect to the low voltage side.  
IHI – IHI_Q  
(4)  
ILO  
=
K
RLO represents the impedance of the BCM and is a function of the  
RDS_ON of the HI side and LO side MOSFETs, PC board resistance of  
HI side and LO side boards and the winding resistance of the power  
transformer. IHI_Q represents the HI side quiescent current of the  
BCM controller, gate drive circuitry and core losses.  
Assuming that R = 1Ω, the effective R as seen from the low voltage  
side is 62.5mΩ, with K = 1/4.  
BCM® in a VIA Package  
Page 19 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
A similar exercise can be performed with the addition of a  
capacitor or shunt impedance at the high voltage side of the  
BCM. A switch in series with VHI is added to the circuit. This is  
depicted in Figure 21.  
Low impedance is a key requirement for powering a high-current,  
low-voltage load efficiently. A switching regulation stage  
should have minimal impedance while simultaneously providing  
appropriate filtering for any switched current. The use of a BCM  
between the regulation stage and the point of load provides a  
dual benefit of scaling down series impedance leading back to  
the source and scaling up shunt capacitance or energy storage  
as a function of its K factor squared. However, these benefits are  
not achieved if the series impedance of the BCM is too high. The  
impedance of the BCM must be low, i.e., well beyond the crossover  
frequency of the system.  
S
BCM  
V
+
LO  
K = 1/4  
C
V
HI  
A solution for keeping the impedance of the BCM low involves  
switching at a high frequency. This enables the use of small  
magnetic components because magnetizing currents remain low.  
Small magnetics mean small path lengths for turns. Use of low loss  
core material at high frequencies also reduces core losses.  
Figure 21 — BCM with HI side capacitor  
The two main terms of power loss in the BCM module are:  
A change in VHI with the switch closed would result in a change in  
capacitor current according to the following equation:  
nNo load power dissipation (PHI_NL): defined as the power used to  
power up the module with an enabled powertrain at no load.  
nResistive loss (PRLO): refers to the power loss across the BCM  
dVHI  
module modeled as pure resistive impedance.  
IC (t) = C  
(7)  
dt  
PDISSIPATED = PHI_NL + PR  
(10)  
LO  
Assume that with the capacitor charged to VHI, the switch is  
opened and the capacitor is discharged through the idealized  
BCM. In this case,  
Therefore,  
PLO_OUT = PHI_IN – PDISSIPATED = PHI_IN – PHI_NL – PR  
(11)  
LO  
IC = ILO • K  
(8)  
The above relations can be combined to calculate the overall  
module efficiency:  
substituting Equation 1 and 8 into Equation 7 reveals:  
C
dVLO  
dt  
PLO_OUT  
PHI_IN  
PHI_IN – PHI_NL – PR  
PHI_IN  
ILO(t) =  
(9)  
K2  
LO  
η =  
=
(12)  
The equation in terms of the LO side has yielded a K2 scaling factor  
for C, specified in the denominator of the equation.  
A K factor less than unity results in an effectively larger capacitance  
on the low voltage side when expressed in terms of the high  
voltage side. With a K = 1/4 as shown in Figure 21, C = 1µF would  
2
VHI • IHI – PHI_NL – I  
• RLO  
( LO)  
=
VHI • IHI  
appear as C = 16µF when viewed from the low voltage side.  
2
PHI_NL + I  
• RLO  
( LO)  
= 1 –  
( )  
VHI • IHI  
BCM® in a VIA Package  
Page 20 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Filter Design  
Thermal Considerations  
The VIA package provides effective conduction cooling from either  
of the two module surfaces. Heat may be removed from the top  
surface, the bottom surface or both. The extent to which these  
two surfaces are cooled is a key component for determining the  
maximum power that can be processed by a VIA, as can be seen  
from the specified thermal operating area in Figure 1. Since the  
VIA has a maximum internal temperature rating, it is necessary to  
estimate this internal temperature based on a system-level thermal  
solution. For this purpose, it is helpful to simplify the thermal  
solution into a roughly equivalent circuit where power dissipation  
is modeled as a current source, isothermal surface temperatures  
are represented as voltage sources and the thermal resistances are  
represented as resistors. Figure 22 shows the “thermal circuit” for  
the VIA module.  
A major advantage of BCM systems versus conventional PWM  
converters is that the transformer based BCM does not require  
external filtering to function properly. The resonant LC tank,  
operated at extreme high frequency, is amplitude modulated as  
a function of HI side voltage and LO side current and efficiently  
transfers charge through the isolation transformer. A small amount  
of capacitance embedded in the high voltage side and low voltage  
side stages of the module is sufficient for full functionality and is  
key to achieving power density.  
This paradigm shift requires system design to carefully evaluate  
external filters in order to:  
Guarantee low source impedance:  
To take full advantage of the BCM module’s dynamic response,  
the impedance presented to its HI side terminals must be low  
from DC to approximately 5MHz. The connection of the bus  
converter module to its power source should be implemented  
with minimal distribution inductance. If the interconnect  
inductance exceeds 100nH, the HI side should be bypassed  
with a RC damper to retain low source impedance and stable  
operation. With an interconnect inductance of 200nH, the RC  
damper may be as high as 1µF in series with 0.3Ω. A single  
electrolytic or equivalent low-Q capacitor may be used in place  
of the series RC bypass.  
+
θINT_TOP  
TC_TOP  
θHOU  
s
TC_BOT  
θINT_BOT  
+
PDISS  
Further reduce HI side and/or LO side voltage ripple  
without sacrificing dynamic response:  
s
Given the wide bandwidth of the module, the source response  
is generally the limiting factor in the overall system response.  
Anomalies in the response of the source will appear at the LO  
side of the module multiplied by its K factor.  
Figure 22 — Double-sided cooling VIA thermal model  
In this case, the internal power dissipation is PDISS, θINT_TOP and  
θ
INT_BOT are the thermal resistance characteristics of the VIA module  
Protect the module from overvoltage transients imposed  
by the system that would exceed maximum ratings and  
induce stresses:  
and the top and bottom surface temperatures are represented  
as TC_TOP and TC_BOT. It is interesting to note that the package  
itself provides a high degree of thermal coupling between the  
top and bottom case surfaces (represented in the model by the  
resistor θHOU). This feature enables two main options regarding  
thermal designs:  
The module high side/low side voltage ranges shall not be  
exceeded. An internal overvoltage lockout function prevents  
operation outside of the normal operating HI side range. Even  
when disabled, the powertrain is exposed to the applied voltage  
and the power MOSFETs must withstand it.  
nSingle side cooling: the model of Figure 22 can be simplified by  
calculating the parallel resistor network and using one simple  
thermal resistance number and the internal power dissipation  
curves; an example for bottom side cooling only is shown in  
Figure 23.  
