SX073H060A4OT [VISHAY]
DIODE RECTIFIER DIODE, Rectifier Diode;型号: | SX073H060A4OT |
厂家: | VISHAY |
描述: | DIODE RECTIFIER DIODE, Rectifier Diode 二极管 |
文件: | 总3页 (文件大小:68K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
New Product
SX...H060.4.. Series
Vishay General Semiconductor
www.vishay.com
Schottky Bare Die
FEATURES
a
c
e
• Planar Schottky (VBRM = 60 V)
• Low forward voltage drop
• High frequency operation
CIRCUIT DIAGRAM
d
b
C (2)
A (1)
C (2)
A (1)
Notes
(1)
Front metallization side: Anode
Back metallization side: Cathode
(2)
MECHANICAL DATA
DIMENSIONS in inches (millimeters)
TYPICAL TOTAL METAL THICKNESS
BONDABLE/
CHIP
CHIP SIZE
a, b
FRONT SIDE A
BACK SIDE C
DEVICE (1)
ASSEMBLY
SOLDERABLE
THICKNESS
c, d
e
METAL THICKNESS METAL THICKNESS
min.
max.
min.
max.
min.
max.
0.071
0.073
0.067
0.069
0.010
0.012
SX073H060A4OT
SX073H060S4PT
SX110H060S4PU
SX128H060S4OV
Bondable
Solderable
Solderable
Solderable
Ti/Ni/Al
Ti/Ni/Ag
Ti/Ni/Ag
Ti/Ni/Ag
4.4 μm
5.4 μm
5.4 μm
5.4 μm
Ti/Ni/Ag
Ti/Ni/Ag
Ti/Ni/Ag
Ti/Ni/Ag
3.3 μm
3.3 μm
3.3 μm
3.3 μm
(1.803) (1.854) (1.702) (1.753) (0.254) (0.305)
0.071 0.073 0.067 0.069 0.010 0.012
(1.803) (1.854) (1.702) (1.753) (0.254) (0.305)
0.108 0.110 0.104 0.106 0.010 0.012
(2.743) (2.794) (2.642) (2.692) (0.254) (0.305)
0.126 0.128 0.122 0.124 0.010 0.012
(3.200) (3.251) (3.099) (3.150) (0.254) (0.305)
Note
(1)
Refer to Device Code definition
ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted)
BARE DIE
FINISH GOOD (for reference not guarantee for bare die)
MAXIMUM
MINIMUM
MAXIMUM
REVERSE
CURRENT
RM AT VBRM
(μA)
OPERATING
JUNCTION
TEMPERATURE
RANGE
FORWARD DROP
VOLTAGE (1)
VF AT IF
BREAKDOWN
VOLTAGE
DEVICE
EQUIVALENT
PRODUCT (3)
PACKAGE
STYLE
VBRM (2) (V)
I
(2)
AT IR = 1 mA
(V)
7.3
7.3
6.8
6.9
(A)
7.5
7.5
15
SX073H060A4OT
SX073H060S4PT
SX110H060S4PU
SX128H060S4OV
60
60
60
60
50
50
- 65 °C to + 175 °C
- 65 °C to + 175 °C
- 65 °C to + 175 °C
- 65 °C to + 175 °C
MBR15H60CT
MBR7H60
TO-220AB
TO-220AC
TO-263AB
TO-247AD
60
MBRB30H60CT
MBR40H60PT
100
20
Notes
(1)
Pulse test: 300 μs pulse width
Pulse test: Pulse width 40 ms
(2)
(3)
Package equivalent product quality level information will provide per customer request but only for reference no guarantee bare die can meet
the same
Revision: 09-Sep-11
Document Number: 89212
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
New Product
SX...H060.4.. Series
Vishay General Semiconductor
www.vishay.com
PACKAGING
DEVICE
PACKAGE CODE
DELIVERY MODE
BASE QUANTITY
SX073H060A4.T
SX110H060S4PU
SX128H060S4OV
T
U
V
12 mm tape/4 mm pitch, 7" diameter plastic tape and reel
12 mm tape/4 mm pitch, 7" diameter plastic tape and reel
12 mm tape/8 mm pitch, 7" diameter plastic tape and reel
6000
6000
3000
DEVICE CODE
SX 073
H
060
A
4
P
T
1
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
-
-
-
-
-
-
-
-
Planar Schottky Die
Die dimensions in mils
Process (for Schottky)
R = TJ max. 125 °C
S = TJ max. 150 °C
H = TJ max. 175 °C
Voltage code: Code = VBRM
A = Bondable
S = Solderable
Chip surface metallization (see Mechanical Data table)
Wafer diameter in inches
4 = 4" wafer
6 = 6" wafer
P = Packaged die, high reliability grade (1)
O = Packaged die, commercial grade (1)
N = Non packaged die (2)
Quality level code
Packaging (see Packaging table)
Notes
(1)
Packaged die
• Existing die in qualified package
Non packaged die
(2)
• Existing fab. process
• Non standard die metal
• Die metal has been qualified
• No production in packaged form
Revision: 09-Sep-11
Document Number: 89212
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
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Disclaimer
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Revision: 12-Mar-12
Document Number: 91000
1
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