SIHF9Z24L [VISHAY]

Power MOSFET; 功率MOSFET
SIHF9Z24L
型号: SIHF9Z24L
厂家: VISHAY    VISHAY
描述:

Power MOSFET
功率MOSFET

晶体 晶体管 功率场效应晶体管 开关 脉冲 局域网
文件: 总8页 (文件大小:2304K)
中文:  中文翻译
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IRF9Z24S, IRF9Z24L, SiHF9Z24S, SiHF9Z24L  
Vishay Siliconix  
Power MOSFET  
FEATURES  
• Advanced Process Technology  
PRODUCT SUMMARY  
VDS (V)  
- 60  
Available  
• Surface Mount (IRF9Z24S/SiHF9Z24S)  
RDS(on) (Ω)  
VGS = - 10 V  
0.28  
Low-Profile Through-Hole (IRF9Z24L/SiHF9Z24L)  
RoHS*  
Qg (Max.) (nC)  
19  
5.4  
COMPLIANT  
• 175 °C Operating Temperature  
• Fast Switching  
Q
Q
gs (nC)  
gd (nC)  
11  
• P-Channel  
Configuration  
Single  
• Fully Avalanche Rated  
• Lead (Pb)-free Available  
S
DESCRIPTION  
D2PAK (TO-263)  
I2PAK (TO-262)  
Third generation Power MOSFETs from Vishay utilize  
advanced processing techniques to achieve extremely low  
on-resistance per silicon area. This benefit, combined with  
the fast switching speed and ruggedized device design that  
Power MOSFETs are well known for, provides the designer  
with an extremely efficient and reliable device for use in a  
wide variety of applications.  
G
G
D
S
D
P-Channel MOSFET  
The D2PAK is a surface mount power package capable of  
accommodating die size up to HEX-4. It provides the highest  
power capability and the lowest possible on-resistance in  
any existing surface mount package. The D2PAK is suitable  
for high current applications because of its low internal  
connection resistance and can dissipate up to 2.0 W in a  
typical surface mount application.  
The through-hole version (IR9Z24L/SiH9Z24L) is available  
for low-profile applications.  
ORDERING INFORMATION  
Package  
D2PAK (TO-263)  
D2PAK (TO-263)  
D2PAK (TO-263)  
IRF9Z24STRRPbFa  
SiHF9Z24STR-E3a  
IRF9Z24STRRa  
I2PAK (TO-262)  
IRF9Z24LPbF  
SiHF9Z24L-E3  
IRF9Z24L  
IRF9Z24SPbF  
SiHF9Z24S-E3  
IRF9Z24S  
IRF9Z24STRLPbFa  
SiHF9Z24STL-E3a  
IRF9Z24STRLa  
Lead (Pb)-free  
SnPb  
SiHF9Z24S  
SiHF9Z24STLa  
SiHF9Z24STRa  
SiHF9Z24L  
Note  
a. See device orientation.  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
Gate-Source Voltage  
VDS  
- 60  
20  
V
VGS  
TC = 25 °C  
TC =100°C  
- 11  
- 7.7  
- 44  
0.40  
240  
- 11  
6.0  
Continuous Drain Currente  
VGS at - 10 V  
ID  
A
Pulsed Drain Currenta, e  
IDM  
Linear Derating Factor  
W/°C  
mJ  
A
Single Pulse Avalanche Energyb, e  
Repetitive Avalanche Currenta  
Repetitive Avalanche Energya  
EAS  
IAR  
EAR  
mJ  
* Pb containing terminations are not RoHS compliant, exemptions may apply  
Document Number: 91091  
S-Pending-Rev. A, 03-Jun-08  
www.vishay.com  
1
WORK-IN-PROGRESS  
IRF9Z24S, IRF9Z24L, SiHF9Z24S, SiHF9Z24L  
Vishay Siliconix  
ABSOLUTE MAXIMUM RATINGS TC = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
LIMIT  
3.7  
UNIT  
W
T
A = 25 °C  
C = 25 °C  
Maximum Power Dissipation  
PD  
T
60  
W
Peak Diode Recovery dV/dtc, e  
dV/dt  
- 4.5  
V/ns  
Operating Junction and Storage Temperature Range  
Soldering Recommendations (Peak Temperature)  
TJ, Tstg  
- 55 to + 175  
300d  
°C  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. VDD = - 25 V, starting TJ = 25 °C, L = 2.3 mH, RG = 25 Ω, IAS = - 11 A (see fig. 12).  
c. ISD - 11 A, dI/dt 140 A/µs, VDD VDS, TJ 175 °C.  
d. 1.6 mm from case.  
e. Uses IRF9Z24/SiHF9Z24 data and test conditions.  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
MIN.  
