SI6544BDQ [VISHAY]

N-and P-Channel 30-V (D-S) MOSFET; N端和P沟道30 V(D -S)的MOSFET
SI6544BDQ
型号: SI6544BDQ
厂家: VISHAY    VISHAY
描述:

N-and P-Channel 30-V (D-S) MOSFET
N端和P沟道30 V(D -S)的MOSFET

文件: 总8页 (文件大小:67K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Si6544BDQ  
Vishay Siliconix  
New Product  
N- and P-Channel 30-V (D-S) MOSFET  
PRODUCT SUMMARY  
FEATURES  
VDS (V)  
rDS(on) (W)  
ID (A)  
D TrenchFETr Power MOSFETS  
0.032 @ V = 10 V  
4.3  
3.7  
GS  
N-Channel  
P-Channel  
30  
0.046 @ V = 4.5 V  
GS  
0.043 @ V = -10 V  
-3.8  
-2.8  
GS  
-30  
0.073 @ V = -4.5 V  
GS  
D
1
S
2
TSSOP-8  
G
D
1
D
1
2
3
4
8
7
6
5
2
2
2
2
D
S
1
S
1
1
S
S
G
1
G
G
2
Top View  
Ordering Information: Si6544BDQ-T1  
S
1
D
2
N-Channel MOSFET  
P-Channel MOSFET  
ABSOLUTE MAXIMUM RATINGS (T = 25_C UNLESS OTHERWISE NOTED)  
A
N-Channel  
10 sec Steady State  
P-Channel  
10 sec  
Steady State  
Parameter  
Symbol  
Unit  
Drain-Source Voltage  
Gate-Source Voltage  
V
30  
-30  
DS  
V
V
GS  
"20  
T
= 25_C  
= 70_C  
4.3  
3.5  
3.7  
3.0  
-3.8  
-3.0  
-3.8  
-2.6  
A
a
Continuous Drain Current (T = 150_C)  
I
J
D
T
A
A
Pulsed Drain Current  
I
20  
-20  
DM  
a
Continuous Source Current (Diode Conduction)  
I
1..0  
1.14  
0.73  
0.7  
-1..0  
1.14  
0.73  
-0.7  
0.83  
0.53  
S
T
= 25_C  
= 70_C  
0.83  
0.53  
A
a
Maximum Power Dissipation  
P
W
D
T
A
Operating Junction and Storage Temperature Range  
T , T  
-55 to 150  
_C  
J
stg  
THERMAL RESISTANCE RATINGS  
Parameter  
Symbol  
Typical  
Maximum  
Unit  
t v 10 sec  
88  
120  
65  
110  
150  
80  
a
Maximum Junction-to-Ambient  
R
thJA  
R
thJF  
Steady State  
_C/W  
Maximum Junction-to-Foot (Drain)  
Notes  
a. Surface Mounted on FR4 Board, t v 10 sec.  
Document Number: 72244  
S-31251—Rev. A, 16-Jun-03  
www.vishay.com  
1
 
