10-FY12S2A040SH-L868L48 [VINCOTECH]

Easy paralleling;High speed switching;Low switching losses;
10-FY12S2A040SH-L868L48
型号: 10-FY12S2A040SH-L868L48
厂家: VINCOTECH    VINCOTECH
描述:

Easy paralleling;High speed switching;Low switching losses

文件: 总22页 (文件大小:10172K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
10-FY12S2A040SH-L868L48  
datasheet  
flowBOOST 1 symmetric dual  
1200 V / 40 A  
Features  
flow 1 12 mm housing  
● Symmetric Boost for 1500 Vdc applications  
● Latest IGBT technology for high speed frequencies  
● Low inductance package  
● Integrated NTC  
● Cost efffective alternative to L869L08  
● Same package and pin-out as L869L08  
Target applications  
● Solar Inverters  
● 10-FY12S2A040SH-L868L48  
Copyright Vincotech  
1
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
Boost Switch  
VCES  
Collector-emitter voltage  
1200  
43  
V
A
IC  
Collector current (DC current)  
Repetitive peak collector current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
Ts = 80 °C  
Tj = 150 °C  
ICRM  
tp limited by Tjmax  
Tj = Tjmax  
120  
111  
±20  
10  
A
Ptot  
W
V
VGES  
Gate-emitter voltage  
tSC  
Short circuit ratings  
VGE = 15 V, VCC = 800 V  
µs  
°C  
Tjmax  
Maximum junction temperature  
175  
Boost Diode  
VRRM  
Peak repetitive reverse voltage  
1200  
28  
V
A
IF  
Forward current (DC current)  
Repetitive peak forward current  
Surge (non-repetitive) forward current  
Total power dissipation  
Tj = Tjmax  
Ts = 80 °C  
IFRM  
IFSM  
Ptot  
tp limited by Tjmax  
92  
A
Single Half Sine Wave,  
tp = 8,3 ms  
Tj = 150 °C  
Ts = 80 °C  
66  
A
Tj = Tjmax  
87  
W
°C  
Tjmax  
Maximum junction temperature  
175  
Boost Sw. Protection Diode  
VRRM  
Peak repetitive reverse voltage  
Forward current (DC current)  
Surge (non-repetitive) forward current  
Surge current capability  
1600  
25  
V
A
IF  
IFSM  
I2t  
Tj = Tjmax  
Ts = 80 °C  
Tj = 150 °C  
Ts = 80 °C  
200  
200  
37  
A
Single Half Sine Wave,  
tp = 10 ms  
A2s  
W
°C  
Ptot  
Total power dissipation  
Tj = Tjmax  
Tjmax  
Maximum junction temperature  
150  
Copyright Vincotech  
2
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Maximum Ratings  
Tj = 25 °C, unless otherwise specified  
Parameter  
Symbol  
Conditions  
Value  
Unit  
ByPass Diode  
VRRM  
Peak repetitive reverse voltage  
1600  
38  
V
A
IF  
Forward current (DC current)  
Surge (non-repetitive) forward current  
Surge current capability  
Tj = Tjmax  
Ts = 80 °C  
Tj = 150 °C  
Ts = 80 °C  
IFSM  
I2t  
270  
370  
47  
A
Single Half Sine Wave,  
tp = 10 ms  
A2s  
W
°C  
Ptot  
Total power dissipation  
Tj = Tjmax  
Tjmax  
Maximum junction temperature  
150  
Module Properties  
Thermal Properties  
Tstg  
Tjop  
Storage temperature  
-40…+125  
°C  
°C  
Operation temperature under switching  
condition  
-40…+(Tjmax - 25)  
Isolation Properties  
Isolation voltage  
Isolation voltage  
Creepage distance  
Clearance  
Visol  
Visol  
DC Test Voltage*  
AC Voltage  
tp = 2 s  
6000  
2500  
V
tp = 1 min  
V
min. 12,7  
9,6  
mm  
mm  
Comparative Tracking Index  
*100 % tested in production  
CTI  
≥ 200  
Copyright Vincotech  
3
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Switch  
Static  
VGE(th)  
VCEsat  
ICES  
IGES  
rg  
Gate-emitter threshold voltage  
Collector-emitter saturation voltage  
Collector-emitter cut-off current  
Gate-emitter leakage current  
Internal gate resistance  
Input capacitance  
VCE = VGE  
0,0015  
40  
25  
5,3  
5,8  
6,3  
V
