PSC3400CL4A1GNKW1 [VISHAY]
General Purpose Inductor,;型号: | PSC3400CL4A1GNKW1 |
厂家: | VISHAY |
描述: | General Purpose Inductor, 电感器 |
文件: | 总4页 (文件大小:113K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
PSC
Vishay Electro-Films
www.vishay.com
High Frequency RF Spiral Inductor for Wire Bonded Assemblies
FEATURES
• Wire bond assembly
• Small size: 45 mils x 45 mils x 10 mils
• Low DCR, high Q
• Low parasitic capacitance, high SRF
APPLICATIONS
• RF choking for DC biasing
• RF tuning circuits
PSC series RF spiral inductors are designed for RF circuits
that require wire bondable components. High precision
equivalent circuit modeling enables accurate computer
simulation of component performance. Additional values
and form factors available upon request.
• Lumped element filters
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
VALUE
UNIT
Inductance Range
Tolerance (1)
0.001 to 0.1
20
μH
%
Max. Power Handling
Operating Temperature
Storage Temperature
250
mW
°C
-55 to +125
-55 to +125
°C
Note
(1)
Main source of value tolerance is due to variation in wire bonds. See “text fixture” section below
RF CHARACTERISTICS - TYPICAL VALUES
INDUCTANCE
(nH)
Q
IN-CIRCUIT
INDUCTANCE(1)
(nH)
IN-CIRCUIT
DCR (1)
()
DCR
SRF
(UNITLESS)
PART NUMBER
()
(GHz)
250 MHz
1000 MHz
3.4
250 MHz
1000 MHz
PSC3400C
PSC1050B
PSC1250B
PSC1800B
PSC4500B
3.4
10.5
12.5
18
0.26
0.9
6
0.36
1
8
14
16
18
15
8
10.2
5.5
5.0
4.2
2.4
10.5
12.5
18
12
10
12
13
13
0.9
15
1
1.25
3.4
20.5
47.5
1.35
3.5
45
50
Note
(1)
Including the added inductance and resistance of typical bond wires. See equivalent circuit section
DIMENSIONS in inches (millimeters)
0.045
0.006
LENGTH
WIDTH
THICKNESS
BOND PAD DIAMETER
0.045 0.002 (1.143 0.051)
0.045 0.002 (1.143 0.051)
0.010 0.001 (0.254 0.0254)
0.006 (0.152)
Revision: 14-Mar-2019
Document Number: 61050
1
For technical questions, contact: efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PSC
Vishay Electro-Films
www.vishay.com
MECHANICAL SPECIFICATIONS
Chip Substrate Material
Alumina 99.6 %
Gold
Conductor Material
Conductor Thickness
Bond Pad Diameter (1)
5 μm 10 %
6 mil
Note
(1)
Bond pad geometry can be modified upon request
GLOBAL PART NUMBER INFORMATION
Global Part Number: PSC3400CL4A1GNHW1
Global Part Number Description: PSC 3.4 nH 25 % 45 x 45 x 10 Au None
H
W1
P
S
C
4
0
0
0
C
L
4
A
1
G
N
H
W
1
INDUCTANCE
MULTIPLIER
CODE
INDUCTANCE
(nH)
TOLERANCE
CODE
THICKNESS
(mil)
BACK
METAL
TEST
CLASS
PACKAGING
CODE
MODEL
SIZE
= 45 x 45
SUBSTRATE
TERMINATION
= au
PSC
The first
4 digits are
significant
figures of
inductance
C
= 0.001
= 0.01
M
L
= 20 %
= 25 %
4
A
= alumina
1
= 10
G
G
= au
H
K
= class H
= class K
W1 =
wafflepack,
1 min.,
B
A
N = none
= 0.1
1 mult.
TS = tape
and reel
100 min.,
1 mult.
EQUIVALENT CIRCUIT
The inductor’s spiral trace presents a substantial amount of series resistance, and the close spacing of the spiral turns presents
measurable amounts of stray capacitance that interact with the inductive characteristics.
A useful tool commonly used to model the behavior of electronic components at high frequency is the equivalent circuit model.
While the equivalent circuit model accurately predicts the reactive part of the total impedance, it fails to determine the real part
of the response at high frequency. This is due to the fact that the model does not include skin and proximity effects that
significantly increase the real part of the impedance as the frequency rises.
Bond Wire
Spiral Inductor
The equivalent circuit values are presented in the table
below:
EQUIVALENT CIRCUIT MODEL 2
Rbw
Lbw
L
R
INDUCTANCE VALUE DCR
SHUNT
CAP. C
(fF)
TYP.
Rbw
()
TYP.
Lbw
(nH)
(1)
(1)
L
R
(nH)
()
3.4
10.5
12.5
18
0.26
0.9
71
80
81
84
92
0.1
0.1
0.1
0.1
0.1
2.5
2.5
2.5
2.5
2.5
C
0.9
1.25
3.4
L: Desired inductance
R: Parasitic self resistance
C: Parasitic shunt capacitance
45
Note
(1)
Rbw: Bond wire self resistance
Typical bond wires are approximated as being 1.25 mil in
diameter gold, totaling a length of 3 mm. The resistance listed
above includes the added effect of the bond wire adhesion to the
substrate and component
Fig. 1 - Equivalent Circuit
Revision: 14-Mar-2019
Document Number: 61050
2
For technical questions, contact: efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
PSC
Vishay Electro-Films
www.vishay.com
TYPICAL COMPONENT PERFORMANCE
2.1
2.0
1.9
1.8
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
12.5 nH
18 nH
45 nH
10.5 nH
3.5 nH
0.9
100
1000
10 000
Frequency (MHz)
Fig. 2 - Relative Impedance vs. Frequency
LAYOUT CONSIDERATIONS
The RF spiral inductor is electrically connected to the circuit by wire bonds. All wire bonds add parasitic inductance and
resistance, as shown in Figure 1.
It is important to note that setup variations might affect the performance of the component. Special care must be given to
minimize these effects by careful design of the component host circuit board. The following aspects should be considered:
• Bond wire length should be minimized. The bond wire added inductance can be roughly estimated at 0.75 nH per mm of
1.25 mil diameter gold wire.
• Any ground plane directly under the component will increase the parasitic shunt capacitance. This will cause self-resonance
at lower frequencies.
• The epoxy used to attach the component is the limiting factor in power handling. For applications that require high power
handling it is recommended to use high temperature epoxy and to ensure adequate heat sinking.
Revision: 14-Mar-2019
Document Number: 61050
3
For technical questions, contact: efi@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Disclaimer
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Revision: 08-Feb-17
Document Number: 91000
1
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