Si6544BDQ  
New Product  
Vishay Siliconix  
SPECIFICATIONS (T = 25_C UNLESS OTHERWISE NOTED)  
J
Parameter  
Symbol  
Test Condition  
Min  
Typ  
Max  
Unit  
Static  
V
= V , I = 250 mA  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
1.0  
3.0  
-3.0  
"100  
"100  
1
DS  
GS  
D
Gate Threshold Voltage  
Gate-Body Leakage  
V
V
GS(th)  
V
DS  
= V , I = -250 mA  
-1.0  
GS  
D
I
V
DS  
= 0 V, V = "20 V  
nA  
GSS  
GS  
V
= 24 V, V = 0 V  
GS  
DS  
V
DS  
= -24 V, V = 0 V  
-1  
GS  
Zero Gate Voltage Drain Current  
I
mA  
A
DSS  
V
= 24 V, V = 0 V, T = 55_C  
5
DS  
GS  
J
V
DS  
= -24 V, V = 0 V, T = 55_C  
-5  
GS  
J
V
w 5 V, V = 10 V  
20  
DS  
GS  
a
On-State Drain Current  
I
D(on)  
V
DS  
w -5 V, V = -10 V  
-20  
GS  
V
= 10 V, I = 4.3 A  
0.025  
0.034  
0.037  
0.058  
11  
0.032  
0.043  
0.046  
0.073  
GS  
D
V
GS  
= -10 V, I = -3.8 A  
D
a
Drain-Source On-State Resistance  
r
W
DS(on)  
V
= 4.5 V, I = 3.7 A  
D
GS  
V
GS  
= -4.5 V, I = -2.8 A  
D
V
= 15 V, I = 4.3 A  
D
DS  
a
Forward Transconductance  
g
fs  
S
V
V
DS  
= -15 V, I = - 3.8 A  
11  
D
I
S
= 1.25 A, V = 0 V  
0.77  
-0.77  
1.1  
GS  
a
Diode Forward Voltage  
V
SD  
I
S
= -1.25 A, V = 0 V  
GS  
-1.1  
Dynamicb  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
N-Ch  
P-Ch  
9.5  
16  
15  
25  
Total Gate Charge  
Q
g
N-Channel  
V
= 15 V, V = 10 V, I = 4.3 A  
1.8  
2.3  
1.55  
4.5  
0.45  
8.8  
13  
DS  
GS D  
nC  
Gate-Source Charge  
Gate-Drain Charge  
Gate Resistance  
Turn-On Delay Time  
Rise Time  
Q
Q
gs  
gd  
P-Channel  
V
DS  
= -15 V, V = -10 V, I = -3.8 A  
GS D  
R
g
W
25  
25  
25  
25  
50  
65  
20  
50  
60  
t
d(on)  
14  
N-Channel  
14  
V
= 15 V, R = 15 W  
DD  
L
t
r
14  
I
D
^ 1 A, V = 10 V, R = 6 W  
GEN G  
30  
P-Channel  
= -15 V, R = 15 W  
Turn-Off Delay Time  
Fall Time  
t
ns  
d(off)  
V
DD  
L
40  
I
D
^ -1 A, V  
= -10 V, R = 6 W  
GEN G  
10  
t
f
30  
I
= 1.25 A, di/dt = 100 A/ms  
= -1.25 A, di/dt = 100 A/ms  
30  
F
Source-Drain  
Reverse Recovery Time  
t
rr  
I
30  
F
Notes  
a. Pulse test; pulse width v 300 ms, duty cycle v 2%.  
b. Guaranteed by design, not subject to production testing.  
Document Number: 72244  
S-31251—Rev. A, 16-Jun-03  
www.vishay.com  
2
 
