298D156X9010M2T [VISHAY]

CAPACITOR, TANTALUM, SOLID, POLARIZED, 10 V, 15 uF, SURFACE MOUNT, 0603, CHIP, GREEN;
298D156X9010M2T
型号: 298D156X9010M2T
厂家: VISHAY    VISHAY
描述:

CAPACITOR, TANTALUM, SOLID, POLARIZED, 10 V, 15 uF, SURFACE MOUNT, 0603, CHIP, GREEN

文件: 总12页 (文件大小:167K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
FEATURES  
• Small sizes include 0603 and 0402 footprint  
• Lead (Pb)-free L-shaped terminations  
• 8 mm tape and reel packaging available per  
EIA-481-1 and reeling per IEC 286-3  
7" [178 mm] standard  
• Mounting: Surface mounted  
• Compliant to RoHS Directive 2002/95/EC  
PERFORMANCE CHARACTERISTICS  
Operating Temperature: - 55 °C to + 85 °C  
(to + 125 °C voltage derating)  
Capacitance Tolerance: 20 % standard  
Voltage Range: 2.5 VDC to 50 VDC  
Capacitance Range: 1 μF to 220 μF  
ORDERING INFORMATION  
298D  
106  
X0  
010  
M
2
T
TYPE  
CAPACITANCE  
CAPACITANCE  
TOLERANCE  
DC VOLTAGE RATING  
AT + 85 °C  
CASE CODE  
TERMINATION  
REEL SIZE AND  
PACKAGING  
This is expressed  
in picofarads. The  
first two digits are  
the significant  
figures. The third  
is the number of  
zeros to follow.  
X0 = 20 ꢀ  
X9 = 10 %  
This is expressed in volts.  
To complete the  
See Ratings  
and Case  
Codes table  
2 = 100 ꢀ tin  
4 = Gold plated  
T = Tape and reel  
7" [178 mm] reel  
three-digit block, zeros  
precede the voltage rating.  
A decimal point is indicated  
by an “R”  
(6R3 = 6.3 V).  
Note  
Preferred tolerance and reel sizes are in bold.  
We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size.  
Voltage substitutions will be marked with the higher voltage rating.  
DIMENSIONS in inches [millimeters]  
Anode Polarity Bar  
Cathode Termination  
Anode Termination  
W
C
H
P1  
P2  
P1  
L
CASE CODE  
L
W
H
P1  
P2 (REF.)  
C
0.039 + 0.008  
[1.0 + 0.2]  
0.02 + 0.008  
[0.5 + 0.2]  
0.024 max.  
[0.6 max.]  
0.01 0.004  
[0.25 0.1]  
0.02  
[0.5]  
0.015 0.004  
[0.38 0.1]  
K
M
R
P
0.063 0.008  
[1.60 0.2]  
0.033 0.008  
[0.85 0.2]  
0.031 0.004  
[0.80 0.1]  
0.020 0.004  
[0.50 0.1]  
0.024  
[0.60]  
0.024 0.004  
[0.60 0.1]  
0.079 0.004  
[2.0 0.1]  
0.050 0.004  
[1.25 0.1]  
0.060 max.  
[1.5 max.]  
0.020 0.004  
[0.50 0.1]  
0.035 0.004  
[0.90 0.1]  
0.04  
[1.0]  
0.094 0.004  
[2.4 0.1]  
0.057 0.004  
[1.45 0.1]  
0.043 0.004  
[1.10 0.1]  
0.020 0.004  
[0.50 0.1]  
0.057  
[1.40]  
0.035 0.004  
[0.90 0.1]  
0.126 0.008  
[3.2 0.2]  
0.063 0.008  
[1.6 0.2]  
0.063 0.008  
[1.6 0.2]  
0.031 0.004  
[0.80 0.1]  
0.063  
[1.60]  
0.047 0.004  
[1.20 0.1]  
A
0.126 0.008  
[3.2 0.2]  
0.063 0.008  
[1.6 0.2]  
0.039 max.  
[1.0 max.]  