TYP.  
MAX.  
40  
UNIT  
°C/W  
Maximum Junction-to-Ambient  
(PCB Mount)a  
RthJA  
-
-
-
-
Maximum Junction-to-Case (Drain)  
RthJC  
2.5  
Note  
a. When mounted on 1" square PCB (FR-4 or G-10 material).  
SPECIFICATIONS TJ = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Static  
Drain-Source Breakdown Voltage  
VDS Temperature Coefficient  
Gate-Source Threshold Voltage  
Gate-Source Leakage  
VDS  
ΔVDS/TJ  
VGS(th)  
IGSS  
VGS = 0 V, ID = - 250 µA  
Reference to 25 °C, ID = - 1 mAc  
VDS = VGS, ID = - 250 µA  
- 60  
-
-
V
V/°C  
V
-
- 0.056  
-
- 2.0  
-
-
-
-
-
-
- 4.0  
100  
- 100  
- 500  
0.28  
-
VGS  
=
20 V  
-
nA  
VDS = - 60 V, VGS = 0 V  
-
-
Zero Gate Voltage Drain Current  
IDSS  
µA  
V
DS = - 48 V, VGS = 0 V, TJ = 150 °C  
Drain-Source On-State Resistance  
Forward Transconductance  
Dynamic  
RDS(on)  
gfs  
VGS = - 10 V  
VDS = - 25 V, ID = - 6.6 Ac  
ID = - 6.6 Ab  
-
Ω
1.4  
S
Input Capacitance  
Ciss  
Coss  
Crss  
Qg  
-
-
-
-
-
-
-
-
-
-
570  
360  
65  
-
-
-
VGS = 0 V,  
DS = - 25 V,  
f = 1.0 MHz, see fig. 5c  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
V
pF  
nC  
-
19  
5.4  
11  
-
ID = - 11 A, VDS = - 480 V,  
Gate-Source Charge  
Gate-Drain Charge  
Qgs  
Qgd  
td(on)  
tr  
V
GS = - 10 V  
-
see fig. 6 and 13b, c  
-
Turn-On Delay Time  
Rise Time  
13  
68  
15  
29  
-
VDD = - 30 V, ID = - 11 A,  
ns  
R
G = 18 Ω, RD = 2.5 Ω, see fig. 10b  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
-
-
Drain-Source Body Diode Characteristics  
MOSFET symbol  
showing the  
integral reverse  
p - n junction diode  
D
Continuous Source-Drain Diode Current  
IS  
-
-
- 11  
A
V
G
Pulsed Diode Forward Currenta  
Body Diode Voltage  
ISM  
-
-
-
-
- 44  
S
VSD  
TJ = 25 °C, IS = - 11 A, VGS = 0 Vb  
- 6.3  
www.vishay.com  
2
Document Number: 91091  
S-Pending-Rev. A, 03-Jun-08  
IRF9Z24S, IRF9Z24L, SiHF9Z24S, SiHF9Z24L  
Vishay Siliconix  
SPECIFICATIONS TJ = 25 °C, unless otherwise noted  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNIT  
Drain-Source Body Diode Characteristics  
Body Diode Reverse Recovery Time  
Body Diode Reverse Recovery Charge  
Forward Turn-On Time  
trr  
-
-
100  
320  
200  
640  
ns  
TJ = 25 °C, IF = -11 A, dI/dt = 100 A/µsb, c  
Qrr  
ton  
nC  
Intrinsic turn-on time is negligible (turn-on is dominated by LS and LD)  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature (see fig. 11).  
b. Pulse width 300 µs; duty cycle 2 %.  
c. Uses IRF9Z24/SiHF9Z24 data and test conditions.  
