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SC200H150A5F [VISHAY]

Rectifier Diode, Schottky, 1 Element, 150V V(RRM);
SC200H150A5F
型号： SC200H150A5F
厂家： VISHAY    VISHAY
描述：

Rectifier Diode, Schottky, 1 Element, 150V V(RRM)

二极管
文件： 总6页 (文件大小：146K)
中文：  中文翻译
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Bulletin I0505J rev. E 03/07  
SC200.....5. Series  
SCHOTTKY DIE 200 x 200 mils  
40 (157)  
Wafer flat alligned with  
side b of the die  
a
0.35 ± 0.01  
(14 ± 0.4)  
c
C
D
A
NOTES:  
1. ALL DIMENSIONS ARE SHOWN IN  
MILLIMETERS (MILS).  
Ø
2. CONTROLLING DIMENSION: (MILS).  
Ø 125 (492)  
3. LETTER DESIGNATION:  
A = Anode (Top Metal)  
C = Cathode (Back Metal)  
D = Reject Ink Dot (only on non-conforming dies)  
4. SAWING:  
Recommended Blade  
SEMITEC S1025 QS00 Blade  
Sawing Street  
NOT TO SCALE  
0.05 +0, - 0.005  
(2 +0, - 0.2)  
5. DIMENSIONS AND TOLERANCES  
Device  
#
T
J
Max.  
V
A
B
C
D
diameter  
R
(°C)  
(V)  
SC200R015x5x  
125  
15  
5.08 +0, -0.01 5.08 +0, -0.01 4.57 +0, -0.01 4.57 +0, -0.01  
(200 +0, -0.4) (200 +0, -0.4) (180 +0, -0.4) (180 +0, -0.4)  
0.7 0.1  
30  
4
SC200S020x5x  
150  
20  
5.08 +0, -0.01 5.08 +0, -0.01 4.57 +0, -0.01 4.57 +0, -0.01  
(200 +0, -0.4) (200 +0, -0.4) (180 +0, -0.4) (180 +0, -0.4)  
0.7 0.1  
30  
0.7 0.1  
30  
0.7 0.1  
30  
0.7 0.1  
30  
0.7 0.1  
30  
0.7 0.1  
30  
0.7 0.1  
30  
4
SC200S030x5x  
SC200S045x5x  
150  
150  
30  
45  
5.08 +0, -0.01 5.08 +0, -0.01 4.57 +0, -0.01 4.57 +0, -0.01  
(200 +0, -0.4) (200 +0, -0.4) (180 +0, -0.4) (180 +0, -0.4)  
4
5.08 +0, -0.01 5.08 +0, -0.01 4.57 +0, -0.01 4.57 +0, -0.01  
(200 +0, -0.4) (200 +0, -0.4) (180 +0, -0.4) (180 +0, -0.4)  
4
SC200S060x5x  
150  
60  
5.08 +0, -0.01 5.08 +0, -0.01 4.57 +0, -0.01 4.57 +0, -0.01  
(200 +0, -0.4) (200 +0, -0.4) (180 +0, -0.4) (180 +0, -0.4)  
4
SC200H045x5x  
SC200H100x5x  
SC200H150x5x  
175  
175  
175  
45  
5.08 +0, -0.01 5.08 +0, -0.01 4.57 +0, -0.01 4.57 +0, -0.01  
(200 +0, -0.4) (200 +0, -0.4) (180 +0, -0.4) (180 +0, -0.4)  
4
100  
150  
5.08 +0, -0.01 5.08 +0, -0.01 4.57 +0, -0.01 4.57 +0, -0.01  
(200 +0, -0.4) (200 +0, -0.4) (180 +0, -0.4) (180 +0, -0.4)  
4
5.08 +0, -0.01 5.08 +0, -0.01 4.57 +0, -0.01 4.57 +0, -0.01  
(200 +0, -0.4) (200 +0, -0.4) (180 +0, -0.4) (180 +0, -0.4)  
4
Document Number: 93869  
www.vishay.com  
1
SC200.....5.  
Bulletin I0505J rev. E 03/07  
Electrical Characteristics  
Device  
#
T
J
Max.  
V
Typ. I @ 25°C Typ. I @ 125°C Max. V @ I @ 25°C  
Package  
Style  
R
R
R
F
F
(°C)  
(V)  
(μA)  
(mA)  
(V)  
D-61 gen III  
package  
SC200R015x5x  
SC200S020x5x  
SC200S030x5x  
SC200S045x5x  
SC200S060x5x  
125  
150  
150  
150  
150  
15  
1000  
2100  
500  
200 (100°C)  
450  
0.36 @ 40A  
0.46 @ 40A  
0.48 @ 25A  
0.56 @ 50A  
0.58 @ 40A  
20  
30  
45  
60  
TO-247  
TO-247  
200  
300  
180  
PowIRtab  
D-61 gen III  
package  
200  
130  
D-61 gen III  
package  
SC200H045x5x  
SC200H100x5x  
SC200H150x5x  
175  
175  
175  
45  
160  
30  
25  
18  
12  
0.60 @ 40A  
0.77 @ 30A  
0.83 @ 40A  
100  
150  
TO-247  
TO-247  
10  
Mechanical Data  
Device  
#
MetalThickness  
MetalThickness  
Back Metal  
Front Metal  
Al (1% Si) 30 kÅ  
Ni 1 kÅ  
SC200xxxxA5x  
SC200xxxxS5x  
Bondable  
Solderable  
--  
--  
Cr 1 kÅ  
Ni 2 kÅ  
