298D105X9016K4T [VISHAY]
CAPACITOR, TANTALUM, SOLID, POLARIZED, 16 V, 1 uF, SURFACE MOUNT, 0402, CHIP, GREEN;
| 型号： | 298D105X9016K4T |
| 厂家： | 
VISHAY |
| 描述： | CAPACITOR, TANTALUM, SOLID, POLARIZED, 16 V, 1 uF, SURFACE MOUNT, 0402, CHIP, GREEN |
| 文件： | 总12页 (文件大小：183K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
298D
Vishay Sprague
Solid Tantalum Chip Capacitors
TM
MICROTAN Leadframeless Molded
FEATURES
• 0805, 0603 and 0402 footprint
• Lead (Pb)-free L-shaped terminations
• 8 mm tape and reel packaging available per
EIA-481-1 and reeling per IEC 286-3
7" [178 mm] standard
• Compliant to RoHS directive 2002/95/EC
PERFORMANCE CHARACTERISTICS
Operating Temperature: - 55 °C to + 85 °C
Capacitance Range: 0.68 µF to 220 µF
(to + 125 °C voltage derating)
Capacitance Tolerance: 20 ꢀ standard
Voltage Range: 2 WVDC to 50 WVDC
ORDERING INFORMATION
298D
106
X0
010
M
2
T
MODEL
CAPACITANCE
CAPACITANCE
TOLERANCE
DC VOLTAGE RATING
AT + 85 °C
CASE CODE TERMINATION
REEL SIZE AND
PACKAGING
This is expressed in
picofarads. The first
two digits are the
significant figures. The
third is the number of
zeros to follow.
X0 = 20 ꢀ
X9 = 10 ꢀ
This is expressed in volts.
To complete the three-digit and Case
block, zeros precede the Codes Table
See Ratings 2 = 100 ꢀ Tin T = Tape and Reel
4 = Gold Plated
7" [178 mm] Reel
voltage rating.
A decimal
point is indicated by an “R”
(6R3 = 6.3 V).
Note Preferred tolerance and reel size are in bold.
We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size.
Voltage substitutions will be marked with the higher voltage rating.
DIMENSIONS in inches [millimeters]
Anode Polarity Bar
Cathode Termination
Anode Termination
W
C
H
P1
P2
P1
L
CASE
L
W
H
P1
P2 (REF.)
C
0.039 + 0.008
[1.0 + 0.2]
0.02 + 0.008
[0.5 + 0.2]
0.024 max.
0.6 max.
0.01 0.004
[0.25 0.1]
0.02
[0.5]
0.015 0.004
[0.38 0.1]
K
0.063 0.004
[1.60 0.1]
0.033 0.004
[0.85 0.1]
0.031 0.004
[0.80 0.1]
0.020 0.004
[0.50 0.1]
0.024
[0.60]
0.024 0.004
[0.60 0.1]
M
P
0.094 0.004
[2.4 0.1]
0.057 0.004
[1.45 0.1]
0.043 0.004
[1.10 0.1]
0.020 0.004
[0.50 0.1]
0.057
[1.40]
0.035 0.004
[0.90 0.1]
** Please see document “Vishay Material Category Policy” (5-2008)”: www.vishay.com/doc?99902
www.vishay.com
38
For technical questions, contact: tantalum@vishay.com
Document Number: 40065
Revision: 05-Nov-09
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
RATINGS AND CASE CODES
µF
0.68
1.0
2.2
3.3
4.7
6.8
10
2 V
2.5 V
4 V
6.3 V
10 V
16 V
25 V
35 V
50 V
M*
K
K
K/M
M
M
P
K/M
K/M
K
K*/M
K*/M
M
M
P
K*
K/M
K
M
M
M
P
15
22
M
M
M
P*
P
33
M
47
M
P
M
P
100
220
P*
P
Note
* Preliminary values, contact factory for availability.
