VIB0101THJ [VICOR]
DC to DC Bus Converter Module; 直流到直流母线转换模块
| 型号： | VIB0101THJ |
| 厂家： | 
VICOR CORPORATION |
| 描述： | DC to DC Bus Converter Module |
| 文件： | 总16页 (文件大小：1202K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VIB0101THJ
S
C
NRTL US
TM
BCM
DC to DC
Bus Converter Module
FEATURES
DESCRIPTION
The V•I Chip Bus Converter Module is a high efficiency (>95%)
Sine Amplitude Converter (SAC) operating from a 38 to 55 Vdc
primary bus to deliver an isolated 12 V nominal, unregulated
secondary. The SAC offers a low AC impedance beyond the
bandwidth of most downstream regulators, meaning that input
capacitance normally located at the input of a 12 V regulator
can be located at the input to the SAC. Since the K factor of
the VIB0101THJ is 1/4, that capacitance value can be reduced
by a factor of 16x, resulting in savings of board area, materials
and total system cost.
• 48 Vdc – 12 Vdc 120 W Bus Converter Module
• High efficiency (>95%) reduces system power
consumption
• High power density (801 W/in3) reduces power system
footprint by >50%
•
• “Half Chip” V I Chip package enables surface mount,
low impedance interconnect to system board
• Contains built-in protection features: undervoltage,
overvoltage lockout, over current protection, short
circuit protection, overtemperature protection.
The VIB0101THJ is provided in a V•I Chip package compatible
with standard pick-and-place and surface mount assembly
processes. The V•I Chip package provides flexible thermal
management through its low junction-to-case and junction-to-
board thermal resistance. With high conversion efficiency the
VIB0101THJ increases overall system efficiency and lowers
operating costs compared to conventional approaches.
• Provides enable/disable control, internal temperature
monitoring
• ZVS/ZCS Resonant Sine Amplitude Converter topology
• Less than 50°C temperature rise at full load in typical
applications
VIN = 38 – 55 V
POUT = 120 W(NOM)
K = 1/4
TYPICAL APPLICATION
VOUT = 9.5 – 13.75 V (NO LOAD)
• High End Computing Systems
• Automated Test Equipment
• Telecom Base Stations
• High Density Power Supplies
• Communication Systems
TYPICAL APPLICATION
POL
POL
enable / disable
TM
PC
switch
SW1
F1
BCM+Out
POL
POL
+In
-In
3.15 A
VOUT
C1
10 µF
VIN
-Out
Rev. 1.4
9/2009
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 1 of 16
vicorpower.com
VIB0101THJ
CONTROL PIN SPECIFICATIONS
ABSOLUTE MAXIMUM RATINGS
See section 5.0 for further application details and guidelines.
+IN to –IN . . . . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc – +60 Vdc
PC to –IN . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +20 Vdc
TM to –IN . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 Vdc – +7.0 Vdc
+IN/-IN to +OUT/-OUT . . . . . . . . . . . . . . . . . . . 2250 V (Hi Pot)
+IN/-IN to +OUT/-OUT. . . . . . . . . . . . . . . . . . . . 60 V (working)
+OUT to –OUT . . . . . . . . . . . . . . . . . . . . . . -1.0 Vdc - +16 Vdc
Temperature during reflow . . . . . . . . . . . . . . . . . 225°C (MSL5)
•
PC (V I Chip BCM Primary Control)
The PC pin can enable and disable the BCM. When held below
VPC-DIS the BCM shall be disabled. When allowed to float with
an impedance to –IN of greater than 50 kΩ the module will
start. When connected to another BCM PC pin (either directly,
or isolated through a diode), the BCMs will start simultane-
ously when enabled. The PC pin is capable of being either
driven high by an external logic signal or internal pull up to 5 V
(operating).
PACKAGE ORDERING INFORMATION
4
3
2
1
•
TM (V I Chip BCM Temperature Monitor)
A
B
C
D
+In
The TM pin monitors the internal temperature of the BCM
within an accuracy of +8/-5 °C. It has a room temperature
setpoint of ~3.0 V and an approximate gain of 10 mV/°C. It
can source up to 100 uA and may also be used as a “Power
Good” flag to verify that the BCM is operating.
