232266197002 [VISHAY]
Surface Mount PTC Thermistors For Overload Protection; 表面贴装PTC热敏电阻过载保护
| 型号： | 232266197002 |
| 厂家： | 
VISHAY |
| 描述： | Surface Mount PTC Thermistors For Overload Protection |
| 文件： | 总4页 (文件大小：110K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
2322 661 97...
Vishay BCcomponents
Surface Mount PTC Thermistors
For Overload Protection
FEATURES
• Ideal for pick-and-place circuit assembly
• Low mounting height
• Suitable for reflow soldering
• Small ceramic diameter for faster response
• Low heat transfer to substrate
• Flat terminations for stable positioning and good
solderability.
APPLICATIONS
• Telecom
– Central office switching (C.O.)
– Subscriber terminal equipment (T.E.)
– Set top box
QUICK REFERENCE DATA
VALUE
DESCRIPTION
STANDARD
TELECOM
TYPES(1)(2)
– Modems
TYPES(1)(2)
– Cable TV communications
• General industry and automotive
– Low power supplies overload protection
– Data bus protection.
Nominal R25
2 to 500 Ω
10 to 70 Ω
Resistance tolerance
Maximum overload current
(voltage dependent)
±10%; ±15%; ±20%
2 to 10 A
Non-trip current
50 to 500 mA 50 to 100 mA
at 25 °C
DESCRIPTION
at 70 °C
The component consists of a high-performance PTC
ceramic disc mounted in a lead-frame for direct soldering
onto a printed-circuit board (PCB) or substrate.
Maximum voltage
16 to 400 V
(RMS)
220 to 600 V
( RMS)
Response time at 25 °C and
20 W overload power
Matching
<1 s
down to 0.5 Ω
The ceramic is soldered to the leadframe by a local reflow
process, during which the solder layer is melted to the
metallized ceramic surface using a low residue flux.
−
Maximum continuous power at
2 W
Notes
1. Customized products are available on request.
2. Coated and/or reinforced types are available on request.
MARKING
• All SMD PTCs are marked with the last 3-digits of the type
number and a date code (YYWW).
ELECTRICAL DATA AND ORDERING INFORMATION
MAX.
TRIP-TIME
R25
I
nt at
It at
V
MAX.
(V)
MATCHED
PAIRS
AVAILABLE
CERAMIC
SIZE
(mm)
CATALOG
NUMBER
2322 661 .....
tt
(s)
at It
(mA)
Ω
( )
°
°
°
(%)
25 C
70 C
25 C
Telecommunication types; see note 1
40
15 to 20(1)
15 to 20(1)
25(1)
25
−
−
265
300
300
265
425
245
245
300
425
80
50
100
100
70
130
250
250
220
175
270
270
250
150
2.5
1.5
1.5
1.3
1.0
3.0
3.0
1.4
0.8
500
no
0.5 Ω
no
1 Ω
1 Ω
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
97002
97003
97004
97005
97009
97012
97016
97018
97019
150
150
120
110
165
165
120
90
1000
1000
1000
1000
1000
1000
1000
1000
20
35(1)
+15/−20
20
70
10(1)
100
100
70
no
10(1)
20
20
20
0.5 Ω
0.5 Ω
1 Ω
20(1)
50
60
General industrial types
9.4(1)
3.3(1)
25
25
60
24
150
400
100
−
300
650
4.0
6.0
600
1000
−
−
6.5
6.5
97011
97013
Note
1. These types pass “ITU-T K20/21” telecommunication protection recommendation.
Document Number: 29068
Revision: 10-Oct-03
For technical questions contact: nlr.europe@vishay.com
www.vishay.com
147
2322 661 97...
Surface Mount PTC Thermistors
For Overload Protection
Vishay BCcomponents
DIMENSIONS in millimeters
MATERIAL INFORMATION
2
3
REF.
DESCRIPTION
MATERIAL AND REMARKS
1
1
ceramic
BaTiO3 doped
NiCr Ag layer
(vacuum deposition)
2
metallization
Ni plated phosphor bronze material
covered by PbSn8 solder layer
3
leadframe
2
3
Product outline. See Material Information table.
HANDLING PRECAUTIONS
The special leadframe construction and the applied processes do not allow high handling forces on the component.
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of
perspiration can influence component behaviour at high temperatures.
Handling forces vertically applied to the centre of the component should be limited to 5 N in the non-soldered condition and to
10 N in the soldered. These forces should not be exceeded during the handling, transportation and packaging of the soldered
product.
For those applications where higher handling forces can be present, a re-inforced version is available on request.
PTC OUTLINES
PTC SMD ceramic size: 6.5 mm.