Total load capacitance at the LO side of the BCM module shall not  
exceed the specified maximum. Owing to the wide bandwidth  
and small LO side impedance of the module, low-frequency bypass  
capacitance and significant energy storage may be more densely  
and efficiently provided by adding capacitance at the HI side of  
the module. At frequencies <500kHz the module appears as an  
impedance of RLO between the source and load.  
In this case, θINT can be derived as follows:  
INT_TOP + θHOU) • θINT_BOT  
θINT_TOP + θHOU + θINT_BOT  
(14)  
θINT  
=
Within this frequency range, capacitance at the HI side appears as  
effective capacitance on the LO side per the relationship defined  
in Equation 13.  
CHI_EXT  
K
CLO_EXT  
=
(13)  
2
This enables a reduction in the size and number of capacitors used  
in a typical system.  
BCM® in a VIA Package  
Page 21 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
ZIN_EQ1  
ZOUT_EQ1  
BCM®1  
R0_1  
VLO  
VHI  
ΦINT  
+ TC_BOT  
s
ZOUT_EQ2  
ZIN_EQ2  
BCM®2  
R0_2  
PDISS  
+
Load  
DC  
s
Figure 23 — Single-sided cooling VIA thermal model  
ZOUT_EQn  
BCM®n  
R0_n  
ZIN_EQn  
nDouble side cooling: while this option might bring limited  
advantage to the module internal components (given the  
surface-to-surface coupling provided), it might be appealing  
in cases where the external thermal system requires allocating  
power to two different elements, such as heatsinks with  
independent airflows or a combination of chassis/air cooling.  
Figure 24 — BCM module array  
Fuse Selection  
Current Sharing  
In order to provide flexibility in configuring power systems, BCM in  
a VIA package modules are not internally fused. Input line fusing  
of BCM products is recommended at the system level to provide  
thermal protection in case of catastrophic failure.  
The performance of the BCM is based on efficient transfer  
of energy through a transformer without the need of closed  
loop control. For this reason, the transfer characteristic can be  
approximated by an ideal transformer with a positive temperature  
coefficient series resistance.  
The fuse shall be selected by closely matching system  
requirements with the following characteristics:  
This type of characteristic is close to the impedance characteristic  
of a DC power distribution system both in dynamic (AC) behavior  
and for steady state (DC) operation.  
nCurrent rating  
(usually greater than maximum current of BCM module)  
nMaximum voltage rating  
(usually greater than the maximum possible input voltage)  
When multiple BCM modules of a given part number are  
connected in an array, they will inherently share the load current  
according to the equivalent impedance divider that the system  
implements from the power source to the point of load. Ensuring  
equal current sharing among modules requires that BCM array  
impedances be matched.  
nAmbient temperature  
nNominal melting I2t  
nRecommend fuse: 40A Littlefuse 456 Series (HI side)  
Some general recommendations to achieve matched array  
impedances include:  
Reverse Operation  
BCM modules are capable of reverse power operation. Once the  
unit is started, energy will be transferred from the low voltage  
side back to the high voltage side whenever the low side voltage  
exceeds VHI • K. The module will continue operation in this fashion  
as long as no faults occur.  
nDedicate common copper planes/wires within the PCB/Chassis to  
deliver and return the current to the modules.  
nProvide as symmetric a PCB/Wiring layout as possible among  
modules  
For further details see AN:016 Using BCM Bus Converters  
in High Power Arrays.  
The BCM3814x60E15A3yzz has not been qualified for continuous  
operation in a reverse power condition. However, fault protections  
that help to protect the module in forward operation will also  
protect the module in reverse operation.  
Transient operation in reverse is expected in cases where there is  
significant energy storage on the low voltage side and transient  
voltages appear on the high voltage side.  
BCM® in a VIA Package  
Page 22 of 41  
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BCM3814x60E15A3yzz  
System Diagram for PMBus™ Interface  
5V  
EXT_BIAS  
SCL  
SDA  
SCL  
BCM in a VIA  
Package  
Host  
PMBus™  
SDA  
SGND  
ADDR  
SGND  
The controller of the BCM in a VIA package is referenced to the low voltage side signal ground (SGND).  
The BCM in a VIA package provides the Host PMBus system with accurate telemetry monitoring and reporting, threshold and warning limits  
adjustment, in addition to corresponding status flags. The standalone BCM is periodically polled for status by the host PMBus. Direct communication  
to the BCM is enabled by a page command. For example, the page (0x00) prior to a telemetry inquiry points to the controller data and page (0x01)  
prior to a telemetry inquiry points to the BCM parameters.  
The BCM enables the PMBus compatible host interface with an operating bus speed of up to 400kHz. The BCM follows the PMBus command  
structure and specification.  
BCM® in a VIA Package  
Page 23 of 41  
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BCM3814x60E15A3yzz  
Where:  
PMBus™ Interface  
Refer to “PMBus Power System Management Protocol Specification  
Revision 1.2, Part I and II” for complete PMBus specifications details  
at http://pmbus.org.  
X, is a “real world” value in units (A, V, °C, s)  
Y, is a two’s complement integer received from the BCM controller  
m, b and R are two’s complement integers defined as follows:  
Device Address  
Command  
TON_DELAY  
Code  
60h  
88h  
89h  
8Bh  
8Ch  
8Dh  
96h  
A0h  
A1h  
A4h  
A5h  
A6h  
A7h  
D1h  
D4h  
m
R
3
1
3
1
2
0
0
0
0
0
0
0
0
0
5
b
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
The PMBus address (ADDR Pin) should be set to one of the  
predetermined 16 possible addresses shown in the table below  
using a resistor between the ADDR pin and SGND pin.  
READ_VIN  
1
READ_IIN  
1
The BCM accepts only a fixed and persistent address and does not  
support SMBus address resolution protocol. At initial power up, the  
BCM controller will sample the address pin voltage and will keep  
this address until device power is removed.  
