V23990-P627-F88-PM [VINCOTECH]
Easy paralleling;High speed switching;Low switching losses;型号: | V23990-P627-F88-PM |
厂家: | VINCOTECH |
描述: | Easy paralleling;High speed switching;Low switching losses |
文件: | 总17页 (文件大小:1484K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
V23990-P627-F88-PM
V23990-P627-F89-PM
datasheet
fastPack 0 H
1200 V / 15 A
Features
flow 0 housing
● High efficient H-bridge
● High-speed IGBT
● Ultra high switching frequency
● Ultra low inductive design
● Clip-in PCB mounting
12mm housing
17mm housing
Schematic
Target applications
● Solar
● SMPS
● UPS
● Welding
Types
● V23990-P627-F88-PM
● V23990-P627-F89-PM
Maximum Ratings
Tj=25°C, unless otherwise specified
Condition
Parameter
Symbol
Value
Unit
H-Bridge Switch
Collector-emitter voltage
1200
22
V
A
VCES
IC
Collector current
Tj = Tjmax
Ts =80 °C
Ts =80 °C
Repetitive peak collector current
Total power dissipation
Gate-emitter voltage
I CRM
Ptot
VGES
Tjmax
tp limited by Tjmax
Tj = Tjmax
45
A
71
W
V
±20
175
Maximum Junction Temperature
°C
Copyright Vincotech
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V23990-P627-F89-PM
datasheet
Conditions
Parameter
Symbol
Value
Unit
H-Bridge Diode
Peak Repetitive Reverse Voltage
Continuous (direct) forward current
Surge (non-repetitive) forward current
Surge current capability
1200
16
V
A
A
VRRM
I F
Tj = Tjmax
T
h = 80°C
Tj = °C
IFSM
50 Hz Single Half Sine Wave
65
I2
t
A2s
W
tp = 10 ms 50 Hz sine
21
Total power dissipation
=
= 80°C
42
Ptot
Tj Tjmax
Th
Maximum Junction Temperature
Tjmax
175
°C
Conditions
Value
Parameter
Symbol
Unit
Module Properties
Thermal Properties
Storage temperature
-40…+125
Tstg
Tjop
°C
°C
Operation temperature under switching
condition
-40…+(Tjmax - 25)
Isolation Properties
Isolation voltage
Visol
DC voltage
tp=2s
4000
min 12,7
9,55 / >12,7
>200
V
Creepage distance
Clearance
mm
mm
12mm housing / 17mm housing
Comparative Tracking Index
CTI
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datasheet
Characteristic Values
Parameter
Symbol
Conditions
Value
Unit
H-Bridge Switch
V GE [V] V CE [V] IC [A] Tj[ °C]
Min
Typ
Max
Static
25
0,0005
5,3
5,8
6,3
Gate-emitter threshold voltage
=
V
V
VGE VCE
V
(th)
GE
125
25
1,78
1,89
2,28
2,42
Collector-emitter saturation voltage
15
15
125
150
25
V
CEsat
2
Collector-emitter cut-off current
Gate-emitter leakage current
Internal gate resistance
0
1200
0
µA
nA
Ω
I
CES
125
25
120
20
I
GES
125
none
875
45
rg
Input capacitance
C
ies
f=1 MHz
0
25
25
pF
Reverse transfer capacitance
C
res
Thermal
Phase-Change
Material
=3,4W/mK
Thermal resistance junction to sink
1,35
K/W
R
th(j-s)
ʎ
IGBT Switching
25
84
85
86
Turn-on delay time
td(on)
125
150
25
Rgoff = 32 Ω
= 32 Ω
24
Rise time
tr
125
150
25
125
150
25
125
150
25
125
150
25
25
26
174
221
230
42
Rgon
ns
Turn-off delay time
Fall time
td(off)
±15
600
15
tf
63
69
QrFWD = 1,1 ꢀC
QrFWD = 2,1 ꢀC
QrFWD = 2,6 ꢀC
0,894
1,283
1,444
0,512
0,815
0,890
Turn-on energy (per pulse)
Turn-off energy (per pulse)
E on
mWs
E off
125
150
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datasheet
Symbol
Parameter
Conditions
Value
Typ
Unit
V
T
r [V] IF [A] j [°C] Min
Max
H-Bridge Diode
Static
25
2,37
2,47
2,71
Forward voltage
15
125
150
25
V
VF
60
Reverse leakage current
1200
µA
Ir
150
1800
Thermal
Phase-Change
Material
Thermal resistance junction to sink
2,46
K/W
