SIHS36N50D-E3 [VISHAY]

TRANSISTOR POWER, FET, FET General Purpose Power;
SIHS36N50D-E3
型号: SIHS36N50D-E3
厂家: VISHAY    VISHAY
描述:

TRANSISTOR POWER, FET, FET General Purpose Power

开关 脉冲 晶体管
文件: 总8页 (文件大小:174K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SiHS36N50D  
Vishay Siliconix  
www.vishay.com  
D Series Power MOSFET  
FEATURES  
• Optimal Design  
PRODUCT SUMMARY  
VDS (V) at TJ max.  
DS(on) max. at 25 °C ()  
Qg max. (nC)  
550  
- Low Area specific On-Resistance  
- Low Input Capacitance (Ciss  
R
VGS = 10 V  
0.130  
)
125  
23  
- Reduced Capacitive Switching Losses  
- High Body Diode Ruggedness  
- Avalanche Energy Rated (UIS)  
• Optimal Efficiency and Operation  
- Low Cost  
Q
gs (nC)  
gd (nC)  
Q
37  
Configuration  
Single  
- Simple Gate Drive Circuitry  
- Low Figure-Of-Merit (FOM): Ron x Qg  
- Fast Switching  
D
Super-247  
• Material categorization: For definitions of compliance  
please see www.vishay.com/doc?99912  
S
G
D
G
APPLICATIONS  
• Consumer Electronics  
- Displays (LCD or Plasma TV  
• Server and Telecom Power Supplies  
- SMPS  
S
N-Channel MOSFET  
• Industrial  
- Welding, Induction Heating, Motor Drives  
• Battery Chargers  
ORDERING INFORMATION  
Package  
Super-247  
Lead (Pb)-free  
SiHS36N50D-E3  
ABSOLUTE MAXIMUM RATINGS (TC = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
LIMIT  
UNIT  
Drain-Source Voltage  
VDS  
500  
V
Gate-Source Voltage  
30  
VGS  
Gate-Source Voltage AC (f > 1 Hz)  
30  
TC = 25 °C  
C = 100 °C  
36  
23  
Continuous Drain Current (TJ = 150 °C)  
VGS at 10 V  
ID  
T
A
Pulsed Drain Currenta  
IDM  
112  
Linear Derating Factor  
Single Pulse Avalanche Energyb  
3.6  
W/°C  
mJ  
W
EAS  
PD  
332  
Maximum Power Dissipation  
446  
Operating Junction and Storage Temperature Range  
Drain-Source Voltage Slope  
Reverse Diode dV/dtd  
TJ, Tstg  
- 55 to + 150  
24  
°C  
TJ = 125 °C  
dV/dt  
V/ns  
°C  
0.1  
300c  
Soldering Recommendations (Peak Temperature)  
for 10 s  
Notes  
a. Repetitive rating; pulse width limited by maximum junction temperature.  
b. VDD = 50 V, starting TJ = 25 °C, L = 2.3 mH, Rg = 25 , IAS = 17 A.  
c. 1.6 mm from case.  
d. ISD ID, starting TJ = 25 °C.  
S12-1457-Rev. A, 18-Jun-12  
Document Number: 91514  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHS36N50D  
Vishay Siliconix  
www.vishay.com  
THERMAL RESISTANCE RATINGS  
PARAMETER  
SYMBOL  
TYP.  
MAX.  
