TH5E106M021G5000 [VISHAY]
Solid Tantalum Surface Mount Chip Capacitors;型号: | TH5E106M021G5000 |
厂家: | VISHAY |
描述: | Solid Tantalum Surface Mount Chip Capacitors |
文件: | 总11页 (文件大小:1133K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TH5
Vishay Sprague
www.vishay.com
Solid Tantalum Surface Mount Chip Capacitors TANTAMOUNT™,
Molded Case, HI-TMP®, Very High Temperature 200 °C
FEATURES
• Operating temperature up to +200 °C
• Category voltage at +200 °C: same as rated
voltage (RV) at 25 °C to 85 °C
• 500 h continuous operation at RV
• Gold plated terminations
• 100 ꢀ surge current tested
• Standard EIA 535BAAC case sizes
• Moisture sensitivity level 1
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Oil and petroleum
PERFORMANCE / ELECTRICAL
CHARACTERISTICS
• High temperature sensing and drilling systems
• Industrial
• Safety critical industrial tools and products
• High temperature extended activities
• High temperature engines
Operating Temperature: -55 °C to +200 °C
Capacitance Range: 4.7 μF to 100 μF
Capacitance Tolerance: 10 ꢀ, 20 ꢀ
Voltage Range: 5 VDC to 24 VDC
• Electronic sensors
ORDERING INFORMATION
TH5
E
106
K
021
B
1000
TYPE
CASE
CODE
CAPACITANCE
CAPACITANCE CATEGORY VOLTAGE
TERMINATION /
PACKAGING
ESR
TOLERANCE
AT -55 °C TO +200 °C
See Ratings This is expressed
K = 10 ꢀ
M = 20 ꢀ
This is expressed
in V. To complete the
three-digit block,
zeros precede the
voltage rating.
Gold
Maximum
100 kHz ESR
0500 = 500 m
5000 = 5
and Case
Codes table
in picofarads.
The first two
A = 7" (178 mm) reel
B = 13" (330 mm) reel
G = 7" (178 mm) ½ reel
Q = 7" (178 mm) partial reel
Other (1)
digits are the
significant
figures. The third
is the number
of zeros to follow.
10R0 = 10.0
Note
(1) Other termination on request
DIMENSIONS in inches [millimeters]
L
W
TW
H
TH
(MIN.)
Glue Pad
Glue Pad
P
CASE CODE
EIA SIZE
L
W
H
P
TW
TH (MIN.)
0.287 0.012
[7.3 0.30]
0.169 0.012
[4.3 0.30]
0.110 0.012
[2.8 0.30]
0.051 0.012
[1.3 0.30]
0.094 0.004
[2.4 0.10]
0.039
[1.0]
D
7343-31
0.287 0.012
[7.3 0.30]
0.170 0.012
[4.3 0.30]
0.158 0.012
[4.0 0.30]
0.051 0.012
[1.3 0.30]
0.095 0.004
[2.4 0.10]
0.039
[1.0]
E
7343-43
Note
Glue pad (non-conductive, part of molded case) is dedicated for glue attachment (as user option).
•
Note
TH5 series capacitors have been designed for, and tested at category voltage at +200 °C for 500 h.
As with all Tantalum capacitors, reliability and life time may be extended by application of lower voltage.
•
Revision: 28-Sep-16
Document Number: 40146
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TH5
Vishay Sprague
www.vishay.com
RATINGS AND CASE CODES
μF
4.7
10
5 V
8 V
21 V
24 V
E (2.50)
E (1.00, 0.50)
22
D (0.50), E (0.50)
100
E (0.25)
Note
•
ESR limit (in ) is shown in parenthesis.
CONSTRUCTION AND MARKING
Gold Termination
Capacitance Voltage
Epoxy
encapsulation
Silver
adhesive
Polarity bar
Date code
10u21
2
B1
Vishay marking
Anode
polarity bar
TH5 Standard Marking
Case Sizes “D” and “E”
Marking:
MnO2 / carbon /
Capacitor marking includes an anode (+) polarity band,
capacitance in microfarads and the voltage rating.
silver coating
Solderable anode
termination
Solderable
cathode
Leadframe
The Vishay identification is included if space permits. A
manufacturing date code is marked on all capacitors. Call
the factory for further explanation.