READ_VOUT [f]  
READ_IOUT  
1
1
READ_TEMPERATURE_1 [g]  
READ_POUT  
1
Slave  
Address  
Recommended  
Resistor RADDR (Ω)  
ID  
HEX  
1
MFR_VIN_MIN  
MFR_VIN_MAX  
MFR_VOUT_MIN  
MFR_VOUT_MAX  
MFR_IOUT_MAX  
MFR_POUT_MAX  
READ_K_FACTOR  
READ_BCM_ROUT  
1
1
2
1010 000b  
1010 001b  
1010 010b  
1010 011b  
1010 100b  
1010 101b  
1010 110b  
1010 111b  
1011 000b  
1011 001b  
1011 010b  
1011 011b  
1011 100b  
1011 101b  
1011 110b  
1011 111b  
50h  
51h  
52h  
53h  
54h  
55h  
56h  
57h  
58h  
59h  
5Ah  
5Bh  
5Ch  
5Dh  
5Eh  
5Fh  
487  
1050  
1
1
3
1870  
1
4
2800  
1
5
3920  
1
65536  
1
6
5230  
7
6810  
8
8870  
[f] Default READ LO side voltage returned when BCM unit is disabled = –300V.  
[g] Default READ Temperature returned when BCM unit is disabled = –273°C.  
9
11300  
14700  
19100  
25500  
35700  
53600  
97600  
316000  
10  
11  
12  
13  
14  
15  
16  
No special formatting is required when lowering the supervisory  
limits and warnings.  
Reported DATA Formats  
The BCM controller employs a direct data format where all  
reported measurements are in Volts, Amperes, Degrees Celsius,  
or Seconds. The host uses the following PMBus specification  
to interpret received values metric prefixes. Note that the  
COEFFICIENTS command is not supported:  
1
m
X =  
(
• (Y • 10-R - b)  
)
BCM® in a VIA Package  
Page 24 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Supported Command List  
Command  
Code  
Function  
Default Data Content  
Data Bytes  
PAGE  
00h  
01h  
Access BCM stored information  
Turn BCM on or off  
00h  
80h  
N/A  
20h  
64h  
64h  
64h  
64h  
64h  
64h  
00h  
00h  
00h  
00h  
00h  
1
1
OPERATION  
CLEAR_FAULTS  
CAPABILITY  
03h  
Clear all faults  
Controller PMBusTM key capabilities set by factory  
None  
1
19h  
OT_FAULT_LIMIT  
OT_WARN_LIMIT  
VIN_OV_FAULT_LIMIT  
VIN_OV_WARN_LIMIT  
IIN_OC_FAULT_LIMIT  
IIN_OC_WARN_LIMIT  
TON_DELAY  
4Fh [h]  
51h [h]  
55h [h]  
57h [h]  
5Bh [h]  
5Dh [h]  
60h [h]  
78h  
Overtemperature protection  
2
Overtemperature warning  
2
High voltage side overvoltage protection  
High voltage side overvoltage warning  
High voltage side overcurrent protection  
High voltage side overcurrent warning  
Start-up delay in addition to fixed delay  
Summary of faults  
2
2
2
2
2
STATUS_BYTE  
1
STATUS_WORD  
STATUS_IOUT  
79h  
Summary of fault conditions  
2
7Bh  
Overcurrent fault status  
1
STATUS_INPUT  
7Ch  
Overvoltage and undervoltage fault status  
1
Overtemperature and undertemperature  
fault status  
STATUS_TEMPERATURE  
7Dh  
00h  
1
STATUS_CML  
7Eh  
80h  
88h  
89h  
8Bh  
8Ch  
8Dh  
96h  
98h  
99h  
9Ah  
9Bh  
9Ch  
9Dh  
9Eh  
PMBus communication fault  
Other BCM status indicator  
00h  
00h  
1
1
STATUS_MFR_SPECIFIC  
READ_VIN  
Reads HI side voltage  
FFFFh  
2
READ_IIN  
Reads HI side current  
FFFFh  
2
READ_VOUT  
Reads LO side voltage  
FFFFh  
2
READ_IOUT  
Reads LO side current  
FFFFh  
2
READ_TEMPERATURE_1  
READ_POUT  
Reads internal temperature  
FFFFh  
2
Reads LO side power  
FFFFh  
2
PMBUS_REVISION  
MFR_ID  
PMBus compatible revision  
22h  
1
BCM controller ID  
“VI”  
2
MFR_MODEL  
Internal controller or BCM model  
Internal controller or BCM revision  
Internal controller or BCM factory location  
Internal controller or BCM manufacturing date  
Internal controller or BCM serial number  
Minimum rated high side voltage  
Maximum rated high side voltage  
Minimum rated low side voltage  
Maximum rated low side voltage  
Maximum rated low side current  
Maximum rated low side power  
Reads K factor  
Part Number  
FW and HW revision  
“AP”  
18  
18  
2
MFR_REVISION  
MFR_LOCATION  
MFR_DATE  
“YYWW”  
Serial Number  
Varies per BCM  
Varies per BCM  
Varies per BCM  
Varies per BCM  
Varies per BCM  
Varies per BCM  
Varies per BCM  
Varies per BCM  
646464646464h  
4
MFR_SERIAL  
16  
2
MFR_VIN_MIN  
MFR_VIN_MAX  
MFR_VOUT_MIN  
MFR_VOUT_MAX  
MFR_IOUT_MAX  
MFR_POUT_MAX  
READ_K_FACTOR  
READ_BCM_ROUT  
SET_ALL_THRESHOLDS  
A0h  
A1h  
A4h  
A5h  
A6h  
A7h  
D1h  
D4h  
D5h [h]  
2
2
2
2
2
2
Reads low voltage side output resistance  
Set supervisory warning and protection thresholds  
2
6
Disable overvoltage, overcurrent or  
undervoltage supervisory faults  
DISABLE_FAULT  
D7h [h]  
00h  
2
[h] The BCM must be in a disabled state with VHI < VHI_UVLO– and VDDB applied during a write message.  
BCM® in a VIA Package  
Page 25 of 41  
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BCM3814x60E15A3yzz  
Command Structure Overview  
Write Byte protocol:  
The Host always initiates PMBus™ communication with a START bit. All messages are terminated by the Host with a STOP bit. In a write  
message, the master sends the slave device address followed by a write bit. Once the slave acknowledges, the master proceeds with the  
command code and then similarly the data byte.  
