EQ681R0 [VISHAY]
Fixed Resistor, Metal Foil, 0.125W, 681ohm, 40V, 0.05% +/-Tol, 1812;
| 型号： | EQ681R0 |
| 厂家： | 
VISHAY |
| 描述： | Fixed Resistor, Metal Foil, 0.125W, 681ohm, 40V, 0.05% +/-Tol, 1812 |
| 文件： | 总2页 (文件大小：392K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Ultra-Precision SMT Resistor
(
)
Wire-Bondable
TCR, Resistance Range, Tolerance, Rated Power
EQ
Resistance
Range (⍀)*
Resistance
Tolerance (%)
Rated Power (W)
at 70°C
TCR (ppm/°C)
-55°C to +125°C
Type
EP
30 to 100
±
0.1
0.1
0±5
See fig.1
±
±
0.05
100 to 30k
±
0.1
30 to 100
EQ
0.125
100 to 60k
0.05
Power Derating Curve
EP
Composition of Type Number
EQ 10K00
Resistance value, in ohm, is expressed by a series of five characters, four of
which represent significant digits. The fifth R or K is a dual-purpose letter that
designates both the value range (R for ohmic; K for kilo-ohm) and the location of
the decimal point.
Configuration
Type
L
EP
EQ
2.2±0.1
1.6±0.1
4.5±0.1
3.2±0.1
W
T
0.4±0.1
0.25±0.01
0.25±0.01
L1
W1
Dimensions in mm
8
Performance
Test Condition
Parameters
MIL-R-55342 Specification
ALPHA Typical Test Data
Maximum Rated Operating Temperature
Working Temperature Range
Maximum Working Voltage
70°C
-65°C to +125°C
40V
Maximum Working Current
350mA
Thermal Shock
-65°C/30 min.
+125°C/30 min., 5 cycles
±0.05%
±0.01%
Room Temperature, 4 hrs. to 12 hrs.
-65°C, No Load, 1 hr. Rated Voltage, 45 min.
Rated Voltage x 2.5, 5 sec.
Resistance to Bonding Exposure
Low Temperature Operation
Overload
±0.05%
±0.05%
±0.05%
±0.01%
±0.01%
±0.01%
±0.05%
±0.05%
±0.05%
±0.03%
±0.03%
±0.03%
70°C, Rated Power, 1.5 hr. – ON, 0.5 hr. – OFF, 1,000 hrs.
Life
Moisture Resistance
High Temperature Exposure
+65°C to -10°C, 90% RH to 98% RH, No Load, 10 cycles (240 hrs.)
125°C, No Load, 100 hrs.
Fig. 1 Effect of Termination Gold Wire on TCR
Chip Tray
Tray Size
ꢀ
ꢀ
Type
EP
X
Y
Total Pieces
ꢂ
ꢃ
13
10
17
14
221
140
ꢀ
EQ
Tray Capacity
Precaution in Using Wire-Bonded Chip Resistor
1. Storage
3. Recommended Wire Bonding Method
1
Storage condition or environment may adversely affect bondability of the terminal pad
with wire. Do not store in high temperature and humidity. The recommended storage
environment is lower than 40°C, has less than 70% RH humidity and is free from harmful
gases such as sulphur and chlorine.
Bonding Method: Thermosonic ball bonding
2
Preheating Temperature: 80°C to 125°C (temperature of the resistors)
Connecting Wire: dia. 25µm gold wire
3
4. Protective Coat
2. Caution in Mounting
Avoid direct coating of the resistor with n-methylpyrrolidone.
1
Mounting Method: Die-bonding
2
3
<
Adhesive for Placement: Thixotropic epoxy (temperature of cure 180°C)
=
State of Mounting: shown below
Good
Rejective
9
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