T1670P_14 [VISHAY]
Silicon PIN Photodiode;
| 型号： | T1670P_14 |
| 厂家： | 
VISHAY |
| 描述： | Silicon PIN Photodiode |
| 文件： | 总4页 (文件大小：77K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
T1670P
Vishay Semiconductors
www.vishay.com
Silicon PIN Photodiode
FEATURES
• Package type: chip
• Package form: single chip
• Dimensions (L x W x H in mm): 0.72 x 0.72 x 0.28
• Wafer diameter (in mm): 100
• Radiant sensitive area (in mm2): 0.27
• Peak wavelength 560 nm
A
• High photo sensitivity
• High radiant sensitivity
• Suitable for visible light
• Fast response times
21667
• Angle of half sensitivity: ϕ = 60ꢀ
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
T1670P ambient light sensor chip is a PIN photodiode with
0.27 mm2 sensitive area, high speed and high photo
sensitivity. It is sensitive to visible light much like the human
eye and has peak sensitivity at 560 nm. Anode is the bond
pad on top, cathode is the backside contact.
APPLICATIONS
• Ambient light sensor
• Backlight dimmer
GENERAL INFORMATION
The datasheet is based on Vishay optoelectronics sample testing under certain predetermined and assumed conditions, and is
provided for illustration purpose only. Customers are encouraged to perform testing in actual proposed packaged and used
conditions. Vishay optoelectronics die products are tested using Vishay optoelectronics based quality assurance procedures
and are manufactured using Vishay optoelectronics established processes. Estimates such as those described and set forth in
this datasheet for semiconductor die will vary depending on a number of packaging, handling, use, and other factors. Therefore
sold die may not perform on an equivalent basis to standard package products.
PRODUCT SUMMARY
COMPONENT
Ira (nA)
ϕ (deg)
λ0.5 (nm)
T1670P
138
60
390 to 800
Note
•
Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
T1670P-SD-F
Wafer sawn on foil with disco frame
MOQ: 55 000 pcs
Chip
Note
MOQ: minimum order quantity
•
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 ꢀC, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
16
UNIT
V
Reverse voltage
VR
Junction temperature
Tj
100
ꢀC
Operating temperature range
Storage temperature range
Storage temperature range on foil
Tamb
Tstg1
Tstg2
-40 to +100
-40 to +100
-40 to +50
ꢀC
ꢀC
ꢀC
Rev. 1.5, 22-May-14
Document Number: 81999
1
For technical questions, contact: optochipsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
T1670P
Vishay Semiconductors
www.vishay.com
BASIC CHARACTERISTICS (Tamb = 25 ꢀC, unless otherwise specified)
PARAMETER
TEST CONDITION
R = 100 μA, E = 0
R = 10 V, E = 0
R = 3 V, f = 1 MHz, E = 0
EV = 100 lx, CIE illuminant A, VR = 5 V
SYMBOL
MIN.
TYP.
MAX.
UNIT
V
Breakdown voltage
Reverse dark current
Diode capacitance
Reverse light current
Angle of half sensitivity
Wavelength of peak sensitivity
Range of spectral bandwidth
Rise time
I
V(BR)
Iro
16
V
0.1
28
2
nA
pF
V
CD
Ira
138
nA
deg
nm
nm
ns
ϕ
60
λp
λ0.5
tr
560
390 to 800
100
V
R = 5 V, RL = 50 Ω, λ = 515 nm
R = 5 V, RL = 50 Ω, λ = 515 nm
Fall time
V
tf
100
ns
Note
The measurements are based on samples of die which are mounted on a TO-header without resin coating
•
BASIC CHARACTERISTICS (Tamb = 25 ꢀC, unless otherwise specified)
70
1.0
E0 = 0
f = 1 MHz
60
0.8
50
0.6
0.4
0.2
0.0
40
30
20
10
0
0
10
20
30
400 500 600 700 800 900 1000 1100
21741
λ - Wavelength (nm)
VR - Reverse Voltage (V)
20094
Fig. 1 - Diode Capacitance vs. Reverse Voltage
Fig. 2 - Relative Spectral Sensitivity vs. Wavelength
MECHANICAL DIMENSIONS
PARAMETER
SYMBOL
MIN.
TYP.
0.72
MAX.
UNIT
mm
Length of chip edge (x-direction)
Length of chip edge (y-direction)
Sensitive area
Lx
Ly
0.72
mm
mm2
AS
D
0.27
Wafer diameter
100
mm
Die height
H
0.265
0.28
0.295
mm
Bond pad anode
x * y
0.125 x 0.11
mm2
ADDITIONAL INFORMATION
Frontside metallization, anode
Backside metallization, cathode
Dicing
AlSi
NiV-Ag
Sawing
Die bonding technology
Epoxy bonding
Note
All chips are checked in accordance with the Vishay Semiconductor, specification of visual inspection FVOV6870.
•
The visual inspection shall be made in accordance with the “specification of visual inspection as referenced”. The visual inspection of chip
backside is performed with stereo microscope with incident light and 40x to 80x magnification.
The quality inspection (final visual inspection) is performed by production. An additional visual inspection step as special release procedure
by QM is not installed.
Rev. 1.5, 22-May-14
Document Number: 81999
2
For technical questions, contact: optochipsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
T1670P
Vishay Semiconductors
www.vishay.com
HANDLING AND STORAGE CONDITIONS
• The hermetically sealed shipment lots shall be opened in temperature and moisture controlled cleanroom environment only.
It is mandatory to follow the rules for disposition of material that can be hazardous for humans and environment.
• Product must be handled only at ESD safe workstations. Standard ESD precautions and safe work environments are as
defined in MIL-HDBK-263.
• Singulated die are not to be handled with tweezers. A vacuum wand with non metallic ESD protected tip should be used.
PACKING
Chips are fixed on adhesive foil. Upon request the foils can be mounted on plastic frame or disco frame. For shipment, the
wafers are arranged to stacks and hermetically sealed in plastic bags to ensure protection against environmental influence
(humidity and contamination).
Use for recycling reliable operators only. We can help getting in touch with your nearest sales office. By agreement we will take
back packing material, if it is sorted. You will have to bear the costs of transport. We will invoice you for any costs incurred for
packing material that is returned unsorted or which we are not obliged to accept.
Rev. 1.5, 22-May-14
Document Number: 81999
3
For technical questions, contact: optochipsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
Document Number: 91000
1
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