1
7
1
1
8
1
8
1
1
S
Slave Address Wr  
A
Command Code  
A
x = 0  
Data Byte  
A
x = 0  
P
x = 0 x = 0  
S
Start Condition  
Repeated start Condition  
Sr  
Rd Read  
Wr Write  
X
A
P
Indicated that field is required to have the value of x  
Acknowledge (bit may be 0 for an ACK or 1 for a NACK)  
Stop Condition  
From Master to Slave  
From Slave to Master  
Continued next line  
Figure 1 — PAGE COMMAND (00h), WRITE BYTE PROTOCOL  
Read Byte protocol:  
A Read message begins by first sending a Write Command, followed by a REPEATED START Bit and a slave Address. After receiving the  
READ bit, the BCM controller begins transmission of the Data responding to the Command. Once the Host receives the requested Data, it  
terminates the message with a NACK preceding a stop condition signifying the end of a read transfer.  
1
7
1
1
8
1
1
7
1
1
8
1
1
S
Slave Address Wr  
A
Command Code  
A
x = 0  
Sr Slave Address Rd  
A
Data Byte  
A
x = 1  
P
x = 0 x = 0  
x = 1 x = 0  
Figure 2 — ON_OFF_CONFIG COMMAND (02h), READ BYTE PROTOCOL  
BCM® in a VIA Package  
Page 26 of 41  
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BCM3814x60E15A3yzz  
Write Word protocol:  
When transmitting a word, the lowest order byte leads the highest order byte. Furthermore, when transmitting a Byte, the least significant  
bit (LSB) is sent last. Refer to System Management Bus (SMBus) specification version 2.0 for more details.  
Note: Extended command and Packet Error Checking Protocols are not supported.  
1
7
1
1
8
1
8
1
8
1
1
S
Slave Address Wr  
A
Command Code  
A
x = 0  
Data Byte Low  
A
x = 0  
Data Byte High  
A
x = 0  
P
x = 0 x = 0  
Figure 3 — TON_DELAY COMMAND (D6h)_WRITE WORD PROTOCOL  
Read Word protocol:  
1
7
1
1
8
1
1
7
1
1
8
1
8
1
1
S
Slave Address Wr  
A
Command Code  
A
x = 0  
Sr Slave Address Rd  
A
Data Byte Low  
A
x = 0  
Data Byte High  
A
x = 1  
P
x = 0 x = 0  
x = 1 x = 0  
Figure 4 — MFR_VIN_MIN COMMAND (88h)_READ WORD PROTOCOL  
Write Block protocol:  
1
7
1
1
8
1
8
1
8
1
S
Slave Address Wr  
A
Command Code  
A
x = 0  
Byte Count = N  
A
x = 0  
Data Byte 1  
A
x = 0  
...  
x = 0 x = 0  
...  
8
1
8
1
1
Data Byte 2  
A
x = 0  
...  
...  
Data Byte N  
A
x = 0  
P
Figure 5 — SET_ALL_THRESHOLDS COMMAND (D5h)_WRITE BLOCK PROTOCOL  
BCM® in a VIA Package  
Page 27 of 41  
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BCM3814x60E15A3yzz  
Read Block protocol:  
1
7
1
1
8
1
1
7
1
1
8
1
S
Slave Address Wr  
A
Command Code  
A
x = 0  
Sr Slave Address Rd  
A
Data Byte = N  
A
x = 0  
...  
x = 0 x = 0  
x = 1 x = 0  
...  
8
1
8
1
8
1
1
Data Byte 1  
A
x = 0  
Data Byte 2  
A
x = 0  
...  
...  
Data Byte N  
A
x = 1  
P
Figure 6 — SET_ALL_THRESHOLDS COMMAND (D5h)_READ BLOCK PROTOCOL  
Write Group Command protocol:  
Note that only one command per device is allowed in a group command.  
1
7
1
1
8
1
8
1
8
1
S
Slave Address Wr  
A
Command Code  
A
x = 0  
Data Byte Low  
A
x = 0  
Data Byte High  
One or more Data Bytes  
A
x = 0  
...  
First Device  
x = 0 x = 0  
First Command  
1
7
1
1
8
1
8
1
8
1
Sr Slave Address Wr  
A
Command Code  
A
Data Byte Low  
A
x = 0  
Data Byte High  
A
...  
P
Second Device  
x = 0 x = 0  
Second Command  
x = 0  
One or more Data Bytes  
x = 0  
1
7
1
1
8
1
8
1
8
1
Sr Slave Address Wr  
A
Command Code  
A
x = 0  
Data Byte Low  
A
x = 0  
Data Byte High  
One or more Data Bytes  
A
x = 0  
Nth Device  
x = 0 x = 0  
Nth Command  
Figure 7 — DISABLE_FAULT COMMAND (D7h)_WRITE  
BCM® in a VIA Package  
Page 28 of 41  
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BCM3814x60E15A3yzz  
Supported Commands Transaction Type  
Page Command (00h)  
A direct communication to the BCM controller and a simulated  
communication to non-PMBus™ devices is enabled by a page  
command. Supported command access privileges with a  
pre-selected PAGE are defined in the following table. Deviation  
from this table generates a communication error in  
STATUS_CML register.  
The page command data byte of 00h prior to a command call  
will address the controller specific data and a page data byte of  
01h would broadcast to the BCM. The value of the Data Byte  
corresponds to the pin name trailing number with the exception  
of 00h and FFh.  
Data Byte  
Description  
PAGE Data Byte  
Access Type  
00h  
01h  
BCM controller  
BCM  
Command  
Code  
00h  
01h  
PAGE  
00h  
01h  
03h  
19h  
4Fh  
R/W  
R
R/W  
R/W  
W
OPERATION Command (01h)  
OPERATION  
The OPERATION command can be used to turn on and off  
the connected BCM.  
CLEAR_FAULTS  
CAPABILITY  
W
R
If synchronous start up is required in the system, it is recommended  
to use the command from host PMBus in order to achieve  
simultaneous array start up.  