Sintered
tantalum
termination
STANDARD RATINGS
MAX. ESR
MAX. DCL
AT +25 °C
(μA)
TYPICAL DCL
AT +200 °C
(μA)
MAX. DF
AT +25 °C
(%)
MAX. RIPPLE
100 kHz
CAPACITANCE
(μF)
CASE
CODE
AT +25 °C
100 kHz
()
PART NUMBER
I
RMS (A)
5 VDC AT +200 °C
100
E
TH5E107(1)005(2)0250
5.0
300
8
0.250
0.81
8 VDC AT +200 °C
22
22
D
E
TH5D226(1)008(2)0500
TH5E226(1)008(2)0500
6.0
6.0
360
360
6
6
0.500
0.500
0.55
0.57
21 VDC AT +200 °C
10
10
E
E
TH5E106(1)021(2)1000
TH5E106(1)021(2)0500
2.1
2.1
120
120
6
6
1.000
0.500
0.41
0.57
24 VDC AT +200 °C
4.7
E
TH5E475(1)024(2)2500
1.1
60
10
2.500
0.26
Note
•
Part number definitions:
(1) Capacitance tolerance codes: K, M
(2) Terminations and packaging: A, B, G, Q
STANDARD PACKAGING QUANTITY
UNITS PER REEL
CASE CODE
13" FULL REEL
7" FULL REEL
7" HALF REEL
7" PARTIAL REEL
D
E
2500
1500
500
400
250
200
100
100
Note
•
TH5 series capacitors have been designed for, and tested at category voltage at +200 °C for 500 h.
As with all Tantalum capacitors, reliability and life time may be extended by application of lower voltage.
Revision: 28-Sep-16
Document Number: 40146
2
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
Vishay Sprague
www.vishay.com
Guide for Molded Tantalum Capacitors
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance / volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance / volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum / tantalum oxide / manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today's surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
COMPARISON OF CAPACITOR
DIELECTRIC CONSTANTS
e
DIELECTRIC
DIELECTRIC CONSTANT
Air or vacuum
Paper
1.0
2.0 to 6.0
2.1 to 6.0
2.2 to 2.3
2.7 to 2.8
3.8 to 4.4
4.8 to 8.0
5.1 to 5.9
5.4 to 8.7
8.4
Plastic
Mineral oil
Silicone oil
Quartz
Glass
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
Porcelain
Mica
Aluminum oxide
Tantalum pentoxide
Ceramic
THE BASICS OF TANTALUM CAPACITORS
26
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called
“valve”metals and include titanium, zirconium, niobium,
tantalum, hafnium, and aluminum. Only a few of these
permit the accurate control of oxide thickness by
electrochemical means. Of these, the most valuable for the
electronics industry are aluminum and tantalum.
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
12 to 400K
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
eA
C = ------
t
where
C = capacitance
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
Revision: 12-Sep-17
Document Number: 40074
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
Vishay Sprague
www.vishay.com
SOLID ELECTROLYTE TANTALUM CAPACITORS
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
They will typically withstand up to about 10 % of the rated
DC working voltage in a reverse direction. Also important
are their good low temperature performance characteristics
and freedom from corrosive electrolytes.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the Leadframe.
Vishay Sprague patented the original solid electrolyte
capacitors and was the first to market them in 1956. Vishay
Sprague has the broadest line of tantalum capacitors and
has continued its position of leadership in this field. Data
sheets covering the various types and styles of Vishay
Sprague capacitors for consumer and entertainment
electronics, industry, and military applications are available
where detailed performance characteristics must be
specified.
Molded Chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to assure long life and
reliability. It offers excellent reliability and high stability for
consumer and commercial electronics with the added
feature of low cost
Surface mount designs of “Solid Tantalum” capacitors use
lead frames or lead frameless designs as shown in the
accompanying drawings.
