CRCW02015K60FKED [VISHAY]
RES SMD 5.6K OHM 1% 1/20W 0201;型号: | CRCW02015K60FKED |
厂家: | VISHAY |
描述: | RES SMD 5.6K OHM 1% 1/20W 0201 |
文件: | 总5页 (文件大小:84K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
CRCW0201 e3
www.vishay.com
Vishay
Lead (Pb)-Free Commodity Thick Film Chip Resistors
FEATURES
• High volume product suitable for commercial
applications
• Pure tin solder contacts on Ni barrier layer
provides compatibility with lead (Pb)-free and
lead containing soldering processes
• Metal glaze on high quality ceramic
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
LIMITING
ELEMENT
VOLTAGE
Umax.
ACRMS/DC
V
CASE
SIZE
INCH
CASE
SIZE
METRIC
POWER RATING
TEMPERATURE
COEFFICIENT
ppm/K
RESISTANCE
RANGE
Ω
TOLERANCE
%
MODEL
P70
SERIES
W
200
-200 / +400
100
10.0 to 10M
1.0 to 9.76
47.0 to 1M
10.0 to 10M
1.0 to 9.76
10.0 to 10M
1.0 to 9.1
0.5
1
E24; E96
E24; E96
E24
0.05
30
200
CRCW0201
0201 RR 0603M
-200 / +400
200
5
-200 / +400
Zero-ohm-resistor: Rmax. = 50 mΩ, Imax. at 70 °C = 1.0 A
Notes
•
These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over
operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material
•
TECHNICAL SPECIFICATIONS
PARAMETER
UNIT
W
CRCW0201
0.05
Rated Dissipation at 70 °C (1)
Operating Voltage Umax. ACRMS/DC
Insulation Voltage Uins (1 min)
Insulation Resistance
V
30
V
50
Ω
> 109
Operating Temperature Range
Weight
°C
mg
-55 to +155
0.17
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded
Revision: 05-Jan-2021
Document Number: 20052
1
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRCW0201 e3
www.vishay.com
Vishay
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW02011K00FNED
C
R
C
W
0
2
0
1
1
K
0
0
F
K
E
D
MODEL
VALUE
TOLERANCE
TCR
PACKAGING
CRCW0201
R = decimal
K = thousand
M = million
D = 0.5 ꢀ
F = 1.0 ꢀ
J = 5.0 ꢀ
Z = jumper
K = 100 ppm/K
N = 200 ppm/K
X = -200 ppm/K / +400 ppm/K
0 = jumper
ED
EE
EI
0000 = jumper
Product Description: CRCW0201 100 1K0 1 % ET7 e3
CRCW0201
100
562R
1 %
ET7
e3
RESISTANCE
VALUE
TOLERANCE
VALUE
MODEL
TCR
PACKAGING
LEAD (Pb)-FREE
CRCW0201
200 ppm/K
100 ppm/K
- 200/+ 400 ppm/K
1R0 = 1 Ω
10R = 10 Ω
1K0 = 1 kΩ
10K = 10 kΩ
1M0 = 1 MΩ
0R0 = jumper
0.5 %
1 %
5 %
ET7
EF4
ET2
e3 = pure tin
termination finish
PACKAGING
MODEL
CODE
QUANTITY
10 000
CARRIER TAPE
WIDTH
PITCH
REEL DIAMETER
180 mm / 7"
ED = ET7
EI = ET2
EE = EF4
Paper tape according
to IEC 60068-3 type I
CRCW0201
20 000
8 mm
2 mm
254 mm / 10"
330 mm / 13"
50 000
DIMENSIONS in millimeters
L
T2
b
l
W
H
a
T1
SIZE
DIMENSIONS
SOLDER PAD DIMENSIONS
INCH
METRIC
L
W
H
T1
T2
a
b
l
0201
0603
0.6 0.05
0.3 0.03
0.23 0.03 0.15 0.05 0.10 0.05
0.28
0.43
0.23
Note
No marking for 0201 size
•
Revision: 05-Jan-2021
Document Number: 20052
2
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRCW0201 e3
www.vishay.com
Vishay
DERATING
Axis Title
10000
1000
100
100
50
0
10
-60 -50 -40
-20