Ag 3 kÅ  
Ag 3 kÅ  
Ti 2 kÅ  
Ag 35 kÅ Cr 1 kÅ  
Ni 2 kÅ  
RecommendedStorageEnvironment: Store in original container, in dessicated nitrogen, with no contamination.  
Shelf life for parts stored in above condition is 2 years.  
If the storage is done in normal atmosphere shelf life is reduced to six months.  
Packaging  
Device  
#
Description  
Minimum Order Quantity  
Die in Sale Package  
SC200xxxxx5B  
SC200xxxxx5R  
SC200xxxxx5P  
SC200xxxxx5F  
Inked Probed Unsawn Wafer (Wafer in Box)  
Probed Die in Tape & Reel  
339  
8000  
339  
Probed Die in Waffle Pack  
Inked Probed Sawn Wafer on Film  
339  
www.vishay.com  
2
Document Number: 93869  
SC200.....5.  
Bulletin I0505J rev. E 03/07  
Ordering Information Table  
Device Code  
SC 200  
S
150  
A
5
B
3
1
2
4
5
6
7
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Schottky Die  
Die Size Code  
H = 830 Process  
Process (see Electrical Characteristics Table)  
Voltage code: Code = VRRM  
R = OR'ing Process  
S = Standard Process  
Chip surface metallization (see Mechanical Data Table)  
Wafer Diameter in inches  
Packaging (see Packaging Table)  
Wafer on Film  
Document Number: 93869  
www.vishay.com  
3
SC200.....5.  
Bulletin I0505J rev. E 03/07  
Wafer in Box  
ROUND CONTAINER  
TYVEK DISK  
FOAM DISK  
Die in Waffle Pack  
CHIP TRAY POCKET  
www.vishay.com  
4
Document Number: 93869  
SC200.....5.  
Bulletin I0505J rev. E 03/07  
Tape and Reel  
REEL FRAME  
BARE DIE CARRIER TAPE  
Data and specifications subject to change without notice.  
This product has been designed for Industrial Level.  
Qualification Standards can be found on IR's Web site.  
IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105  
TAC Fax: (310) 252-7309  
Visit us at www.irf.com for sales contact information. 03/07  
Document Number: 93869  
www.vishay.com  
5
Legal Disclaimer Notice  
Vishay  
Notice  
The products described herein were acquired by Vishay Intertechnology, Inc., as part of its acquisition of  
International Rectifier’s Power Control Systems (PCS) business, which closed in April 2007. Specifications of the  
products displayed herein are pending review by Vishay and are subject to the terms and conditions shown below.  
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or  
anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.  
Information contained herein is intended to provide a product description only. No license, express or implied, by  
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's  
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express  
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness  
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.  
Customers using or selling these products for use in such applications do so at their own risk and agree to fully  
indemnify Vishay for any damages resulting from such improper use or sale.  
International Rectifier®, IR®, the IR logo, HEXFET®, HEXSense®, HEXDIP®, DOL®, INTERO®, and POWIRTRAIN®  
are registered trademarks of International Rectifier Corporation in the U.S. and other countries. All other product  
names noted herein may be trademarks of their respective owners.  
Document Number: 99901  
Revision: 12-Mar-07  
www.vishay.com  
1

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