TM8L106M016EZB [VISHAY]
Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded; 固体钽电容器芯片MICROTANTM高可靠性，低DCL ， Leadframeless模压
| 型号： | TM8L106M016EZB |
| 厂家： | 
VISHAY |
| 描述： | Solid Tantalum Chip Capacitors MICROTANTM High Reliability, Low DCL, Leadframeless Molded |
| 文件： | 总10页 (文件大小：161K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TM8
Vishay Sprague
Solid Tantalum Chip Capacitors
TM
MICROTAN High Reliability, Low DCL, Leadframeless Molded
FEATURES
• High reliability solid surface mount tantalum
capacitors
• Low DCL for extended battery life
• Small sizes for space constrained applications
• L-shaped terminations for superior board
mounting
• Suitable for medical implantable applications with
additional screening
• Compliant to RoHS directive 2002/95/EC
PERFORMANCE CHARACTERISTICS
Operating Temperature: - 55 °C to + 85 °C
Capacitance Range: 1 µF to 47 µF
(to + 125 °C with voltage derating)
Capacitance Tolerance: 10 ꢀ and 20 ꢀ standard
Voltage Range: 2 WVDC to 40 WVDC
ORDERING INFORMATION
TM8
R
106
M
016
E
B
A
MODEL
CASE
CODE
CAPACITANCE
CAPACITANCE DC VOLTAGE RATING
TERMINATION/
PACKAGING
RELIABILITY
LEVEL
SURGE
CURRENT
TOLERANCE
AT + 85 °C
See
Ratings
and
Case
Codes
Table
This is expressed
in picofarads.
The first two
digits are the
significant
figures. The third
is the number of
zeros to follow.
K = 10 ꢀ
M = ꢀ0 ꢁ
This is expressed in
volts.
To complete the
three-digit block, zeros
precede the voltage
rating. A decimal point is
indicated by an “R”
(6R3 = 6.3 V).
E = Sn/Pb solder/
7" (178 mm) reels
B = 0.1 ꢁ
A = 10 cycles
at ꢀ5 °C
weibull FRL
R = Sn/Pb solder/ S = Hi-Rel std. B = 10 cycles at
7" (178 mm)
300 pcs. qty.
C = 100 ꢀ tin/
7" (178 mm) reels
U = 100 ꢀ tin/
7" (178 mm)
(40 h burn-in)
Z = Non-
established
reliability
- 55 °C/+ 85 °C
Z = None
300 pcs. qty.
Note
• Standard options are in bold
DIMENSIONS in inches [millimeters]
Anode Polarity Bar
Cathode Termination
Anode Termination
W
C
H
P1
Pꢀ
P1
L
CASE
L
W
H
P1
Pꢀ (REF.)
C
0.100 0.015
[2.54 0.38]
0.053 0.012
[1.35 0.30]
0.050 0.012
[1.27 0.30]
0.031 + 0.004/- 0.006
[0.80 + 0.1/- 0.15]
0.038 0.010
[0.96 0.25]
0.046 + 0.009/- 0.001
[1.17 + 0.23/- 0.025]
Q
0.150 0.015
[3.8 0.38]
0.100 0.015
[2.54 0.38]
0.050 0.012
[1.27 0.30]
0.031 + 0.004/- 0.006
[0.80 + 0.1/- 0.15]
0.088 0.010
[2.24 0.25]
0.091 + 0.009/- 0.001
[2.3 + 0.23/- 0.025]
D
E
F
K
0.201 0.015
[5.1 0.38]
0.100 0.015
[2.54 0.38]
0.050 0.012
[1.27 0.30]
0.031 + 0.004/- 0.006
[0.80 + 0.1/- 0.15]
0.139 0.010
[3.5 0.25]
0.091 + 0.009/- 0.001
[2.3 + 0.23/- 0.025]
0.220 0.015
[5.6 0.38]
0.138 0.012
[3.5 0.3]
0.050 0.012
[1.27 0.30]
0.039 0.005
[1.0 0.13]
0.142 0.010
[3.6 0.25]
0.126 + 0.009/- 0.001
[3.2 + 0.23/- 0.025]
0.045 0.002
[1.14 0.05]
0.026 0.002
[0.66 0.05]
0.024 max.
[0.61 max.]
0.010 0.004
[0.25 0.1]
0.020 min.
[0.51 min.]
0.015 0.004
[0.38 0.1]
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For technical questions, contact: tantalum@vishay.com
Document Number: 40133
Revision: 22-Jun-10
TM8
Solid Tantalum Chip Capacitors
MICROTANTM High Reliability, Low DCL,
Leadframeless Molded
Vishay Sprague
DIMENSIONS in inches [millimeters]
CASE
L
W
H
P1
Pꢀ (REF.)