0
20
40
50
60
80
100
120
140 150 160
70
ϑamb - Ambient Temperature (°C)
TEST PROCEDURES AND REQUIREMENTS
REQUIREMENTS
IEC
60068-2
TEST
PROCEDURE
PERMISSIBLE CHANGE (ΔR)
EN 60115-1
CLAUSE
TEST
Stability for product types:
METHOD
CRCW0201 e3
1 Ω to 10 MΩ
4.5
4.7
-
-
Resistance
-
0.5 ꢀ; 1 ꢀ; 5 ꢀ
Voltage proof
U = 1.4 x Uins; 60 s
No flashover or breakdown
Solder bath method;
Sn60Pb40
non activated flux;
Good tinning (≥ 95 ꢀ covered)
no visible damage
(235 5) °C
(2 0.2) s
4.13
58 (Td)
Solderability
Solder bath method;
Sn96.5Ag3Cu0.5
non-activated flux;
(245 5) °C
Good tinning (≥ 95 ꢀ covered)
no visible damage
(3 0.3) s
100 ppm/K,
200 ppm/K,
-200 ppm/K / +400 ppm/K
(20 / -55 / 20) °C and
(20 / 125 / 20) °C
4.8.4.2
4.32
-
Temperature coefficient
Shear (adhesion)
21 (Uu3)
21 (Uu1)
9 N
No visible damage
No visible damage,
no open circuit in bent position
(0.5 ꢀ R + 0.05 Ω)
4.33
Substrate bending
Depth 2 mm; 3 times
30 min. at -55 °C;
30 min. at 125 °C
Rapid change
of temperature
4.19
14 (Na)
5 cycles
1000 cycles
(0.5 ꢀ R + 0.05 Ω)
(1 ꢀ R + 0.05 Ω)
4.23
-
Climatic sequence:
Dry heat
-
4.23.2
4.23.3
4.23.4
4.23.5
4.23.6
4.23.7
2 (Ba)
30 (Db)
1 (Aa)
13 (M)
30 (Db)
-
125 °C; 16 h
Damp heat, cyclic
Cold
55 °C; ≥ 90 ꢀ RH; 24 h; 1 cycle
-55 °C; 2 h
(2 ꢀ R + 0.1 Ω)
Low air pressure
Damp heat, cyclic
DC load
1 kPa; (25 10) °C; 1 h
55 °C; ≥ 90 ꢀ RH; 24 h; 5 cycles
U = P70 x R ≤ Umax.
Revision: 05-Jan-2021
Document Number: 20052
3
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CRCW0201 e3
www.vishay.com
Vishay
TEST PROCEDURES AND REQUIREMENTS
REQUIREMENTS
IEC
60068-2
TEST
PROCEDURE
PERMISSIBLE CHANGE (ΔR)
EN 60115-1
CLAUSE
TEST
Stability for product types:
METHOD
CRCW0201 e3
1 Ω to 10 MΩ
U = P70 x R ≤ Umax.
;
1.5 h on; 0.5 h off;
4.25.1
4.18.2
-
Endurance at 70 °C
70 °C; 1000 h
70 °C; 8000 h
(2 ꢀ R + 0.1 Ω)
(4 ꢀ R + 0.1 Ω)
Solder bath method
(260 5) °C; (10 1) s
Resistance to
soldering heat
58 (Td)
(1 ꢀ R + 0.05 Ω)
IEC 60695-11-5;
10 s
Flammability,
needle flame test
4.35
-
No burning after 30 s
(2 ꢀ R + 0.1 Ω)
4.24
78 (Cab)
-
Damp heat, steady state
(40 2) °C; (93 3) ꢀ RH; 56 days
Endurance at upper
category temperature
4.25.3
155 °C, 1000 h
(2 ꢀ R + 0.1 Ω)
Isopropyl alcohol;
50 °C; method 2
Component
solvent resistance
4.29
4.22
45 (XA)
6 (Fc)
No visible damage
f = 10 Hz to 2000 Hz;
x, y, z ≤ 1.5 mm;
A ≤ 200 m/s2;
Vibration, endurance
by sweeping
(0.5 ꢀ R + 0.05 Ω)
10 sweeps per axis
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, environmental test procedures
Packaging of components is done in paper tapes according to IEC 60286-3.
Revision: 05-Jan-2021
Document Number: 20052
4
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Vishay
Disclaimer
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Revision: 09-Jul-2021
Document Number: 91000
1
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