25  
1,78  
1,95  
2,29  
2,42(1)  
15  
0
V
125  
1200  
0
25  
25  
5
µA  
nA  
Ω
20  
120  
None  
2330  
150  
Cies  
Coes  
Cres  
Qg  
pF  
pF  
pF  
nC  
Output capacitance  
f = 1 Mhz  
0
25  
25  
25  
Reverse transfer capacitance  
Gate charge  
130  
VCC = 960 V  
15  
40  
185  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
0,86  
K/W  
25  
25,6  
24,64  
24,48  
16,8  
td(on)  
Turn-on delay time  
Rise time  
125  
150  
25  
ns  
ns  
tr  
125  
150  
25  
18,24  
18,56  
236,64  
300,48  
315,84  
41,88  
82,25  
97,94  
1,11  
Rgon = 8 Ω  
Rgoff = 8 Ω  
td(off)  
Turn-off delay time  
Fall time  
125  
150  
25  
ns  
0/15  
700  
40  
tf  
125  
150  
25  
ns  
QrFWD=0,108 µC  
QrFWD=0,079 µC  
QrFWD=0,08 µC  
Eon  
Turn-on energy (per pulse)  
Turn-off energy (per pulse)  
125  
150  
25  
1,24  
mWs  
mWs  
1,26  
1,75  
Eoff  
125  
150  
2,84  
3,1  
Copyright Vincotech  
4
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VGE [V]  
VGS [V]  
Min  
Max  
VF [V]  
IF [A]  
Boost Diode  
Static  
25  
1,43  
1,74  
1,84  
20  
1,6(1)  
400  
VF  
IR  
Forward voltage  
20  
125  
150  
25  
V
Reverse leakage current  
Thermal  
Vr = 1200 V  
µA  
150  
160  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
Dynamic  
1,09  
K/W  
25  
13,46  
13,33  
13,38  
11,28  
11,68  
11,81  
0,108  
0,079  
0,08  
IRRM  
Peak recovery current  
125  
150  
25  
A
trr  
Reverse recovery time  
125  
150  
25  
ns  
di/dt=2497 A/µs  
di/dt=2455 A/µs  
Qr  
Recovered charge  
0/15  
700  
40  
125  
150  
25  
μC  
0,025  
0,013  
0,013  
3711  
3575  
3448  
Erec  
Reverse recovered energy  
Peak rate of fall of recovery current  
125  
150  
25  
mWs  
A/µs  
(dirf/dt)max  
125  
150  
Copyright Vincotech  
5
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
Boost Sw. Protection Diode  
Static  
25  
1,12  
1,03  
1,02  
1,1(1)  
VF  
IR  
Forward voltage  
18  
125  
150  
25  
V
100  
Reverse leakage current  
Thermal  
Vr = 1600 V  
µA  
150  
1000  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
1,87  
K/W  
ByPass Diode  
Static  
25  
1,15  
1,1  
1,1(1)  
VF  
IR  
Forward voltage  
28  
V
125  
25  
100  
Reverse leakage current  
Vr = 1600 V  
µA  
150  
1000  
Thermal  
λpaste = 3,4 W/mK  
(PSX)  
(2)  
Rth(j-s)  
Thermal resistance junction to sink  
1,5  
K/W  
Copyright Vincotech  
6
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Characteristic Values  
Symbol  
Parameter  
Conditions  
Values  
Typ  
Unit  
VCE [V] IC [A]  
VDS [V] ID [A] Tj [°C]  
VF [V] IF [A]  
VGE [V]  
VGS [V]  
Min  
Max  
Thermistor  
Static  
R
ΔR/R  
P
Rated resistance  
Deviation of R100  
Power dissipation  
Power dissipation constant  
B-value  
25  
22  
kΩ  
%
R100 = 1484 Ω  
100  
-5  
5
5
mW  
mW/K  
K
d
25  
1,5  
B(25/50)  
Tol. ±1 %  
Tol. ±1 %  
3962  
4000  
B(25/100)  
B-value  
K
Vincotech Thermistor Reference  
I
(1)  
Value at chip level  
(2)  
Only valid with pre-applied Vincotech thermal interface material.  
Copyright Vincotech  
7
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Switch Characteristics  
figure 1.  
IGBT  
figure 2.  
IGBT  
Typical output characteristics  
Typical output characteristics  
IC = f(VCE  
)
IC = f(VCE)  
125  
125  
VGE  
:
7 V  
8 V  
9 V  
100  
75  
50  
25  
0
100  
75  
50  
25  
0
10 V  
11 V  
12 V  
13 V  
14 V  
15 V  
16 V  
17 V  
0
1
2
3
4
5
6
7
8
0
1
2
3
4
5
6
7
8
V
CE(V)  
VCE(V)  
tp  
=
=
tp  
=
250  
15  
μs  
V
250  
125  
μs  
°C  
25 °C  
Tj:  
