CDHV2512AF20M0M0500JFB 概述
Thick Film Chip Dividers, High Voltage
CDHV2512AF20M0M0500JFB 数据手册
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Vishay Techno
www.vishay.com
Thick Film Chip Dividers, High Voltage
FEATURES
• High voltage up to 3000 V
• Typical resistance ratios of 250:1 to a maximum
resistance ratio of 500:1
Available
Available
• Flow solderable
• Tape and reel packaging available
• Termination style: 3-sided wraparound termination or
single termination flip chip available
• Suitable for solderable, epoxy bondable, or wire bondable
applications
LINKS TO ADDITIONAL RESOURCES
• Termination material: solder-coated nickel barrier or
solder coated non-magnetic terminations standard; gold,
palladium silver, platinum gold, platinum silver or platinum
palladium gold terminations available
3
D
3D Models
Footprints
• Multiple styles, termination materials and configurations,
allow wide design flexibility
• Epoxy bondable or wire bondable non-magnetic
terminations available
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
*
This datasheet provides information about parts that are RoHS-compliant and / or parts that are non RoHS-compliant. For example, parts
with lead (Pb) terminations are not RoHS-compliant. Please see the information / tables in this datasheet for details
STANDARD ELECTRICAL SPECIFICATIONS
MAXIMUM
WORKING
VOLTAGE (1)
V
TEMPERATURE
COEFFICIENT (4)
(-55 °C to +155 °C)
ppm/°C
POWER RATING
RESISTANCE
RANGE (2)
Ω
GLOBAL
MODEL
CASE
SIZE
TOLERANCE (3)
ꢀ
TCR TRACKING
ppm/°C
P70 °C
W
CDHV 2512
2512
1
3000
20M to 20G
1, 2, 5, 10, 20
100
50 (typical)
Notes
(1)
Continuous working voltage shall be P x R or maximum working voltage, whichever is less
Resistance values below 1 GΩ are calibrated at 100 VDC, and values of 1 GΩ and above are calibrated at 1000 VDC. Calibration at other
voltages available upon request
Contact factory for tighter tolerances
Reference only: not for all values specified. Consult factory for your value
(2)
(3)
(4)
VOLTAGE AND TEMPERATURE COEFFICIENTS OF RESISTANCE CHART TYPICAL
RESISTANCE (Ω)
RATIO (TYPICAL)
VCR (ppm/V)
TCR (ppm/°C) -55 °C to +155 °C
20M
250:1
10
10
10
100
150
200
150M
800M
300:1
500:1
Note
•
Contact factory for other ratios
Revision: 19-May-2021
Document Number: 68020
1
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CDHV
Vishay Techno
www.vishay.com
GLOBAL PART NUMBER INFORMATION
New Global Part Numbering: CDHVAF20M0J2500GFB (preferred part number format)
C
D
H
V
A
F
2
0
M
0
J
2
5
0
0
G
F
B
GLOBAL
MODEL
TERM
STYLE
TERM
MATERIAL
RESISTANCE
VALUE (R1)
RATIO
RATIO
SOLDER
TOLERANCE
PACKAGING
(R1 + R2) / R2 TOLERANCE TERMINATION
CDHV =
A =
F = nickel barrier
M = MΩ
G = GΩ
F = 1 %
G = 2 %
3 digit
significant
G = 2 %
H = 3 %
E = Sn100
B = bulk
CDHV2512 3-sided G = non-magnetic
F = Sn95/Ag5, (250 pcs max.)
B = top
only
A = palladium
silver
B = platinum gold
C = gold
D = platinum
silver
E = platinum
palladium gold
20M0 = 20 MΩ
J = 5 % figure, followed J = 5 %
HSD
N = no solder
S = Sn62 /
Pb36 / Ag2,
HSD
F = T / R
(full reel)
800M = 800 MΩ K = 10 % by a multiplier
1G00 = 1 GΩ
M = 20 %
0500 = 50:1
2500 = 250:1
3000 = 300:1
5000 = 500:1
1 = T / R
(1000 pcs)
5 = T / R
(500 pcs)
T = T / R
(250 pcs min.)