MARKING
M-CASE
P-CASE
V
CODE
CAP, µF
0.68
1
CODE
M-Case
w
A
J
2.5
e
G
J
Voltage Code
Polarity Bar
4
P-Case
Voltage
6.3
10
16
20
25
35
50
2.2
3.3
4.7
6.8
10
Capacitance
Code
Polarity Bar
Code
A
C
D
E
V
T
N
S
W
α
e
A
K-Case
GJ
15
22
j
33
n
47
s
68
w
A
E
J
100
150
220
Document Number: 40065
Revision: 05-Nov-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
39
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
STANDARD RATINGS
MAX. DC
LEAKAGE
AT + 25 °C
(µA)
MAX. ESR
MAX. RIPPLE
100 kHz
Irms
MAX. DF
AT + 25 °C
(ꢀ)
CAPACITANCE CASE
PART
NUMBER
AT + 25 °C
100 kHz
(Ω)
ΔC/C (1)
(ꢀ)
(µF)
CODE
(A)
2 WVDC AT + 85 °C, . . . 1.3 WVDC AT + 125 °C
298D106X0002K2T 0.5 15 15
2.5 WVDC AT + 85 °C, . . . 1.6 WVDC AT + 125 °C
10
K
0.027
30
47
220
M
P
298D476X02R5M2T
298D227X02R5P2T
2.4
11.0
20
30
4.0
3.0
0.08
0.122
30
30
4 WVDC AT + 85 °C, . . . 2.7 WVDC AT + 125 °C
4.7
10
10
15
22
33
47
100
220
K
K
M
K
M
M
M
P
298D475X0004K2T
298D106X0004K2T
298D106X0004M2T
298D156X0004K2T
298D226X0004M2T
298D336X0004M2T
298D476X0004M2T
298D107X0004P2T
298D227X0004P2T
0.5
4.0
0.5
10
0.9
2.6
3.8
4.0
17.6
15
50
8.0
50
15
30
40
20
30
20
20
5.0
20
4.0
4.0
7.5
2.0
3.0
0.027
0.027
0.071
0.027
0.08
0.08
0.08
0.1
0.122
30
30
10
30
15
20
30
30
30
P
6.3 WVDC AT + 85 °C, . . . 4 WVDC AT + 125 °C
1.0
2.2
2.2
4.7
4.7
10
10
15
22
33
K
K
M
K
M
K
M
M
M
M
P
298D105X06R3K2T
298D225X06R3K2T
298D225X06R3M2T
298D475X06R3K2T (2)
298D475X06R3M2T
298D106X06R3K2T (2)
298D106X06R3M2T
298D156X06R3M2T
298D226X06R3M2T
298D336X06R3M2T
298D476X06R3P2T
298D107X06R3P2T
0.5
0.5
0.5
4.0
0.5
10
0.6
1.0
2.8
4.2
3.0
6.3
6.0
8.0
10
50
8.0
50
8.0
20
20
30
22
30
20
20
5.0
20
3.0
20
5.0
7.0
5.5
7.5
3.0
2.0
0.027
0.027
0.07
0.027
0.09
0.027
0.071
0.06
0.067
0.058
0.122
0.150
30
30
10
30
10
30
10
20
15
30
20
20
47
100
P
10 WVDC AT + 85 °C, . . . 7 WVDC AT + 125 °C
1.0
2.2
2.2
4.7
10
15
22
33
47
K
K
298D105X0010K2T
298D225X0010K2T
298D225X0010M2T
298D475X0010M2T
298D106X0010M2T
298D156X0010M2T
298D226X0010M2T
298D336X0010P2T
298D476X0010P2T
0.5
0.5
0.5
0.5
1.0
1.5
22
6.0
8.0
10
6.0
20
30
40
10
22
20
15
10
5.0
7.5
7.5
10.0
2.0
3.0
0.027
0.027
0.05
0.071
0.058
0.058
0.05
30
30
10
15
15
20
30
10
20
M
M
M
M
M
P
3.3
4.7
0.150
0.122
P
16 WVDC AT + 85 °C, . . . 10 WVDC AT + 125 °C
1.0
1.0
2.2
4.7
K
M
M
M
298D105X0016K2T
298D105X0016M2T
298D225X0016M2T
298D475X0016M2T
3.0
0.5
0.5
0.8
10
6.0
10
20
0.027
0.045
0.045
0.06
30
15
15
15
12.0
12.0
6.0
8.0
25 WVDC AT + 85 °C, . . . 17 WVDC AT + 125 °C
1.0
4.7
M
P
298D105X0025M2T
298D475X0025P2T
0.5
1.2
6.0
6.0
10.0
4.0
0.05
0.106
10
10
50 WVDC AT + 85 °C, . . . 33 WVDC AT + 125 °C
298D105X0050P2T 0.5 8.0 8.0
1.0
P
0.075
10
Notes
(1) See Performance Characteristics tables, page 41
(2) In development
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For technical questions, contact: tantalum@vishay.com
Document Number: 40065
Revision: 05-Nov-09
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
CAPACITORS PERFORMANCE CHARACTERISTICS
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM
PERFORMANCE CHARACTERISTICS
Category Temperature Range
Capacitance Tolerance
Dissipation Factor (at 120 Hz)
ESR (100 kHz)
- 55 °C to + 85 °C (to + 125 °C with voltage derating)
20 ꢀ, 10 ꢀ (at 120 Hz) 2 Vrms at + 25 °C using a capacitance bridge
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 120 Hz.