MOLDED CHIP CAPACITOR, ALL TYPES EXCEPT 893D / TF3 / T86
Epoxy
Encapsulation
Silver
Adhesive
Anode
Polarity Bar
MnO2/Carbon/
Silver Coating
Solderable Anode
Solderable
Cathode
Leadframe
Termination
Sintered
Tantalum
Termination
MOLDED CHIP CAPACITOR WITH BUILT-IN FUSE, TYPES 893D / TF3 / T86
Epoxy Encapsulation
Silver Adhesive
Anode Polarity Bar
Solderable Cathode
Termination
MnO2/Carbon/Silver
Coating
Sintered Tantalum
Fusible
Pellet
Wire
Solderable
Anode Termination
Lead Frame
Revision: 12-Sep-17
Document Number: 40074
2
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
Vishay Sprague
www.vishay.com
COMMERCIAL PRODUCTS
SOLID TANTALUM CAPACITORS - MOLDED CASE
793DX-CTC3-
SERIES
293D
593D
TR3
TP3
TL3
CTC4
PRODUCT IMAGE
TYPE
Surface mount TANTAMOUNT™, molded case
Standard
industrial grade
High performance,
automotive grade
FEATURES
CECC approved
Low ESR
Low ESR
Very low DCL
TEMPERATURE
RANGE
-55 °C to +125 °C
CAPACITANCE
RANGE
0.1 μF to 1000 μF 0.1 μF to 100 μF 1 μF to 470 μF
0.47 μF to 1000 μF
4 V to 75 V
0.1 μF to 470 μF 0.1 μF to 470 μF
VOLTAGE RANGE
4 V to 75 V
4 V to 50 V
4 V to 50 V
4 V to 50 V
4 V to 50 V
CAPACITANCE
TOLERANCE
10 %, 20 %
0.005 CV or
0.25 ꢀA,
whichever is
greater
LEAKAGE
CURRENT
0.01 CV or 0.5 ꢀA, whichever is greater
DISSIPATION
FACTOR
4 % to 30 %
4 % to 6 %
A, B, C, D
4 % to 15 %
A, B, C, D, E
4 % to 30 %
A, B, C, D, E, V, W
4 % to 15 %
A, B, C, D, E
4 % to 15 %
A, B, C, D, E
CASE CODES
TERMINATION
A, B, C, D, E, V
100 % matte tin standard, tin / lead available
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES
TH3
TH4
TH5
893D
TF3
PRODUCT IMAGE
TYPE
Surface mount TANTAMOUNT™, molded case
High temperature
+150 °C,
automotive grade
High temperature
+175 °C,
automotive grade
Very high temperature
+200 °C
Built-in fuse,
low ESR
FEATURES
Built-in fuse
TEMPERATURE
RANGE
-55 °C to +150 °C
-55 °C to +175 °C
-55 °C to +200 °C
-55 °C to +125 °C
CAPACITANCE
RANGE
VOLTAGE RANGE
0.33 μF to 220 μF
6.3 V to 50 V
10 μF to 100 μF
6.3 V to 35 V
4.7 μF to 100 μF
5 V to 24 V
0.47 μF to 680 μF
4 V to 50 V
0.47 μF to 470 μF
4 V to 50 V
CAPACITANCE
TOLERANCE
10 %, 20 %
LEAKAGE
CURRENT
0.01 CV or 0.5 ꢀA, whichever is greater
DISSIPATION
FACTOR
4 % to 8 %
A, B, C, D, E
4.5 % to 8 %
6 % to 10 %
D, E
6 % to 15 %
C, D, E
6 % to 15 %
C, D, E
CASE CODES
B, C, D, E
100 % matte tin
standard, tin / lead and
gold plated available
TERMINATION
100 % matte tin
Gold plated
100 % matte tin standard
Revision: 12-Sep-17
Document Number: 40074
3
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
Vishay Sprague
www.vishay.com
HIGH RELIABILITY PRODUCTS
SOLID TANTALUM CAPACITORS - MOLDED CASE
SERIES
TM3
T83
T86
CWR11
95158
PRODUCT
IMAGE
TANTAMOUNT™,
molded case,
Hi-Rel.