R th(j-s)
ʎ
=3,4W/mK
FWD Switching
25
12
15
16
Peak recovery current
IRRM
125
150
25
A
ns
250
Reverse recovery time
trr
125
150
25
125
150
25
125
150
25
125
150
429
466
di/dt = 615 A/ꢀs
di/dt = 691 A/ꢀs ±15
di/dt = 576 A/ꢀs
1,122
2,063
2,610
0,439
0,830
1,075
133
Recovered charge
Qr
600
15
ꢀC
Reverse recovered energy
Peak rate of fall of recovery current
E rec
mWs
A/µs
(di rf/dt)max
101
94
Thermistor
Conditions
Value
Typ
Parameter
Symbol
Unit
V
GE [V]
V CE [V]
I C [A]
T j[ °C]
Min
Max
Rated resistance
Deviation of R100
Power dissipation
Power dissipation constant
B-value
R
ΔR/R
P
25
100
25
25
25
25
21,5
kΩ
%
R100=1486 Ω
-4,5
+4,5
210
3,5
mW
mW/K
K
B(25/50)
3884
3964
B-value
B(25/100)
K
Vincotech NTC Reference
F
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datasheet
H-Bridge Switch Characteristics
Typical output characteristics
IGBT
Typical output characteristics
IGBT
IC = f(VCE
)
I C = f(VCE)
I
I
I
I
I
I
I
I
tp
=
250
15
ꢀs
V
25 °C
125 °C
150 °C
tp
=
250
150
ꢀs
°C
VGE
=
Tj =
VGE from
7 V to 17 V in steps of 1 V
Typical transfer characteristics
IGBT
Transient Thermal Impedance as function of Pulse duration
IGBT
IC = f(VGE
)
Z th(j-s) = f(tp)
101
I
I
I
I
Z
Z
Z
Z
100
10-1
10-2
10-4
10-3
10-2
10-1
10
101
102
tp(s)
tp
=
100
10
ꢀs
V
25 °C
125 °C
150 °C
D =
R th(j-s)
tp / T
1,35
VCE
=
=
K/W
IGBT thermal model values
R th (K/W)
1,62E-01
6,34E-01
2,82E-01
1,64E-01
8,75E-02
1,75E-02
τ
(s)
5,85E-01
9,42E-02
2,85E-02
6,73E-03
9,43E-04
3,79E-04
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datasheet
Gate voltage vs Gate charge
IGBT
VGE = f(Q G
)
V
V
V
V
At
IC=
15
A
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datasheet
H-Bridge Diode Characteristics
Typical forward characteristics
FWD
Transient thermal impedance as a function of pulse width
FWD
IF = f(VF)
Z th(j-s) = f(tp)
101
Z
Z
Z
Z
100
D = 0,5
0,2
10-1
0,1
0,05
0,02
0,01
0,005
0.000
10-2
10-4
=
10-3
10-2
10-1
100
101
102
D =
R th(j-s)
tp
=
250
ꢀs
25 °C
125 °C
150 °C
tp / T
2,24
T j:
K/W
FWD thermal model values
R (K/W)
τ
(s)
7,47E-02
1,66E-01
9,90E-01
4,45E-01
3,36E-01
2,26E-01
2,62E+00
3,82E-01
7,20E-02
1,82E-02
3,41E-03
6,98E-04
Thermistor
Typical Thermistor resistance values
Thermistor typical temperature characteristic
Typical NTC characteristic
as a function of temperature
R T = f(T)
Copyright Vincotech
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datasheet
H-Bridge Switching Definition
Figure 1.
IGBT
Figure 2.
IGBT
Typical switching energy losses as a function of collector current
Typical switching energy losses as a function of gate resistor
E = f(rg)
E = f(IC
)
E
E
E
E
E
E
E
E
25 °C
25 °C
125 °C
150 °C
With an inductive load at
With an inductive load at
600
±15
32
V
V
Ω
Ω
j:
125 °C
150 °C
600
±15
15
V
VCE
VGE
=
=
=
=
T
VCE
VGE
IC
=
=
=
T j:
V
A
R gon
R goff
32
Figure 3.
FWD
Figure 4.
FWD
Typical reverse recovered energy loss as a function of collector current
Typical reverse recovered energy loss as a function of gate resistor
Erec = f(Ic)
Erec = f(rg )
E
E
E
E
E
E
E
E
25 °C
125 °C
150 °C
25 °C
125 °C
150 °C
With an inductive load at
With an inductive load at
:
600
±15
32
V
V
Ω
:
600
±15
15
V
V
A
VCE
VGE
=
=
=
T j
VCE
VGE
IC
=
=
=
T j
R gon
Copyright Vincotech
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V23990-P627-F89-PM
datasheet
H-Bridge Switching Definitions
Figure 5.