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 100 kHz.
After application of rated voltage applied to capacitors for 5 minutes using a steady source of power
with 1 kΩ resistor in series with the capacitor under test, leakage current at 25 °C is not more than
described in. Standard Ratings Table. Note that the leakage current varies with temperature and
applied voltage. See graph below for the appropriate adjustment factor.
Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 ꢀ of the DC
rating at + 25 °C
5 ꢀ of the DC rating at + 85 °C
Leakage Current
Reverse Voltage
Vishay does not recommended intentional or repetitive application of reverse voltage
If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or
voltage shall be calculated using the derating factors:
Temperature Derating
1.0 at + 25 °C
0.9 at + 85 °C
0.4 at + 125 °C
K-case: 0.015
M-case: 0.025
P-case: 0.045
Maximum Permissible Power
Dissipation at 25 °C (W) in free air
+ 85 °C RATING
+ 125 °C RATING
WORKING VOLTAGE (V) SURGE VOLTAGE (V) WORKING VOLTAGE (V) SURGE VOLTAGE (V)
4
5.2
8
2.7
4
3.4
5
6.3
10
16
20
25
35
50
13
20
26
32
46
65
7
8
Operating Temperature
10
13
17
23
33
12
16
20
28
40
TYPICAL LEAKAGE CURRENT FACTOR RANGE
100
+ 125 °C
+ 85 °C
10
1.0
+ 55 °C
+ 25 °C
0 °C
0.1
- 55 °C
0.01
0.001
0
10
20
30
40
50
60
70
80
90
100
PERCENT OF RATED VOLTAGE
Notes
• At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings Table
• At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings Table
• At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings Table
Document Number: 40065
Revision: 05-Nov-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
41
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
1000 h application of rated voltage at
85 °C with a 3 Ω series resistance,
MIL-STD-202G Method 108A
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 ꢀ of initial
Not to exceed 200 ꢀ of initial
Life Test at + 85 °C
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 ꢀ of initial
Not to exceed 200 ꢀ of initial
At 40 °C/90 ꢀ RH 500 h, no voltage
applied. MIL-STD-202G Method 103B
Humidity Tests
Thermal Shock
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 ꢀ of initial
Not to exceed 200 ꢀ of initial
At - 55 °C/+ 125 °C, 30 min each,
for 5 cycles. MIL-STD-202G Method 107G
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
CONDITION
POST TEST PERFORMANCE
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Apply a pressure load of 5 N for 10 s 1 s
horizontally to the center of capacitor side body.
AEC Q-200 rev. C Method 006
Terminal Strength
There shall be no mechanical or visual damage to capacitors
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AEC-Q200 rev. C Method 005
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Substrate Bending
(Board flex)
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
MIL-STD-202G, Method 204D,
10 Hz to 2000 Hz, 20 G peak
Vibration
Shock
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
MIL-STD-202G, Method 213B, Condition I,
100 G peak
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to Solder
Heat
At 260 °C, for 10 s, reflow
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 ꢀ of initial
Not to exceed 200 ꢀ of initial
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Solderability
MIL-STD-202G, Method 208H, ANSI/J-STD-002, There shall be no mechanical or visual damage to capacitors
Test B. Applies only to solder and tin plated
post-conditioning.
terminations. Does not apply to gold terminations.
Resistance to
Solvents
MIL-STD-202, Method 215D
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Flammability
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 ꢀ.