0.031 0.004  
[0.80 0.1]  
0.063  
[1.60]  
0.047 0.004  
[1.20 0.1]  
Q
** Please see document “Vishay Material Category Policy”: www.vishay.com/doc?99902  
www.vishay.com  
38  
For technical questions, contact: tantalum@vishay.com  
Document Number: 40065  
Revision: 24-May-11  
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
RATINGS AND CASE CODES  
μF  
1.0  
1.5  
2.2  
3.3  
4.7  
6.8  
10  
15  
22  
33  
47  
2.5 V  
4 V  
6.3 V  
K
10 V  
K
M
K/M  
M
M
16 V  
K/M  
20 V  
25 V  
M/R  
35 V  
50 V  
P
K/M  
M
K*/M  
M
M
R
K
P
P
K/M  
K
M
M
M
P
K*/M  
M
M
M
P
M
M
M
P
M
P
P
100  
220  
P/A/Q*  
P
Note  
* Preliminary values, contact factory for availability.  
MARKING  
VOLTAGE CODE  
CAPACITANCE CODE  
P, R-Case  
V
2.5  
4
6.3  
10  
16  
20  
25  
35  
50  
CODE  
CAP, μF  
0.68  
1
2.2  
3.3  
4.7  
6.8  
10  
CODE  
M-Case  
Voltage Code  
Capacitance  
Voltage  
Code Code  
e
G
J
w
A
J
N
S
W
e
Polarity Bar  
Polarity Bar  
A
C
D
E
V
T
GJ  
A
15  
EIA Capacitance  
Code (pF)  
Voltage  
Code  
K-Case  
Polarity Bar  
22  
j
33  
n
47  
s
68  
w
A
E
J
J107  
100  
150  
220  
STANDARD RATINGS  
MAX. DC  
LEAKAGE  
AT + 25 °C  
(μA)  
MAX. ESR  
MAX. RIPPLE  
100 kHz  
IRMS  
MAX. DF  
AT + 25 °C  
(ꢀ)  
C/C (1)  
(ꢀ)  
CAPACITANCE CASE  
PART  
NUMBER  
AT + 25 °C  
100 kHz  
()  
(μF)  
CODE  
(A)  
2.5 VDC AT + 85 °C; 1.6 VDC AT + 125 °C  
47  
220  
M
P
298D476X02R5M2T  
298D227X02R5P2T  
2.4  
11.0  
20  
30  
4.0  
3.0  
0.080  
0.122  
30  
30  
4 VDC AT + 85 °C; 2.7 VDC AT + 125 °C  
4.7  
10  
10  
15  
22  
33  
47  
100  
220  
K
K
M
K
M
M
M
P
298D475X0004K2T  
298D106X0004K2T  
298D106X0004M2T  
298D156X0004K2T  
298D226X0004M2T  
298D336X0004M2T  
298D476X0004M2T  
298D107X0004P2T  
298D227X0004P2T (3)  
0.5  
4.0  
0.5  
10.0  
0.9  
2.6  
3.8  
4.0  
17.6  
15.0  
50.0  
8.0  
50.0  
15.0  
30.0  
40.0  
30.0  
30.0  
20.0  
20.0  
5.0  
20.0  
4.0  
4.0  
7.5  
2.0  
3.0  
0.027  
0.027  
0.071  
0.027  
0.080  
0.080  
0.080  
0.100  
0.122  
30  
30  
10  
30  
15  
20  
30  
30  
30  
P
Notes  
(1)  
(2)  
(3)  
See Performance Characteristics tables  
In development  
10 % capacitance tolerance available  
Document Number: 40065  
Revision: 24-May-11  
For technical questions, contact: tantalum@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
39  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
STANDARD RATINGS  
MAX. DC  
LEAKAGE  
AT + 25 °C  
(μA)  
MAX. ESR  
AT + 25 °C  
100 kHz  
()  
MAX. RIPPLE  
100 kHz  
IRMS  
MAX. DF  
AT + 25 °C  
(ꢀ)  
C/C (1)  
(ꢀ)  
CAPACITANCE CASE  
PART  
NUMBER  
(μF)  
CODE  
(A)  
6.3 VDC AT + 85 °C; 4 VDC AT + 125 °C  