IGBT
Figure 6.
IGBT
Typical switching times as a function of collector current
Typical switching times as a function of gate resistor
t = f(I C
)
t = f(rg)
t
t
t
t
t
t
t
t
With an inductive load at
With an inductive load at
150
600
±15
32
°C
150
600
±15
15
°C
Tj =
Tj =
VCE
=
=
=
=
V
V
Ω
Ω
VCE
=
=
=
V
V
A
VGE
R gon
R goff
VGE
IC
32
Figure 7.
FWD
Figure 8.
FWD
Typical reverse recovery time as a function of collector current
Typical reverse recovery time as a function of IGBT turn on gate resistor
trr = f(IC
)
trr = f(R gon
)
t
t
t
t
t
t
t
t
600
600
±15
32
V
V
Ω
25 °C
V
V
A
25 °C
125 °C
150 °C
At
VCE
=
At
VCE =
:
:
125 °C
150 °C
±15
15
VGE
R gon
=
=
Tj
VGE
IC
=
Tj
=
Copyright Vincotech
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V23990-P627-F89-PM
datasheet
H-Bridge Switching Definition
Figure 9.
FWD
Figure 10.
FWD
Typical recovered charge as a function of collector current
Typical recoved charge as a function of IGBT turn on gate resistor
Q r = f(IC
)
Qr = f(R gon)
Q
Q
Q
Q
Q
Q
Q
Q
25 °C
600
V
V
Ω
600
±15
15
V
25 °C
125 °C
150 °C
At
VCE
VGE
R gon
=
At
VCE
VGE
IC
=
:
:
±15
32
125 °C
150 °C
V
A
=
T j
=
T j
=
=
Figure 11.
FWD
Figure 12.
FWD
Typical peak reverse recovery current current as a function of collector current
Typical peak reverse recovery current as a function of IGBT turn on gate resistor
I RM = f(I C
)
IRM = f(R gon
)
I
I
I I
I I
I
I
25 °C
600
V
V
Ω
600
±15
15
V
V
A
25 °C
125 °C
150 °C
At
VCE
=
At
VCE =
:
:
±15
32
125 °C
150 °C
VGE
R gon
=
=
T j
VGE
IC
=
T j
=
Copyright Vincotech
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V23990-P627-F88-PM
V23990-P627-F89-PM
datasheet
H-Bridge Switching Definition
Figure 13.
FWD
Figure 14.
FWD
Typical rate of fall of forward and reverse recovery current as a function of collector current
Typical rate of fall of forward and reverse recovery current as a function of IGBT turn on gate resistor
di F/dt,di rr/dt = f(Ic)
di F/dt,di rr/dt = f(R g)
diF/dt
diF
/
dt
t
t
t
t
t
t
t
t
dir r/d
t
i
i
i
i
dir r
/dt
i
i
i
i
25 °C
125 °C
150 °C
600
±15
32
V
V
Ω
600
±15
15
V
At
VCE
=
At
VCE
VGE
IC
=
:
V
A
VGE
=
=
T j
=
R gon
=
Figure 15.
IGBT
Reverse bias safe operating area
I C = f(V CE
)
IC MAX
I
I
I
I
I
I
I
I
I
I
I
I
V
V
V
V
At
175
°C
Ω
Tj =
32
32
R gon =
R goff =
Ω
Copyright Vincotech
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V23990-P627-F89-PM
datasheet
H-Bridge Switching Definition
General conditions
=
=
=
125 °C
32 Ω
T j
Rgon
R goff
32 Ω
Figure 1.
IGBT
Figure 2.
IGBT
Turn-off Switching Waveforms & definition of tdoff, tEoff (tEoff = integrating time for Eoff)
Turn-on Switching Waveforms & definition of tdon, tEon (tEon = integrating time for Eon)
tdoff
IC
VCE
IC
VCE
VGE
tEoff
VGE
tEon
-15
V
V
V
A
-15
V
VGE (0%) =
VGE (0%) =
15
15
V
VGE (100%) =
VC (100%) =
I C (100%) =
VGE (100%) =
VC (100%) =
IC (100%) =
600
15
600
15
V
A
0,221
0,403
ꢀs
0,085
0,329
ꢀs
ꢀs
tdoff
tEoff
=
=
tdon
tEon
=
=
ꢀs
Figure 3.
IGBT
Figure 4.
IGBT
Turn-off Switching Waveforms & definition of tf
Turn-on Switching Waveforms & definition of tr
IC
VCE
IC
VCE
tr
tf
600
600
V
V
VC (100%) =
I C (100%) =
tf =
VC (100%) =
IC (100%) =
15
A
15
A
0,063
µs
0,025
µs
tr
=
Copyright Vincotech
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V23990-P627-F89-PM
datasheet
H-Bridge Switching Definition
Figure 5.