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted  
Fig. 1 - Typical Output Characteristics  
Fig. 3 - Typical Transfer Characteristics  
Fig. 4 - Normalized On-Resistance vs. Temperature  
Fig. 2 - Typical Output Characteristics  
Document Number: 91091  
S-Pending-Rev. A, 03-Jun-08  
www.vishay.com  
3
IRF9Z24S, IRF9Z24L, SiHF9Z24S, SiHF9Z24L  
Vishay Siliconix  
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage  
Fig. 7 - Typical Source-Drain Diode Forward Voltage  
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage  
Fig. 8 - Maximum Safe Operating Area  
www.vishay.com  
4
Document Number: 91091  
S-Pending-Rev. A, 03-Jun-08  
IRF9Z24S, IRF9Z24L, SiHF9Z24S, SiHF9Z24L  
Vishay Siliconix  
RD  
VDS  
VGS  
D.U.T.  
RG  
-
+
VDD  
- 10 V  
Pulse width 1 µs  
Duty factor 0.1 %  
Fig. 10a - Switching Time Test Circuit  
td(on) tr  
td(off) tf  
VGS  
10 %  
90 %  
VDS  
Fig. 9 - Maximum Drain Current vs. Case Temperature  
Fig. 10b - Switching Time Waveforms  
Fig. 11 - Maximum Effective Transient Thermal Impedance, Junction-to-Case  
Document Number: 91091  
S-Pending-Rev. A, 03-Jun-08  
www.vishay.com  
5
IRF9Z24S, IRF9Z24L, SiHF9Z24S, SiHF9Z24L  
Vishay Siliconix  
L
IAS  
VDS  
Vary tp to obtain  
required IAS  
VDS  
D.U.T.  
IAS  
R G  
-
V
+
DD  
VDD  
tp  
- 10 V  
0.01 Ω  
tp  
VDS  
Fig. 12a - Unclamped Inductive Test Circuit  
Fig. 12b - Unclamped Inductive Waveforms  
Fig. 12c - Maximum Avalanche Energy vs. Drain Current  
Current regulator  
Same type as D.U.T.  
50 kΩ  
QG  
- 10 V  
12 V  
0.2 µF  
0.3 µF  
-
QGS  
QGD  
V
+
DS  
D.U.T.  
VG  
VGS  
- 3 mA  
Charge  
IG  
ID  
Current sampling resistors  
Fig. 13a - Basic Gate Charge Waveform  
Fig. 13b - Gate Charge Test Circuit  
www.vishay.com  
6
Document Number: 91091  
S-Pending-Rev. A, 03-Jun-08  
IRF9Z24S, IRF9Z24L, SiHF9Z24S, SiHF9Z24L  
Vishay Siliconix  
Peak Diode Recovery dV/dt Test Circuit  
D.U.T.  
+
Circuit layout considerations  
Low stray inductance  
Ground plane  
Low leakage inductance  
current transformer  
-
+
-
+
-
RG  
+
-
dV/dt controlled by RG  
ISD controlled by duty factor "D"  
D.U.T. - device under test  
VDD  
Compliment N-Channel of D.U.T. for driver  
Driver gate drive  
P.W.  
Period  
Period  
D =  
P.W.  
V
= - 10 V*  
GS  
D.U.T. I waveform  
SD  
Reverse  
recovery  
current  
Body diode forward  
current  
dI/dt  
D.U.T. V waveform  
DS  
Diode recovery  
dV/dt  
V
DD  
Re-applied  
voltage  
Body diode forward drop  
Ripple 5 %  
Inductor current  
I
SD  
* VGS = - 5 V for logic level and - 3 V drive devices  
Fig. 14 - For P-Channel  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see http://www.vishay.com/ppg?91091.  
Document Number: 91091  
S-Pending-Rev. A, 03-Jun-08  
www.vishay.com  
7
Legal Disclaimer Notice  
Vishay  
Disclaimer  
All product specifications and data are subject to change without notice.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf  
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein  
or in any other disclosure relating to any product.  
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any  
information provided herein to the maximum extent permitted by law. The product specifications do not expand or  
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed  
therein, which apply to these products.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this  
document or by any conduct of Vishay.  
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless  
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such  
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting  
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding  
products designed for such applications.  
Product names and markings noted herein may be trademarks of their respective owners.  
Document Number: 91000  
Revision: 18-Jul-08  
www.vishay.com  
1

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