MKP385e
Vishay BCcomponents
www.vishay.com
AUTOMOTIVE AEC-Q200, REVISION D QUALIFICATION
SAMPLE
SIZE
STRESS
REVISION
CONDITION
PERFORMANCE REQUIREMENTS
1. High
D
Test as per MIL-STD 202, method 108
Temp.: 105 ºC; unpowered
Duration: 1000 h
77
|C/C| 5 %
temperature
0.0005 for C 100 nF at 100 kHz
exposure
(storage)
0.0010 for 100 nF < C 470 nF at 100 kHz
0.0015 for 470 nF < C 1 μF at 100 kHz
0.0015 for 1 μF < C 10 μF at 10 kHz
IR > 50 % of initial specified value
2. Temperature
D
D
Test as per JESD22, method JA-104
Total no. of cycles: 1000 cycles
Lower temp.: -40 °C
77
|C/C| 5 %
cycling
Increase of tan :
0.0005 for C 100 nF at 100 kHz
0.0010 for 100 nF < C 470 nF at 100 kHz
0.0015 for 470 nF < C 1 μF at 100 kHz
0.0015 for 1 μF < C 10 μF at 10 kHz
IR > 50 % of initial specified value
Upper temp: +105 °C
Dwell each 30 min as per rev. D
3. Moisture
Test as per MIL-STD 202, method 106
10 cycles at 24 h/cycle
unpowered
77
|C/C| 5 %
Increase of tan :
0.0005 for C 100 nF at 100 kHz
0.0010 for 100 nF < C 470 nF at 100 kHz
0.0015 for 470 nF < C 1 μF at 100 kHz
0.0015 for 1 μF < C 10 μF at 10 kHz
IR > 50 % of initial specified value
resistance
4. Biased
D
D
D
Test as per MIL-STD 202, method 103
77
77
77
|C/C| 5 %
humidity AC
Temp.: 40 °C; RH: 93 %; URAC
Increase of tan : 0.008 at 1 kHz
IR > 50 % of initial specified value
Duration: 1000 h
5. Biased
Test as per MIL-STD 202, method 103
|C/C| 5 %
Increase of tan : 0.008 at 1 kHz
IR > 50 % of initial specified value
humidity DC
Temp.: 40 °C; RH: 93 %; URDC
Duration: 1000 h
6. Operational
Test as per MIL-STD 202, method 108
|C/C| 5 %
Increase of tan :
0.0005 for C 100 nF at 100 kHz
0.0010 for 100 nF < C 470 nF at 100 kHz
0.0015 for 470 nF < C 1 μF at 100 kHz
0.0015 for 1 μF < C 10 μF at 10 kHz
IR > 50 % of initial specified value
life AC
Temp. = 105 °C; load = URAC
Duration: 1000 h
7. Operational
D
Test as per MIL-STD 202, method 108
77
|C/C| 5 %
life DC
Temp. = 105 °C; Load = URDC
Increase of tan :
Duration: 1000 h
0.0005 for C 100 nF at 100 kHz
0.0010 for 100 nF < C 470 nF at 100 kHz
0.0015 for 470 nF < C 1 μF at 100 kHz
0.0015 for 1 μF < C 10 μF at 10 kHz
IR > 50 % of initial specified value
8. Terminal
D
D
Test as per MIL-STD 202, method 211
Test leaded device lead integrity only.
- A (pull-test): 2.27 kg (10 s)
30
5
No visual damage
strength (leaded)
- C (wire-lead bend test): 227 g (3 x 3 s)
9. Resistance
MIL-STD-202 method 215
- Also aqueous chemical
- OKEM clean or equivalent.
Do not use banned solvents.
No visual damage
Legible marking
to solvents
10. Mechanical
D
D
MIL-STD-202 method 213
100 g's; 6 ms;
30
30
No visual damage
No visual damage
shock
half sine; 3.75 m/s
11. Vibration
MIL-STD-202 method 204
5 g's for 20 min
12 cycles x 3 directions
10 Hz to 2000 Hz
12. Resistance to
D
MIL-STD-202 method 210
30
|C/C| 5 %
soldering heat
Temp.: 280 °C; time: 10 s
Increase of tan :
solder within 1.5 mm of device body
0.0005 for C 100 nF at 100 kHz
0.0010 for 100 nF < C 470 nF at 100 kHz
0.0015 for 470 nF < C 1 μF at 100 kHz
0.0015 for 1 μF < C 10 μF at 10 kHz
IR > 50 % of initial specified value
13. Solderability
14. Flammability
D
D
J-STD-002
15
15
Good tinning as evidence by free flowing of the
Leaded: method A at 235 °C,
category 3 (245 °C / 3 s)
solder with wetting of terminations > 95 %
UL-94
One flame application
Class B
V-0 is acceptable.
Class B or C according IEC is also acceptable
Revision: 28-May-2019
Document Number: 28255
27
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