1.0  
2.2  
2.2  
3.3  
4.7  
4.7  
10  
K
K
298D105X06R3K2T  
298D225X06R3K2T  
298D225X06R3M2T (3)  
298D335X06R3M2T (3)  
298D475X06R3K2T (2)  
298D475X06R3M2T (2)  
298D106X06R3K2T (2)  
298D106X06R3M2T (3)  
298D156X06R3M2T (3)  
298D226X06R3M2T  
298D336X06R3M2T  
298D476X06R3P2T  
298D107X06R3A2T  
298D107X06R3Q2T (2)  
298D107X06R3P2T  
0.5  
0.5  
0.5  
0.5  
4.0  
0.5  
10.0  
0.6  
1.0  
2.8  
4.2  
3.0  
6.3  
10.0  
6.3  
6.0  
8.0  
20.0  
20.0  
5.0  
0.027  
0.027  
0.070  
0.090  
0.027  
0.090  
0.027  
0.071  
0.060  
0.067  
0.058  
0.122  
0.270  
0.220  
0.150  
30  
30  
10  
10  
30  
10  
30  
10  
20  
15  
30  
20  
10  
20  
20  
M
M
K
10.0  
8.0  
6.0  
50.0  
8.0  
20.0  
3.0  
M
K
50.0  
8.0  
20.0  
5.0  
10  
M
M
M
M
P
15  
20.0  
20.0  
30.0  
22.0  
20.0  
30.0  
30.0  
7.0  
22  
5.5  
33  
7.5  
47  
3.0  
100  
100  
100  
A
1.0  
Q
P
1.1  
2.0  
10 VDC AT + 85 °C; 7 VDC AT + 125 °C  
1.0  
1.5  
2.2  
2.2  
3.3  
4.7  
10  
K
M
K
298D105X0010K2T  
298D155X0010M2T (3)  
298D225X0010K2T  
298D225X0010M2T  
298D335X0010M2T (3)  
298D475X0010M2T (3)  
298D106X0010M2T  
298D156X0010M2T (3)  
298D226X0010M2T  
298D336X0010P2T (3)  
298D476X0010P2T  
0.5  
0.5  
0.5  
0.5  
0.5  
0.5  
1.0  
1.5  
22.0  
3.3  
4.7  
6.0  
6.0  
20.0  
14.0  
15.0  
10.0  
6.0  
0.027  
0.040  
0.027  
0.050  
0.090  
0.071  
0.058  
0.058  
0.050  
0.150  
0.122  
30  
10  
30  
10  
10  
15  
15  
20  
30  
10  
20  
8.0  
M
M
M
M
M
M
P
10.0  
8.0  
6.0  
5.0  
20.0  
30.0  
40.0  
20.0  
22.0  
7.5  
15  
7.5  
22  
10.0  
4.0  
33  
47  
P
3.0  
16 VDC AT + 85 °C; 10 VDC AT + 125 °C  
1.0  
1.0  
2.2  
4.7  
10  
K
M
M
M
R
298D105X0016K2T  
298D105X0016M2T (3)  
298D225X0016M2T (3)  
298D475X0016M2T  
298D106X0016R2T  
3.0  
0.5  
0.5  
0.8  
1.6  
10.0  
6.0  
20.0  
12.0  
12.0  
6.0  
0.027  
0.045  
0.045  
0.060  
0.075  
30  
15  
15  
15  
10  
10.0  
8.0  
8.0  
8.0  
20 VDC AT + 85 °C; 13 VDC AT + 125 °C  
298D475X0020P2T (3)  
1.0 6.0  
25 VDC AT + 85 °C; 17 VDC AT + 125 °C  
4.7  
P
4.0  
0.106  
10  
1.0  
1.0  
4.7  
10  
M
R
P
298D105X0025M2T  
0.5  
0.5  
1.2  
2.5  
6.0  
6.0  
10.0  
10.0  
4.0  
0.050  
0.050  
0.106  
0.146  
10  
10  
10  
10  
298D105X0025R2T  
298D475X0025P2T (3)  
298D106X0025A2T (2)(3)  
6.0  
A
10.0  
3.5  
50 VDC AT + 85 °C; 33 VDC AT + 125 °C  
298D105X0050P2T 0.5 8.0  
1.0  
P
8.0  
0.075  
10  
Notes  
(1)  
(2)  
(3)  
See Performance Characteristics tables  
In development  
10 % capacitance tolerance available  
www.vishay.com  
40  
For technical questions, contact: tantalum@vishay.com  
This document is subject to change without notice.  