TANTAMOUNT™, molded case,
Hi-Rel. COTS
TANTAMOUNT™, molded case,
DLA approved
TYPE
High reliability,
High reliability,
built-in fuse,
High reliability,
for Medical
Instruments
MIL-PRF-55365/8
FEATURES
standard and
Low ESR
standard and
qualified
low ESR
low ESR
TEMPERATURE
RANGE
-55 °C to +125 °C
CAPACITANCE
1 μF to 220 μF
4 V to 20 V
0.1 μF to 470 μF 0.47 μF to 330 μF
4 V to 63 V
0.1 μF to 100 μF
4 V to 50 V
4.7 μF to 220 μF
10 %, 20 %
RANGE
VOLTAGE RANGE
CAPACITANCE
TOLERANCE
10 %, 20 %
5 %, 10 %, 20 %
LEAKAGE
CURRENT
0.005 CV or 0.25 μA,
whichever is greater
0.01 CV or 0.5 ꢀA, whichever is greater
DISSIPATION
4 % to 8 %
A, B, C, D, E
4 % to 15 %
A, B, C, D, E
6 % to 16 %
4 % to 6 %
A, B, C, D
4 % to 12 %
C, D, E
FACTOR
CASE CODES
TERMINATION
C, D, E
100 % matte tin;
tin / lead;
100 % matte tin;
tin / lead
Tin / lead;
tin / lead solder fused
Tin / lead solder plated;
gold plated
100 % matte tin
tin / lead
solder fused
Revision: 12-Sep-17
Document Number: 40074
4
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
Vishay Sprague
www.vishay.com
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 0.004
[4.0 0.10]
10 pitches cumulative
tolerance on tape
0.008 [0.200]
Tape thickness
0.014
[0.35]
MAX.
Deformation
between
embossments
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
0.069 0.004
[1.75 0.10]
0.079 0.002
Embossment
[2.0 0.05]
Top
cover
tape
A0
20°
0.030 [0.75]
MIN. (Note 3)
F
W
Maximum
component
rotation
B1 MAX.
(Note 6)
K0
B0
Top
0.030 [0.75]
cover
tape
MIN. (Note 4)
(Side or front sectional view)
0.004 [0.1]
MAX.
Center lines
of cavity
P1
For tape feeder
reference only
including draft.
Concentric around B
(Note 5)
D
1 MIN. for components
0.079 x 0.047 [2.0 x 1.2] and larger.
(Note 5)
USER DIRECTION OF FEED
Maximum
cavity size
(Note 1)
0
Cathode (-)
Anode (+)
Direction of Feed
Tape and Reel Specifications: all case sizes are available
on plastic embossed tape per EIA-481. Standard reel
diameter is 7" [178 mm], 13" [330 mm] reels are available and
recommended as the most cost effective packaging method.
3.937 [100.0]
0.039 [1.0]
MAX.
20° maximum
component rotation
Typical
component
cavity
Tape
B0
0.039 [1.0]
MAX.
The most efficient packaging quantities are full reel
increments on a given reel diameter. The quantities shown
allow for the sealed empty pockets required to be in
conformance with EIA-481. Reel size and packaging
orientation must be specified in the Vishay Sprague part
number.
center line
0.9843 [250.0]
Typical
component
center line
Camber
(top view)
A0
Allowable camber to be 0.039/3.937 [1/100]
non-cumulative over 9.843 [250.0]
(Top view)
Notes
•
(1)
Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
A0, B0, K0, are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°.
(2)
(3)
(4)
(5)
(6)
Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum.
This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less.
This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less.
The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of
embossement location shall be applied independent of each other.
B1 dimension is a reference dimension tape feeder clearance only.
CASE
CODE
TAPE
SIZE
B1
(MAX.)
D1
(MIN.)
K0
(MAX.)