UNIT  
Maximum Junction-to-Ambient  
RthJA  
RthJC  
-
-
40  
°C/W  
Maximum Junction-to-Case (Drain)  
0.28  
SPECIFICATIONS (TJ = 25 °C, unless otherwise noted)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Static  
Drain-Source Breakdown Voltage  
VDS Temperature Coefficient  
Gate Threshold Voltage (N)  
Gate-Source Leakage  
VDS  
VDS/TJ  
VGS(th)  
IGSS  
VGS = 0 V, ID = 250 μA  
500  
-
-
-
V
V/°C  
V
-
3.0  
-
0.52  
Reference to 25 °C, ID = 250 μA  
VDS = VGS, ID = 250 μA  
-
5.0  
100  
1
VGS  
=
30 V  
-
-
nA  
VDS = 500 V, VGS = 0 V  
-
Zero Gate Voltage Drain Current  
IDSS  
μA  
V
DS = 400 V, VGS = 0 V, TJ = 125 °C  
-
-
10  
0.130  
-
Drain-Source On-State Resistance  
Forward Transconductancea  
RDS(on)  
gfs  
VGS = 10 V  
ID = 18 A  
-
0.105  
12.8  
VDS = 50 V, ID = 18 A  
-
S
Dynamic  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
Ciss  
Coss  
Crss  
-
-
-
3233  
285  
25  
-
-
-
VGS = 0 V,  
V
DS = 100 V,  
f = 1 MHz  
pF  
nC  
Effective Output Capacitance, Energy  
Relateda  
Co(er)  
Co(tr)  
-
-
240  
352  
-
-
VGS = 0 V, VDS = 0 V to 400 V  
Effective Output Capacitance, Time  
Relatedb  
Total Gate Charge  
Gate-Source Charge  
Gate-Drain Charge  
Turn-On Delay Time  
Rise Time  
Qg  
Qgs  
Qgd  
td(on)  
tr  
-
-
-
-
-
-
-
-
83  
23  
37  
33  
89  
79  
68  
1.8  
125  
-
V
GS = 10 V  
ID = 18 A, VDS = 400 V  
-
66  
134  
119  
102  
-
V
V
DD = 400 V, ID = 18 A,  
GS = 10 V, Rg = 9.1   
ns  
Turn-Off Delay Time  
Fall Time  
td(off)  
tf  
Gate Input Resistance  
Rg  
f = 1 MHz, open drain  
Drain-Source Body Diode Characteristics  
MOSFET symbol  
showing the  
integral reverse  
p - n junction diode  
D
Continuous Source-Drain Diode Current  
IS  
-
-
-
-
36  
A
G
Pulsed Diode Forward Current  
ISM  
144  
S
Diode Forward Voltage  
Reverse Recovery Time  
Reverse Recovery Charge  
Reverse Recovery Current  
VSD  
trr  
TJ = 25 °C, IS = 18 A, VGS = 0 V  
-
-
-
-
-
1.2  
V
ns  
μC  
A
490  
8.2  
31  
-
-
-
TJ = 25 °C, IF = IS = 18 A,  
dI/dt = 100 A/μs, VR = 20 V  
Qrr  
IRRM  
Notes  
a. Coss(er) is a fixed capacitance that gives the same energy as Coss while VDS is rising from 0 % to 80 % VDSS  
b. Coss(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 % to 80 % VDSS  
.
.
