SI5435DC [VISHAY]

P-Channel 30-V (D-S) MOSFET; P通道30 -V (D -S )的MOSFET
SI5435DC
型号: SI5435DC
厂家: VISHAY    VISHAY
描述:

P-Channel 30-V (D-S) MOSFET
P通道30 -V (D -S )的MOSFET

文件: 总4页 (文件大小:104K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si5435DC  
Vishay Siliconix  
P-Channel 30-V (D-S) MOSFET  
PRODUCT SUMMARY  
V
(V)  
r
()  
I (A)  
D
DS  
DS(on)  
0.050 @ V = --10 V  
-- 5 . 6  
-- 4 . 0  
GS  
-- 30  
0.080 @ V = --4.5  
GS  
V
S
1206-8 ChipFETt  
1
D
G
D
D
D
D
Marking Code  
BE XX  
D
G
S
Lot Traceability  
and Date Code  
Part # Code  
D
P-Channel MOSFET  
Bottom View  
Ordering Information: Si5435DC-T1  
ABSOLUTE MAXIMUM RATINGS (TA = 25_C UNLESS OTHERWISE NOTED)  
Parameter  
Symbol  
5 secs  
Steady State  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
-- 3 0  
DS  
V
V
GS  
20  
T
= 25_C  
= 85_C  
-- 4 . 1  
-- 2 . 9  
-- 5 . 6  
-- 4 . 0  
A
a
Continuous Drain Current (T = 150_C)  
I
D
J
T
A
A
Pulsed Drain Current  
I
-- 3 0  
DM  
a
Continuous Source Current  
I
-- 2 . 1  
2.5  
-- 1 . 1  
1.3  
S
T
= 25_C  
= 85_C  
A
a
Maximum Power Dissipation  
P
W
D
T
A
1.3  
0.7  
Operating Junction and Storage Temperature Range  
T , T  
--55 to 150  
260  
J
stg  
_C  
b, c  
Soldering Recommendations (Peak Temperature)  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
t 5 sec  
Steady State  
Steady State  
40  
80  
15  
50  
95  
20  
a
Maximum Junction-to-Ambient  
R
R
thJA  
thJF  
_C/W  
Maximum Junction-to-Foot (Drain)  
Notes  
a. Surface Mounted on 1” x 1” FR4 Board.  
b. See Reliability Manual for profile. The ChipFET is a leadless package. The end of the lead terminal is exposed copper (not plated) as a result of the singulation  
process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder intercon-  
nection.  
c. Rework Conditions: manual soldering with a soldering iron is not recommended for leadless components.  
Document Number: 71144  
S-21251—Rev. B, 05-Aug-02  
www.vishay.com  
2-1  
Si5435DC  
Vishay Siliconix  
SPECIFICATIONS (TJ = 25_C UNLESS OTHERWISE NOTED)  
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Static  
Gate Threshold Voltage  
Gate-Body Leakage  
V
V
= V , I = --250 mA  
-- 1  
V
GS(th)  
DS  
GS D  
I
V
= 0 V, V = 20 V  
100  
nA  
GSS  
DS  
GS  
V
= --24 V, V = 0 V  
-- 1  
-- 5  
DS  
GS  
Zero Gate Voltage Drain Current  
I
mA  
DSS  
V
DS  
= --24 V, V = 0 V, T = 85_C  
GS J  
a
On-State Drain Current  
I
V
DS  
-- 5 V, V = --10 V  
-- 3 0  
A
D(on)  
GS  
V
= --10 V, I = --4.1 A  
0.042  
0.070  
0.050  
0.080  
GS  
D
a
Drain-Source On-State Resistance  
r
DS(on)  
V
= --4.5 V, I = --3.1 A  
D
GS  
a
Forward Transconductance  
g
8
S
V
V
= --15 V, I = --4.1 A  
D
fs  
DS  
a
Diode Forward Voltage  
V
SD  
I
= --1.1 A, V = 0 V  
-- 0 . 8  
-- 1 . 2  
24  
S
GS  
b
Dynamic  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
