TFBS4711_06 [VISHAY]
Serial Infrared Transceiver SIR, 115.2 kbit/s, 2.7 V to 5.5 V Operation; 串行红外收发器爵士， 115.2 kbit / s的2.7 V至5.5 V操作
| 型号： | TFBS4711_06 |
| 厂家： | 
VISHAY |
| 描述： | Serial Infrared Transceiver SIR, 115.2 kbit/s, 2.7 V to 5.5 V Operation |
| 文件： | 总12页 (文件大小：202K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TFBS4711
Vishay Semiconductors
Serial Infrared Transceiver SIR, 115.2 kbit/s,
2.7 V to 5.5 V Operation
Description
The TFBS4711 is a low profile, Infrared Data Trans-
ceiver module. It supports IrDA data rates up to
115.2 kbit/s (SIR). The transceiver module consists of
a PIN photodiode, an infrared emitter (IRED), and a
low-power CMOS control IC to provide a total front-
end solution in a single package.
The device is designed for the low power IrDA stan-
dard with an extended range on-axis up to 1 m. The
RXD pulse width is independent of the duration of
TXD pulse and always stays at a fixed width thus
making the device optimum for all standard SIR
Encoder/ Decoder and interfaces. The Shut Down
(SD) feature cuts current consumption to typically 10 nA.
20208
Features
• Compliant with the latest IrDA physical
layer low power specification
• Tri-State receiver output, floating in shutdown with
a weak pull-up
( 9.6 kbit/s to 115.2 kbit/s)
• Constant RXD output pulse width (2 µs typical)
• Small package:
• Meets IrFM Fast Connection requirements
• Split power supply, an independent, unregulated
supply for IRED Anode and a well regulated
e4
H 1.9 mm x D 3.1 mm x L 6.0 mm
• Industries smallest footprint
- 6.0 mm length
- 1.9 mm height
• Typical Link distance on-axis up to 1 m
supply for V
CC
• Directly interfaces with various Super I/O and Con-
troller Devices and Encoder/ Decoder such as
TOIM4232
• Lead (Pb)-free device
• Qualified for lead (Pb)-free and Sn/Pb processing
(MSL4)
• Battery & power management features:
> Idle Current - 75 µA Typical
> Shutdown current - 10 nA typical
> Operates from 2.4 V - 5.5 V within specification
over full temperature range from - 25 °C to + 85 °C
• Device in accordance with RoHS 2002/95/EC and
WEEE 2002/96EC
• Remote Control - transmit distance up to 8 meters
Applications
• Ideal for battery operated devices
• PDAs
• Data loggers
• External infrared adapters (Dongles)
• Diagnostics systems
• Mobile phones
• Electronic wallet (IrFM)
• Notebook computers
• Digital still and video cameras
• Medical and industrial data collection devices
• Kiosks, POS, Point and Pay devices
• GPS
• Printers, fax machines, photocopiers,
screen projectors
• Access control
• Field programming devices
Parts Table
Part
Description
Oriented in carrier tape for side view surface mounting
Qty/Reel
1000 pcs
2500 pcs
1000 pcs
TFBS4711-TR1
TFBS4711-TR3
TFBS4711-TT1
Oriented in carrier tape for side view surface mounting
Oriented in carrier tape for top view surface mounting
Document Number 82633
Rev. 1.9, 07-Nov-06
www.vishay.com
1
TFBS4711
Vishay Semiconductors
Functional Block Diagram
V
CC
Amp
Comp
RXD
IRED A
Driver
Power
Control
SD
Driver
TXD
18280
GND
Pinout
Definitions:
TFBS4711
weight 50 mg
In the Vishay transceiver data sheets the following nomenclature is
used for defining the IrDA operating modes:
SIR: 2.4 kbit/s to 115.2 kbit/s, equivalent to the basic serial infrared
standard with the physical layer version IrPhy 1.0
MIR: 576 kbit/s to 1152 kbit/s
FIR: 4 Mbit/s
VFIR: 16 Mbit/s
MIR and FIR were implemented with IrPhy 1.1, followed by IrPhy
1.2, adding the SIR Low Power Standard.