C
0.081 0.008
[2.05 0.2]
0.051 0.004
[1.3 0.10]
0.04 max.
[1.0 max.]
0.020 0.004
[0.50 0.1]
0.027 min.
[0.70 min.]
0.035 + 0.009/- 001
[0.9+0.23/- 0.02]
L
0.063 0.006
[1.60 0.15]
0.033 0.006
[0.84 0.15]
0.033 0.006
[0.84 0.15]
0.020 0.004
[0.51 0.1]
0.019 min.
[0.48 min.]
0.024 0.004
[0.61 0.1]
M
N
P
0.138+0.004/-0.008
[3.505 + 0.101/- 0.203]
0.110 0.004
[2.80 0.1]
0.04 max.
[1.0 max.]
0.031 + 0.004/- 0.006
[0.80 + 0.1/- 0.15]
0.088 0.010
[2.24 0.25]
0.091 + 0.009/- 0.001
[2.3 + 0.23/- 0.025]
0.096 0.006
[2.45 0.15]
0.059 0.006
[1.5 0.15]
0.049 max.
[1.25 max.]
0.020 0.004
[0.51 0.1]
0.043 min.
[1.1 min.]
0.035 0.004
[0.90 0.1]
0.081 0.006
[2.06 0.15]
0.053 0.006
[1.35 0.15]
0.058 0.004
[1.47 0.10]
0.020 0.004
[0.51 0.1]
0.028 min.
[0.71 min.]
0.035 0.004
[0.90 0.1]
R
T
0.138+0.004/-0.008
[3.505 + 0.101/- 0.203]
0.110 0.004
[2.80 0.1]
0.06 max.
[1.52 max.]
0.031 + 0.004/- 0.006
[0.80 + 0.1/- 0.15]
0.088 0.010
[2.24 0.25]
0.091 + 0.009/- 0.001
[2.3 + 0.23/- 0.025]
0.081 0.006
[2.06 0.15]
0.053 0.006
[1.35 0.15]
0.047 max.
[1.2 max.]
0.020 0.004
[0.51 0.1]
0.028 min.
[0.71 min.]
0.035 0.004
[0.90 0.1]
W
RATINGS AND CASE CODES
F
1.0
2.2
3.3
4.7
7.5
10
6.3 V
10 V
16 V
ꢀ0 V
ꢀ5 V
40 V
M
M
W
R
P
R
M
L
P
N*
M
M
R
R
15
22
33
47
T
Note
* Preliminary values, contact factory for availability.
MARKING
P-Case
M-Case
Voltage Code
Polarity Bar
Polarity Bar
Voltage Capacitance
Code
Code
A
GJ
D, E, F, N, T-Case
K-Case
Capacitance
Voltage
XXX - XX
Polarity
band
Vishay logo
(if space allows)
Document Number: 40133
Revision: 22-Jun-10
For technical questions, contact: tantalum@vishay.com
www.vishay.com
39
TM8
Solid Tantalum Chip Capacitors
MICROTANTM High Reliability, Low DCL,
Leadframeless Molded
Vishay Sprague
STANDARD RATINGS
MAX. DC
MAX. ESR
AT + ꢀ5 °C
100 kHz STD.
