MFU0402FF01250E000 [VISHAY]
Electric Fuse, VERY FAST BLOW ELECTRIC FUSE, 1.25A, 32VDC, 50A (IR), SURFACE MOUNT, HALOGEN FREE AND ROHS COMPLIANT;型号: | MFU0402FF01250E000 |
厂家: | VISHAY |
描述: | Electric Fuse, VERY FAST BLOW ELECTRIC FUSE, 1.25A, 32VDC, 50A (IR), SURFACE MOUNT, HALOGEN FREE AND ROHS COMPLIANT |
文件: | 总13页 (文件大小:173K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
MFU Series
Vishay Beyschlag
Thin Film Chip Fuses
FEATURES
• Advanced thin film technology
• Very quick acting fuse characteristics
• Outstanding stability of fusing characteristics
• Standard SMD sizes
• Green product, supports lead (Pb)-free soldering
• Halogen-free according to IEC 61249-2-21 definition
• Compliant to RoHS directive 2002/95/EC
APPLICATIONS
• Information technology
• Industrial electronics
• Automotive electronics
• Telecommunication
• Medical equipment
• Audio/video electronics
MFU Thin Film Chip Fuses are the perfect choice for the
most fields of modern electronics. The highly controlled
manufacturing thin film process guarantees an outstanding
stability of fusing characteristics. Typical applications include
information technology, telecommunication, medical
equipment, industrial, audio/video, and automotive
electronics.
SIZE
INCH
0402
0603
0805
1206
METRIC
1005M
1608M
2012M
3216M
TECHNICAL SPECIFICATIONS
DESCRIPTION
MFU 0402
MFU 0603
MFU 0805
MFU 1206
Metric size
1005M
1608M
0.5 A to 5.0 A
32 V
2012M
0.5 A to 5.0 A
32 V
3216M
0.5 A to 6.3 A
63 V
Rated Current range IR
Rated voltage, Umax. DC
0.5 A to 3.15 A
32 V
Breaking Capacity,
Imax. at Umax. DC
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 63 V
Voltage drop at 1 x IR
90 mV to 368 mV
22 mΩ to 560 mΩ
55/125/56
85 mV to 361 mV
13 mΩ to 550 mΩ
55/125/56
98 mV to 374 mV
15 mΩ to 570 mΩ
55/125/56
116 mV to 433 mV
14 mΩ to 660 mΩ
55/125/56
Cold resistance at 0.1 x IR
Climatic category (LCT/UCT/days)
Permissible continuous
current rating at ϑamb = 23 °C
0.7 x IR
E253806
n/a
0.7 x IR
0.7 x IR
0.7 x IR
UL recognition file
E253806
E253806
E253806
Approval
Refer to table:
MFU 0603 RATING
Refer to table:
MFU 1206 RATING
IEC 60127-4
FITobserved
≤ 0.2 x 10- 9/h
≤ 0.2 x 10- 9/h
≤ 0.2 x 10- 9/h
≤ 0.2 x 10- 9/h
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: thinfilm.chipfuse@vishay.com
www.vishay.com
1
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
PART NUMBER AND PRODUCT DESCRIPTION (1)
PART NUMBER: MFU0603FF01000PW00
M
F
U
0
6
0
3
F
F
0
1
0
0
0
P
W
0
0
MODEL/SIZE
FUSE CHARACTERISTIC
RATED CURRENT VALUE
Rated current value in mA
PACKAGING (2)
SPECIAL
MFU0402
MFU0603
MFU0805
MFU1206
FF = Very quick acting
E1
E5
E0
P1
P5
PW
Up to 2 digits
00 = Standard
Examples:
0.5 A = 00500
1.0 A = 01000
6.3 A = 06300
PRODUCT DESCRIPTION: MFU 0603 -FF PW 1A0
MFU
0603
-FF
PW
1A0
MODEL
SIZE
FUSE CHARACTERISTIC
PACKAGING (2)
RATED CURRENT VALUE
Rated current value in mA
MFU
0402
0603
0805
1206
FF = Very quick acting
E1
E5
E0
P1
P5
PW
Examples:
0.5 A = 0A5
1.0 A = 1A0
6.3 A = 6A3
Notes
(1)
Products can be ordered using either the PART NUMBER or the PRODUCT DESCRIPTION
Please refer to table PACKAGING
(2)
PACKAGING
REEL
MODEL
DIAMETER
180 mm/7"