+Out
-Out
NC
TM
NC
PC
-In
E
F
J
K
L
G
H
M
Bottom View
Signal
Name
+In
–In
Designation
A1-B1, A2-B2
L1-M1, L2-M2
E1
NC
TM
F2
NC
G1
PC
H2
+Out
–Out
A3-D3, A4-D4
J3-M3, J4-M4
PART NUMBER
DESCRIPTION
VIB0101THJ
-40°C – 125°C TJ, J lead
Rev. 1.4
9/2009
Page 2 of 16
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VIB0101THJ
1.0 ELECTRICAL CHARACTERISTICS
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the
temperature range of -40°C < TJ < 125°C (T-Grade); All other specifications are at TJ = 25º unless otherwise noted
ATTRIBUTE
Voltage range
dV/dt
SYMBOL
CONDITIONS / NOTES
MIN
38
TYP
48
MAX
UNIT
VIN
dVIN /dt
PQ
55
1
150
2.55
3.5
Vdc
V/µs
mW
Quiescent power
PC connected to -IN
VIN = 48 V
VIN = 38 to 55 V
68
1.85
No load power dissipation
PNL
W
VIN = 48 V COUT = 500 µF,
IOUT = 10.55 A
Inrush Current Peak
DC Input Current
IINR-P
5.5
1/4
12
A
A
IIN-DC
3.5
VOUT
K Factor
K
(
)
VIN
VIN = 38 – 55 Vdc; See Figure 14
VIN = 46 – 55 Vdc; See Figure 14
97
120
Output Power (Average)
Output Power (Peak)
POUT
W
W
VIN = 46 – 55 Vdc
150
POUT-P
Average P
OUT < = 120 W, Tpeak < 10 ms
VOUT
IOUT
Output Voltage
Output Current (Average)
Section 3.0
Pout < =120 W
8.5
14
11.3
V
A
V
IN = 48 V, POUT = 120 W
93
90.5
92.0
94.8
93.7
Efficiency (Ambient)
η
%
VIN = 38 V to 55 V, POUT = 100 W
VIN = 48 V, TJ = 100° C,POUT = 120 W
η
η
Efficiency (Hot)
%
%
Minimum Efficiency
(Over Load Range)
24 W < POUT < POUT Max
89
ROUT
ROUT
ROUT
COUT
FSW
Output Resistance (Ambient)
Output Resistance (Hot)
Output Resistance (Cold)
Load Capacitance
Switching Frequency
Ripple Frequency
TJ = 25° C
TJ = 125° C
TJ = -40° C
32
40
26
46
58
38
60
75
50
500
1.90
3.80
mΩ
mΩ
mΩ
uF
MHz
MHz
1.60
3.20
1.75
3.50
FSW-RP
10.55 A
, VIN = 48 V,
COUT = 0µF, IOUT
Section 8.0
=
Output Voltage Ripple
VOUT-PP
TON1
140
570
355
mV
ms
VIN to VOUT (Application of VIN)
VIN = 48 V, CPC = 0; See Figure 16
800
PC
VPC
PC Voltage (Operating)
PC Voltage (Enable)
PC Voltage (Disable)
4.7
2.0
5.0
2.5
5.3
3.0
1.95
300
2
400
588
1000
V
V
V
VPC-EN
VPC-DIS
IPC-EN
PC Source Current (Startup)
PC Source Current (Operating)
PC Internal Resistance
PC Capacitance (Internal)
PC Capacitance (External)