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For technical questions, contact: tantalum@vishay.com
Document Number: 40065
Revision: 05-Nov-09
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“M” Case
“M” Case
100
10
1
100
10
1
IMPEDANCE
ESR
IMPEDANCE
ESR
47 µF - 4 V
22 µF - 4 V
100
0.1
0.1
1
10
100
1000
0.1
1
10
1000
FREQUENCY, kHz
FREQUENCY, kHz
“M” Case
“M” Case
1000
100
10
1000
100
10
IMPEDANCE
ESR
IMPEDANCE
ESR
4.7 µF - 10 V
1
10 µF - 6 V
100 1000
1
0.1
0.1
0.1
1
10
100
1000
1
10
FREQUENCY, kHz
FREQUENCY, kHz
“M” Case
“M” Case
1000
100
10
10 000
1000
100
10
IMPEDANCE
ESR
IMPEDANCE
ESR
1 µF - 16 V
10 µF - 10 V
100
1
0.1
1
0.1
1
10
1000
1
10
100
1000
FREQUENCY, kHz
FREQUENCY, kHz
Document Number: 40065
Revision: 05-Nov-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
43
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“P” CASE
“P” CASE
100.0
10.0
1.0
1000.0
100.0
IMPEDANCE
ESR
IMPEDANCE
ESR
10.0
1.0
33 µF - 10 V
4.7 µF - 25 V
0.1
0.1
10
100
1000
0.1
1
0.1
1000
1
10
100
FREQUENCY, kHz
FREQUENCY, kHz
“P” CASE
“P” CASE
10.0
100.0
10.0
1.0
IMPEDANCE
ESR
IMPEDANCE
ESR
1.0
0.1
47 µF - 10 V
100
220 µF - 4 V
0.1
0.1
1
10
1000
0.1
1
10
100
1000
FREQUENCY, kHz
FREQUENCY, kHz
www.vishay.com
44
For technical questions, contact: tantalum@vishay.com
Document Number: 40065
Revision: 05-Nov-09
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 0.004
[4.0 0.10]
10 pitches cumulative
tolerance on tape
0.008 [0.200]
Tape Thickness
0.014
[0.35]
MAX.
Deformation
Between
Embossments
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
Embossment
0.069 0.004
[1.75 0.10]
0.079 0.002
[2.0 0.05]
Top
Cover
Tape
A0
20°
0.030 [0.75]
MIN.(Note 3)
F
W
Maximum
Component
Rotation
B
1 MAX.
K0
(Note 6)
B0
Top
Cover
Tape
0.030 [0.75]
MIN.(Note 4)
(Side or Front Sectional View)
0.004 [0.1]
MAX.
Center Lines
of Cavity
P1
For Tape Feeder
Reference only
including draft.
Concentric around B
(Note 5)
D
1 MIN. For Components
0.079 x 0.047 [2.0 x 1.2] and Large.r
Maximum (Note 5)
Cavity Size
USER DIRECTION OF FEED
0
(Note 1)
Cathode (-)
Anode (+)
Direction of Feet
Tape and Reel Specifications: All case sizes are available on
plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3
is also available. Standard reel diameter is 7" [178 mm],
13" [330 mm] reels are available and recommended as the most
cost effective packaging method.
3.937 [100.0]
0.039 [1.0]
MAX.
20° Maximum
Component Rotation
Typical
Component
Cavity
Tape
B0
0.039 [1.0]
MAX.
Center Line
The most efficient packaging quantities are full reel increments on
a given reel diameter. The quantities shown allow for the sealed
empty pockets required to be in conformance with EIA-481-1. Reel
size and packaging orientation must be specified in the Vishay
Sprague part number.
0.9843 [250.0]
Typical
Component
Center Line
Camber
(Top View)
A0
(Top View)
Allowable Camber to be 0.039/3.937 [1/100]
Non-Cumulative Over 9.843 [250.0]
Note
Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
CASE
CODE
TAPE
SIZE
B1
(MAX.)
D1
(MIN.)
K0
(MAX.)