Document Number: 40065  
Revision: 24-May-11  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
CAPACITORS PERFORMANCE CHARACTERISTICS  
ELECTRICAL PERFORMANCE CHARACTERISTICS  
ITEM  
PERFORMANCE CHARACTERISTICS  
Category Temperature Range  
Capacitance Tolerance  
Dissipation Factor (at 120 Hz)  
ESR (100 kHz)  
- 55 °C to + 85 °C (to + 125 °C with voltage derating)  
20 %, 10 % (at 120 Hz) 2 VRMS at + 25 °C using a capacitance bridge  
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 120 Hz.  
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 100 kHz.  
After application of rated voltage applied to capacitors for 5 min using a steady source of power with  
1 kresistor in series with the capacitor under test, leakage current at 25 °C is not more than  
described in Standard Ratings Table. Note that the leakage current varies with temperature and  
applied voltage. See graph below for the appropriate adjustment factor.  
Leakage Current  
Reverse Voltage  
Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the  
DC rating at + 25 °C  
5 % of the DC rating at + 85 °C  
Vishay does not recommend intentional or repetitive application of reverse voltage  
If capacitors are to be used at temperatures above + 25 °C, the permissible RMS ripple current or  
voltage shall be calculated using the derating factors:  
1.0 at + 25 °C  
0.9 at + 85 °C  
0.4 at + 125 °C  
Temperature Derating  
+ 85 °C RATING  
+ 125 °C RATING  
WORKING VOLTAGE (V) SURGE VOLTAGE (V) WORKING VOLTAGE (V) SURGE VOLTAGE (V)  
4
5.2  
8
2.7  
4
3.4  
5
6.3  
10  
16  
20  
25  
35  
50  
13  
20  
26  
32  
46  
65  
7
8
Operating Temperature  
10  
13  
17  
23  
33  
12  
16  
20  
28  
40  
TYPICAL LEAKAGE CURRENT FACTOR RANGE  
100  
+ 125 °C  
+ 85 °C  
10  
1.0  
+ 55 °C  
+ 25 °C  
0 °C  
0.1  
- 55 °C  
0.01  
0.001  
0
10  
20  
30  
40  
50  
60  
70  
80  
90  
100  
PERCENT OF RATED VOLTAGE  
Notes  
At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table  
At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table  
At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table  
Document Number: 40065  
Revision: 24-May-11  
For technical questions, contact: tantalum@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
41  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS  
ITEM  
CONDITION  
POST TEST PERFORMANCE  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
1000 h application of rated voltage at 85 °C  
with a 3 series resistance,  
MIL-STD-202G method 108A  
Life Test at + 85 °C  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
At 40 °C/90 % RH 500 h, no voltage applied.  
MIL-STD-202G method 103B  
Humidity Tests  
Thermal Shock  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
At - 55 °C/+ 125 °C, 30 min each, for 5 cycles.  
MIL-STD-202G method 107G  
MECHANICAL PERFORMANCE CHARACTERISTICS  
ITEM  
CONDITION  
POST TEST PERFORMANCE  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Initial specified value or less  
Initial specified value or less  
Apply a pressure load of 5 N for 10 s 1 s  
horizontally to the center of capacitor side body.  