External PC Resistance
PC External Toggle Rate
PC to VOUT with PC Released
PC to VOUT, Disable PC
50
50
100
150
uA
mA
kΩ
pF
pF
kΩ
Hz
µs
IPC-OP
RPC-SNK
CPC_INT
CPC_EXT
RPC
FPC-TOG
Ton2
Internal pull down resistor
Section 5.0
External capacitance delays PC enable time
Connected to –VIN
50
1
100
10
VIN = 48 V, Pre-applied; See Figure 16
VIN = 48 V, Pre-applied; See Figure 16
60
4
TPC-DIS
µs
Rev. 1.4
9/2009
Page 3 of 16
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VIB0101THJ
1.0 ELECTRICAL CHARACTERISTICS (CONT.)
Specifications apply over all line and load conditions unless otherwise noted; Boldface specifications apply over the
temperature range of -40°C < TJ < 125°C (T-Grade); All other specifications are at TJ = 25º unless otherwise noted
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
MIN
-5
TYP
MAX
UNIT
TM
Actm
ATM
ITM
RTM-SNK
CTM
VTM-PP
TM accuracy
TM Gain
TM Source Current
TM Internal Resistance
External TM Capacitance
TM Voltage Ripple
+8
ºC
mV/°C
uA
10
40
100
50
50
25
75
kΩ
pF
CTM = 0uF, VIN = 55 V, POUT = 120 W
180
250
mV
PROTECTION
VIN OVLO-
VIN OVLO+
VIN UVLO-
VIN UVLO+
IOCP
Negative going OVLO
Positive going OVLO
Negative going UVLO
Positive going UVLO
Output Overcurrent Trip
55.1
55.5
29.1
30.7
12
57.5
58.6
30.8
32.6
18
58.6
59.8
35.4
37.3
25
V
V
V
V
A
VIN = 48 V, 25°C
Short Circuit Protection
Trip Current
Short Circuit Protection
Response Time
Thermal Shutdown
Junction setpoint
15
0.8
125
ISSP
TSSP
40
1.2
135
A
1.0
us
°C
TJ-OTP
130
GENERAL SPECIFICATION
Isolation Voltage (Hi-Pot)
Working Voltage (IN – OUT)
Isolation Capacitance
Isolation Resistance
MTBF
VHIPOT
2250
V
V
pF
Vworking
CIN OUT
-
RIN-OUT
60
2150
Unpowered unit
1350
10
1750
7.1
MΩ
MIL HDBK 217F, 25° C, GB
cTUVus
Mhrs
CE Mark
Agency Approvals/Standards
ROHS 6 of 6
Rev. 1.4
9/2009
Page 4 of 16
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VIB0101THJ
1.1 APPLICATION CHARACTERISTICS
All specifications are at TJ = 25ºC unless otherwise noted. See associated figures for general trend data.
ATTRIBUTE
No Load Power
Inrush Current Peak
SYMBOL
CONDITIONS / NOTES
TYP
UNIT
PNL
INR-P
VIN = 48 V, PC enabled; See Figure 1
COUT = 500 µF, POUT = 120 W
1.75
6
W
A
V
IN = 48 V, POUT = 120 W
COUT = 500 µF
IN = 48 V, POUT = 120 W
Efficiency (Ambient)
η
η
95
%
V
Efficiency (Hot – 100°C)
94
%
COUT = 500 µF
VIN = 48 V
VIN = 48 V
VIN= 48 V
COUT = 0uF, POUT = 120 W @ VIN = 48,
VIN = 48 V
IOUT_STEP = 0 TO 10.55 A
ISLEW >10 A/us; See Figure 12
IOUT_STEP = 10.55 A to 0 A,
ISLEW > 10 A/us; See Figure 11
ROUT_C
ROUT_R
ROUT_H
Output Resistance (-40°C)
Output Resistance (25°C)
Output Resistance (100°C)
42
50
67
mΩ
mΩ
mΩ
Output Voltage Ripple
VOUT Transient (Positive)
VOUT-PP
VOUT-TRAN+
VOUT-TRAN-
TUVLO
160
1.4
1.3
2.4
4.4
2.4
mV
,
V
VOUT Transient (Negative)
V
Undervoltage Lockout
Response Time
Output Overcurrent
Response Time
Overvoltage Lockout
Response Time
us
ms
µs
TOCP
12 < IOCP < 25 A
TOVLO
Rev. 1.4
9/2009
Page 5 of 16
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VIB0101THJ
Full Load Efficiency vs. Case Temperature
No Load Power Dissipation vs. Line
95.5
4
3.75
3.5
3.25
3
95
94.5
94
2.75
2.5
2.25
2
93.5
93
92.5
92
1.75
1.5
1.25
1
91.5
91
35
40
45
50
55
-40°C
60
-60
-40
-20
0
20
40
60
80
100 120