F
P1
W
MOLDED CHIP CAPACITORS; ALL TYPES
A
B
C
D
E
0.165
[4.2]
0.039
[1.0]
0.138 0.002
[3.5 0.05]
0.094
[2.4]
0.157 0.004
[4.0 1.0]
0.315 0.012
[8.0 0.30]
8 mm
0.32
[8.2]
0.059
[1.5]
0.217 0.00
[5.5 0.05]
0.177
[4.5]
0.315 0.004
[8.0 1.0]
0.472 0.012
[12.0 0.30]
12 mm
V
W
Revision: 12-Sep-17
Document Number: 40074
5
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
Vishay Sprague
www.vishay.com
RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles.
Tp
TC - 5 °C
tp
Max. ramp-up rate = 3 °C/s
Max. ramp-down rate = 6 °C/s
TL
tL
Ts max.
Preheat area
Ts min.
ts
25
Time 25 °C to peak
TIME (s)
PROFILE FEATURE
Preheat / soak
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
Temperature min. (Ts min.
)
100 °C
150 °C
150 °C
200 °C
Temperature max. (Ts max.
)
Time (ts) from (Ts min. to Ts max.
Ramp-up
)
60 s to 120 s
60 s to 120 s
Ramp-up rate (TL to Tp)
Liquidus temperature (TL)
Time (tL) maintained above TL
3 °C/s max.
183 °C
3 °C/s max.
217 °C
60 s to 150 s
60 s to 150 s
Peak package body temperature (Tp)
Depends on case size - see table below
Time (tp) within 5 °C of the specified
classification temperature (TC)
20 s
30 s
Time 25 °C to peak temperature
Ramp-down
6 min max.
8 min max.
Ramp-down rate (Tp to TL)
6 °C/s max.
6 °C/s max.
PEAK PACKAGE BODY TEMPERATURE (Tp)
PEAK PACKAGE BODY TEMPERATURE (Tp)
CASE CODE
SnPb EUTECTIC PROCESS
235 °C
LEAD (Pb)-FREE PROCESS
260 °C
250 °C
A, B, C, V
D, E, W
220 °C
PAD DIMENSIONS in inches [millimeters]
D
C
B
A
A
B
C
D
CASE CODE
(MIN.)
(NOM.)
(NOM.)
(NOM.)
MOLDED CHIP CAPACITORS, ALL TYPES
A
B
C
D
E
0.071 [1.80]
0.118 [3.00]
0.118 [3.00]
0.157 [4.00]
0.157 [4.00]
0.157 [4.00]
0.185 [4.70]
0.067 [1.70]
0.071 [1.80]
0.094 [2.40]
0.098 [2.50]
0.098 [2.50]
0.098 [2.50]
0.098 [2.50]
0.053 [1.35]
0.065 [1.65]
0.118 [3.00]
0.150 [3.80]
0.150 [3.80]
0.150 [3.80]
0.150 [3.80]
0.187 [4.75]
0.207 [5.25]
0.307 [7.80]
0.346 [8.80]
0.346 [8.80]
0.346 [8.80]
0.346 [8.80]
V
W
Revision: 12-Sep-17
Document Number: 40074
6
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Molded Guide
Vishay Sprague
www.vishay.com
GUIDE TO APPLICATION
1.
AC Ripple Current: the maximum allowable ripple
be established when calculating permissible
operating levels. (Power dissipation calculated using
+25 °C temperature rise).
current shall be determined from the formula:
P
RESR
IRMS
=
------------
6.
Printed Circuit Board Materials: molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
where,
P =
power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
7.
Attachment:
7.1
Solder Paste: the recommended thickness of the
RESR = the capacitor equivalent series resistance at
the specified frequency
solder paste after application is 0.007"
0.001"
[0.178 mm 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat. In
practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
2.
AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
VRMS = IRMS x Z
or, from the formula:
P
VRMS = Z ------------
RESR
7.2
Soldering: capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering,
and hot plate methods. The soldering profile charts
show recommended time / temperature conditions
for soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per s.
where,
P =
power dissipation in W at +25 °C as given in
the tables in the product datasheets (Power
Dissipation).