AEC Q-200 rev. C method 006  
Terminal Strength  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
With parts soldered onto substrate test board,  
apply force to the test board for a deflection  
of 1 mm. AEC-Q200 rev. C method 005  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Initial specified value or less  
Initial specified value or less  
Substrate Bending  
(Board flex)  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Initial specified value or less  
Initial specified value or less  
MIL-STD-202G, method 204D,  
10 Hz to 2000 Hz, 20 g peak  
Vibration  
Shock  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Initial specified value or less  
Initial specified value or less  
MIL-STD-202G, method 213B, Condition I,  
100 g peak  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Capacitance change  
Dissipation factor  
Leakage current  
Refer to Standard Ratings table  
Not to exceed 150 % of initial  
Not to exceed 200 % of initial  
Resistance to Solder  
Heat  
At 260 °C, for 10 s, reflow  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
MIL-STD-202G, method 208H, ANSI/J-STD-002,  
Test B. Applies only to solder and tin plated  
terminations. Does not apply to gold  
terminations.  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
Solderability  
Resistance to  
Solvents  
There shall be no mechanical or visual damage to capacitors  
post-conditioning.  
MIL-STD-202, method 215D  
Encapsulation materials meet UL 94 V-0 with an  
oxygen index of 32 %  
Flammability  
www.vishay.com  
42  
For technical questions, contact: tantalum@vishay.com  
Document Number: 40065  
Revision: 24-May-11  
This document is subject to change without notice.  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY  
“M” Case  
“M” Case  
100  
10  
1
100  
10  
1
IMPEDANCE  
ESR  
IMPEDANCE  
ESR  
47 µF - 4 V  
22 µF - 4 V  
100  
0.1  
0.1  
1
10  
100  
1000  
0.1  
1
10  
1000  
FREQUENCY, kHz  
FREQUENCY, kHz  
“M” Case  
“M” Case  
1000  
100  
10  
1000  
100  
10  
IMPEDANCE  
ESR  
IMPEDANCE  
ESR  
4.7 µF - 10 V  
1
10 µF - 6 V  
100 1000  
0.1  
0.1  
1
0.1  
1
10  
100  
1000  
1
10  
FREQUENCY, kHz  
FREQUENCY, kHz  
“M” Case  
“M” Case  
10 000  
1000  
100  
10  
1000  
100  
10  
IMPEDANCE  
ESR  
IMPEDANCE  
ESR  
1 µF - 16 V  
10 µF - 10 V  
100  
1
0.1  
1
0.1  
1
10  
1000  
1
10  
100  
1000  
FREQUENCY, kHz  
FREQUENCY, kHz  
Document Number: 40065  
Revision: 24-May-11  
For technical questions, contact: tantalum@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
43  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY  
“P” CASE  
“P” CASE  
1000.0  
100.0  
100.0  
10.0  
1.0  
IMPEDANCE  
ESR  
IMPEDANCE  
ESR  
10.0  
1.0  
33 µF - 10 V  
4.7 µF - 25 V  
0.1  
0.1  
10  
100  
1000  
0.1  
1
0.1  
1000  
1
10  
100  
FREQUENCY, kHz  
FREQUENCY, kHz  
“P” CASE  
“P” CASE  
10.0  
100.0  
IMPEDANCE  
ESR  
IMPEDANCE  
ESR  
10.0  
1.0  
1.0  
0.1  
47 µF - 10 V  
100  
220 µF - 4 V  
0.1  
0.1  
1
10  
1000  
0.1  
1
10  
100  
1000  
FREQUENCY, kHz  
FREQUENCY, kHz  
www.vishay.com  
44  
For technical questions, contact: tantalum@vishay.com  
This document is subject to change without notice.  
Document Number: 40065  
Revision: 24-May-11  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]  
0.157 0.004  
[4.0 0.10]  
10 pitches cumulative  
tolerance on tape  
0.008 [0.200]  
Tape Thickness  
0.014  
[0.35]  
MAX.  
Deformation  
Between  
Embossments  
0.059 + 0.004 - 0.0  
[1.5 + 0.10 - 0.0]  
Embossment  
0.069 0.004  
[1.75 0.10]  
0.079 0.002  
[2.0 0.05]  
Top  
Cover  
Tape  
A0  
20°  
0.030 [0.75]  
MIN. (Note 3)  
F
W
Maximum  
Component  
Rotation  
B1 MAX.  
(Note 6)  
K0  
B0  
Top  
Cover  
Tape  
0.030 [0.75]  
MIN. (Note 4)  
(Side or Front Sectional View)  
0.004 [0.1]  
MAX.  