OT_FAULT_LIMIT  
OT_WARN_LIMIT  
VIN_OV_FAULT_LIMIT  
VIN_OV_WARN_LIMIT  
IIN_OC_FAULT_LIMIT  
IIN_OC_WARN_LIMIT  
TON_DELAY  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R/W  
R
51h  
55h  
57h  
5Bh  
5Dh  
60h  
78h  
79h  
7Bh  
7Ch  
7Dh  
7Eh  
80h  
88h  
89h  
8Bh  
8Ch  
8Dh  
96h  
98h  
99h  
9Ah  
9Bh  
9Ch  
9Dh  
9Eh  
A0h  
A1h  
A4h  
A5h  
A6h  
A7h  
D1h  
D4h  
D5h  
D7h  
Unit is On when asserted (default)  
Reserved  
STATUS_BYTE  
R/W  
R
STATUS_WORD  
STATUS_IOUT  
R
R
R/W  
R/W  
R/W  
STATUS_INPUT  
STATUS_TEMPERATURE  
STATUS_CML  
R
7
6
5
4
3
2
1
0
b
1
0
0
0
0
0
0
0
R
R/W  
R
STATUS_MFR_SPECIFIC  
READ_VIN  
R/W  
R
This command accepts only two data values: 00h and 80h. If any  
other value is sent the command will be rejected and a CML Data  
error will result.  
READ_IIN  
R
R
READ_VOUT  
R
READ_IOUT  
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
R
READ_TEMPERATURE_1  
READ_POUT  
R
R
PMBUS_REVISION  
MFR_ID  
MFR_MODEL  
R
R
MFR_REVISION  
MFR_LOCATION  
MFR_DATE  
R
R
MFR_SERIAL  
R
MFR_VIN_MIN  
R
MFR_VIN_MAX  
MFR_VOUT_MIN  
MFR_VOUT_MAX  
MFR_IOUT_MAX  
MFR_POUT_MAX  
READ_K_FACTOR  
READ_BCM_ROUT  
SET_ALL_THRESHOLDS  
DISABLE_FAULT  
R
R
R
R
R
R
R
R/W  
R/W  
BCM® in a VIA Package  
Page 29 of 41  
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BCM3814x60E15A3yzz  
The VIN_UV_WARN_LIMIT (58h) and VIN_UV_FAULT_LIMIT  
(59h) are set by the factory and cannot be changed by the host.  
However, a host can disable the undervoltage setting using the  
DISABLE_FAULT COMMAND (D7h).  
CLEAR_FAULTS Command (03h)  
This command clears all status bits that have been previously set.  
Persistent or active faults are re-asserted again once cleared. All  
faults are latched once asserted in the BCM controller. Registered  
faults will not be cleared when shutting down the BCM powertrain  
by recycling the BCM high side voltage or sending the  
OPERATION command.  
All FAULT_RESPONSE commands are unsupported. The BCM  
powertrain supervisory limits and powertrain protection will behave  
as described in the Electrical Specifications. In general, once a fault  
is detected, the BCM powertrain will shut down and attempt to  
auto-restart after a predetermined delay.  
CAPABILITY Command (19h)  
TON_DELAY Command (60h)  
The value of this register word is set in non-volatile memory and  
can only be written when the BCM is disabled.  
Packet Error Checking is not supported  
Maximum supported bus speed is 400kHz  
The maximum possible delay is 100ms. Default value is set  
to (00h). The reported value can be interpreted using the  
following equation.  
The Device does not have SMBALERT# pin and does  
not support the SMBus Alert Response protocol  
Reserved  
TON_DELAYACTUAL = tREPORTED • 10-3(s)  
7
6
5
4
3
2
1
0
Staggering start up in an array is possible with the TON_DELAY  
Command. This delay will be in addition to any start-up delay  
inherent in the BCM module. For example: start-up delay from  
application of VHI is typically 20ms. When TON_DELAY is greater  
than zero, the set delay will be added to it.  
b
0
0
1
0
0
0
0
0
The BCM controller returns a default value of 20h. This value  
indicates that the PMBus™ frequency supported is up to 400kHz  
and that both Packet Error Checking (PEC) and SMBALERT# are  
not supported.  
OT_FAULT_LIMIT Command (4Fh),  
OT_WARN_ LIMIT Command (51h),  
VIN_OV_FAULT_ LIMIT Command (55h),  
VIN_OV_WARN_ LIMIT Command (57h),  
IIN_OC_FAULT_ LIMIT Command (5Bh),  
IIN_OC_WARN_ LIMIT Command (5Dh)  
The values of these registers are set in non-volatile memory and  
can only be written when the BCM is disabled.  
The values of the above mentioned faults and warnings are set by  
default to 100% of the respective BCM model supervisory limits.  
However, these limits can be set to a lower value. For example: In  
order for a limit percentage to be set to 80%, one would send a  
write command with a (50h) Data Word.  
Any values outside the range of (00h – 64h) sent by a host will be  
rejected, will not override the currently stored value and will set the  
Unsupported Data bit in STATUS_CML.  
The SET_ALL_THRESHOLDS COMMAND (D5h) combines in one  
block overtemperature fault and warning limits, VHI overvoltage  
fault and warning limits as well as ILO overcurrent fault and warning  
limits. A delay prior to a read command of up to 200ms following a  
write of new value is required.  
BCM® in a VIA Package  
Page 30 of 41  
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BCM3814x60E15A3yzz  
STATUS_BYTE (78h) and STATUS_WORD (79h)  
STATUS_WORD  
High Byte  
Low Byte  
STATUS_BYTE  
Not Supported: UNKNOWN FAULT OR WARNING  
Not Supported: OTHER  
UNIT IS BUSY  
UNIT IS OFF  
Not Supported: FAN FAULT OR WARNING  
Not Supported: VOUT_OV_FAULT  
POWER_GOOD Negated*  
IOUT_OC_FAULT  
VIN_UV_FAULT  
STATUS_MFR_SPECIFIC  
INPUT FAULT OR WARNING  
TEMPERATURE FAULT OR WARNING  
IOUT/POUT FAULT OR WARNING  
PMBusTM COMMUNICATION EVENT  
NONE OF THE ABOVE  
Not Supported: VOUT FAULT OR WARNING  
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
0
1
1
1
1
0
0
0
1
1
0
1
1
1
1
0
b
* equal to POWER_GOOD#  
If the BCM controller is powered through VDDB, it will retain the  
last telemetry data and this information will be available to the user  
via a PMBus Status request. This is in agreement with the PMBus  
standard, which requires that status bits remain set until specifically  
cleared. Note that in the case where the BCM VHI is lost, the status  
will always indicate an undervoltage fault, in addition to any other  
fault that occurred.  
