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SC036S030S5B [VISHAY]

Rectifier Diode, Schottky, 1 Phase, 1 Element, 30V V(RRM), Silicon, WAFER;
SC036S030S5B
型号： SC036S030S5B
厂家： VISHAY    VISHAY
描述：

Rectifier Diode, Schottky, 1 Phase, 1 Element, 30V V(RRM), Silicon, WAFER

二极管
文件： 总6页 (文件大小：131K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
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Bulletin I0501J rev. G 03/07  
SC036.....5. Series  
SCHOTTKY DIE 36 x 36 mils  
40 (157)  
Wafer flat alligned with  
side b of the die  
a
c
0.35 ± 0.01  
(14 ± 0.4)  
C
D
A
NOTES:  
1. ALL DIMENSIONS ARE SHOWN IN  
MILLIMETERS (MILS).  
Ø
2. CONTROLLING DIMENSION: (MILS).  
Ø 125 (492)  
3. LETTER DESIGNATION:  
A = Anode (Top Metal)  
C = Cathode (Back Metal)  
D = Reject Ink Dot (only on non-conforming dies)  
4. SAWING:  
Recommended Blade  
SEMITEC S1025 QS00 Blade  
Sawing Street  
NOT TO SCALE  
0.05 +0, - 0.005  
(2 +0, - 0.2)  
5. DIMENSIONS AND TOLERANCES  
Device  
#
T
J
Max.  
V
A
B
C
D
diameter  
R
(°C)  
(V)  
SC036R015x5x  
125  
15  
0.91 + 0, -0.01 0.91 + 0, -0.01 0.76 + 0, -0.01 0.76 + 0, -0.01  
(36 + 0, -0.4) (36 + 0, -0.4) (30 + 0, -0.4) (30 + 0, -0.4)  
0.5 0.1  
20  
4
SC036S020x5x  
150  
20  
0.91 + 0, -0.01 0.91 + 0, -0.01 0.76 + 0, -0.01 0.76 + 0, -0.01  
(36 + 0, -0.4) (36 + 0, -0.4) (30 + 0, -0.4) (30 + 0, -0.4)  
0.5 0.1  
20  
0.5 0.1  
20  
0.5 0.1  
20  
0.5 0.1  
20  
4
SC036S030x5x  
SC036S045x5x  
150  
150  
30  
45  
0.91 + 0, -0.01 0.91 + 0, -0.01 0.76 + 0, -0.01 0.76 + 0, -0.01  
(36 + 0, -0.4) (36 + 0, -0.4) (30 + 0, -0.4) (30 + 0, -0.4)  
0.91 + 0, -0.01 0.91 + 0, -0.01 0.76 + 0, -0.01 0.76 + 0, -0.01  
(36 + 0, -0.4) (36 + 0, -0.4) (30 + 0, -0.4) (30 + 0, -0.4)  
4
4
SC036S060x5x  
150  
60  
0.91 + 0, -0.01 0.91 + 0, -0.01 0.76 + 0, -0.01 0.76 + 0, -0.01  
(36 + 0, -0.4) (36 + 0, -0.4) (30 + 0, -0.4) (30 + 0, -0.4)  
4
SC036H045x5x  
SC036H100x5x  
175  
175  
45  
n.a. contact factory  
100  
0.91 + 0, -0.01 0.91 + 0, -0.01 0.76 + 0, -0.01 0.76 + 0, -0.01  
(36 + 0, -0.4) (36 + 0, -0.4) (30 + 0, -0.4) (30 + 0, -0.4)  
0.5 0.1  
20  
4
SC036H150x5x  
175  
150  
n.a. contact factory  
Document Number: 93860  
www.vishay.com  
1
SC036.....5. Series  
Bulletin I0501J rev. G 03/07  
Electrical Characteristics  
Device  
#
T
J
Max.  
V
Typ. I @ 25°C Typ. I @ 125°C Max. V @ I @ 25°C Package  
R
R
R
F
F
(°C)  
(V)  
(μA)  
(mA)  
(V)  
Style  
SC036R015x5x  
SC036S020x5x  
SC036S030x5x  
SC036S045x5x  
SC036S060x5x  
SC036H045x5x  
SC036H100x5x  
SC036H150x5x  
125  
150  
150  
150  
150  
175  
175  
175  
15  
150  
15  
10  
10  
8
5 (100°C)  
0.25 @ 1A  
0.45 @ 1A  
0.50 @ 1A  
0.55 @ 1A  
0.63 @ 1A  
SMB  
20  
30  
7
3
SMB  
SOT-223  
DO-41  
SMA  
45  
4
60  
3.5  
45  
n.a. contact factory  
100  
150  
0.5  
0.5  
0.85 @ 1A  
DO- 41  
n.a. contact factory  
Mechanical Data  
Device  
#
MetalThickness  
Front Metal  
MetalThickness  
Back Metal  
SC036xxxxA5x  
SC036xxxxS5x  
Bondable  
Solderable  
--  
Al (1% Si) 30 kÅ  
Ni 1 kÅ  
--  
Cr 1 kÅ  
Ni 2 kÅ  
Ni 2 kÅ  