(Ω)
MAX. DF
AT + ꢀ5 °C
(ꢁ)
CAPACITANCE
(µF)
CASE
CODE
LEAKAGE
PART NUMBER
AT + ꢀ5 °C
(µA)
6.3 WVDC AT + 85 °C, 4 WVDC AT + 1ꢀ5 °C
10
15
M
M
TM8M106(1)6R3(2)(3)(5)
TM8M156(1)6R3(2)(3)(5)
0.32
0.47
8
8
5.0
5.0
10 WVDC AT + 85 °C, 7 WVDC AT + 1ꢀ5 °C
1.0
4.7
7.5
10
M
M
L
TM8M105(1)010(2)(3)(5)
TM8M475(1)010(2)(3)(5)
TM8L755(1)010(2)(3)(5)
TM8R106(1)010(2)(3)(5)
TM8T476(1)010(2)(3)(5)
0.20
0.24
0.38
0.50
2.35
6
8
8
8
8
12.0
6.0
8.0
6.0
1.0
R
T
47
16 WVDC AT + 85 °C, 10 WVDC AT + 1ꢀ5 °C
1.0
10
M
R
TM8M105(1)016(2)(3)(5)
TM8R106(1)016(2)(3)(5)
0.20
0.80
6
8
12.0
6.0
ꢀ0 WVDC AT + 85 °C, 13 WVDC AT + 1ꢀ5 °C
1.0
3.3
7.5
W
R
TM8W105(1)020(2)(3)(5)
TM8R335(1)020(2)(3)(5)
TM8N755(1)020(2)(3)(5)*
0.20
0.33
0.93
8
8
8
8.0
8.0
8.0
N
ꢀ5 WVDC AT + 85 °C, 17 WVDC AT + 1ꢀ5 °C
1.0
4.7
R
P
TM8R105(1)025(2)(3)(5)
TM8P475(1)025(2)(3)(5)
0.20
0.59
6
6
10.0
6.0
40 WVDC AT + 85 °C, ꢀ7 WVDC AT + 1ꢀ5 °C
TM8P105(1)040(2)(3)(5) 0.20
1.0
P
8
10.0
Notes
(1) Capacitance tolerance: K, M
(2) Termination and Packaging: E, C
(3) Reliability level: Z, S, B
(4) Reliability level: Z only
(5) Surge current: Z, A, B
(6) Surge current: Z only
* Preliminary ratings: contact factory for availability
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For technical questions, contact: tantalum@vishay.com
Document Number: 40133
Revision: 22-Jun-10
TM8
Solid Tantalum Chip Capacitors
MICROTANTM High Reliability, Low DCL,
Leadframeless Molded
Vishay Sprague
CAPACITORS PERFORMANCE CHARACTERISTICS
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM
PERFORMANCE CHARACTERISTICS
Category Temperature Range
Capacitance Tolerance
Dissipation Factor (at 120 Hz)
ESR (100 kHz)
- 55 °C to + 85 °C (to + 125 °C with voltage derating)
20 ꢀ, 10 ꢀ (at 120 Hz) 1 Vrms at + 25 °C using a capacitance bridge
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz.
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz.
After application of rated voltage applied to capacitors for 5 minutes using a steady source of power with
1 kΩ resistor in series with the capacitor under test, leakage current at 25 °C is not more than described
in Standard Ratings Table. Note that the leakage current varies with temperature and applied voltage. See
graph below for the appropriate adjustment factor.
Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 ꢀ of the DC
rating at + 25 °C or 5 ꢀ of the DC rating at + 85 °C.
Leakage Current
Reverse Voltage
Vishay does not recommended intentional or repetitive application of reverse voltage.
If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or voltage
shall be calculated using the derating factors:
Temperature Derating
1.0 at + 25 °C
0.9 at + 85 °C
0.4 at + 125 °C
+ 85 °C RATING
+ 1ꢀ5 °C RATING
WORKING VOLTAGE (V)
WORKING VOLTAGE (V)
2
4
1.3
2.7
4
6.3
10
15
16
20
25
40
Operating Temperature
7
10
10
13
17
27
TYPICAL LEAKAGE CURRENT FACTOR RANGE
100
+ 1ꢀ5 °C
+ 85 °C
10
1.0
+ 55 °C
+ ꢀ5 °C
0 °C
0.1
- 55 °C
0.01
0.001
0
10
ꢀ0
30
40
50
60
70
80
90
100
PERCENT OF RATED VOLTAGE
Notes
• At + ꢀ5 °C, the leakage current shall not exceed the value listed in the Standard Ratings table
• At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table
• At + 1ꢀ5 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table
Document Number: 40133
Revision: 22-Jun-10
For technical questions, contact: tantalum@vishay.com
www.vishay.com
41
TM8
Solid Tantalum Chip Capacitors
MICROTANTM High Reliability, Low DCL,
Leadframeless Molded
Vishay Sprague
TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“M” Case
“M” Case
1000
100
10
1000
100
10
IMPEDANCE
ESR
IMPEDANCE
ESR
4.7 µF - 10 V
1
10 µF - 6 V
100
1
0.1
0.1
1
10
100
1000
0.1
1
10
1000
FREQUENCY, kHz
FREQUENCY, kHz
“M” Case
“P” CASE
10 000
1000.0
100.0
IMPEDANCE
ESR
IMPEDANCE
ESR
1000
100
10
10.0
1.0
1 µF - 16 V
4.7 µF - ꢀ5 V
100
1
0.1
0.1
0.1
1
10
100
1000
1000
10
1
FREQUENCY, kHz
FREQUENCY, kHz
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For technical questions, contact: tantalum@vishay.com
Document Number: 40133
Revision: 22-Jun-10
TM8
Solid Tantalum Chip Capacitors
MICROTANTM High Reliability, Low DCL,
Leadframeless Molded
Vishay Sprague
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 0.004
[4.0 0.10]
10 pitches cumulative
tolerance on tape
0.008 [0.ꢀ00]
Tape Thickness
0.014
[0.35]
MAX.