Center Lines  
of Cavity  
P1  
For Tape Feeder  
Reference only  
including draft.  
Concentric around B  
(Note 5)  
D
1 MIN. For Components  
0.079 x 0.047 [2.0 x 1.2] and Large.r  
Maximum (Note 5)  
Cavity Size  
USER DIRECTION OF FEED  
0
(Note 1)  
Cathode (-)  
Anode (+)  
Direction of Feet  
Tape and Reel Specifications: All case sizes are available on  
plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3  
is also available. Standard reel diameter is 7" [178 mm],  
13" [330 mm] reels are available and recommended as the most  
cost effective packaging method.  
20° Maximum  
Component Rotation  
3.937 [100.0]  
0.039 [1.0]  
MAX.  
Typical  
Component  
Cavity  
Tape  
B0  
Center Line  
0.039 [1.0]  
MAX.  
The most efficient packaging quantities are full reel increments on  
a given reel diameter. The quantities shown allow for the sealed  
empty pockets required to be in conformance with EIA-481-1. Reel  
size and packaging orientation must be specified in the Vishay  
Sprague part number.  
0.9843 [250.0]  
Typical  
Component  
Center Line  
Camber  
(Top View)  
A0  
(Top View)  
Allowable Camber to be 0.039/3.937 [1/100]  
Non-Cumulative Over 9.843 [250.0]  
Note  
Metric dimensions will govern. Dimensions in inches are rounded and for reference only.  
CASE  
CODE  
TAPE  
SIZE  
B1  
(MAX.)  
D1  
(MIN.)  
K0  
(MAX.)  
F
P1  
W
298D  
0.108  
[2.75]  
0.039  
[1.0]  
0.138 0.002  
[3.5 0.05]  
0.054  
[1.37]  
0.157 0.004 0.315 + 0.0118/- 0.0039  
P, R  
8 mm  
8 mm  
[4.0 1.0]  
[8.0 + 0.30/- 0.10]  
0.165  
[4.2]  
0.039  
[1.0]  
0.138 0.002  
[3.5 0.05]  
0.094  
[2.4]  
0.157 0.004  
[4.0 1.0]  
0.315 0.012  
[8.0 0.30]  
A
Document Number: 40065  
Revision: 24-May-11  
For technical questions, contact: tantalum@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
45  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
PAPER TAPE AND REEL PACKAGING in inches [millimeters]  
[10 pitches cumulative tolerance  
P2  
on tape 0.2 mm]  
T
E1  
Ø D0  
P0  
A0  
F
Bottom Cover  
Tape  
W
B0  
E2  
Top  
Cover Tape  
Anode  
P1  
Bottom Cover Tape  
G
Cavity Center Lines  
Cavity Size  
Note 1  
User Feed Direction  
298D  
CASE TAPE  
A
0
B
0
D
0
P
0
P
1
P
2
E
F
W
T
SIZE  
SIZE  
0.033 0.002 0.053 0.002 0.06 0.004 0.157 0.004 0.078 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.03 0.002  
[0.85 0.05] [1.35 0.05] [1.5 0.1] [4.0 0.1] [2.0 0.1] [2.0 0.05] [1.75 0.1] [3.5 0.05] [8.0 0.2] [0.75 0.05]  
K
8 mm  
0.041 0.002 0.071 0.002 0.06 0.004 0.157 0.004 0.157 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.037 0.002  
M
8 mm  
[1.05 0.05]  
[1.8 0.05]  
[1.5 0.1]  
[4.0 0.1]  
[4.0 0.1]  
[2.0 0.05]  
[1.75 0.1]  
[3.5 0.05]  
[8.0 0.2]  
[0.95 0.05]  
STANDARD PACKAGING QUANTITY  
QUANTITY (pcs/reel)  
SERIES  
CASE CODE  
7" REEL  
5000  
K
M
P
4000  
298D  
3000  
R
A
2500  
2000  
RECOMMENDED VOLTAGE DERATING GUIDELINES  
STANDARD CONDITIONS: FOR EXAMPLE: OUTPUT FILTERS  
Capacitor Voltage Rating  
Operating Voltage  
4.0  
2.5  
3.6  
6.0  
10  
12  
15  
24  
28  
6.3  
10  
16  
20  
25  
35  
50  
SEVERE CONDITIONS: FOR EXAMPLE: INPUT FILTERS  
Capacitor Voltage Rating  
Operating Voltage  
4.0  
6.3  
10  
16  
20  
25  
35  
50  
2.5  
3.3  
5.0  
8.0  
10  
12  
15  
24  
www.vishay.com  
46  
For technical questions, contact: tantalum@vishay.com  
This document is subject to change without notice.  