PIN 1
19428
Pin Description
Pin Number Function
Description
I/O
Active
1
IRED
Anode
IRED Anode is directly connected to a power supply. The LED current can be
decreased by adding a resistor in series between the power supply and IRED
Anode. A separate unregulated power supply can be used at this pin.
2
3
TXD
RXD
This Input is used to turn on IRED transmitter when SD is low. An on-chip protection
I
O
I
HIGH
LOW
HIGH
circuit disables the LED driver if the TXD pin is asserted for longer than 80 μs
Received Data Output, normally stays high but goes low for a fixed duration during
received pulses. It is capable of driving a standard CMOS or TTL load.
4
5
6
SD
Shutdown. Setting this pin active switches the device into shutdown mode
VCC
Supply Voltage
Ground
GND
Absolute Maximum Ratings
Reference Point Ground, Pin 6 unless otherwise noted.
Parameter
Test Conditions
Symbol
VCC
Min
Typ.
Max
Unit
V
Supply voltage range, all states
Input current
- 0.5
+ 6.0
10.0
25.0
80
ICC
For all Pins except IRED Anode Pin
mA
mA
mA
mA
V
Output sink current, RXD
Average output current, pin 1
Repetitive pulsed output current
IRED anode voltage, pin 1
Voltage at all inputs and outputs
IIRED (DC)
IIRED (RP)
VIREDA
VIN
20 % duty cycle
< 90 µs, ton < 20 %
400
- 0.5
- 0.5
- 30
+ 6.0
+ 6.0
+ 85
Vin > VCC is allowed
V
Ambient temperature range
(operating)
Tamb
°C
Tstg
Storage temperature range
Soldering temperature
- 40
+ 100
260
°C
°C
See Recommended Solder Profile
www.vishay.com
2
Document Number 82633
Rev. 1.9, 07-Nov-06
TFBS4711
Vishay Semiconductors
Eye safety information
Parameter
Test Conditions
Symbol
d
Min
1.3
Typ.
1.5
Max
Unit
mm
Virtual source size
Method: (1-1/e) encircled
energy
*)
Maximum intensity for class 1
IEC60825-1 or EN60825-1,
edition Jan. 2001, operating
below the absolute maximum
ratings
Ie
mW/sr
(500)**)
Electrical Characteristics
Transceiver
Tamb = 25 °C, VCC = VIREDA = 2.4 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions
Symbol
VCC
Min
2.4
Typ.
75
Max
5.5
Unit
V
Supply voltage range, all states
SD = Low, Ee = 1 klx*),
Tamb = - 25 °C to + 85 °C,
VCC = 2.7 V to 5.5 V
Idle supply current at VCC1
(receive mode, no signal)
ICC1
130
µA
SD = Low, Ee = 1 klx*),
Tamb = 25 °C,
ICC1
µA
VCC = 2.7 V to 5.5 V
VCC = 2.7 V
ICC
ISD
Receive current
80
µA
µA
µA
°C
V
SD = High, T = 25 °C, Ee = 0 klx
SD = High, T = 85 °C
Shutdown current
< 0.1
2
ISD
3
TA
Operating temperature range
Output voltage low, RXD
Output voltage high, RXD
- 25
+ 85
I
OL = 1 mA
IOH = - 500 µA
OH = - 250 µA
VOL
VOH
VOH
RRXD
VIL
0.15 x VCC
VCC + 0.5
VCC + 0.5
- 0.5
0.8 x VCC
0.9 x VCC
V
I
V
RXD to VCC impedance
400
- 0.5
500
600
0.5
6.0
kΩ
V
Input voltage low: TXD, SD
Input voltage high: TXD, SD
CMOS level (0.5 x VCC typ,
threshold level)
VIH
VCC - 0.5
V
Vin = 0.9 x VCC
IICH
Input leakage current (TXD, SD)
Controlled pull down current
- 2
- 1
+ 2
µA
µA
SD, TXD = "0" or "1",
0 < Vin < 0.15 VCC
IIRTx
+ 150
SD, TXD = "0" or "1"
IIRTx
CIN
0
1
5
µA
pF
V
in > 0.7 VCC
Input capacitance
Document Number 82633
Rev. 1.9, 07-Nov-06
www.vishay.com
3
TFBS4711
Vishay Semiconductors
Optoelectronic Characteristics
Receiver
Tamb = 25 °C, VCC = 2.4 V to 5.5 V unless otherwise noted
Parameter
Minimum irradiance Ee in
angular range **)
Test Conditions
Symbol
Ee
Min
Typ.