All fault or warning flags, if set, will remain asserted until  
cleared by the host or once the BCM and VDDB power is  
removed. This includes undervoltage fault, overvoltage fault,  
overvoltage warning, overcurrent warning, overtemperature  
fault, overtemperature warning, undertemperature fault, reverse  
operation, communication faults and analog controller  
shutdown fault.  
NONE OF THE ABOVE bit will be asserted if either the  
STATUS_MFR_SPECIFIC (80h) or the High Byte of the  
STATUS WORD is set.  
Asserted status bits in all status registers, with the exception of  
STATUS_WORD and STATUS_BYTE, can be individually cleared.  
This is done by sending a data byte with one in the bit position  
corresponding to the intended warning or fault to be cleared. Refer  
to the PMBus™ Power System Management Protocol Specification  
– Part II – Revision 1.2 for details.  
STATUS_IOUT (7Bh)  
The POWER_GOOD# bit reflects the state of the device and does  
not reflect the state of the POWER_GOOD# signal limits. The  
POWER_GOOD_ON COMMAND (5Eh) and POWER_GOOD_OFF  
COMMAND (5Fh) are not supported. The POWER_GOOD# bit is  
set, when the BCM is not in the active state, to indicate that the  
powertrain is inactive and not switching. The POWER_GOOD#  
bit is cleared, when the BCM is in the active state, 5ms after the  
powertrain is activated allowing for soft start to elapse.  
POWER_ GOOD# and OFF bits cannot be cleared as they always  
reflect the current state of the device.  
IOUT_OC_FAULT  
Not Supported: IOUT_OC_LV_FAULT  
IOUT_OC_WARNING  
Not Supported: IOUT_UC_FAULT  
Not Supported: Current Share Fault  
Not Supported: In Power Limiting Mode  
Not Supported: POUT_OP_FAULT  
Not Supported: POUT_OP_WARNING  
The Busy bit can be cleared using CLEAR_ALL Command (03h) or  
by writing either data value (40h, 80h) to PAGE (00h) using the  
STATUS_BYTE (78h).  
7
6
5
4
3
2
1
0
b
1
0
0
1
0
0
0
0
Fault reporting, such as SMBALERT# signal output, and host  
notification by temporarily acquiring bus master status is  
not supported.  
Unsupported bits are indicated above. A one indicates a fault.  
BCM® in a VIA Package  
Page 31 of 41  
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BCM3814x60E15A3yzz  
The STATUS_CML data byte will be asserted when an unsupported  
PMBus™ command or data or other communication fault occurs.  
STATUS_INPUT (7Ch)  
VIN_OV_FAULT  
STATUS_MFR_SPECIFIC (80h)  
VIN_OV_WARNING  
Not Supported: VIN_UV_WARNING  
VIN_UV_FAULT  
Reserved  
Reserved  
Reserved  
Reserved  
PAGE Data Byte = (01h)  
Not Supported: Unit Off For Insufficient  
Input Voltage  
Not Supported: IIN_OC_FAULT  
Not Supported: IIN_OC_WARNING  
Not Supported: PIN_OP_WARNING  
Reserved  
BCM UART CML  
Hardware Protections Shutdown Fault  
BCM Reverse Operation  
7
6
5
4
3
2
1
0
b
1
1
0
1
0
0
0
0
Unsupported bits are indicated above. A one indicates a fault.  
7
6
5
4
3
2
1
0
b
0
0
0
0
0
1
1
1
STATUS_TEMPERATURE (7Dh)  
The reverse operation bit, if asserted, indicates that the BCM is  
processing current in reverse. Reverse current reported value is  
not supported.  
OT_FAULT  
OT_WARNING  
Not Supported: UT_WARNING  
The BCM has hardware protections and supervisory limits. The  
hardware protections provide an additional layer of protection  
and have the fastest response time. The Hardware Protections  
Shutdown Fault, when asserted, indicates that at least one of the  
powertrain protection faults is triggered. This fault will also be  
asserted if a disabled fault event occurs after asserting any bit using  
the DISABLE_FAULTS COMMAND.  
UT_FAULT  
Reserved  
Reserved  
Reserved  
Reserved  
The BCM UART is designed to operate with the controller UART.  
If the BCM UART CML is asserted, it may indicate a hardware or  
connection issue between both devices.  
7
6
5
4
3
2
1
0
b
1
1
0
1
0
0
0
0
Reserved  
PAGE Data Byte = (00h)  
Reserved  
Reserved  
Unsupported bits are indicated above. A one indicates a fault.  
STATUS_CML (7Eh)  
BCM at PAGE (01h) is present  
Reserved  
Invalid Or Unsupported Command Received  
Invalid Or Unsupported Data Received  
Not Supported: Packet Error Check Failed  
BCM UART CML  
Hardware Protections Shutdown Fault  
BCM Reverse Operation  
Not Supported: Memory Fault Detected  
Not Supported: Processor Fault Detected  
Reserved  
7
6
5
4
3
2
1
0
b
0
0
0
0
0
0
0
0
Other Communication Faults  
Not Supported: Other Memory Or Logic  
Fault  
When the PAGE COMMAND (00h) data byte is equal to (00h),  
the BCM Reverse operation, Analog Controller Shutdown Fault,  
and BCM UART CML bit will return the result of the active BCM.  
The BCM UART CML will also be asserted if the active BCM  
stops responding. The BCM must communicate at least once  
to the internal controller in order to trigger this FAULT.  
The BCM UART CML can be cleared using the PAGE (00h)  
CLEAR_FAULTS (03h) Command.  
7
6
5
4
3
2
1
0
b
1
1
0
0
0
0
1
0
Unsupported bits are indicated above. A one indicates a fault.  
BCM® in a VIA Package  
Page 32 of 41  
Rev 2.0  
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BCM3814x60E15A3yzz  
READ_VIN Command (88h)  
READ_POUT Command (96h)  
If PAGE data byte is equal to (01h), command will return the BCM’s  
HI side voltage in the following format:  
If PAGE data byte is equal to (01h), command will return the BCM’s  
LO side power in the following format:  
VHI_ACTUAL = VHI_REPORTED • 10-1(V)  
PLO_ACTUAL = PLO_REPORTED (W)  
If PAGE data byte is equal to (00h), command will also return the  
BCM’s LO side power.  