Document Number: 40065  
Revision: 24-May-11  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
POWER DISSIPATION  
MAXIMUM PERMISSIBLE  
POWER DISSIPATION AT + 25 °C (W) IN FREE AIR  
CASE CODE  
K
M
P
0.015  
0.025  
0.045  
0.045  
0.075  
298D  
R
A
RECOMMENDED REFLOW PROFILES  
Tp °C  
(tp)  
TL °C  
Ts MAX. °C  
(tL)  
Ts MAX. °C  
Preheat (ts)  
25 °C  
t, s  
All Case Codes  
TS  
MIN.  
Sn/Pb  
TS  
MAX.  
Sn/Pb  
tS  
TP  
TP  
TL  
TL  
TS MIN.  
T
S MAX.  
tS  
TYPE  
298D  
tP  
Lead  
tL  
Lead (Pb)-free Sn/Pb  
Lead (Pb)-free  
S
n
/P  
b
Lead (Pb)-free  
Lead (Pb)-free  
Sn/Pb  
(Pb)-free  
260 °C  
225 °C 10  
217 °C  
183 °C  
150 °C  
100 °C  
200 °C  
150 °C  
60 to 150  
60 to 90 60  
PAD DIMENSIONS in inches [millimeters]  
D
C
B
A
A
B
C
D
CASE CODE  
(MIN.)  
(NOM.)  
(NOM.)  
(NOM.)  
298D  
K
M
P
R
A
0.028 [0.70]  
0.039 [1.00]  
0.063 [1.60]  
0.059 [1.50]  
0.071 [1.80]  
0.018 [0.45]  
0.028 [0.70]  
0.031 [0.80]  
0.031 [0.80]  
0.067 [1.70]  
0.024 [0.60]  
0.024 [0.60]  
0.047 [1.20]  
0.039 [1.0]  
0.053 [1.35]  
0.059 [1.50]  
0.080 [2.00]  
0.110 [2.80]  
0.102 [2.60]  
0.187 [4.75]  
Document Number: 40065  
Revision: 24-May-11  
For technical questions, contact: tantalum@vishay.com  
This document is subject to change without notice.  
www.vishay.com  
47  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
298D  
Vishay Sprague  
Solid Tantalum Chip Capacitors,  
MICROTANTM Leadframeless Molded  
GUIDE TO APPLICATION  
1.  
AC Ripple Current: The maximum allowable ripple  
6.  
Printed Circuit Board Materials: Molded capacitors  
current shall be determined from the formula:  
are compatible with commonly used printed circuit  
board materials (alumina substrates, FR4, FR5, G10,  
PTFE-fluorocarbon and porcelanized steel).  
P
RESR  
IRMS  
=
------------  
7.  
Attachment:  
where,  
P =  
7.1  
Solder Paste: The recommended thickness of the  
Power dissipation in W at + 25 °C as given in  
the table in paragraph number 5  
(power dissipation)  
solder paste after application is 0.007"  
0.001"  
[0.178 mm 0.025 mm]. Care should be exercised in  
selecting the solder paste. The metal purity should  
be as high as practical. The flux (in the paste) must  
be active enough to remove the oxides formed on the  
metallization prior to the exposure to soldering heat.  
In practice this can be aided by extending the solder  
preheat time at temperatures below the liquidous  
state of the solder.  
RESR = The capacitor equivalent series resistance at  
the specified frequency  
2.  