180 mm/7"
180 mm/7"
180 mm/7"
180 mm/7"
330 mm/13"
180 mm/7"
180 mm/7"
330 mm/13"
180 mm/7"
180 mm/7"
330 mm/13"
PIECES/REEL
1000
CODE
E1
MFU0402
MFU0603
MFU0805
MFU1206
5000
E5
10 000
1000
E0
P1
5000
P5
20 000
1000
PW
P1
5000
P5
20 000
1000
PW
P1
5000
P5
20 000
PW
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2
For technical questions, contact: thinfilm.chipfuse@vishay.com
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
DIMENSIONS
T1
WT
W
H
T2
L
DIMENSIONS - Chip fuse types, mass and relevant physical dimensions
H
(mm)
L
W
(mm)
WT
(mm)
T1
(mm)
T2
(mm)
MASS
(mg)
TYPE
(mm)
MFU 0402
0.32 0.07
1.0 0.05
1.55 0.05
2.0 0.1
0.5 0.05
0.85 0.1
1.25 0.15
1.6 0.15
> 75 % of W
> 75 % of W
> 75 % of W
> 75 % of W
0.2 + 0.1/- 0.15
0.2 0.1
0.65
1.9
MFU 0603 0.45 + 0.1/- 0.05
MFU 0805 0.45 + 0.1/- 0.05
0.3 + 0.15/- 0.2 0.3 + 0.15/- 0.2
0.4 + 0.1/- 0.2
0.5 0.25
0.4 + 0.1/- 0.2
0.5 0.25
4.7
MFU 1206
0.55 0.1
3.2 + 0.1/- 0.2
9.5
SOLDER PAD DIMENSIONS
X
G
Y
Z
RECOMMENDED SOLDER PAD DIMENSIONS
WAVE SOLDERING
REFLOW SOLDERING
TYPE
G
Y
X
Z
G
Y
X
Z
(mm)
(mm)
(mm)
(mm)
(mm)
0.35
0.65
0.90
1.50
(mm)
(mm)
(mm)
MFU 0402
MFU 0603
MFU 0805
MFU 1206
-
-
-
-
0.55
0.70
0.90
1.15
0.55
0.95
1.40
1.75
1.45
2.05
2.70
3.80
0.55
0.80
1.40
1.10
1.25
1.50
1.10
1.50
1.90
2.75
3.30
4.40
Note
• The given solder pad dimensions reflect the considerations for board design and assembly as outlined e.g. in standards IEC 61188-5-x, or in
publication IPC-7351. They do not guarantee any supposed thermal properties, particularly as these are also strongly influenced by many other
parameters.
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: thinfilm.chipfuse@vishay.com
www.vishay.com
3
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
MFU 0402 RATING - Very quick acting (FF)
VOLT.
COLD
PRE-ARCING (2)
BREAKING
CAPACITY MARK. APPROVAL
DC
FUSE
RATED
RATED
DROP (2) RESIS (2)
SIZE
I2t
PART NUMBER (3)(4)
CHAR. CURRENT (1) VOLTAGE
at
1 x IR
at
0.1 x IR
at 10 x IR
500 mA (5)
630 mA (5)
750 mA (5)
800 mA
1.0 A
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
0.0009 A2s
0.0014 A2s
0.0020 A2s
0.0023 A2s
0.0028 A2s
0.0039 A2s
0.0059 A2s
0.0065 A2s
0.0077 A2s
0.0101 A2s
0.0157 A2s
0.0227 A2s
0.0250 A2s
368 mV 560 m
331 mV 400 m
275 mV 280 m
231 mV 220 m
184 mV 140 m
Ω
Ω
Ω
Ω
Ω
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
-
-
-
-
-
-
-
-
-
-
-
-
-
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
MFU0402FF00500E500
MFU0402FF00630E500
MFU0402FF00750E500
MFU0402FF00800E500
MFU0402FF01000E500
MFU0402FF01250E500
MFU0402FF01500E500
MFU0402FF01600E500
MFU0402FF01750E500
MFU0402FF02000E500
MFU0402FF02500E500
MFU0402FF03000E500
MFU0402FF03150E500
1.25 A
1.5 A
159 mV
146 mV
136 mV
124 mV
115 mV
107 mV
95 mV
97 m
74 m
65 m
54 m
44 m
33 m
24 m
22 m
Ω
0402
FF
Ω
Ω
Ω
Ω
Ω
Ω
Ω
1.6 A
1.75 A
2.0 A
2.5 A
3.0 A
3.15 A
90 mV
Notes
(1) Other values of rated current are available on request
(2) Typical values
(3) For packages with 1000 pieces, please use for packaging E1 instead of E5
(4) For packages with 10 000 pieces, please use for packaging E0 instead of E5
(5) Available on request
MFU 0603 RATING - Very quick acting (FF)
VOLT.