READ_IIN Command (89h)  
If PAGE data byte is equal to (01h), command will return the BCM’s  
HI side current in the following format:  
MFR_VIN_MIN Command (A0h),  
MFR_VIN_MAX Command (A1h),  
MFR_VOUT_MIN Command (A4h),  
MFR_VOUT_MAX Command (A5h),  
MFR_IOUT_MAX Command (A6h),  
MFR_POUT_MAX Command (A7h)  
IHI_ACTUAL = IHI_REPORTED • 10-2(A)  
If PAGE data byte is equal (00h), command will also return the  
BCM’s HI side current.  
These values are set by the factory and indicate the device HI  
side/LO side voltage and LO side current range and LO side  
power capacity.  
READ_VOUT Command (8Bh)  
If PAGE data byte is equal to (01h), command will return the BCM’s  
LO side voltage in the following format:  
If the PAGE data byte is equal to (00h – 01h), commands will report  
the rated BCM HI side voltage minimum and maximum in Volts,  
LO side voltage minimum and maximum in Volts, LO side current  
maximum in Amperes and LO side power maximum in Watts.  
VLO_ACTUAL = VLO_REPORTED • 10-1(V)  
READ_IOUT Command (8Ch)  
If PAGE data byte is equal to (01h), command will return the BCM’s  
LO side current in the following format:  
ILO_ACTUAL = ILO_REPORTED • 10-2(A)  
If PAGE data byte is equal (00h), command will also return the  
BCM’s LO side current.  
READ_TEMPERATURE_1 Command (8Dh)  
If PAGE data byte is equal to (01h), command will return the BCM’s  
temperature in the following format:  
TACTUAL = TREPORTED (°C)  
If PAGE data byte is equal (00h), command will also return the  
BCM’s temperature.  
BCM® in a VIA Package  
Page 33 of 41  
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BCM3814x60E15A3yzz  
READ_K_FACTOR Command (D1h)  
DISABLE_FAULT Command (D7h)  
If PAGE data byte is equal to (01h), command will return the BCM’s  
K factor in the following format:  
DISABLE_FAULT  
MSB  
LSB  
K_FACTORACTUAL = K_FACTORREPORTED 2-16(V/V)  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
IOUT_OC_FAULT  
Reserved  
The K factor is defined in a BCM to represent the ratio of the  
transformer winding and hence is equal to VLO / VHI.  
VIN_OV_FAULT  
Reserved  
Reserved  
Reserved  
Reserved  
Reserved  
VIN_UV_FAULT  
Reserved  
READ_BCM_ROUT Command (D4h)  
If PAGE data byte is equal to (01h), command will return the BCM’s  
LO side resistance in the following format:  
7
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
0
1
0
0
0
0
0
0
0
0
1
0
1
0
0
0
b
BCM_RLO_ACTUAL = BCM_RLO_REPORTED • 10-5(Ω)  
Unsupported bits are indicated above. A one indicates that the  
supervisory fault associated with the asserted bit is disabled.  
SET_ALL_THRESHOLDS Command (D5h)  
The values of this register block are set in non-volatile memory and  
can only be written when the BCM is disabled.  
SET_ALL_THRESHOLDS_BLOCK (6 Bytes)  
This command allows the host to disable the supervisory faults  
and respective statuses. It does not disable the powertrain analog  
protections or warnings with respect to the set limits in the  
SET_ALL_THRESHOLDS Command.  
IOUT_OC_WARN_ LIMIT  
IOUT_OC_FAULT_ LIMIT  
VIN_OV_WARN_ LIMIT  
The HI side undervoltage can only be disabled to a pre-set low  
limit as specified in the Monitored Telemetry Functional  
Reporting Range.  
VIN_OV_FAULT_ LIMIT  
OT_WARN_LIMIT  
OT_FAULT_LIMIT  
5
4
3
2
1
0
h
64 64 64 64 64 64  
The values of this register block are set in non-volatile memory and  
can only be written when the BCM is disabled.  
This command provides a convenient way to configure all of the  
limits, or any combination of limits described previously using  
one command.  
VHI overvoltage, overcurrent and overtemperature values are all set  
to 100% of the specified supervisory limits by default and can only  
be set to a lower percentage.  
To leave a particular threshold unchanged, set the corresponding  
threshold data byte to a value greater than (64h).  
BCM® in a VIA Package  
Page 34 of 41  
Rev 2.0  
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BCM3814x60E15A3yzz  
3. The unsupported PMBus command code response as  
The BCM Controller Implementation vs.  
PMBus™ Specification Rev 1.2  
The BCM controller is an I2C™ compliant, SMBus™ compatible  
device and PMBus command compliant device. This section denotes  
some deviation, perceived as differences from the PMBus Part I and  
Part II specification Rev 1.2.  
described in the Fault Management and Reporting:  
nꢀnDeviations from the PMBus specification:  
a. PMBus section 10.2.5.3, exceptions  
• The busy bit of the STATUS_BYTE as implemented can  
be cleared (80h). In order to maintain compatibility with  
the specification, (40h) can also be used.  
1. The PMBus interface meets all Part I and II PMBus specification  
requirements with the following differences to the  
transport requirement.  
nManufacturer Implementation of the PMBus Spec  
a. PMBus section 10.5, setting the response to a detected  
Unmet DC parameter Implementation vs SMBus™ spec  
fault condition  
PMBus  
Interface  
SMBus  
Rev 2.0  
• All powertrain responses are pre-set and cannot be  
changed.  
Symbol  
Parameter  
Units  
Min Max Min Max  
b. PMBus section 10.6, reporting faults and warnings  
[a]  
VIL  
Input Low Voltage  
Input High Voltage  
Input Leakage per Pin  
-
0.99  
-
-
0.8  
V
V
to the Host.  
[a]  
VIH  
2.31  
10  
2.1 VVDD_IN  
• SMBALERT# signal and Direct PMBus Device to Host  
Communication are not supported. However, the  
PMBus™ interface will set the corresponding fault status  
bits and will wait for the host to poll.  
[b]  
ILEAK_PIN  
22  
-
5
µA  
[a]  
V
V
= 3.3V  
= 5V  
VDD_IN  
[b]  
BUS  
c. PMBus section 10.7, clearing a shutdown due to a fault  
2.The BCM accepts 38 PMBus command codes.  
• There is no RESET pin or EN pin in the BCM.  
Cycling power to the BCM will not clear a BCM  
Shutdown. The BCM will clear itself once the fault  
condition is removed.  
