CRCW1206330MJPEAHR [VISHAY]
RES SMD 330M OHM 5% 1/4W 1206;
| 型号： | CRCW1206330MJPEAHR |
| 厂家： | 
VISHAY |
| 描述： | RES SMD 330M OHM 5% 1/4W 1206 |
| 文件： | 总5页 (文件大小：82K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
D/CRCW-HR
www.vishay.com
Vishay
Lead (Pb)-Bearing Thick Film,
Rectangular High Value Chip Resistor
FEATURES
• High resistance values (up to 470M)
• Suitable for voltage dividers and hybrids
• Lead (Pb)-bearing termination plating on Ni barrier layer
• Metal glaze on high quality ceramic
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
STANDARD ELECTRICAL SPECIFICATIONS
LIMITING
POWER
RATING
P70
ELEMENT
VOLTAGE
Umax.
ACRMS/DC
V
CASE
SIZE
INCH METRIC
CASE
SIZE
TEMPERATURE
COEFFICIENT
ppm/K
RESISTANCE
RANGE
TOLERANCE
%
MODEL
SERIES
W
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
0603 RR 1608M
0805 RR 2012M
1206 RR 3216M
0.10
0.125
0.25
75
500
500
500
5
5
5
11M to 470M
11M to 470M
11M to 470M
E24
E24
E24
150
200
Notes
•
These resistors do not feature a limited lifetime when operated within the limits of rated dissipation, permissible operating voltage, and
permissible film temperature. However, the resistance typically increase due to the resistor’s film temperature over operating time, generally
known as drift. The drift may exceed the stability requirements of an individual application circuit and thereby limits the functional time.
Marking and packaging: See datasheet “Surface Mount Resistor Marking” (www.vishay.com/doc?20020)
•
•
Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.
TECHNICAL SPECIFICATIONS
PARAMETER
UNIT
W
D11/CRCW0603-HR
D12/CRCW0805-HR
D25/CRCW1206-HR
(1)
Rated Dissipation at P70
0.1
75
0.125
150
0.25
200
Operating Voltage Umax. ACRMS/DC
V
< 100M: < 0.1
> 100M: < 0.3
Voltage Coefficient
%/V
Insulation Voltage Uins (1 min)
Insulation Resistance
Operating Temperature Range
Weight
V
100
2
200
> 109
300
10
°C
mg
- 55 to + 155
5.5
Note
(1)
The power dissipation on the resistor generates a temperature rise against the local ambient, depending on the heat flow support of the
printed-circuit board (thermal resistance). The rated dissipation applies only if the permitted film temperature of 155 °C is not exceeded.
Revision: 12-Jun-12
Document Number: 20011
1
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-HR
www.vishay.com
Vishay
PART NUMBER AND PRODUCT DESCRIPTION
Part Number: CRCW060316M0JPTBHR
C
R
C
W
0
6
0
3
1
6
M
0
J
P
T
B
H
R
MODEL/SIZE
RESISTANCE
TOLERANCE
TCR
PACKAGING
SPECIAL
CRCW0603
CRCW0805
CRCW1206
M = Million
J = 5 %
P = 500 ppm/K
TA, TB
TC
Up to 2 digits
HR = High value
Product Description: CRCW0603-HR 500 16M 5% RT5
CRCW0603-HR
500
16M
J
RT5
MODEL
TCR
RESISTANCE
TOLERANCE
PACKAGING
CRCW0603-HR
CRCW0805-HR
CRCW1206-HR
500 ppm/K
68M = 68 M
220M = 220 M
5 %
RT1, RT5
RT6
PACKAGING
MODEL
CODE
QUANTITY
5000
CARRIER TAPE
WIDTH
PITCH
REEL DIAMETER
180 mm/7"
TA = RT1
TB = RT5
TC = RT6
TA = RT1
TB = RT5
TC = RT6
TA = RT1
TB = RT5
TC = RT6
CRCW0603-HR
10 000
20 000
5000
8 mm
4 mm
285 mm/11.25"
330 mm/13"
180 mm/7"
Paper tape acc. to
IEC 60068-3
Type I
CRCW0805-HR
10 000
20 000
5000
8 mm
8 mm
4 mm
4 mm
285 mm/11.25"
330 mm/13"
180 mm/7"
CRCW1206-HR
10 000
20 000
285 mm/11.25"