COLD
PRE-ARCING (7)
BREAKING
CAPACITY MARK. APPROVAL
DC
FUSE
RATED
RATED
DROP (7) RESIS (7)
SIZE
I2t
PART NUMBER (8)(9)
CHAR. CURRENT (6) VOLTAGE
at
1 x IR
at
0.1 x IR
at 10 x IR
500 mA
630 mA
750 mA
800 mA
1.0 A
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
0.0009 A2s
0.0014 A2s
0.0020 A2s
0.0023 A2s
0.0028 A2s
0.0039 A2s
0.0059 A2s
0.0065 A2s
0.0077 A2s
0.0101 A2s
0.0157 A2s
0.0227 A2s
0.0250 A2s
0.0308 A2s
0.0403 A2s
0.2275 A2s
361 mV 550 m
331 mV 400 m
258 mV 262 m
249 mV 237 m
223 mV 170 m
180 mV 110 m
Ω
Ω
Ω
Ω
Ω
Ω
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
F
CT
G
CV
H
UL/IEC
UL
MFU0603FF00500P500
MFU0603FF00630P500
MFU0603FF00750P500
MFU0603FF00800P500
MFU0603FF01000P500
MFU0603FF01250P500
MFU0603FF01500P500
MFU0603FF01600P500
MFU0603FF01750P500
MFU0603FF02000P500
MFU0603FF02500P500
MFU0603FF03000P500
MFU0603FF03150P500
MFU0603FF03500P500
MFU0603FF04000P500
MFU0603FF05000P500
UL
UL
UL/IEC
UL
1.25 A
1.5 A
J
155 mV
159 mV
138 mV
150 mV
121 mV
126 mV
120 mV
106 mV
100 mV
85 mV
79 m
76 m
60 m
57 m
37 m
32 m
29 m
23 m
19 m
Ω
K
UL
1.6 A
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
EF
L
UL/IEC
UL
0603
FF
1.75 A
2.0 A
N
UL/IEC
UL
2.5 A
O
P
3.0 A
UL
3.15 A
3.5 A
EL
R
UL/IEC
UL
4.0 A
S
UL
5.0 A
13 mΩ 50 A at 32 V
T
UL
Notes
(6) Other values of rated current are available on request
(7) Typical values
(8) For packages with 1000 pieces, please use for packaging P1 instead of P5
(9) For packages with 20 000 pieces, please use for packaging PW instead of P5
www.vishay.com
4
For technical questions, contact: thinfilm.chipfuse@vishay.com
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
MFU 0805 RATING - Very quick acting (FF)
VOLT.