AC Ripple Voltage: The maximum allowable ripple  
voltage shall be determined from the formula:  
P
VRMS = Z ------------  
RESR  
or, from the formula:  
VRMS = IRMS x Z  
where,  
7.2  
Soldering: Capacitors can be attached by  
conventional soldering techniques; vapor phase,  
convection reflow, infrared reflow, wave soldering  
and hot plate methods. The Soldering Profile charts  
show recommended time/temperature conditions for  
soldering. Preheating is recommended. The  
recommended maximum ramp rate is 2 °C per s.  
P =  
Power dissipation in W at + 25 °C as given in  
the table in paragraph number 5  
(power dissipation).  
Attachment with  
a
soldering iron is not  
recommended due to the difficulty of controlling  
temperature and time at temperature. The soldering  
iron must never come in contact with the capacitor.  
R
ESR = The capacitor equivalent series resistance at  
the specified frequency.  
Z =  
The capacitor impedance at the specified  
frequency.  
7.2.1 Backward and Forward Compatibility: Capacitors  
with SnPb or 100 % tin termination finishes can be  
soldered using SnPb or lead (Pb)-free soldering  
processes.  
2.1  
2.2  
The sum of the peak AC voltage plus the applied DC  
voltage shall not exceed the DC voltage rating of the  
capacitor.  
8.  
Cleaning (Flux Removal) After Soldering: Molded  
capacitors are compatible with all commonly used  
solvents such as TES, TMS, Prelete, Chlorethane,  
Terpene and aqueous cleaning media. However,  
CFC/ODS products are not used in the production of  
these devices and are not recommended. Solvents  
containing methylene chloride or other epoxy  
solvents should be avoided since these will attack  
the epoxy encapsulation material.  
The sum of the negative peak AC voltage plus the  
applied DC voltage shall not allow a voltage reversal  
exceeding 10 % of the DC working voltage at  
+ 25 °C.  
3.  
4.  
Reverse Voltage: These capacitors are capable of  
withstanding peak voltages in the reverse direction  
equal to 10 % of the DC rating at + 25 °C, 5 % of the  
DC rating at + 25 °C; 5 % of the DC rating at + 85 °C  
and 1 % of the DC rating at + 125 °C.  
8.1  
9.  
When using ultrasonic cleaning, the board may  
resonate if the output power is too high. This  
vibration can cause cracking or a decrease in the  
adherence of the termination. DO NOT EXCEED 9W/l  
at 40 kHz for 2 min.  
Temperature Derating: If these capacitors are to be  
operated at temperatures above + 25 °C, the  
permissible RMS ripple current or voltage shall be  
calculated using the derating factors as shown:  
Recommended Mounting Pad Geometries: Proper  
mounting pad geometries are essential for  
successful solder connections. These dimensions  
are highly process sensitive and should be designed  
to minimize component rework due to unacceptable  
solder joints. The dimensional configurations shown  
are the recommended pad geometries for both wave  
and reflow soldering techniques. These dimensions  
are intended to be a starting point for circuit board  
designers and may be fine tuned if necessary based  
upon the peculiarities of the soldering process  
and/or circuit board design.  
TEMPERATURE  
+ 25 °C  
DERATING FACTOR  
1.0  
0.9  
0.4  
+ 85 °C  
+ 125 °C  
5.  
Power Dissipation: Power dissipation will be  
affected by the heat sinking capability of the  
mounting surface. Non-sinusoidal ripple current may  
produce heating effects which differ from those  
shown. It is important that the equivalent IRMS value  
be established when calculating permissable  
operating levels. (Power dissipation calculated using  
+ 25 °C temperature rise.)  
www.vishay.com  
48  
For technical questions, contact: tantalum@vishay.com  
This document is subject to change without notice.  
Document Number: 40065  
Revision: 24-May-11  
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Legal Disclaimer Notice  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical  
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements  
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular  
product with the properties described in the product specification is suitable for use in a particular application. Parameters  
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All  
operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree  
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and  
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay  
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to  
obtain written terms and conditions regarding products designed for such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by  
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 11-Mar-11  
www.vishay.com  
1

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