330 mm/13"
DIMENSIONS
SOLDER PAD DIMENSIONS in millimeters
REFLOW SOLDERING WAVE SOLDERING
SIZE
DIMENSIONS in millimeters
INCH METRIC
L
W
H
T1
T2
a
b
l
a
b
l
+ 0.10
- 0.05
0603
0805
1206
1608
2012
3216
1.55
2.0
0.85 0.1 0.45 0.05 0.3 0.2
0.3 0.2
0.3 0.2
0.4 0.2
0.5
0.7
0.9
0.9
1.3
1.7
1.0
1.2
2.0
0.9
0.9
1.1
0.9
1.3
1.7
1.0
1.3
2.3
+ 0.20
- 0.10
+ 0.20
- 0.10
1.25 0.15 0.45 0.05 0.3
+ 0.10
- 0.20
3.2
1.6 0.15 0.55 0.05 0.45 0.2
Revision: 12-Jun-12
Document Number: 20011
2
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-HR
www.vishay.com
Vishay
DERATING
100
%
50
0
- 50
0
50
100
°C
150
70
Ambient Temperature in
amb
TEST PROCEDURES AND REQUIREMENTS
IEC
60068-2
TEST
REQUIREMENTS
EN 60115-1
CLAUSE
PERMISSIBLE CHANGE (R)
TEST
PROCEDURE
STABILITY CLASS 2 OR BETTER
METHOD
Stability for product types:
D/CRCW-HR
11 M to 470 M
4.5
_
_
Resistance
-
5 %
U = 2.5 x √P70 x R 2 x Umax.
;
4.13
Short time overload
(0.5 % R + 0.05 )
Duration acc. to style
Solder bath method;
Sn60Pb40
Good tinning ( 95 % covered); no visible
4.17.2
58 (Td)
Solderability
damage
Temperature
coefficient
20 °C/- 55 °C/20 °C and
20 °C/125 °/20 °C
4.8.4.2
4.32
_
500 ppm/K
RR 1608: 9 N
RR 2012 and RR 3216: 45 N
21 (Uu3)
Shear (adhesion)
No visible damage
No visible damage, no open circuit in bent
position
Depth 2 mm;
3 times
4.33
4.19
21 (Uu1)
14 (Na)
Substrate bending
(0.25 % R + 0.05 )
30 min. at - 55 °C;
30 min. at 125 °C
Rapid change of
temperature
5 cycles
(0.5 % R + 0.05 )
(1 % R + 0.05 )
1000 cycles
Climatic sequence:
Dry Heat
Damp heat, cyclic
4.23
4.23.2
4.23.3
_
-
2 (Ba)
30 (Db)
125 °C; 16 h
55 °C; 90 % RH;
24 h; 1 cycle
Cold
Low air pressure
4.23.4
4.23.5
4.23.6
1 (Aa)
13 (M)
30 (Db)
(2 % R + 0.1 )
- 55 °C; 2 h
1 kPa; (25 10) °C; 1 h
55 °C; 90 % RH
24 h; 5 cycle
Damp heat, cyclic
D.C. Load
U = √P70 x R
4.23.7
_
U = √P70 x R Umax.
1.5 h on; 0.5 h off;
70 °C; 1000 h
Endurance at
70 °C
4.25.1
_
(2 % R + 0.1 )
(4 % R + 0.1 )
70 °C; 8000 h
Revision: 12-Jun-12
Document Number: 20011
3
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
D/CRCW-HR
www.vishay.com
Vishay
TEST PROCEDURES AND REQUIREMENTS
IEC
60068-2
TEST
REQUIREMENTS
EN 60115-1
CLAUSE
PERMISSIBLE CHANGE (R)
TEST
PROCEDURE
STABILITY CLASS 2 OR BETTER
METHOD
Stability for product types:
D/CRCW-HR
11 M to 470 M
(0.5 % R + 0.05 )
Solder bath method
(260 5) °C;
Resistance to
soldering heat
4.18.2
58 (Td)
(10 1) s
Damp heat,
steady state
(40 2) °C;
(93 3) % RH; 56 days
4.24
78 (Cab)
_
(2 % R + 0.1 )
(2 % R + 0.1 )
Endurance at upper
category temperature
4.25.3
155 °C; 1000 h
All tests are carried out in accordance with the following specifications:
• EN 60115-1, generic specification
• EN 140400, sectional specification
• EN 140401-802, detail specification
• IEC 60068-2-x, variety of environmental test procedures
Packaging of components is done in paper or blister tapes according to IEC 60286-3.
Revision: 12-Jun-12
Document Number: 20011
4
For technical questions, contact: thickfilmchip@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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Revision: 09-Jul-2021
Document Number: 91000
1
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