W =
T = Sn90 / Pb10
waffle tray
Historical Part Numbering: CDHV2512AF2005J2500Ge2 (will continue to be accepted)
CDHV2512
A
F
2005
J
2500
G
e2
HISTORICAL
MODEL
TERM
STYLE
TERM
MATERIAL
RESISTANCE
VALUE (R1)
RATIO
(R1 + R2) / R2
RATIO
TOLERANCE
SOLDER
TERMINATION
TOLERANCE
Note
•
For additional information on packaging, refer to the “Surface Mount Resistor Packaging” document (www.vishay.com/doc?31543)
MATERIAL SPECIFICATIONS
Resistive element
Encapsulation
Substrate
Ruthenium oxide
Glass
96 % alumina
Solder-coated nickel barrier or solder coated non-magnetic terminations standard.
Gold, palladium silver, platinum gold, platinum silver, platinum palladium gold terminations available.
Termination
Solder finish
Pure tin or tin / lead solder alloys standard. Tin / silver or tin / lead / silver solder alloys available.
ENVIRONMENTAL SPECIFICATIONS
Operating temperature
-55 °C to +155 °C
Life
Less than 0.5 % change when tested at full rated power
Note
•
Reference only: not for all values specified. Consult factory for your size and value
Revision: 19-May-2021
Document Number: 68020
2
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CDHV
Vishay Techno
www.vishay.com
DIMENSIONS in inches (millimeters)
B
B
L
A
A
C
C
T
T
W
B
B
W
A
A
Style B
Style A
B
C
A
E
W
B
Style A Bottom
(3-sided wraparound)
LENGTH (L)
TERMINATION
WIDTH (W)
THICKNESS (T)
0ꢁ005 (0ꢁ127)
A
0ꢁ005
0ꢁ005
C
0ꢁ005
E
0ꢁ005
0ꢁ006 (0ꢁ152)
0ꢁ006 (0ꢁ152)
Style A
(3-sided wraparound)
0.250
0.126
0.126
0.025
0.025
0.025
0.025
0.040
0.046
Style B
0.240
0.025
0.025
0.040
-
(top only)
DERATING CURVE
120
100
80
60
40
20
0
-55
-25
0
25 50
75 100 125
70
175
155
Ambient Temperature in °C
Note
Reference only: not for all values specified. Consult factory for your specific value
•
Revision: 19-May-2021
Document Number: 68020
3
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CDHV
Vishay Techno
www.vishay.com
TERMINATION
MATERIAL
TERMINATION
STYLE
TERMINATION STYLE /
MATERIAL CODE
SOLDER TERMINATION
CODE
TYPE
3-sided (wraparound)
Top only (flip chip)
3-sided (wraparound)
Top only (flip chip)
AF
BF
AG
BG
E or T (standard);
F or S (optional) (1)
Solderable
Nickel barrier
E or T (standard);
F or S (optional) (1)
Solderable
Non-magnetic
Epoxy bondable /
solderable
N (standard);
Platinum palladium gold
Gold
Top only (flip chip)
Top only (flip chip)
BE
BC
F or S (optional) (2)
Wire bondable /
epoxy bondable
N
N
Palladium silver (3)
Platinum gold
BA
BB
BD
Epoxy bondable
Top only (flip chip)
Platinum silver
Notes
(1)
(2)
(3)
Standard solder plating for the nickel barrier and non-magnetic parts is solder terminations E or T. Hot solder dipped terminations F or S are
also available
Use solder termination N for applications requiring epoxy bondable mounting, and solder terminations F or S for applications requiring
solderable mounting
While not recommended, palladium silver terminations could be used for solderable applications when using a solder alloy containing silver.
If the solder paste being used to solder the palladium silver terminated parts to the boards does not have a silver-based composition, then
the silver in the terminations could begin to leach when it is exposed to liquidus non-silver-based solders, causing the potential for
solderability and/or solder joint issues
SCHEMATIC
R2
R1
Pin 2
R1
1
3
Pin 3
R2
VIN
VOUT
2
2
Pin 1
Revision: 19-May-2021
Document Number: 68020
4
For technical questions, contact: te1resistors@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay's knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer's responsibility to validate that a particular product
with the properties described in the product specification is suitable for use in a particular application. Parameters provided in
datasheets and / or specifications may vary in different applications and performance may vary over time. All operating
parameters, including typical parameters, must be validated for each customer application by the customer's technical experts.
Product specifications do not expand or otherwise modify Vishay's terms and conditions of purchase, including but not limited
to the warranty expressed therein.
Hyperlinks included in this datasheet may direct users to third-party websites. These links are provided as a convenience and
for informational purposes only. Inclusion of these hyperlinks does not constitute an endorsement or an approval by Vishay of
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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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© 2021 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 09-Jul-2021
Document Number: 91000
1
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