Si6544BDQ  
Vishay Siliconix  
New Product  
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)  
N−CHANNEL  
Output Characteristics  
Transfer Characteristics  
20  
16  
12  
8
20  
16  
12  
8
V
GS  
= 10 thru 5 V  
4 V  
T
= 125_C  
C
4
4
25_C  
3 V  
-55_C  
0
0
0
1
2
3
4
5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5  
V
DS  
-
Drain-to-Source Voltage (V)  
V
GS  
-
Gate-to-Source Voltage (V)  
On-Resistance vs. Drain Current  
Capacitance  
0.080  
0.064  
0.048  
0.032  
0.016  
0.000  
1100  
880  
660  
440  
220  
0
C
iss  
V
GS  
= 4.5 V  
V
GS  
= 10 V  
C
oss  
C
rss  
0
4
8
12  
16  
20  
0
6
12  
- Drain-to-Source Voltage (V)  
DS  
18  
24  
30  
I
D
-
Drain Current (A)  
V
Gate Charge  
On-Resistance vs. Junction Temperature  
10  
8
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
V
= 15 V  
= 4.3 A  
V
= 10 V  
DS  
GS  
I
D
I = 4.3 A  
D
6
4
2
0
0
2
4
6
8
10  
-50  
-25  
0
25  
50  
75  
100 125 150  
Q
- Total Gate Charge (nC)  
T
- Junction Temperature (_C)  
g
J
Document Number: 72244  
S-31251—Rev. A, 16-Jun-03  
www.vishay.com  
3
Si6544BDQ  
New Product  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)  
N−CHANNEL  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.15  
20  
10  
0.12  
0.09  
0.06  
0.03  
0.00  
I
D
= 4.3 A  
T
= 150_C  
J
T
= 25_C  
J
1
0.1  
0.0  
0.3  
0.6  
0.9  
1.2  
1.5  
0
2
4
6
8
10  
V
SD  
-
Source-to-Drain Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Threshold Voltage  
Single Pulse Power, Junction-to-Ambient  
0.4  
0.2  
200  
160  
120  
I
D
= 250 mA  
-0.0  
-0.2  
-0.4  
-0.6  
-0.8  
80  
40  
0
-3  
-2  
-1  
-50  
-25  
0
25  
50  
75  
100 125 150  
10  
10  
10  
1
10  
T
- Temperature (_C)  
Time (sec)  
J
Safe Operating Area, Junction-to-Case  
100  
10  
1
Limited by r  
DS(on)  
1 ms  
10 ms  
100 ms  
1 s  
0.1  
T
= 25_C  
C
Single Pulse  
10 s  
dc  
0.01  
0.1  
1
10  
100  
V
DS  
- Drain-to-Source Voltage (V)  
Document Number: 72244  
S-31251—Rev. A, 16-Jun-03  
www.vishay.com  
4
Si6544BDQ  
Vishay Siliconix  
New Product  
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)  
N−CHANNEL  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
0.05  
0.02  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 120_C/W  
thJA  
(t)  
3. T  
- T = P Z  
A DM thJA  
JM  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
100  
600  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (sec)  
Document Number: 72244  
S-31251—Rev. A, 16-Jun-03  
www.vishay.com  
5
Si6544BDQ  
New Product  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)  
P−CHANNEL  
Output Characteristics  
Transfer Characteristics  
20  
20  
16  
12  
8
V
GS  
= 10 thru 5 V  
16  
12  
8
4 V  
T
= 125_C  
C
4
4
3 V  
4
25_C  
-55_C  
0
0
0
1
2
3
5
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5  
V
DS  
-
Drain-to-Source Voltage (V)  
V
GS  
-
Gate-to-Source Voltage (V)  
On-Resistance vs. Drain Current  
Capacitance  
1100  
880  
660  
440  
220  
0
0.15  
0.12  
0.09  
0.06  
0.03  
0.00  
C
iss  
V
GS  
= 4.5 V  
V
GS  
= 10 V  
C
oss  
C
rss  
0
4
8
12  
16  
20  
0
6
12  
- Drain-to-Source Voltage (V)  
DS  
18  
24  
30  
I
D
-
Drain Current (A)  
V
Gate Charge  
On-Resistance vs. Junction Temperature  
10  
8
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
V
= 15 V  
= 3.8 A  
V
= 10 V  
DS  
GS  
I
D
I = 3.8 A  
D
6
4
2
0
0.0  
3.2  
6.4  
9.6  
12.8  
16.0  
-50  
-25  
0
25  
50  
75  
100 125 150  
Q
- Total Gate Charge (nC)  
T
- Junction Temperature (_C)  
g
J
Document Number: 72244  
S-31251—Rev. A, 16-Jun-03  
www.vishay.com  
6
Si6544BDQ  
Vishay Siliconix  
New Product  
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)  
P−CHANNEL  
Source-Drain Diode Forward Voltage  
On-Resistance vs. Gate-to-Source Voltage  
0.20  
20  
10  
0.16  
0.12  
0.08  
0.04  
0.00  
I
D
= 3.8 A  
T
= 150_C  
J
T
= 25_C  
J
1
0.1  
0.0  
0.3  
0.6  
0.9  
1.2  
1.5  
0
2
4
6
8
10  
V
SD  
-
Source-to-Drain Voltage (V)  
V
GS  
- Gate-to-Source Voltage (V)  
Threshold Voltage  
Single Pulse Power, Junction-to-Ambient  
0.6  
0.4  
200  
160  
120  
I
D
= 250 mA  
0.2  
80  
40  
0
0.0  
-0.2  
-0.4  
-3  
-2  
-1  
-50  
-25  
0
25  
50  
75  
100 125 150  
10  
10  
10  
1
10  
T
- Temperature (_C)  
Time (sec)  
J
Safe Operating Area, Junction-to-Case  
100  
10  
1
Limited by r  
DS(on)  
1 ms  
10 ms  
100 ms  
1 s  
0.1  
T
= 25_C  
C
Single Pulse  
10 s  
dc  
0.01  
0.1  
1
10  
100  
V
DS  
- Drain-to-Source Voltage (V)  
Document Number: 72244  
S-31251—Rev. A, 16-Jun-03  
www.vishay.com  
7
Si6544BDQ  
New Product  
Vishay Siliconix  
TYPICAL CHARACTERISTICS (25_C UNLESS NOTED)  
P−CHANNEL  
Normalized Thermal Transient Impedance, Junction-to-Ambient  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
Notes:  
P
DM  
0.1  
0.05  
0.02  
t
1
t
2
t
t
1
2
1. Duty Cycle, D =  
2. Per Unit Base = R  
= 120_C/W  
thJA  
(t)  
3. T  
- T = P Z  
A DM thJA  
JM  
Single Pulse  
4. Surface Mounted  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
100  
600  
Square Wave Pulse Duration (sec)  
Normalized Thermal Transient Impedance, Junction-to-Foot  
2
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
0.02  
Single Pulse  
0.01  
-4  
-3  
-2  
-1  
10  
10  
10  
10  
1
10  
Square Wave Pulse Duration (sec)  
Document Number: 72244  
S-31251—Rev. A, 16-Jun-03  
www.vishay.com  
8

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