Attachment with
a
soldering iron is not
RESR = the capacitor equivalent series resistance at
the specified frequency
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
Z =
the capacitor impedance at the specified
frequency
7.2.1 Backward and Forward Compatibility: capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
2.1
2.2
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+25 °C.
8.
Cleaning (Flux Removal) After Soldering: molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC / ODS products are not used in the production
of these devices and are not recommended.
Solvents containing methylene chloride or other
epoxy solvents should be avoided since these will
attack the epoxy encapsulation material.
3.
4.
Reverse Voltage: solid tantalum capacitors are not
intended for use with reverse voltage applied.
However, they have been shown to be capable of
withstanding momentary reverse voltage peaks of up
to 10 % of the DC rating at 25 °C and 5 % of the DC
rating at +85 °C.
8.1
9.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This
vibration can cause cracking or a decrease in the
adherence of the termination. DO NOT EXCEED 9W/l
at 40 kHz for 2 min.
Temperature Derating: if these capacitors are to be
operated at temperatures above +25 °C, the
permissible RMS ripple current shall be calculated
using the derating factors as shown:
Recommended Mounting Pad Geometries: proper
mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and /
or circuit board design.
TEMPERATURE (°C)
DERATING FACTOR
+25
+85
+125
+150 (1)
+175 (1)
+200 (1)
1.0
0.9
0.4
0.3
0.2
0.1
Note
(1)Applicable for dedicated high temperature product series
5.
Power Dissipation: power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
Revision: 12-Sep-17
Document Number: 40074
7
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Typical Performance Characteristics
www.vishay.com
Vishay Sprague
TH5 Tantalum Capacitors
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM
PERFORMANCE CHARACTERISTICS
Category temperature range
Category voltage
Capacitance tolerance
Dissipation factor
ESR
-55 °C to +200 °C
Category voltage is the same within entire temperature range and is equal to rated voltage
20 %, 10 %, tested via bridge method, at 25 °C, 120 Hz
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz
Leakage current
After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 kΩ
resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in
Standard Ratings table. Note that the leakage current varies with temperature and applied voltage.
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Life test
500 h application of rated voltage at 200 °C
Capacitance change
Dissipation factor
ESR
-30 % / +10 % of initially specified value
Not to exceed 150 % of initial
Not to exceed 125 % of initial
Not to exceed 1 mA (at 200 °C)
Leakage current
Moisture
resistance
Cycled, 20 cycles, MIL-STD-202, method 106
Capacitance change
Dissipation factor
Leakage current
15 % of initially specified value
Not to exceed 150 % of initial
Not to exceed 200 % of initial
Surge voltage
85 °C, 1000 cycles at 1.3 rated voltage in series
with 33 Ω resistor, MIL-PRF-55365
Capacitance change
Dissipation factor
Leakage current
5 % of initially specified value
Initial specified value or less
Initial specified value or less
Note
•
All measurements to be performed after 24 h conditioning at room temperature
MECHANICAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Terminal strength / Apply a pressure load of 17.7 N for 60 s
Capacitance change
Dissipation factor
Leakage current
Within 10 % of initial value
Initial specified limit
Initial specified limit
Shear force test
horizontally to the center of capacitor side body.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Vibration
MIL-STD-202, method 204, condition D,
10 Hz to 2000 Hz, 20 g peak
There shall be no mechanical or visual damage and the
components shall meet the original electrical requirements
Resistance
to solder heat
MIL-STD-202, method 210, condition K
Capacitance change
Dissipation factor
Leakage current
5 % of initially specified value
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Solderability
MIL-STD-202, method 208,
ANSI / J-STD-002, test B
Applies only to solder and tin plated terminations.
Does not apply to gold terminations.
All terminations shall exhibit a continuous solder coating free from
defects for a minimum of 95 % of the critical area of any individual
termination
Resistance
to solvents
MIL-STD-202, method 215
Marking has to remain legible, no degradation of encapsulation
material
Flammability
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %
Note
All measurements to be performed after 24 h conditioning at room temperature
•
Revision: 19-Jul-17
Document Number: 40206
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
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including but not limited to the warranty expressed therein.
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© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
Document Number: 91000
1
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