Ag 3 kÅ  
Ag 3 kÅ  
Ti 2 kÅ  
Ag 35 kÅ Cr 1 kÅ  
RecommendedStorageEnvironment: Store in original container, in dessicated nitrogen, with no contamination.  
Shelf life for parts stored in above condition is 2 years.  
If the storage is done in normal atmosphere shelf life is reduced to six months.  
Packaging  
Device  
#
Description  
Minimum Order Quantity  
Die in Sale Package  
SC036xxxxx5B  
SC036xxxxx5R  
SC036xxxxx5P  
SC036xxxxx5F  
Inked Probed Unsawn Wafer (Wafer in Box)  
Probed Die in Tape & Reel  
12576  
n.a.  
Probed Die in Waffle Pack  
n.a.  
Inked Probed Sawn Wafer on Film  
12576  
www.vishay.com  
2
Document Number: 93860  
SC036.....5. Series  
Bulletin I0501J rev. G 03/07  
Ordering Information Table  
Device Code  
SC 036  
S
060  
A
5
B
3
1
2
4
5
6
7
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die  
Die Size Code  
H = 830 Process  
R = OR'ing Process  
S = Standard Process  
Process (see Electrical Characteristics Table)  
Voltage code: Code = VRRM  
Chip surface metallization (see Mechanical Data Table)  
Wafer Diameter in inches  
Packaging (see Packaging Table)  
Wafer on Film  
STEEL FRAME  
www.vishay.com  
3
Document Number: 93860  
SC036.....5. Series  
Bulletin I0501J rev. G 03/07  
Wafer in Box  
ROUND CONTAINER  
TYVEK DISK  
FOAM DISK  
Die in Waffle Pack  
CHIP TRAY POCKET  
www.vishay.com  
4
Document Number: 93860  
SC036.....5. Series  
Bulletin I0501J rev. G 03/07  
Data and specifications subject to change without notice.  
This product has been designed for Industrial Level.  
Qualification Standards can be found on IR's Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7309  
Visit us at www.irf.com for sales contact information. 03/07  
www.vishay.com  
5
Document Number: 93860  
Legal Disclaimer Notice  
Vishay  
Notice  
The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of  
International Rectifier’s Power Control Systems (PCS) business, which closed in April 2007. Specifications of the  
products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below.  
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or  
anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.  
Information contained herein is intended to provide a product description only. No license, express or implied, by  
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's  
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express  
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness  
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.  
Customers using or selling these products for use in such applications do so at their own risk and agree to fully  
indemnify Vishay for any damages resulting from such improper use or sale.  
International Rectifier®, IR®, the IR logo, HEXFET®, HEXSense®, HEXDIP®, DOL®, INTERO®, and POWIRTRAIN®  
are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product  
names noted herein may be trademarks of their respective owners.  
Document Number: 99901  
Revision: 12-Mar-07  
www.vishay.com  
1

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