S12-1457-Rev. A, 18-Jun-12  
Document Number: 91514  
2
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHS36N50D  
Vishay Siliconix  
www.vishay.com  
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)  
3
2.5  
2
120  
TOP  
15 V  
14 V  
13 V  
12 V  
11 V  
10 V  
9 V  
TJ = 25 °C  
ID = 18 A  
90  
60  
30  
0
8 V  
7 V  
6 V  
BOTTOM 5 V  
1.5  
1
VGS = 10 V  
0.5  
0
- 60 - 40 - 20  
0
20 40 60 80 100 120 140 160  
0
5
10  
15  
20  
25  
30  
TJ, Junction Temperature (°C)  
VDS, Drain-to-Source Voltage (V)  
Fig. 1 - Typical Output Characteristics  
Fig. 4 - Normalized On-Resistance vs. Temperature  
80  
60  
40  
20  
0
10 000  
TOP  
15 V  
14 V  
13 V  
12 V  
11 V  
10 V  
9 V  
TJ = 150 °C  
Ciss  
VGS = 0 V, f = 1 MHz  
Ciss = Cgs + Cgd, Cds Shorted  
Crss = Cgd  
1000  
100  
10  
8 V  
7 V  
Coss = Cds + Cgd  
6 V  
BOTTOM 5 V  
Coss  
Crss  
1
0
5
10  
15  
20  
25  
30  
0
100  
200  
300  
400  
500  
VDS, Drain-to-Source Voltage (V)  
VDS, Drain-to-Source Voltage (V)  
Fig. 2 - Typical Output Characteristics  
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage  
120  
90  
60  
30  
0
24  
VDS = 400 V  
VDS = 250 V  
VDS = 100 V  
TJ = 25 °C  
20  
16  
12  
8
TJ = 150 °C  
4
0
0
5
10  
15  
20  
25  
0
30  
60  
90  
120  
150  
VGS, Gate-to-Source Voltage (V)  
Qg, Total Gate Charge (nC)  
Fig. 3 - Typical Transfer Characteristics  
S12-1457-Rev. A, 18-Jun-12  
Fig. 6 - Typical Gate Charge vs. Gate-to-Source Voltage  
Document Number: 91514  
3
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHS36N50D  
Vishay Siliconix  
www.vishay.com  
40  
30  
20  
10  
0
1000  
ġ
100  
ġ
T
= 150 °C  
J
ġ
ġ
10  
1
ġ
ġ
T
= 25 °C  
J
V
= 0 V  
ġ
GS  
0.1  
ġ
0.2  
0.4  
0.6  
0.8  
1
1.2  
1.4  
1.6  
25  
50  
75  
100  
125  
150  
VSD, Source-Drain Voltage (V)  
TJ, Case Temperature (°C)  
Fig. 7 - Typical Source-Drain Diode Forward Voltage  
Fig. 9 - Maximum Drain Current vs. Case Temperature  
1000  
625  
600  
575  
550  
525  
IDM = Limited  
Operation in this Area  
Limited by RDS(on)  
100  
Limited by RDS(on)  
*
10  
1
100 μs  
1 ms  
T
T
= 25 °C  
= 150 °C  
10 ms  
C
J
500  
475  
Single Pulse  
BVDSS Limited  
0.1  
1
10  
100  
1000  
- 60 - 40 - 20  
0
20 40 60 80 100 120 140 160  
VDS, Drain-to-Source Voltage (V)  
* VGS > minimum VGS at which RDS(on) is s  
TJ, Junction Temperature (°C)  
Fig. 8 - Maximum Safe Operating Area  
Fig. 10 - Temperature vs. Drain-to-Source Voltage  
1
Duty Cycle = 0.5  
0.2  
0.1  
0.1  
0.05  
Single Pulse  
0.02  
0.01  
0.0001  
0.001  
0.01  
0.1  
1
Pulse Time (s)  
Fig. 11 - Normalized Thermal Transient Impedance, Junction-to-Case  
S12-1457-Rev. A, 18-Jun-12  
Document Number: 91514  
4
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHS36N50D  
Vishay Siliconix  
www.vishay.com  
RD  
VDS  
QG  
10 V  
VGS  
D.U.T.  
QGS  
QGD  
RG  
+
-
V
DD  
VG  
10 V  
Pulse width ≤ 1 μs  
Duty factor ≤ 0.1 %  
Charge  
Fig. 12 - Switching Time Test Circuit  
Fig. 16 - Basic Gate Charge Waveform  
Current regulator  
Same type as D.U.T.  
VDS  
90 %  
50 kΩ  
12 V  
0.2 μF  
0.3 μF  
+
-
VDS  
10 %  
VGS  
D.U.T.  
td(on) tr  
td(off) tf  
VGS  
3 mA  
Fig. 13 - Switching Time Waveforms  
IG  
ID  
Current sampling resistors  
Fig. 17 - Gate Charge Test Circuit  
L
VDS  
Vary tp to obtain  
required IAS  
D.U.T.  