Q
16  
3.6  
3.1  
11  
5
g
Q
Q
V
= --15 V, V = --10 V, I = --4.1 A  
nC  
ns  
gs  
gd  
DS  
GS  
D
t
20  
10  
80  
40  
60  
d(on)  
t
r
V
= --15 V, R = 15  
L
GEN G  
DD  
I
D
-- 1 A , V  
= --10 V, R = 6 Ω  
Turn-Off Delay Time  
Fall Time  
t
40  
20  
30  
d(off)  
t
f
Source-Drain Reverse Recovery Time  
Notes  
t
rr  
I = --1.1 A, di/dt = 100 A/ms  
F
a. Pulse test; pulse width 300 ms, duty cycle 2%.  
b. Guaranteed by design, not subject to production testing.  
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)  
Output Characteristics  
Transfer Characteristics  
30  
30  
24  
18  
12  
6
V
GS  
= 10 thru 6 V  
5 V  
T
= --55_C  
C
24  
18  
12  
6
25_C  
125_C  
4 V  
3 V  
0
0
0.0  
0.5  
1.0  
DS  
1.5  
2.0  
2.5  
3.0  
3.5  
4.0  
0
1
2
3
4
5
6
V
-- Drain-to-Source Voltage (V)  
V
GS  
-- Gate-to-Source Voltage (V)  
Document Number: 71144  
S-21251—Rev. B, 05-Aug-02  
www.vishay.com  
2-2  
Si5435DC  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)  
On-Resistance vs. Drain Current  
Capacitance  
0.16  
1200  
900  
600  
300  
0
C
iss  
0.12  
V
GS  
= 10 V  
0.08  
0.04  
0.00  
V
GS  
= 4.5 V  
C
oss  
C
rss  
0
6
12  
18  
24  
30  
0
6
12  
18  
24  
30  
I
D
-- Drain Current (A)  
V
DS  
-- Drain-to-Source Voltage (V)  
Gate Charge  
On-Resistance vs. Junction Temperature  
10  
8
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
V
D
= 15 V  
V
GS  
= 10 V  
DS  
I
= 4.1 A  
I = 4.1 A  
D
6
4
2
0
0
4
8
12  
16  
--50 --25  
0
25  
50  
75  
100 125 150  
Q
-- Total Gate Charge (nC)  
T
-- Junction Temperature (_C)  
g
J
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.16  
0.12  
0.08  
0.04  
0.00  
30  
10  
T
= 150_C  
J
I
D
= 4.1 A  
T
= 25_C  
J
1
0.0  
0.2  
0.4  
0.6  
0.8  
1.0  
1.2  
1.4  
0
2
4
6
8
10  
V
SD  
-- Source-to-Drain Voltage (V)  
V
GS  
-- Gate-to-Source Voltage (V)  
Document Number: 71144  
S-21251—Rev. B, 05-Aug-02  
www.vishay.com  
2-3  
Si5435DC  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)  
Threshold Voltage  
Single Pulse Power  
0.8  
50  
40  
30  
0.6  
I
D
= 250 mA  
0.4  
0.2  
20  
10  
0
0.0  
-- 0 . 2  
-- 0 . 4  
-- 3  
-- 2  
-- 1  
--50 --25  
0
25  
50  
75  
100 125 150  
10  
10  
10  
1
10  
100  
600  
T
-- Temperature (_C)  
Time (sec)  
J
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
0.05  
0.02  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 80_C/W  
thJA  
(t)  
3. T -- T = P  
JM  
Z
A
DM thJA  
Single Pulse  
4. Surface Mounted  
0.01  
-- 4  
-- 3  
-- 2  
-- 1  
10  
10  
10  
10  
1
10  
100  
600  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-- 4  
-- 3  
-- 2  
-- 1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (sec)  
Document Number: 71144  
S-21251—Rev. B, 05-Aug-02  
www.vishay.com  
2-4  

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