Case Temperature (C)
Input Voltage (V)
TCASE
:
100°C
25°C
38 V
48 V
55 V
V
IN
:
Figure 1 – No load power dissipation vs. VIN; TCASE
Figure 2 – Full load efficiency vs. temperature; VIN
Efficiency & Power Dissipation -40°C Case
Efficiency & Power Dissipation 25°C Case
96
94
92
90
88
86
84
82
80
98
96
94
92
90
88
86
84
82
80
14
14
12
10
8
12
10
8
η
η
6
6
PD
PD
4
4
2
2
0
0
12
0
2
4
6
8
10
12
0
2
4
6
8
10
Output Load (A)
Output Load (A)
38 V
48 V
55 V
38 V
48 V
55 V
VIN:
38 V
48 V
55 V
38 V
48 V
55 V
V
IN
:
Figure 3 – Efficiency and power dissipation at 25°C (case); VIN
Figure 4 – Efficiency and power dissipation at –40°C (case); VIN
ROUT vs. CaseTemperature
Efficiency & Power Dissipation 100°C Case
75
96
14
12
10
8
70
65
60
55
50
45
40
35
94
92
η
90
88
6
86
PD
4
84
2
82
80
0
-60
-40
-20
0
20
40
60
80
100 120
0
2
4
6
8
10
12
Output Load (A)
Temperature (°C)
38 V
48 V
55 V
38 V
48 V
55 V
V
IN
:
IOUT
:
1.05 A
10.55 A
Figure 5 – Efficiency and power dissipation at 100°C (case); VIN
Figure 6 – ROUT vs. temperature vs. IOUT
Rev. 1.4
9/2009
Page 6 of 16
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VIB0101THJ
Output Voltage Ripple 25°C vs. IOUT
180
160
140
120
100
80
60
40
20
0
8
0
2
4
6
10
IOUT (A)
Figure 7 – Vripple vs. IOUT ; 48 Vin, no external capacitance
Figure 8 – PC to VOUT startup waveform
Figure 9 – VIN to VOUT startup waveform
Figure 10 – Output voltage and input current ripple, 48 Vin, 120 W
no cOUT
Figure 11 – Positive load transient (0 – 11.3 A)
Figure 12 – Negative load transient (11.3 A – 0 A)
Rev. 1.4
9/2009
Page 7 of 16
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
vicorpower.com
VIB0101THJ
POUT (W)
ꢀ
120
97
VIN (VDC)
38
46
55
Figure 13 – PC disable waveform, 48 VIN, 500 µF COUT full load
Figure 14 – POUT derating vs. VIN
2.0 PACKAGE/MECHANICAL SPECIFICATIONS
All specifications are at T =25ºC unless otherwise noted. See associated figures for general trend data.
J
ATTRIBUTE
SYMBOL
CONDITIONS / NOTES
MIN
TYP
MAX
UNIT
Length
Width
Height
Volume
Footprint
L
W
H
Vol
F
21.7 / 0.854 22.0 / 0.866 22.3 / 0.878 mm/in
16.37 / 0.644 16.50 / 0.650 16.63 / 0.655 mm/in
6.48 / 0.255 6.73 / 0.265 6.98 / 0.275 mm/in
No Heatsink
No Heatsink
2.44 / 0.150
3.6 / 0.56
801
cm3/in3
cm2/in2
W/in3
W/cm3
oz/g
Power Density
Weight
PD
W
No Heatsink
49
0.28/8
Nickel (0.51-2.03 µm)
Palladium (0.02-0.15 µm)
Gold (0.003-0.05 µm)
Lead Finish
Operating Temperature
Storage Temperature
Thermal Impedance
Thermal Capacity
TJ
TST
ØJC
-40
-40
125
125
2.7
°C
°C
°C/W
Ws/°C
Junction to Case
5
Peak Compressive Force
Applied to Case (Z-axis)
Supported by J-leads only
2.5
3.0
lbs
Moisture Sensitivity Level
MSL Level 5
Human Body Model[a]
Machine Model[b]
5
1500
400
ESDHBM
ESDMM
VDC
VDC
°C
ESD Rating
Peak Temperature During Reflow
Peak Time Above 183°C
Peak Heating Rate During Reflow
Peak Cooling Rate Post Reflow
225
150
3
s
1.5
1.5
°C/s
°C/s
6
[a]
[b]
JEDEC JESD 22-A114C.01
JEDED JESD 22-A115-A
Rev. 1.4
9/2009
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 8 of 16
vicorpower.com
VIB0101THJ
2.1 MECHANICAL DRAWING
mm
(inch)
2.2 RECOMMENDED LAND PATTERN
2.3 RECOMMENDED LAND PATTERN FOR PUSH PIN HEATSINK
22.52
(0.887)
21.00
Notes:
1. Maintain 3.50 (0.138) Dia. keep-out zone
free of copper, all PCB layers.