VGE  
Tj =  
125 °C  
VGE from 7 V to 17 V in steps of 1 V  
figure 3.  
IGBT  
figure 4.  
IGBT  
Typical transfer characteristics  
Transient thermal impedance as a function of pulse width  
IC = f(VGE  
)
Zth(j-s) = f(tp)  
0
40  
10  
-1  
30  
20  
10  
0
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
10  
0,05  
0,02  
0,01  
0,005  
0
-4  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
10  
1
10  
2
0,0  
2,5  
5,0  
7,5  
10,0  
12,5  
10  
10  
tp(s)  
V
GE(V)  
tp  
=
=
250  
10  
μs  
V
D =  
tp / T  
0,856  
25 °C  
Tj:  
VCE  
125 °C  
Rth(j-s) =  
K/W  
IGBT thermal model values  
R (K/W)  
τ (s)  
1,40E-01  
4,53E-01  
1,58E-01  
7,23E-02  
3,25E-02  
8,31E-01  
1,26E-01  
3,84E-02  
8,41E-03  
8,46E-04  
Copyright Vincotech  
8
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Switch Characteristics  
figure 5.  
IGBT  
Safe operating area  
IC = f(VCE  
)
1000  
100  
10  
100µs  
1ms  
1
10ms  
100ms  
DC  
0,1  
0,01  
1
10  
100  
1000  
10000  
V
CE(V)  
D =  
single pulse  
Ts =  
80  
15  
°C  
V
VGE  
=
Tj =  
Tjmax  
Copyright Vincotech  
9
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Diode Characteristics  
figure 6.  
FWD  
figure 7.  
FWD  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
60  
50  
40  
30  
20  
10  
0
10  
0
10  
-1  
10  
-2  
10  
0,5  
0,2  
0,1  
-3  
0,05  
0,02  
0,01  
0,005  
0
10  
-4  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0
1
2
3
4
5
10  
10  
10  
10  
tp(s)  
VF(V)  
tp  
=
250  
μs  
D =  
tp / T  
1,093  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
FWD thermal model values  
R (K/W)  
τ (s)  
4,73E-02  
1,05E-01  
5,77E-01  
1,79E-01  
1,16E-01  
6,86E-02  
2,96E+00  
4,20E-01  
8,31E-02  
2,65E-02  
5,49E-03  
1,07E-03  
Copyright Vincotech  
10  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Sw. Protection Diode Characteristics  
figure 8.  
Rectifier  
figure 9.  
Rectifier  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
50  
40  
30  
20  
10  
0
10  
0
10  
-1  
10  
0,5  
0,2  
-2  
10  
0,1  
0,05  
0,02  
0,01  
0,005  
0
-3  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,00  
0,25  
0,50  
μs  
0,75  
1,00  
1,25  
1,50  
1,75  
10  
10  
10  
10  
VF(V)  
tp(s)  
tp  
=
250  
D =  
tp / T  
1,869  
25 °C  
125 °C  
150 °C  
Rth(j-s) =  
Tj:  
K/W  
Rectifier thermal model values  
R (K/W)  
τ (s)  
5,65E-02  
1,70E-01  
6,15E-01  
6,94E-01  
2,16E-01  
1,19E-01  
8,90E+00  
1,08E+00  
1,58E-01  
5,21E-02  
6,16E-03  
1,06E-03  
Copyright Vincotech  
11  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
ByPass Diode Characteristics  
figure 10.  
Rectifier  
figure 11.  
Rectifier  
Typical forward characteristics  
Transient thermal impedance as a function of pulse width  
IF = f(VF)  
Zth(j-s) = f(tp)  
1
80  
60  
40  
20  
0
10  
0
10  
-1  
10  
0,5  
0,2  
-2  
10  
0,1  
0,05  
0,02  
0,01  
0,005  
0
-3  
10  
-5  
-4  
10  
-3  
10  
-2  
10  
-1  
10  
0
1
2
0,00  
0,25  
0,50  
μs  
0,75  
1,00  
1,25  
1,50  
1,75  
2,00  
VF(V)  
10  
10  
10  
10  
tp(s)  
tp  
=
250  
D =  
tp / T  
1,5  
25 °C  
Tj:  
125 °C  
Rth(j-s) =  
K/W  
Rectifier thermal model values  
R (K/W)  
τ (s)  
9,44E-02  
3,47E-01  
7,44E-01  
2,04E-01  
1,11E-01  
2,48E+00  
3,51E-01  
7,63E-02  
1,21E-02  
1,25E-03  
Copyright Vincotech  
12  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Thermistor Characteristics  
figure 12.  
Thermistor  
Typical NTC characteristic as function of temperature  
RT = f(T)  