Max
Unit
mW/m2
(µW/cm2)
9.6 kbit/s to 115.2 kbit/s
λ = 850 nm - 900 nm,
α = 0°, 15°
35
(3.5)
80
(8)
kW/m2
(mW/cm2)
mW/m2
(µW/cm2)
ns
Maximum irradiance Ee in
angular range***)
λ = 850 nm - 900 nm
Ee
Ee
5
(500)
Maximum no detection
irradiance
4
(0.4)
10 % to 90 %, CL = 15 pF
90 % to 10 %, CL = 15 pF
Input pulse width > 1.2 µs
tr(RXD)
tf(RXD)
tPW
Rise time of output signal
Fall time of output signal
RXD pulse width
10
10
100
100
3.0
ns
µs
ns
1.7
2.0
Input Irradiance = 100 mW/m2,
Leading edge jitter
250
≤ 115.2 kbit/s
Standby /Shutdown delay,
receiver startup time
After shutdown active
or power-on
150
150
µs
µs
tL
Latency
**) IrDA sensitivity definition: Minimum Irradiance Ee In Angular Range, power per unit area. The receiver must meet the BER specifica-
tion while the source is operating at the minimum intensity in angular range into the minimum half-angle range at the maximum Link Length.
***) Maximum Irradiance Ee In Angular Range, power per unit area. The optical delivered to the detector by a source operating at the
maximum intensity in angular range at Minimum Link Length must not cause receiver overdrive distortion and possible related link errors.
If placed at the Active Output Interface reference plane of the transmitter, the receiver must meet its bit error ratio (BER).
For more definitions see the document “Symbols and Terminology” on the Vishay Website (http://www.vishay.com/docs/82512/82512.pdf).
Transmitter
Tamb = 25 °C, VCC = 2.4 V to 5.5 V unless otherwise noted.
Parameter
Test Conditions
Symbol
ID
Min
200
Typ.
300
0.57
Max
400
Unit
mA
mA
Tamb = - 25 °C to + 85 °C
IRED operating current
Transceiver operating peak
supply current
During pulsed IRED operation at
D = 300 mA
ICC
I
TXD = 0 V, 0 < VCC < 5.5 V
IIRED
Ie
IRED leakage current
Output radiant intensity
- 1
45
1
µA
α = 0°, TXD = High, SD = Low,
R = 0 Ω, VLED = 2.4 V
60
35
300
mW/sr
α = 0°, 15°, TXD = High, SD =
Low, R = 0 Ω, VLED = 2.4 V
Ie
Ie
25
300
mW/sr
mW/sr
V
CC = 5.0 V, α = 0°, 15°, TXD =
0.04
High or SD = High (Receiver is
inactive as long as SD = High)
Output radiant intensity, angle of
half intensity
α
22
45
°
λp
Peak-emission wavelength
Spectral bandwidth
880
900
nm
nm
ns
Δλ
tropt
Optical rise time
10
10
100
100
2.23
tfopt
topt
Optical fall time
ns
Optical output pulse duration
Input pulse width 1.63 µs,
115.2 kbit/s
1.41
1.63
µs
Input pulse width tTXD < 20 µs
topt
topt
tTXD
tTXD
0.15
300
+
µs
Input pulse width tTXD ≥ 20 µs
µs
%
Optical overshoot
25
www.vishay.com
4
Document Number 82633
Rev. 1.9, 07-Nov-06
TFBS4711
Vishay Semiconductors
Recommended Solder Profiles
Solder Profile for Sn/Pb soldering
Manual Soldering
Manual soldering is the standard method for lab use.