21.00
(0.827)
0.76
(0.030)
(0.827)
2.95 0.07
2.95 0.07
ø
ø
10.50
2. (A) minimum recommended pitch is 24.00 (0.945)
this provides 7.50 (0.295) component
edge–to–edge spacing, and 0.50 (0.020)
clearance between Vicor heat sinks.
(
)
10.50
(0.413)
Dashed lines indicates
half VIC position
(0.116 0.003)
non-plated
thru hole
(0.116 0.003)
non-plated
thru hole
Dashed lines indicates
half VIC position
(
)
(0.413)
See note 1
See note 1
(B) Minimum recommended pith is 25.50 (1.004).
This provides 9.00 (0.354) component
edge–to–edge spacing, and 2.00 (0.079)
clearence between Vicor heat sinks.
3.50
(0.138)
0.44
(0.017)
3.50
(0.138)
(
)
7.63
(0.300)
7.63
(0.300)
(
)
3. V•I Chip land pattern shown for reference
only, actual land pattern may differ.
Dimensions from edges of land pattern
to push–pin holes will be the same for
all half size V•I Chips.
6.12
(0.241)
22.26
7.00
(0.876) (0.276)
22.26
)
7.00
(0.876) (0.276)
(
)
(
4. RoHS complient per CST–0001 latest revision.
5. Unless otherwise specified:
Dimensions are mm (inches)
tolerances are:
x.x (x.xx) = 0.13 (0.01)
x.xx (x.xxx) = 0.13 (0.005)
2.03
ø
(0.080)
(2) Pl.
15.48
(0.609)
15.48
(0.609)
24.00
(0.945)
See Note 2A
2.76
(0.109)
(
)
(
)
plated
thru hole
See note 6
2.76
(0.109)
25.50
(1.004)
See note 2B
6. Plated through holes for grounding clips (33855)
shown for reference, Heatsink orientation and
device pitch will dictate final grounding solution.
(NO GROUNDING CLIPS)
(WITH GROUNDING CLIPS)
Rev. 1.4
9/2009
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 9 of 16
vicorpower.com
VIB0101THJ
3.0 POWER, VOLTAGE, EFFICIENCY RELATIONSHIPS
Because of the high frequency, fully resonant SAC topology,
power dissipation and overall conversion efficiency of BCM
converters can be estimated as shown below.
OUTPUT
POWER
INPUT
POWER
Key relationships to be considered are the following:
1. Transfer Function
a. No load condition
PR
OUT
PNL
VOUT = VIN • K
Eq. 1
Figure 15 – Power transfer diagram
Where K (transformer turns ratio) is constant
for each part number
b. Loaded condition
VOUT = Vin • K – IOUT • ROUT
Eq. 2
2. Dissipated Power
The two main terms of power losses in the
BCM module are:
- No load power dissipation (PNL) defined as the power
used to power up the module with an enabled power
train at no load.
- Resistive loss (ROUT) refers to the power loss across
the BCM modeled as pure resistive impedance.
~
~
PDISSIPATED
P
NL + PROUT
Eq. 3
Therefore, with reference to the diagram shown in Figure 15
POUT = PIN – PDISSIPATED = PIN – PNL – PROUT Eq. 4
Notice that ROUT is temperature and input voltage dependent
and PNL is temperature dependent (See Figure 15).
The above relations can be combined to calculate the overall module efficiency:
POUT
PIN
PIN – PNL – PROUT
VIN • IIN – PNL – (IOUT)2 • ROUT
PNL + (IOUT)2 • ROUT
η
=
=
=
= 1 –
Eq. 5
(
)
PIN
VIN • IIN
VIN • IIN
Rev. 1.4
9/2009
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 10 of 16
vicorpower.com
VIB0101THJ
4.0 OPERATING
Figure 16 – Timing diagram
Rev. 1.4
9/2009
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 11 of 16
vicorpower.com
VIB0101THJ
5.0 USING THE CONTROL SIGNALS TM AND PC
6.0 FUSE SELECTION
The PC control pin can be used to accomplish the following
functions:
V•I Chips are not internally fused in order to provide flexibility
•
in configuring power systems. Input line fusing of V I Chips is
recommended at system level, in order to provide thermal
protection in case of catastrophic failure.