25000  
20000  
15000  
10000  
5000  
0
20  
40  
60  
80  
100  
120  
140  
T(°C)  
Copyright Vincotech  
13  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Switching Characteristics  
figure 13.  
IGBT  
figure 14.  
IGBT  
Typical switching energy losses as a function of collector current  
Typical switching energy losses as a function of gate resistor  
E = f(IC)  
E = f(Rg)  
6
5
4
3
2
1
0
4,0  
3,5  
3,0  
2,5  
2,0  
1,5  
1,0  
0,5  
0,0  
Eoff  
Eon  
Eoff  
Eon  
Eon  
Eoff  
Eoff  
Eon  
Eon  
Eoff  
Eon  
Eoff  
0
10  
20  
30  
40  
50  
60  
70  
80  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
=
=
=
=
VCE  
VGE  
IC  
=
=
=
700  
0/15  
8
V
V
Ω
Ω
125 °C  
150 °C  
700  
0/15  
40  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Rgon  
Rgoff  
8
figure 15.  
FWD  
figure 16.  
FWD  
Typical reverse recovered energy loss as a function of collector current  
Typical reverse recovered energy loss as a function of gate resistor  
Erec = f(IC)  
Erec = f(Rg)  
0,040  
0,035  
0,030  
0,025  
0,020  
0,015  
0,010  
0,005  
0,000  
0,08  
0,07  
0,06  
0,05  
0,04  
0,03  
0,02  
0,01  
0,00  
Erec  
Erec  
Erec  
Erec  
Erec  
Erec  
0
10  
20  
30  
40  
50  
60  
70  
80  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
700  
0/15  
8
V
V
Ω
125 °C  
150 °C  
700  
0/15  
40  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
Copyright Vincotech  
14  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Switching Characteristics  
figure 17.  
IGBT  
figure 18.  
IGBT  
Typical switching times as a function of collector current  
Typical switching times as a function of gate resistor  
t = f(IC)  
t = f(Rg)  
0
10  
0
10  
td(off)  
td(off)  
tf  
tf  
-1  
10  
-1  
10  
td(on)  
tr  
tr  
td(on)  
-2  
10  
-2  
10  
-3  
10  
-3  
10  
0
10  
20  
30  
40  
50  
60  
70  
80  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
Rg(Ω)  
With an inductive load at  
With an inductive load at  
Tj =  
Tj =  
150  
700  
0/15  
8
°C  
V
150  
700  
0/15  
40  
°C  
VCE  
=
=
=
=
VCE  
=
=
=
V
V
A
VGE  
Rgon  
Rgoff  
VGE  
IC  
V
Ω
Ω
8
figure 19.  
FWD  
figure 20.  
FWD  
Typical reverse recovery time as a function of collector current  
Typical reverse recovery time as a function of IGBT turn on gate resistor  
trr = f(IC)  
trr = f(Rgon)  
0,0200  
0,0175  
0,0150  
0,0125  
0,0100  
0,0075  
0,0050  
0,0025  
0,0000  
0,0175  
0,0150  
0,0125  
0,0100  
0,0075  
0,0050  
0,0025  
0,0000  
trr  
trr  
trr  
trr  
trr  
trr  
0
10  
20  
30  
40  
50  
60  
70  
80  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
700  
0/15  
8
V
125 °C  
150 °C  
700  
0/15  
40  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
V
Ω
Copyright Vincotech  
15  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Switching Characteristics  
figure 21.  
FWD  
figure 22.  
FWD  
Typical recovered charge as a function of collector current  
Typical recovered charge as a function of turn on gate resistor  
Qr = f(IC)  
Qr = f(Rgon)  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
0,200  
0,175  
0,150  
0,125  
0,100  
0,075  
0,050  
0,025  
0,000  
Qr  
Qr  
Qr  
Qr  
Qr  
Qr  
0
10  
20  
30  
40  
50  
60  
70  
80  
0
5
10  
15  
20  
25  
30  
35  
IC(A)  
Rgon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
700  
0/15  
8
V
V
Ω
125 °C  
150 °C  
700  
0/15  
40  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 23.  
FWD  
figure 24.  
FWD  
Typical peak reverse recovery current as a function of collector current  