IGBT
Figure 6.
IGBT
Turn-off Switching Waveforms & definition of tEoff
Turn-on Switching Waveforms & definition of tEon
Pon
Eoff
Poff
Eon
tEoff
tEon
9,05
kW
mJ
ꢀs
9,05
1,28
0,33
kW
mJ
ꢀs
Poff (100%) =
Eoff (100%) =
Pon (100%) =
Eon (100%) =
0,82
0,40
tEoff
=
tEon =
Figure 7.
FWD
Turn-off Switching Waveforms & definition of trr
Id
Vd
fitted
Vd (100%) =
I d (100%) =
I RRM (100%) =
600
V
A
A
15
-15
Copyright Vincotech
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V23990-P627-F88-PM
V23990-P627-F89-PM
datasheet
H-Bridge Switching Definition
Figure 8.
FWD
Figure 9.
FWD
Turn-on Switching Waveforms & definition of tQrr (tQrr = integrating time for Qrr
)
Turn-on Switching Waveforms & definition of tErec (tErec= integrating time for Erec)
Id
Qrr
Erec
tErec
Prec
I d (100%) =
15
A
Prec (100%) =
Erec (100%) =
9,05
kW
mJ
ꢀs
Q rr (100%) =
2,06
0,86
ꢀC
ꢀs
0,83
0,86
tQrr
=
tErec =
Copyright Vincotech
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V23990-P627-F89-PM
datasheet
Ordering Code & Marking
Version
Ordering Code
V23990-P627-F88
V23990-P627-F89
in DataMatrix as
in packaging barcode as
P627F88
without thermal paste 12mm housing
without thermal paste 17mm housing
P627F88
P627F89
P627F89
Vinco
Vinco
Date code
WWYY
Name&Ver
UL
UL
Lot
Serial
Vinco WWYY
NNNNNNNVV UL
LLLLL SSSS
Text
NNNNNNNVV
Serial
LLLLL
SSSS
Type&Ver
TTTTTTTVV
Lot number
LLLLL
Date code
WWYY
Datamatrix
SSSS
Outline
Pin table [mm]
Pin
1
X
Y
Function
G11
0
22,5
22,5
22,5
22,5
22,5
22,5
22,5
22,5
17,8
15,3
7,2
4,7
0
2
2,9
8,3
10,8
19,6
22,1
29,1
32
S11
3
DC-
4
DC-
5
DC+
DC+
S12
6
7
8
G12
9
33,5
33,5
33,5
33,5
32
OUT1
OUT1
OUT2
OUT2
G14
10
11
12
13
14
15
16
17
18
19
20
21
22
29,1
22,1
19,6
10,8
8,3
2,9
0
0
S14
0
DC+
DC+
DC-
0
0
0
DC-
0
S13
0
G13
0
8
Therm1
Therm2
0
14,5
Copyright Vincotech
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datasheet
Pinout
Identification
ID
Component
Voltage
Current
Function
Comment
T11-T14
IGBT
1200V
15A
15A
-
H-Bridge Switch
D11-D14
Rt
FWD
NTC
1200V
-
H-Bridge Diode
Thermistor
Copyright Vincotech
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datasheet
Packaging instruction
Handling instruction
Standard packaging quantity (SPQ)
135
>SPQ
Standard
<SPQ
Sample
Handling instructions for flow 0 packages see vincotech.com website.
Document No.:
Date:
Modification:
Pages
V23990-P627-F8x-D2-14
22 Okt. 2015
Module properties correction
2
DISCLAIMER
The information, specifications, procedures, methods and recommendations herein (together “information”) are presented by Vincotech to
reader in good faith, are believed to be accurate and reliable, but may well be incomplete and/or not applicable to all conditions or situations
that may exist or occur. Vincotech reserves the right to make any changes without further notice to any products to improve reliability,
function or design. No representation, guarantee or warranty is made to reader as to the accuracy, reliability or completeness of said
information or that the application or use of any of the same will avoid hazards, accidents, losses, damages or injury of any kind to persons
or property or that the same will not infringe third parties rights or give desired results. It is reader’s sole responsibility to test and determine
the suitability of the information and the product for reader’s intended use.
LIFE SUPPORT POLICY
Vincotech products are not authorised for use as critical components in life support devices or systems without the express written approval
of Vincotech.
As used herein:
1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or
sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in labelling can be
reasonably expected to result in significant injury to the user.
2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause
the failure of the life support device or system, or to affect its safety or effectiveness.
Copyright Vincotech
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