COLD
PRE-ARCING (2)
BREAKING
CAPACITY MARK. APPROVAL
DC
FUSE
RATED
RATED
DROP (2) RESIS (2)
SIZE
I2t
PART NUMBER (3)(4)
CHAR. CURRENT (1) VOLTAGE
at
1 x IR
at
0.1 x IR
at 10 x IR
500 mA
630 mA
750 mA
800 mA
1.0 A
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
32 V
0.0009 A2s
0.0014 A2s
0.0021 A2s
0.0023 A2s
0.0028 A2s
0.0040 A2s
0.0059 A2s
0.0065 A2s
0.0077 A2s
0.0101 A2s
0.0157 A2s
0.0227 A2s
0.0250 A2s
0.0308 A2s
0.0403 A2s
0.2275 A2s
374 mV 570 m
347 mV 420 m
280 mV 285 m
262 mV 250 m
243 mV 185 m
205 mV 125 m
Ω
Ω
Ω
Ω
Ω
Ω
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
50 A at 32 V
F
CT
G
CV
H
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
UL
MFU0805FF00500P500
MFU0805FF00630P500
MFU0805FF00750P500
MFU0805FF00800P500
MFU0805FF01000P500
MFU0805FF01250P500
MFU0805FF01500P500
MFU0805FF01600P500
MFU0805FF01750P500
MFU0805FF02000P500
MFU0805FF02500P500
MFU0805FF03000P500
MFU0805FF03150P500
MFU0805FF03500P500
MFU0805FF04000P500
MFU0805FF05000P500
1.25 A
1.5 A
J
171 mV
164 mV
161 mV
176 mV
131 mV
134 mV
128 mV
119 mV
105 mV
98 mV
87 m
78 m
70 m
67 m
40 m
34 m
31 m
26 m
20 m
Ω
K
1.6 A
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
EF
L
0805
FF
1.75 A
2.0 A
N
2.5 A
O
P
3.0 A
3.15 A
3.5 A
EL
R
4.0 A
S
5.0 A
15 mΩ 50 A at 32 V
T
MFU 1206 RATING - Very quick acting (FF)
VOLT.
COLD
PRE-ARCING (2)
BREAKING
CAPACITY MARK. APPROVAL
DC
FUSE
RATED
RATED
DROP (2) RESIS (2)
SIZE
I2t
PART NUMBER (3)(4)
CHAR. CURRENT (1) VOLTAGE
at
1 x IR
at
0.1 x IR
at 10 x IR
500 mA
630 mA
750 mA
800 mA
1.0 A
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
63 V
0.0009 A2s
0.0014 A2s
0.0022 A2s
0.0023 A2s
0.0028 A2s
0.0041 A2s
0.0059 A2s
0.0066 A2s
0.0077 A2s
0.0102 A2s
0.0159 A2s
0.0229 A2s
0.0251 A2s
0.0310 A2s
0.0404 A2s
0.2275 A2s
0.5160 A2s
433 mV 660 m
372 mV 450 m
325 mV 330 m
273 mV 260 m
262 mV 200 m
230 mV 140 m
207 mV 105 m
Ω
Ω
Ω
Ω
Ω
Ω
Ω
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
50 A at 63 V
F
CT
G
UL/IEC
UL
MFU1206FF00500P500
MFU1206FF00630P500
MFU1206FF00750P500
MFU1206FF00800P500
MFU1206FF01000P500
MFU1206FF01250P500
MFU1206FF01500P500
MFU1206FF01600P500
MFU1206FF01750P500
MFU1206FF02000P500
MFU1206FF02500P500
MFU1206FF03000P500
MFU1206FF03150P500
MFU1206FF03500P500
MFU1206FF04000P500
MFU1206FF05000P500
MFU1206FF06300P500
UL
CV
H
UL
UL/IEC
UL
1.25 A
1.5 A
J
K
UL
1.6 A
168 mV
174 mV
181 mV
161 mV
173 mV
153 mV
161 mV
147 mV
131 mV
116 mV
80 m
76 m
69 m
49 m
44 m
37 m
35 m
28 m
20 m
14 m
Ω
EF
L
UL/IEC
UL
1206
FF
1.75 A
2.0 A
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
Ω
N
UL/IEC
UL
2.5 A
O
3.0 A
P
UL
3.15 A
3.5 A
EL
R
UL/IEC
UL
4.0 A
S
UL
5.0 A
T
UL
6.3 A
ET
UL
Notes
(1)
Other values of rated current are available on request
Typical values
For packages with 1000 pieces, please use for packaging P1 instead of P5
For packages with 20 000 pieces, please use for packaging PW instead of P5
(2)
(3)
(4)
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: thinfilm.chipfuse@vishay.com
www.vishay.com
5
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
ASSEMBLY
DESCRIPTION
Production is strictly controlled and follows an extensive
set of instructions established for reproducibility.