0
−0.2
7.2
8.0
2
3.45
±0.15
0.2
1
10°
max.
+0.6
0
0.6
7.6 ±0.25
10 ±0.25
3.6 ±0.1
1.2
4 ±0.2
2.8
For electrical data, see Electrical Data
and Ordering Information table.
4 ±0.1
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with “CECC 00802”. Soldering processes which can be
used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 °C during 10 s should
not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of a soldering processes that will provide reliable joints without damage, are shown below.
Dimensions of the solder lands in millimeters
Reflow soldering.
Vapour phase soldering.
300
T
300
10 s
10 s
T
( C)
( C)
260
245
C
C
2
250
200
150
100
50
20 to 40 s
250
200
150
100
215
180
C
C
215
180
C
C
40 s
5
forced
cooling
130
C
130
C
external preheating
100
C
internal preheating,
e.g. by infrared,
max. 2 K/s
2 K/s
50
11
0
0
0
50
100
150
200
250
0
50
100
150
200
250
t (s)
t (s)
Typical values (solid line).
Process limits (dotted line).
Typical values (solid line).
Process limits (dotted lines).
www.vishay.com
148
For technical questions contact: nlr.europe@vishay.com
Document Number: 29068
Revision: 10-Oct-03
2322 661 97...
Surface Mount PTC Thermistors
For Overload Protection
Vishay BCcomponents
PACKAGING
TAPE SPECIFICATIONS
All tape and reel specifications are in accordance with IEC 60286-3”. Basic dimensions are given in Blister Tape and Reel
drawings, and Material Information and Electrical Data and Ordering Information tables. Carrier tape material is conductive
polystyrene or polycarbonate.
Blister tape.
K
P
0
0
T
D
P
2
0
E
F
cover tape
W
B
0
A
D
T
1
0
1
T
P
1
2
Cumulative pitch error: 0.2 mm over 10 pitches.
direction of unreeling
Cumulative tolerance over 10 holes: ±0.2 mm.
Component orientation in the tape: large upper contact is
situated on the sprocket hole side, see Component
Orientation in the Tape drawing.
For dimensions see Dimensions of Blister Tape table.
DIMENSIONS OF BLISTER TAPE in millimeters
SYMBOL
PRODUCT SIZE CODE
TOL.
A0; note 1
B0; note 1
K0
W
7.5
10.5
4.1
16
±0.1
±0.1
±0.1
±0.3
E
F
D0
D1
1.75
7.5
1.5
1.5
4
±0.1
±0.1
+0.1/−0.0
+0.1/−0.0
±0.1
P0; note 2
P1
12
±0.1
P2
2
±0.1
T tape thickness
T1 cover tape
T2
0.3
0.05
4.6
±0.03
−
max.
Notes
1. Measured 0.3 mm above base pocket.
2. P0 pitch tolerance over any 10 pitches is ±0.2 mm.
Component orientation in the tape.
005
005
005
0104
0104
0104
Document Number: 29068
Revision: 10-Oct-03
For technical questions contact: nlr.europe@vishay.com
www.vishay.com
149
2322 661 97...
Surface Mount PTC Thermistors
For Overload Protection
Vishay BCcomponents
LEADER/TRAILER TAPE SPECIFICATION
Leader/trailer tape.
leader end
empty compartments
with cover tape
(min. 240 mm)
trailer end
cover tape only
trailer (min. 160 mm)
leader ≥400 mm
TAPING PACKAGE REQUIREMENTS
Component is free and not sticking to top and/or bottom tape.
Component should be easy to remove from carrier tape.
PEEL-OFF FORCE
Peel-off force of blister tape is in accordance with “IEC 60286-3”; that is, 0.1 to 1.3 N at a peel-off speed of 300 mm/minute.
Peel-off force.
peeling direction
top cover tape
10°
carrier tape
REEL SPECIFICATIONS in millimeters
Reel.
W
2
0.15
0
20.5
12.75
N
A
W
1
For reel dimensions see Electrical Data and Ordering Information table.
REEL DIMENSIONS in millimeters
W2
MAX.
PRODUCT SIZE
CODE
UNITS(2)
PER REEL
TAPE WIDTH
A
N
W1
4028
1500
16
330
62
16.4
20.4
Notes
1. Reels are packed in sealed plastic bags for protection against high humidity and corrosive atmospheres.
2. For matched components it is possible to have a maximum of one incomplete reel per resistance group.
The minimum packaging quantity will be 500 units, with an even 100 up to 1400.
www.vishay.com
150
For technical questions contact: nlr.europe@vishay.com
Document Number: 29068
Revision: 10-Oct-03
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