However, for a production process it cannot be rec-
ommended because the risk of damage is highly
dependent on the experience of the operator. Never-
theless, we added a chapter to the above mentioned
application note, describing manual soldering and
desoldering.
260
10 s max. at 230 °C
240 °C max.
240
220
200
180
160
140
120
100
80
2...4 °C/s
160 °C max.
120 s...180 s
90 s max.
Storage
2...4 °C/s
The storage and drying processes for all VISHAY
transceivers (TFDUxxxx and TFBSxxx) are equiva-
lent to MSL4.
60
40
20
0
The data for the drying procedure is given on labels
on the packing and also in the application note
"Taping, Labeling, Storage and Packing"
(http://www.vishay.com/docs/82601/82601.pdf).
0
50
100
150
200
250
300
350
Time/s
19431
Figure 1. Recommended Solder Profile for Sn/Pb soldering
Lead (Pb)-Free, Recommended Solder Profile
280
T = 260 °C max.
peak
260
240
220
200
180
160
140
120
100
80
≥
≥
T
T
255 °C for 20 s max
217 °C for 50 s max
The TFBS4711 is a lead (Pb)-free transceiver and
qualified for lead (Pb)-free processing. For lead
(Pb)-free solder paste like Sn(3.0-4.0)Ag(0.5-0.9)Cu,
there are two standard reflow profiles: Ramp-Soak-
Spike (RSS) and Ramp-To-Spike (RTS). The Ramp-
Soak-Spike profile was developed primarily for reflow
ovens heated by infrared radiation. With widespread
use of forced convection reflow ovens the Ramp-To-
Spike profile is used increasingly. Shown below in fig-
ure 2 is VISHAY's recommended profiles for use with
the TFBS4711 transceivers. For more details please
refer to Application note: SMD Assembly Instruction.
20 s
90 s...120 s
50 s max.
2 °C...4 °C/s
60
2 °C...4 °C/s
40
20
0
0
50
100
150
200
250
300
350
19261
Time/s
Figure 2. Solder Profile, RSS Recommendation
Wave Soldering
For TFDUxxxx and TFBSxxxx transceiver devices
wave soldering is not recommended.
Document Number 82633
Rev. 1.9, 07-Nov-06
www.vishay.com
5
TFBS4711
Vishay Semiconductors
resistive and inductive wiring should be avoided. The
inputs (TXD, SD) and the output RXD should be
directly (DC) coupled to the I/O circuit
Recommended Circuit Diagram
V
CC
IR Controller
The capacitor C2 combined with the resistor R2 is the
low pass filter for smoothing the supply voltage when
noisy supply voltage is used or pick-up via the wiring
is expected.
Vdd
TFBS4711
IREDA (1)
Rled
TXD
RXD
SD
(2)
(3)
(4)
(5)
(6)
IRTX
IRRX
R2, C1 and C2 are optional and dependent on the
IRMODE
Vcc
quality of the supply voltage V
and injected noise.
CCX
R1= 47Ω
GND
An unstable power supply with dropping voltage dur-
ing transmission may reduce the sensitivity (and
transmission range) of the transceiver.
GND
C4
0.1 μF
C2
C3
C1
4.7 μF
0.1μF 4.7 μF
The placement of these parts is critical. It is strongly
recommended to position C2 as close as possible to
the transceiver power supply pins.
18510
Figure 3. Recommended Application Circuit
In any case, when connecting the described circuit to
the power supply, low impedance wiring should be
used.
When extended wiring is used the inductance of the
power supply can cause dynamically a voltage drop
Operated at a clean low impedance power supply the
TFBS4711 needs no additional external components
when the internal current control is used. For reducing
the IRED drive current for low power applications with
reduced range an additional resistor can be used to
connect the IRED to the separate power supply.