Implemented commands execute functions as described in the  
PMBus specification.  
nDeviations from the PMBus specification:  
a. Section 15, fault related commands  
d. PMBus Section 10.8.1, corrupted data transmission faults:  
• The Limits and Warnings unit is implemented as a  
percentage (%) range from decimal (0 – 100) of the  
factory set limits.  
• Packet error checking is not supported.  
Data Transmission Faults Implementation  
This section describes data transmission faults as implemented in the BCM controller.  
Response to Host  
STATUS_BYTE  
STATUS_CML  
Section  
Description  
Notes  
Unsupported  
NAK  
FFh  
CML  
Other Fault  
Data  
10.8.1  
10.8.2  
10.8.3  
Corrupted data  
No response; PEC not supported  
Sending too few bits  
Reading too few bits  
X
X
X
X
Host sends or reads too  
few bytes  
10.8.4  
X
X
Host sends too many  
bytes  
10.8.5  
10.8.6  
X
X
X
X
X
Reading too many bytes  
X
X
X
Device will ACK own address  
BUSY bit in STATUS_BYTE even if  
STATUS_WORD is set  
10.8.7  
Device busy  
BCM® in a VIA Package  
Page 35 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Data Content Faults Implementation  
This section describes data content fault as implemented in the BCM controller.  
Response  
STATUS_BYTE  
to Host  
STATUS_CML  
Section  
Description  
Notes  
Other  
Fault  
Unsupported  
Command  
Unsupported  
Data  
NAK  
X
CML  
X
Improperly set read bit in  
the address byte  
10.9.1  
10.9.2  
10.9.3  
X
Unsupported  
command code  
X
X
X
Invalid or  
unsupported data  
X
X
X
X
10.9.4  
10.9.5  
Data out of range  
Reserved bits  
No response; not a fault  
BCM® in a VIA Package  
Page 36 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
BCM in VIA Package Chassis (Lug) Mount Package Mechanical Drawing  
'
(5  
ꢊꢀ  
3
4
1
2
BCM® in a VIA Package  
Page 37 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
BCM in VIA Package PCB (Board) Mount Package Mechanical Drawing  
5
6
7
8
9
3
4
2
13  
OTPVIEW  
BTOMSIDE  
C(PMNTOIDSE)  
0
1
1
2
BCM® in a VIA Package  
Page 38 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
BCM in VIA Package PCB (Board) Mount Package Recommended Hole Pattern  
'
SDETI'LA  
4
3
A
9
8
7
6
5
DETAIL  
3
12  
MCDHOLPTARNE  
1
10  
2
1
BCM® in a VIA Package  
Page 39 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Revision History  
Revision  
1.0  
Date  
Description  
Page Number(s)  
03/03/16  
05/02/16  
06/17/16  
08/01/16  
09/26/16  
Initial release  
n/a  
All  
1.1  
New Power Pin Nomenclature  
Notes update  
1.2  
2, 3, 10  
13, 14, 15  
23  
1.3  
Charts format update  
1.4  
Value of R correction for READ_BCM_ROUT  
Content improvements  
Pin Finish update  
All  
17  
1.5  
12/13/16  
PMBus™ Supported Commands update  
26 – 37  
1.6  
1.7  
1.8  
02/08/17  
03/23/17  
06/30/17  
Part Ordering Information Update  
Package drawings update  
1
37 – 39  
1, 6  
Update efficiency specifications  
Updated monitored telemetry technical information and specs  
Updated mechanical drawings  
10  
37 – 39  
1.9  
2.0  
01/24/18  
02/06/18  
Updated agency approvals  
1, 18  
BCM® in a VIA Package  
Page 40 of 41  
Rev 2.0  
02/2018  
BCM3814x60E15A3yzz  
Vicor’s comprehensive line of power solutions includes high density AC-DC and DC-DC modules and  
accessory components, fully configurable AC-DC and DC-DC power supplies, and complete custom  
power systems.  
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for its use. Vicor  
makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication. Vicor reserves  
the right to make changes to any products, specifications, and product descriptions at any time without notice. Information published by  
Vicor has been checked and is believed to be accurate at the time it was printed; however, Vicor assumes no responsibility for inaccuracies.  
Testing and other quality controls are used to the extent Vicor deems necessary to support Vicor’s product warranty. Except where  
mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
Specifications are subject to change without notice.  
Visit http://www.vicorpower.com/dc-dc/isolated-fixed-ratio/lv-bus-converter-module for the latest product information.  
Vicor’s Standard Terms and Conditions and Product Warranty  
All sales are subject to Vicor’s Standard Terms and Conditions of Sale, and Product Warranty which are available on Vicor’s webpage  
(http://www.vicorpower.com/termsconditionswarranty) or upon request.  
Life Support Policy  
VICOR’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE  
EXPRESS PRIOR WRITTEN APPROVAL OF THE CHIEF EXECUTIVE OFFICER AND GENERAL COUNSEL OF VICOR CORPORATION. As used  
herein, life support devices or systems are devices which (a) are intended for surgical implant into the body, or (b) support or sustain life and  
whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to  
result in a significant injury to the user. A critical component is any component in a life support device or system whose failure to perform  
can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness. Per Vicor Terms  
and Conditions of Sale, the user of Vicor products and components in life support applications assumes all risks of such use and indemnifies  
Vicor against all liability and damages.  
Intellectual Property Notice  
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent applications) relating to the  
products described in this data sheet. No license, whether express, implied, or arising by estoppel or otherwise, to any intellectual property  
rights is granted by this document. Interested parties should contact Vicor’s Intellectual Property Department.  
The products described on this data sheet are protected by the following U.S. Patents Numbers:  
Patents Pending.  
Contact Us: http://www.vicorpower.com/contact-us  
Vicor Corporation  
25 Frontage Road  
Andover, MA, USA 01810  
Tel: 800-735-6200  
Fax: 978-475-6715  
www.vicorpower.com  
email  
Customer Service: custserv@vicorpower.com  
Technical Support: apps@vicorpower.com  
©2018 Vicor Corporation. All rights reserved. The Vicor name is a registered trademark of Vicor Corporation.  
The PMBus™ name, SMIF, Inc. and logo are trademarks of SMIF, Inc.  
I2C™ is a trademark of NXP Semiconductor  
All other trademarks, product names, logos and brands are property of their respective owners.  
BCM® in a VIA Package  
Page 41 of 41  
Rev 2.0  
02/2018  

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