Typical peak reverse recovery current as a function of turn on gate resistor  
IRM = f(IC)  
IRM = f(Rgon)  
15,0  
12,5  
10,0  
7,5  
30  
25  
20  
15  
10  
5
IRM  
IRM  
IRM  
5,0  
IRM  
IRM  
IRM  
2,5  
0,0  
0
0
10  
20  
30  
40  
50  
60  
70  
80  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
R
gon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
700  
0/15  
8
V
V
Ω
125 °C  
150 °C  
700  
0/15  
40  
V
125 °C  
150 °C  
Tj:  
Tj:  
V
A
Copyright Vincotech  
16  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Switching Characteristics  
figure 25.  
FWD  
figure 26.  
FWD  
Typical rate of fall of forward and reverse recovery current as a function of collector current  
Typical rate of fall of forward and reverse recovery current as a function of turn on gate resistor  
diF/dt, dirr/dt = f(IC)  
diF/dt, dirr/dt = f(Rgon)  
4500  
10000  
8000  
6000  
4000  
2000  
0
diF/dt ‒ ‒ ‒ ‒ ‒  
diF/dt ‒ ‒ ‒ ‒ ‒  
dirr/dt ──────  
4000  
dirr/dt ──────  
3500  
3000  
2500  
2000  
1500  
1000  
500  
0
0
10  
20  
30  
40  
50  
60  
70  
80  
IC(A)  
0
5
10  
15  
20  
25  
30  
35  
R
gon(Ω)  
With an inductive load at  
With an inductive load at  
25 °C  
25 °C  
VCE  
VGE  
Rgon  
=
=
=
VCE  
VGE  
IC  
=
=
=
700  
0/15  
8
V
V
Ω
125 °C  
150 °C  
700  
0/15  
40  
V
V
A
125 °C  
150 °C  
Tj:  
Tj:  
figure 27.  
IGBT  
Reverse bias safe operating area  
IC = f(VCE  
)
90  
IC MAX  
80  
70  
60  
50  
40  
30  
20  
10  
0
0
250  
500  
750  
1000  
1250  
1500  
V
CE(V)  
Tj =  
At  
150  
°C  
Ω
Rgon  
Rgoff  
=
=
8
8
Ω
Copyright Vincotech  
17  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Switching Definitions  
figure 28.  
IGBT  
figure 29.  
IGBT  
Turn-off Switching Waveforms & definition of tdoff, tEoff (ttEoff = integrating time for Eoff  
)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)  
tdoff  
IC  
IC  
VGE  
VGE  
VCE  
tEoff  
VCE  
tEon  
figure 30.  
IGBT  
figure 31.  
IGBT  
Turn-off Switching Waveforms & definition of tf  
Turn-on Switching Waveforms & definition of tr  
IC  
IC  
VCE  
tr  
VCE  
tf  
Copyright Vincotech  
18  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Boost Switching Definitions  
figure 32.  
FWD  
figure 33.  
FWD  
Turn-off Switching Waveforms & definition of trr  
Turn-on Switching Waveforms & definition of tQr (tQr = integrating time for Qr)  
Qr  
IF  
IF  
fitted  
VF  
Copyright Vincotech  
19  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Ordering Code  
Marking  
Version  
Ordering Code  
Without thermal paste  
With thermal paste  
10-FY12S2A040SH-L868L48  
10-FY12S2A040SH-L868L48-/3/  
Name  
Date code  
UL & VIN  
Lot  
Serial  
Text  
NN-NNNNNNNNNNNNNN-  
TTTTTTVV  
WWYY  
UL VIN  
LLLLL  
SSSS  
Type&Ver  
Lot number  
Serial  
Date code  
Datamatrix  
TTTTTTTVV  
LLLLL  
SSSS  
WWYY  
Outline  
Pin table [mm]  
Pin  
1
X
Y
Function  
DC-In2  
S25  
52,5  
50,6  
47,6  
43,8  
35,9  
31,3  
21,2  
16,6  
8,7  
0
7,6  
6,2  
6,2  
0
2
3
G25  
4
Boost-2  
DC+In2  
Boost+2  
Boost+1  
DC+In1  
Boost-1  
G15  
5
6
6,5  
6,5  
0
7
8
9
6,2  
6,2  
7,6  
0
10  
11  
12  
13  
14  
15  
4,9  
1,9  
S15  
0
DC-In1  
G17  
10,1  
10,1  
0
21  
24  
S17  
25,8  
DC-  
Boost1  
DC-  
16  
0
28,5  
Boost1  
N1  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
9,7  
28,5  
28,5  
28,5  
28,5  
28,5  
28,5  
28,5  
24  
12,4  
22,1  
24,8  
27,5  
37,1  
39,8  
39,4  
39,4  
49,5  
N1  
DC+Boost  
DC+Boost  
DC+Boost  