The fuses are suitable for processing on automatic SMD
assembly systems. They are suitable for automatic
soldering using wave, reflow or vapour phase. The
encapsulation is resistant to all cleaning solvents commonly
used in the electronics industry, including alcohols, esters
and aqueous solutions. The fuses are RoHS compliant, the
pure tin plating provides compatibility with lead (Pb)-free
and lead-containing soldering processes. The immunity of
the plating against tin whisker growth has been proven
under extensive testing. Solderability is specified for 2 years
after production or re-qualification. The permitted storage
time is 20 years.
A
homogeneous film of metal alloy is deposited on a high
grade ceramic body. The fuse elements are covered by a
protective coating designed for electrical, mechanical and
climatic protection. The terminations receive a final pure tin
on nickel plating.
The result of the determined production is verified by an
extensive testing procedure performed on 100 % of the
individual fuses. Only accepted products are laid directly
into the paper tape in accordance with IEC 60286-3.
APPROVALS
All products comply with the CEFIC-EECA-EICTA list of legal
restrictions on hazardous substances.
The fuses are tested in accordance with IEC 60127-4 and
UL 248-14 which refers to UL 248-1, IEC 60127-1 and
IEC 60068 series. Approval of conformity is indicated by the
UMF logo on the package label. Recognition by Underwriter
Laboratories Inc. is indicated by the UL logo on the package
label.
This includes full compliance with the following directives:
• 2000/53/EC End of Vehicle life Directive (ELV) and
Annex II (ELV II)
• 2002/95/EC Restriction of the use of Hazardous
Substances Directive (RoHS)
• 2002/96/EC Waste Electrical and Electronic Equipment
Directive (WEEE)
e3
Lead (Pb)-free Identification
on the Package Label
FUNCTIONAL PERFORMANCE
120
MFU Series
110
100
90
80
70
60
50
40
30
20
10
0
- 60 - 45 - 30 - 15
0
15
30
45
60
75
90 105 120 135 150
ϑ
Ambient Temperature amb [°C]
Current Rating Factor (1) vs. Ambient Temperature ϑamb
Note
(1) Current rating factor is in addition to the given permissible continuous current rating of 0.7
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For technical questions, contact: thinfilm.chipfuse@vishay.com
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
FUNCTIONAL PERFORMANCE
104
MFU 0402-FF
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
103
102
101
100
10-1
10-2
10-3
10-4
0.1
1
10
100
Current I [A]
Typical tpre-arc vs. I characteristic of MFU 0402 (1)
104
103
102
101
100
10-1
10-2
MFU 0402-FF
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10-3
10-4
10-5
10-4
10-3
10-2
10-1
100
101
102
Pre-arc Time tpre-arc [s]
Typical I2t vs. tpre-arc characteristic of MFU 0402 (1)
Note
(1) Fuses mounted on a test board according to IEC 60127-4
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: thinfilm.chipfuse@vishay.com
www.vishay.com
7
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
FUNCTIONAL PERFORMANCE
104
MFU 0603-FF
103
102
101
100
10-1
10-2
10-3
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10-4
0.1
1
10
100
Current I [A]
Typical tpre-arc vs. I characteristic of MFU 0603 (1)
104
103
102
101
100
10-1
10-2
MFU 0603-FF
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10-3
10-4
10-5
10-4
10-3
10-2
10-1
100
101
102
Pre-arc Time tpre-arc [s]
Typical I2t vs. tpre-arc characteristic of MFU 0603 (1)
Note
(1) Fuses mounted on a test board according to IEC 60127-4