IAS  
RG  
+
-
VDD  
10 V  
0.01 Ω  
tp  
Fig. 14 - Unclamped Inductive Test Circuit  
VDS  
tp  
VDD  
VDS  
IAS  
Fig. 15 - Unclamped Inductive Waveforms  
S12-1457-Rev. A, 18-Jun-12  
Document Number: 91514  
5
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
SiHS36N50D  
Vishay Siliconix  
www.vishay.com  
Peak Diode Recovery dV/dt Test Circuit  
+
Circuit layout considerations  
Low stray inductance  
Ground plane  
D.U.T.  
Low leakage inductance  
current transformer  
-
+
-
-
+
Rg  
dV/dt controlled by Rg  
Driver same type as D.U.T.  
ISD controlled by duty factor “D”  
D.U.T. - device under test  
+
-
VDD  
Driver gate drive  
P.W.  
P.W.  
D =  
Period  
Period  
VGS = 10 Va  
D.U.T. lSD waveform  
D.U.T. VDS waveform  
Reverse  
recovery  
current  
Body diode forward  
current  
dI/dt  
Diode recovery  
dV/dt  
VDD  
Re-applied  
voltage  
Body diode forward drop  
Inductor current  
ISD  
Ripple 5 %  
Note  
a. VGS = 5 V for logic level devices  
Fig. 18 - For N-Channel  
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon  
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and  
reliability data, see www.vishay.com/ppg?91514.  
S12-1457-Rev. A, 18-Jun-12  
Document Number: 91514  
6
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Package Information  
www.vishay.com  
Vishay Siliconix  
TO-274AA (High Voltage)  
A
A
B
E
D2  
E1  
E4  
A1  
R
D1  
D
L1  
L
Detail “A”  
C
b
e
A2  
0.10 (0.25) M  
M
B A  
b4  
b2  
Lead Tip  
Detail “A”  
Scale: 2:1  
MILLIMETERS  
MIN.  
INCHES  
MIN.  
MILLIMETERS  
INCHES  
MIN.  
DIM.  
A
MAX.  
MAX.  
0.209  
0.098  
0.104  
0.063  
0.087  
0.128  
0.035  
0.819  
DIM.  
D1  
D2  
E
MIN.  
15.50  
0.70  
MAX.  
MAX.  
0.634  
0.051  
0.634  
0.547  
4.70  
1.50  
2.25  
1.30  
1.80  
3.00  
0.38  
19.80  
5.30  
2.50  
2.65  
1.60  
2.20  
3.25  
0.89  
20.80  
0.185  
0.059  
0.089  
0.051  
0.071  
0.118  
0.015  
0.780  
16.10  
1.30  
0.610  
0.028  
0.594  
0.524  
A1  
A2  
b
15.10  
13.30  
16.10  
13.90  
E1  
e
b2  
b4  
c (1)  
D
5.45 BSC  
0.215 BSC  
L
13.70  
1.00  
2.00  
14.70  
1.60  
3.00  
0.539  
0.039  
0.079  
0.579  
0.063  
0.118  
L1  
R
ECN: X17-0056-Rev. B, 27-Mar-17  
DWG: 5975  
Notes  
Dimensioning and tolerancing per ASME Y14.5M-1994  
Dimension D and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at  
the outer extremes of the plastic body  
Outline conforms to JEDEC® outline to TO-274AA  
Dimension measured at tip of lead  
(1)  
Revision: 27-Mar-17  
Document Number: 91365  
1
For technical questions, contact: hvm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Legal Disclaimer Notice  
www.vishay.com  
Vishay  
Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,  
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
disclosure relating to any product.  
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or  
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all  
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,  
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular  
purpose, non-infringement and merchantability.  
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of  
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding  
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,  
including but not limited to the warranty expressed therein.  
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining  
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.  
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.  
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for  
such applications.  
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document  
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.  
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
1

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