N2  
N2  
S27  
21  
G27  
28,5  
DC-  
Boost2  
DC-  
27  
49,5  
25,8  
Boost2  
Therm1  
Therm2  
28  
29  
52,5  
52,5  
28,5  
21,3  
Copyright Vincotech  
20  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Pinout  
DC+Boost  
19,20,21  
D18  
D28  
DC+In2  
DC+In1  
8
5
D17  
D47  
D27  
Boost+2  
Boost+1  
7
6
T27  
T17  
D57  
G27  
G17  
13  
25  
S27  
S17  
14  
24  
N1  
17,18  
N2  
22,23  
T15  
T25  
D55  
D45  
D15  
G25  
G15  
3
S25  
10  
S15  
2
11  
D25  
Boost-2  
Boost-1  
4
9
D26  
DC-In2  
DC-In1  
1
12  
D16  
15,16  
DC-Boost1  
26,27  
DC-Boost2  
Rt  
Therm1  
28  
Therm2  
29  
Identification  
Component  
Voltage  
Current  
Function  
Comment  
ID  
T15, T17, T25, T27  
D15, D17, D25, D27  
D45, D47, D55 , D57  
D16, D18, D26, D28  
Rt  
IGBT  
FWD  
1200 V  
1200 V  
1600 V  
1600 V  
40 A  
20 A  
18 A  
28 A  
Boost Switch  
Boost Diode  
Rectifier  
Rectifier  
Thermistor  
Boost Sw. Protection Diode  
ByPass Diode  
Thermistor  
Copyright Vincotech  
21  
16 Oct. 2020 / Revision 1  
10-FY12S2A040SH-L868L48  
datasheet  
Packaging instruction  
Handling instruction  
Standard packaging quantity (SPQ) 100  
>SPQ  
Standard  
<SPQ  
Sample  
Handling instructions for flow 1 packages see vincotech.com website.  
Package data  
Package data for flow 1 packages see vincotech.com website.  
Vincotech thermistor reference  
See Vincotech thermistor reference table at vincotech.com website.  
UL recognition and file number  
This device is certified according to UL 1557 standard, UL file number E192116. For more information see vincotech.com website.  
Document No.:  
Date:  
Modification:  
Pages  
10-FY12S2A040SH-L868L48-D1-14  
16 Oct. 2020  
DISCLAIMER  
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to  
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations  
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,  
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said  
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons  
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine  
the suitability of the information and the product for reader’s intended use.  
LIFE SUPPORT POLICY  
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval  
of Vincotech.  
As used herein:  
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or  
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be  
reasonably expected to result in significant injury to the user.  
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause  
the failure of the life support device or system, or to affect its safety or effectiveness.  
Copyright Vincotech  
22  
16 Oct. 2020 / Revision 1  

相关型号:

10-FY12S2A075SH-L860L48

Easy paralleling;High speed switching;Low switching losses
VINCOTECH

10-FZ062PA100SA-P994F08

Insulated Gate Bipolar Transistor
VINCOTECH

10-FZ062PA150SA01-P995F18

Insulated Gate Bipolar Transistor
VINCOTECH

10-FZ062PA200SA01-P996F18

Insulated Gate Bipolar Transistor
VINCOTECH

10-FZ062TA030

Compact and low inductance design
VINCOTECH

10-FZ062TA030FB-P983D18

Vincotech clip-in housing
VINCOTECH

10-FZ062TA030FB01-P983D28

Vincotech clip-in housing
VINCOTECH

10-FZ062TA030FB02-P983D38

Vincotech clip-in housing
VINCOTECH

10-FZ062TA030FB03-P983D48

Vincotech clip-in housing
VINCOTECH

10-FZ062TA040FB-P984D18

Compact and low inductance design
VINCOTECH

10-FZ062TA040FB01-P984D28

Compact and low inductance design
VINCOTECH

10-FZ062TA040FB02-P984D38

Compact and low inductance design
VINCOTECH