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8
For technical questions, contact: thinfilm.chipfuse@vishay.com
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
FUNCTIONAL PERFORMANCE
104
MFU 0805-FF
103
102
101
100
10-1
10-2
10-3
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10-4
0.1
1
10
100
Current I [A]
Typical tpre-arc vs. I characteristic of MFU 0805 (1)
104
103
102
101
100
10-1
10-2
MFU 0805-FF
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10-3
10-4
10-5
10-4
10-3
10-2
10-1
100
101
102
Pre-arc Time tpre-arc [s]
Typical I2t vs. tpre-arc characteristic of MFU 0805 (1)
Note
(1) Fuses mounted on a test board according to IEC 60127-4
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: thinfilm.chipfuse@vishay.com
www.vishay.com
9
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
FUNCTIONAL PERFORMANCE
104
MFU 1206-FF
103
102
101
100
10-1
10-2
10-3
6.30 A
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10-4
0.1
1
10
100
Current I [A]
Typical tpre-arc vs. I characteristic of MFU 1206 (1)
104
103
102
101
100
10-1
10-2
MFU 1206-FF
6.30 A
5.00 A
4.00 A
3.50 A
3.15 A
3.00 A
2.50 A
2.00 A
1.75 A
1.60 A
1.50 A
1.25 A
1.00 A
0.80 A
0.75 A
0.63 A
0.50 A
10-3
10-4
10-5
10-4
10-3
10-2
10-1
100
101
102
Pre-arc Time tpre-arc [s]
Typical I2t vs. tpre-arc characteristic of MFU 1206 (1)
Note
(1) Fuses mounted on a test board according to IEC 60127-4
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For technical questions, contact: thinfilm.chipfuse@vishay.com
Document Number: 28747
Revision: 06-May-10
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
TEST AND REQUIREMENTS
All tests are carried out in accordance with the following
specifications:
Unless otherwise specified the following values apply:
Temperature: 15 °C to 35 °C
IEC 60127-1, Miniature fuse - Part 1: Definitions for miniature
fuses and general requirements for miniature fuse-links
Relative humidity: 45 % to 75 %
Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).
IEC 60127-4, Universal Modular Fuse Links (UMF)
The components are mounted for testing on printed-circuit
boards in accordance with IEC 60127-4, unless otherwise
specified.
UL 248-1, Low voltage fuses - Part 1: General requirements
UL 248-14, Low voltage fuses - Part 14: Supplemental fuses
For the full test schedule refer to the documents listed above.
The testing also covers most of the requirements specified
by METI and CCC.
The requirements stated in the Test Procedures and
Requirements table are based on the required tests and
permitted limits of IEC 60127-1 and IEC 60127-4
respectively. However, some additional tests and a number
of improvements against those minimum requirements have
been included.
The tests are carried out in accordance with IEC 60068 and
under standard atmospheric conditions in accordance with
IEC 60068-1, 5.3. Climatic category LCT/UCT/56 (rated
temperature range: Lower category temperature, upper
category temperature; damp heat, long term, 56 days) is
valid.
TEST PROCEDURES AND REQUIREMENTS
IEC
60068-2
TEST
METHOD
IEC
60127-4
CLAUSE
REQUIREMENTS
PERMISSIBLE CHANGE
TEST
PROCEDURE
Depth 1 mm;
rate 1 mm/s
1 times
Substrate
bending
No visible damage
ΔR/R ≤ 10 %
8.3.2
8.6.2
21 (Ue1)
Solder bath method; SnPb40;
non-activated flux;
Good tinning (≥ 95 % covered);
no visible damage
(215 3) °C; (3 0.3) s
58 (Td)
58 (Td)
Solderability
Solder bath method; SnAg3Cu0.5 or SnAg3.5;
non-activated flux;
Good tinning (≥ 95 % covered);
no visible damage
(245 3) °C; (2 0.2) s