P1
F
W
298D
0.108
[2.75]
0.039
[1.0]
0.138 0.002
[3.5 0.05]
0.054
[1.37]
0.157 0.004
[4.0 1.0]
0.315 0.0118/- 0.0039
[8.0 0.30/- 0.10]
P
8 mm
Document Number: 40065
Revision: 05-Nov-09
For technical questions, contact: tantalum@vishay.com
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45
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
PAPER TAPE AND REEL PACKAGING IN INCHES [millimeters]
[10 pitches cumulative tolerance
on tape 0.2 mm]
P2
T
E1
Ø D0
P0
A0
F
Bottom Cover
Tape
W
B0
E2
Top
Cover Tape
Anode
P1
Bottom Cover Tape
G
Cavity Center Lines
Cavity Size
Note 1
User Feed Direction
Figure 2
298D
CASE TAPE
SIZE SIZE
A0
B0
D0
P0
P1
P2
E
F
W
T
0.033 0.002 0.053 0.002 0.06 0.004 0.157 0.004 0.078 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.03 0.002
K
8 mm
8 mm
[0.85 0.05] [1.35 0.05] [1.5 0.1]
[4.0 0.1]
[2.0 0.1]
[2.0 0.05] [1.75 0.1]
[3.5 0.05]
[8.0 0.2] [0.75 0.05]
0.041 0.002 0.071 0.002 0.06 0.004 0.157 0.004 0.157 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.037 0.002
M
[1.05 0.05] [1.8 0.05]
[1.5 0.1]
[4.0 0.1]
[4.0 0.1]
[2.0 0.05] [1.75 0.1]
[3.5 0.05]
[8.0 0.2] [0.95 0.05]
STANDARD PACKAGING QUANTITY
QTY (PCS/REEL)
SERIES
CASE CODE
7" REEL
5000
13" REEL
N/a
K
M
P
298D
4000
N/a
3000
N/a
RECOMMENDED VOLTAGE DERATING GUIDELINES
STANDARD CONDITIONS: FOR EXAMPLE: OUTPUT FILTERS
Capacitor Voltage Rating
Operating Voltage
4.0
2.5
3.6
6.0
10
12
15
24
28
6.3
10
16
20
25
35
50
SEVERE CONDITIONS: FOR EXAMPLE: INPUT FILTERS
Capacitor Voltage Rating
Operating Voltage
4.0
6.3
10
16
20
25
35
50
2.5
3.3
5.0
8.0
10
12
15
24
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For technical questions, contact: tantalum@vishay.com
Document Number: 40065
Revision: 05-Nov-09
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
POWER DISSIPATION
MAXIMUM PERMISSIBLE
POWER DISSIPATION AT + 25 °C (W) IN FREE AIR
CASE CODE
K
M
P
0.015
0.025
0.045
298D
RECOMMENDED REFLOW PROFILES
Tp °C
(tp)
TL °C
Ts MAX. °C
Ts MAX. °C
(tL)
Preheat (ts)
25 °C
All Case Codes
TP
TP
TL
TL
TS MIN.
TSMIN.
TS MAX.
TS MAX.
tS
tS
TYPE
298D
tP
tL
lead (Pb)-free Sn/Pb
lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb
260 °C
225 °C 10
217 °C
183 °C
150 °C
100 °C
200 °C
150 °C
60 to 150
60 to 90 60
PAD DIMENSIONS in inches [millimeters]
D
C
B
A
A
B
C
D
CASE CODE
(MIN.)
(NOM.)
(NOM.)
(NOM.)
298D
K
M
P
0.028 [0.70]
0.039 [1.00]
0.063 [1.60]
0.018 [0.45]
0.028 [0.70]
0.031 [0.80]
0.024 [0.60]
0.24 [0.60]
0.047 [1.20]
0.059 [1.50]
0.080 [2.00]
0.110 [2.80]
Document Number: 40065
Revision: 05-Nov-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
47
298D
Solid Tantalum Chip Capacitors
Vishay Sprague
MICROTANTM Leadframeless Molded
6.
Printed Circuit Board Materials: Molded capacitors
GUIDE TO APPLICATION
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
1.
A-C Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
P
7.
Attachment:
I
=
---------------
rms
R
ESR
7.1
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" 0.001"
[0.178 mm 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
where,
P =
Power dissipation in watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series resistance
at the specified frequency.
RESR
=
2.
A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
P
7.2
Soldering: Capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time/temperature conditions for
soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
V
= Z ---------------
rms
R
ESR
or, from the formula:
= I
V
× Z
rms
rms
where,
P =
Power dissipation in watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series resistance
at the specified frequency.
RESR
Z =
=
7.2.1 Backward and Forward Compatibility: Capacitors
with SnPb or 100 ꢀ tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
The capacitor impedance at the specified
frequency.
2.1
2.2
3.
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
8.
Cleaning (Flux Removal) After Soldering: Molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack the
epoxy encapsulation material.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 ꢀ of the DC working voltage at + 25 °C.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 ꢀ of the DC rating at + 25 °C, 5 ꢀ of the DC
rating at + 85 °C and 1 ꢀ of the DC rating at + 125 °C.
8.1
9.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l at 40 kHz for
2 minutes.
4.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
TEMPERATURE
+ 25 °C
DERATING FACTOR
Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for successful
solder connections. These dimensions are highly
process sensitive and should be designed to
minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and/or
circuit board design.
1.0
0.9
0.4
+ 85 °C
+ 125 °C
5.
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25 °C temperature
rise.)
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For technical questions, contact: tantalum@vishay.com
Document Number: 40065
Revision: 05-Nov-09
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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