• Delayed start: At start-up, PC pin will source a constant
100 uA current to the internal RC network. Adding an
external capacitor will allow further delay in reaching the
2.5 V threshold for module start.
The fuse shall be selected by closely matching system
requirements with the following characteristics:
• Synchronized start up: In a parallel module array, PC pins
shall be connected in order to ensure synchronous start of all
the units. While every controller has a calibrated 2.5 V
reference on PC comparator, many factors might cause
different timing in turning on the 100 uA current source on
each module, i.e.:
• Current rating (usually greater than maximum BCM current)
• Maximum voltage rating (usually greater than the maximum
possible input voltage)
• Ambient temperature
• Nominal melting I2t
• Recommended fuse: 3.15 A Little Fuse Nano2 Fuse
– Different VIN slew rate
– Statistical component value distribution
By connecting all PC pins, the charging transient will be
shared and all the modules will be enabled synchronously.
• Auxiliary voltage source: Once enabled in regular
operational conditions (no fault), each BCM PC provides a
regulated 5 V, 2 mA voltage source.
• Output disable: PC pin can be actively pulled down in order
to disable module operations. Pull down impedance shall be
lower than 1 kΩ and toggle rate lower than 1 Hz.
• Fault detection flag: The PC 5 V voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and PC voltage is
re-enabled. For system monitoring purposes (microcontroller
interface) faults are detected on falling edges of PC signal.
It is important to notice that PC doesn’t have current sink
capability (only 150 kΩ typical pull down is present),
therefore, in an array, PC line will not be capable of disabling
all the modules if a fault occurs on one of them.
The temperature monitor (TM) pin provides a voltage propor-
tional to the absolute temperature of the converter control IC.
It can be used to accomplish the following functions:
• Monitor the control IC temperature: The temperature in
Kelvin is equal to the voltage on the TM pin scaled
by x100. (i.e. 3.0 V = 300 K = 27ºC). It is important to
•
remember that V I chips are multi-chip modules, whose
temperature distribution greatly vary for each part number as
well with input/output conditions, thermal management and
environmental conditions. Therefore, TM cannot be used to
thermally protect the system.
• Fault detection flag: The TM voltage source is internally
turned off as soon as a fault is detected. After a minimum
disable time, the module tries to re-start, and TM voltage is
re-enabled.
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VIB0101THJ
7.0 CURRENT SHARING
The SAC topology bases its performance on efficient transfer
of energy through a transformer, without the need of closed
loop control. For this reason, the transfer characteristic can be
approximated by an ideal transformer with some resistive drop
and positive temperature coefficient.
It is important to notice that, when successfully started, BCMs
are capable of bidirectional operations (reverse power transfer
is enabled if the BCM input falls within its operating range and
the BCM is otherwise enabled). In parallel arrays, because of
the resistive behavior, circulating currents are never experienced,
because of energy conservation law.
This type of characteristic is close to the impedance characteristic
of a DC power distribution system, both in behavior
(AC dynamic) and absolute value (DC dynamic).
General recommendations to achieve matched array impedances
are (see also AN016 for further details):
When connected in an array (with same K factor), the BCM
module will inherently share the load current with parallel
units, according to the equivalent impedance divider that the
system implements from the power source to the point of load.
• to dedicate common copper planes within the PCB to
deliver and return the current to the modules
• to make the PCB layout as symmetric as possible
• to apply same input/output filters (if present) to each unit
Figure 17 – BCM Array
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V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
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VIB0101THJ
8.0 INPUT AND OUTPUT FILTER DESIGN
A major advantage of SAC systems versus conventional PWM
converters is that the transformers do not require large
functional filters. The resonant LC tank, operated at extreme
high frequency, is amplitude modulated as a function of input
voltage and output current, and efficiently transfers charge
through the isolation transformer. A small amount of
capacitance, embedded in the input and output stages of the
module, is sufficient for full functionality and is key to achieve
power density.
Total load capacitance at the output of the BCM shall not
exceed the specified maximum. Owing to the wide bandwidth
and low output impedance of the BCM, low frequency bypass
capacitance and significant energy storage may be more
densely and efficiently provided by adding capacitance at the
input of the BCM. At frequencies <500 kHz the BCM appears
as an impedance of ROUT between the source and load.
Within this frequency range capacitance at the input appears
as effective capacitance on the output per the relationship
defined in Eq. 6.
This paradigm shift requires system design to carefully evaluate
external filters in order to:
CIN
K2
COUT
=
Eq. 6
1.Guarantee low source impedance:
To take full advantage of the BCM dynamic response, the
impedance presented to its input terminals must be low
from DC to approximately 5 MHz. The connection of the
This enables a reduction in the size and number of capacitors
used in a typical system.