Solder bath method;
(260 5) °C; (10 1) s
No visible damage
ΔR/R ≤ 10 %
Resistance to
soldering heat
8.7.2
9.2.1
Reflow method 2
(IR/forced gas convection);
(260 5) °C; (10 1) s
No visible damage
ΔR/R ≤ 10 %
At 1.25 x IR, tpre-arc > 1 h
at 2.0 x IR, tpre-arc < 60 s
at 10 x IR, tpre-arc < 0.001 s
MFU 0402
IR ≤ 0.75 A
Time/current
characteristics
at nominal
Cold resistance at 0.1 x IR;
destructive testing under
overcurrent conditions
(DC-Current)
MFU 0402 0.8 A ≤ IR ≤ 3.15 A
-
At 1.25 x IR, tpre-arc > 1 h
at 2.0 x IR, tpre-arc < 5 s
at 10 x IR, tpre-arc < 0.001 s
MFU 0603
MFU 0805
MFU 1206
IR ≤ 5.0 A
IR ≤ 5.0 A
IR ≤ 6.3 A
temperature
Breaking
capacity
50 A at rated voltage
acc. to UL 248-14
Optical inspection with naked eye
no visible damage
9.3.2
9.3.3
-
-
Insulation resistance
at 2.0 x UR (DC)
higher than 0.1 MΩ
Residual
resistance
50 A at rated voltage
acc. to UL 248-14
Document Number: 28747
Revision: 06-May-10
For technical questions, contact: thinfilm.chipfuse@vishay.com
www.vishay.com
11
MFU Series
Thin Film Chip Fuses
Vishay Beyschlag
TEST PROCEDURES AND REQUIREMENTS
IEC
60068-2
TEST
METHOD
IEC
60127-4
CLAUSE
REQUIREMENTS
PERMISSIBLE CHANGE
TEST
PROCEDURE
MFU 0402
MFU 0603
MFU 0805
MFU 1206
IR ≤ 3.15 A
IR ≤ 3.15 A
IR ≤ 3.15 A
IR ≤ 3.15 A
a) I = 1.0 x IR (DC)
1.0 h on; 0.25 h off;
23 °C; 100 times
Endurance test
acc. to
IEC 60127-1
No visible damage
ΔR/R ≤ 10 %
9.4
-
b) I = 1.25 x IR (DC)
1.0 h on
23 °C; 1 time
Maximum
sustained
dissipation acc. to
IEC 60127-1
Dissipation ≤ acc. to
IEC 60127-4 table 2
9.5
9.7
-
-
Calculation in accordance with results of clause 9.4 b)
MFU 0402
MFU 0603
MFU 0805
MFU 1206
MFU 0402
MFU 0603
MFU 0805
MFU 1206
IR ≤ 3.15 A
IR ≤ 3.15 A
IR ≤ 3.15 A
IR ≤ 3.15 A
IR ≤ 3.15 A
IR ≤ 5.0 A
IR ≤ 5.0 A
IR ≤ 6.3 A
The test is performed
during the final 5 min of
clause 9.4 b)
Fuse-link
temperature
Temperature rise of terminals
≤ 85 K
Verification of
temp.-rise and
current- carrying
capacity acc. to
UL 248-14
Temperature rise
of hot spot
≤ 75 K
acc. to
UL 248-14 clause 8.2.4
-
-
I = 1.0 x IR (DC)
clause 8.2.3
Damp heat,
steady state
(40 2) °C; 56 days;
(93 3) % RH
ΔR/R ≤ 10 %
I-t characteristic
-
-
78 (Cab)
14 (Na)
30 min at LCT;
30 min at UCT;
LCT = - 55 °C;
UCT = 125 °C;
5 cycles
Rapid change
of temperature
ΔR/R ≤ 10 %
Endurance by sweeping;
10 Hz to 2000 Hz;
no resonance;
-
6 (Fc)
Vibration
ΔR/R ≤ 10 %
amplitude ≤ 1.5 mm or
≤ 200 m/s2; 6 h
Component
solvent
resistance
Isopropyl alcohol;
50 °C; method 2
-
-
45 (XA)
45 (XA)
No visible damage
Solvent
resistance
of marking
Isopropyl alcohol;
50 °C; method 1, toothbrush
Marking legible,
no visible damage
RR 1608M; 9 N
Shear
(adhesion)
-
-
21 (Ue3)
-
No visible damage
RR 2012M and RR 3216M; 45 N
IEC 60695-2-2,
needle flame test; 10 s
Flammability
No burning after 30 s
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For technical questions, contact: thinfilm.chipfuse@vishay.com
Document Number: 28747
Revision: 06-May-10
Legal Disclaimer Notice
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree
to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and
damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay
or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to
obtain written terms and conditions regarding products designed for such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by
any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 11-Mar-11
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1
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