Depending on the entire system design and board
layout, additional components may be required. (see
figure 3).
at V
. Often some power supplies are not to follow
CC2
the fast current rise time. In that case another 10 µF
capacitor at V will be helpful.
CC2
The recommended components in table 1 are for test
set-ups
Worst-case conditions are test set-ups with long
cables to power supplies. In such a case capacitors
are necessary to compensate the effect of the cable
inductance. In case of small applications as e.g.
mobile phones where the power supply is close to the
transceiver big capacitors are normally not neces-
sary. The capacitor C1 is buffering the supply voltage
and eliminates the inductance of the power supply
line. This one should be a small ceramic version or
other fast capacitor to guarantee the fast rise time of
the IRED current. The resistor R1 is optional for
reducing the IRED drive current.
Keep in mind that basic RF - design rules for circuit
design should be taken into account. Especially
longer signal lines should not be used without termi-
nation. See e.g. "The Art of Electronics" Paul Horow-
itz, Winfield Hill, 1989, Cambridge University Press,
ISBN: 0521370957
I/O and Software
In the description, already different I/Os are men-
tioned. Different combinations are tested and the
function verified with the special drivers available
from the I/O suppliers. In special cases refer to the I/
O manual, the Vishay application notes, or contact
directly Vishay Sales, Marketing or Application.
Vishay transceivers integrate a sensitive receiver and
a built-in power driver. The combination of both needs
a careful circuit board layout. The use of thin, long,
Table 1.
Recommended Application Circuit Components
Component
C1, C3
C2, C4
R1
Recommended Value
Vishay Part Number
293D 475X9 016B
4.7 µF, 16 V
0.1 µF, Ceramic
47 Ω, 0.125 W
VJ 1206 Y 104 J XXMT
CRCW-1206-47R0-F-RT1
www.vishay.com
6
Document Number 82633
Rev. 1.9, 07-Nov-06
TFBS4711
Vishay Semiconductors
Table 2.
Truth table
SD
TXD
Optical input Irradiance
RXD
Transmitter
Operation
mW/m2
Inputs
x
Inputs
high
Inputs
x
Outputs
Outputs
0
Remark
weakly pulled
Shutdown
(500 Ω) to VCC1
Ie
0
low
low
high
x
x
high inactive
high inactive
Transmitting
high
Protection is active
> 300 µs
low
low
< 4
high inactive
0
Ignoring low signals below the
IrDA defined threshold for
noise immunity
low
low
low
low
> Min. Detection Threshold Irradiance
< Max. Detection Threshold Irradiance
low (active)
undefined
0
0
Response to an IrDA
compliant optical input signal
> Max. Detection Threshold Irradiance
Overload conditions can
cause unexpected outputs
Package Dimensions in mm
19612
Figure 4. Package drawing of TFBS4711, tolerance of height is + 0.1mm, - 0.2 mm, other tolerances 0.2 mm
Document Number 82633
Rev. 1.9, 07-Nov-06
www.vishay.com
7
TFBS4711
Vishay Semiconductors
19728
Figure 5. Recommended Solder Footprint
Reel Dimensions
Drawing-No.: 9.800-5090.01-4
Issue: 1; 29.11.05
14017
W1 min.
W2 max.
W3 min.
W3 max.
Tape Width
A max.
mm
N
mm
16
mm
50
mm
mm
mm
mm
330
16.4
22.4
15.9
19.4
www.vishay.com
8
Document Number 82633
Rev. 1.9, 07-Nov-06
TFBS4711
Vishay Semiconductors
Tape Dimensions in mm
19613
Document Number 82633
Rev. 1.9, 07-Nov-06
www.vishay.com
9
TFBS4711
Vishay Semiconductors
Tape Dimensions in mm
20416
www.vishay.com
10
Document Number 82633
Rev. 1.9, 07-Nov-06
TFBS4711
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 82633
Rev. 1.9, 07-Nov-06
www.vishay.com
11
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
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