•
V I Chip to its power source should be implemented with
minimal distribution inductance. If the interconnect
inductance exceeds 100 nH, the input should be bypassed
with a RC damper to retain low source impedance and
stable operation. With an interconnect inductance of
200 nH, the RC damper may be as high as 47 µF in series
with 0.3 Ω. A single electrolytic or equivalent low-Q
capacitor may be used in place of the series RC bypass.
2.Further reduce input and/or output voltage ripple without
sacrificing dynamic response:
Given the wide bandwidth of the BCM, the source
response is generally the limiting factor in the overall
system response. Anomalies in the response of the source
will appear at the output of the BCM multiplied by its
K factor. This is illustrated in Figures 11 and 12.
3.Protect the module from overvoltage transients imposed
by the system that would exceed maximum ratings and
cause failures:
•
The V I Chip input/output voltage ranges shall not be
exceeded. An internal overvoltage lockout function
prevents operation outside of the normal operating input
range. Even during this condition, the powertrain is exposed
to the applied voltage and power MOSFETs must withstand
it. A criterion for protection is the maximum amount of
energy that the input or output switches can tolerate if
avalanched.
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V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
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VIB0101THJ
Figure 1 – BCM behavioral block diagram
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VIB0101THJ
Warranty
Vicor products are guaranteed for two years from date of shipment against defects in material or workmanship when in
normal use and service. This warranty does not extend to products subjected to misuse, accident, or improper applica-
tion or maintenance. Vicor shall not be liable for collateral or consequential damage. This warranty is extended to the
original purchaser only.
EXCEPT FOR THE FOREGOING EXPRESS WARRANTY, VICOR MAKES NO WARRANTY, EXPRESS OR IMPLIED, INCLUDING,
BUT NOT LIMITED TO, THE WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE.
Vicor will repair or replace defective products in accordance with its own best judgement. For service under this war-
ranty, the buyer must contact Vicor to obtain a Return Material Authorization (RMA) number and shipping instructions.
Products returned without prior authorization will be returned to the buyer. The buyer will pay all charges incurred in re-
turning the product to the factory. Vicor will pay all reshipment charges if the product was defective within the terms of
this warranty.
Information published by Vicor has been carefully checked and is believed to be accurate; however, no responsibility is
assumed for inaccuracies. Vicor reserves the right to make changes to any products without further notice to improve
reliability, function, or design. Vicor does not assume any liability arising out of the application or use of any product or
circuit; neither does it convey any license under its patent rights nor the rights of others. Vicor general policy does not
recommend the use of its components in life support applications wherein a failure or malfunction may directly threaten
life or injury. Per Vicor Terms and Conditions of Sale, the user of Vicor components in life support applications assumes
all risks of such use and indemnifies Vicor against all damages.
Vicor’s comprehensive line of power solutions includes high density AC-DC
and DC-DC modules and accessory components, fully configurable AC-DC
and DC-DC power supplies, and complete custom power systems.
Information furnished by Vicor is believed to be accurate and reliable. However, no responsibility is assumed by Vicor for
its use. Vicor components are not designed to be used in applications, such as life support systems, wherein a failure or
malfunction could result in injury or death. All sales are subject to Vicor’s Terms and Conditions of Sale, which are
available upon request.
Specifications are subject to change without notice.
Intellectual Property Notice
Vicor and its subsidiaries own Intellectual Property (including issued U.S. and Foreign Patents and pending patent
applications) relating to the products described in this data sheet. Interested parties should contact Vicor's Intel-
lectual Property Department.
The products described on this data sheet are protected by the following U.S. Patents Numbers:
5,945,130; 6,403,009; 6,710,257; 6,911,848; 6,930,893; 6,934,166; 6,940,013; 6,969,909; 7,038,917;
7,166,898; 7,187,263; 7,361,844; D496,906; D505,114; D506,438; D509,472; and for use under 6,975,098
and 6,984,965
Vicor Corporation
25 Frontage Road
Andover, MA, USA 01810
Tel: 800-735-6200
Fax: 978-475-6715
email
Customer Service: custserv@vicorpower.com
Technical Support: apps@vicorpower.com
Rev. 1.4
9/2009
V•I CHIP INC. (A VICOR COMPANY) 25 FRONTAGE RD. ANDOVER, MA 01810 800-735-6200
Page 16 of 16
vicorpower.com
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