Deformation
Between
Embossments
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
Embossment
0.069 0.004
[1.75 0.10]
0.079 0.00ꢀ
[ꢀ.0 0.05]
Top
Cover
Tape
A0
ꢀ0°
0.030 [0.75]
MIN. (Note 3)
F
W
Maximum
Component
Rotation
B
1 MAX.
K0
(Note 6)
B0
Top
Cover
Tape
0.030 [0.75]
MIN. (Note 4)
(Side or Front Sectional View)
0.004 [0.1]
MAX.
Center Lines
of Cavity
P1
For Tape Feeder
Reference only
including draft.
Concentric around B
(Note 5)
D1 MIN. For Components
0.079 x 0.047 [ꢀ.0 x 1.ꢀ] and Large.r
Maximum (Note 5)
Cavity Size
USER DIRECTION OF FEED
0
(Note 1)
Cathode (-)
Anode (+)
Direction of Feet
Tape and Reel Specifications: All case sizes are available on
plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3
is also available. Standard reel diameter is 7" [178 mm],
13" [330 mm] reels are available and recommended as the most
cost effective packaging method.
3.937 [100.0]
0.039 [1.0]
MAX.
ꢀ0° Maximum
Component Rotation
Typical
Component
Cavity
Tape
B0
0.039 [1.0]
MAX.
Center Line
The most efficient packaging quantities are full reel increments on
a given reel diameter. The quantities shown allow for the sealed
empty pockets required to be in conformance with EIA-481-1. Reel
size and packaging orientation must be specified in the Vishay
Sprague part number.
0.9843 [ꢀ50.0]
Typical
Component
Center Line
Camber
(Top View)
A0
(Top View)
Allowable Camber to be 0.039/3.937 [1/100]
Non-Cumulative Over 9.843 [ꢀ50.0]
Note
Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
B1
(MAX.)
D1
(MIN.)
K0
(MAX.)
CASE
CODE
TAPE
SIZE
P1
F
W
TM8
0.108
(2.75)
0.135
(3.43)
0.094
(2.4)
0.039
(1.0)
0.039
(1.0)
0.039
(1.0)
0.138
(3.5)
0.138
(3.5)
0.138
(3.5)
0.054
(1.37)
0.065
(1.65)
0.047
(1.2)
0.157
(4.0)
0.157
(4.0)
0.157
(4.0)
0.315
(8.0)
0.315
(8.0)
0.315
(8.0)
P
8 mm
8 mm
Q
L
8 mm
0.112
(2.85)
0.112
(2.85)
0.154
(3.9)
0.235
(5.97)
0.231
(5.88)
0.150
(3.8)
0.150
(3.8)
0.039
(1.0)
0.039
(1.0)
0.059
(1.5)
0.059
(1.5)
0.059
(1.5)
0.059
(1.5)
0.059
(1.5)
0.138
(3.5)
0.138
(3.5)
0.216
(5.5)
0.216
(5.5)
0.216
(5.5)
0.216
(5.5)
0.216
(5.5)
0.066
(1.68)
0.053
(1.35)
0.051
(1.3)
0.070
(1.78)
0.060
(1.53)
0.047
(1.2)
0.063
(1.60)
0.157
(4.0)
0.157
(4.0)
0.157
(4.0)
0.157
(4.0)
0.157
(4.0)
0.157
(4.0)
0.157
(4.0)
0.315
(8.0)
0.315
(8.0)
0.472
(12.0)
0.472
(12.0)
0.472
(12.0)
0.472
(12.0)
0.472
(12.0)
R
W
D
E
F
8 mm
8 mm
12 mm
12 mm
12 mm
12 mm
12 mm
N
T
Document Number: 40133
Revision: 22-Jun-10
For technical questions, contact: tantalum@vishay.com
www.vishay.com
43
TM8
Solid Tantalum Chip Capacitors
MICROTANTM High Reliability, Low DCL,
Leadframeless Molded
Vishay Sprague
PAPER TAPE AND REEL PACKAGING in inches [millimeters]
[10 pitches cumulative tolerance
on tape 0.ꢀ mm]
Pꢀ
T
E1
Ø D0
P0
A0
F
Bottom Cover
Tape
W
B0
Eꢀ
Top
Cover Tape
Anode
P1
Bottom Cover Tape
G
Cavity Center Lines
Cavity Size
Note 1
User Feed Direction
TM8
CASE TAPE
SIZE SIZE
A0
B0
D0
P0
P1
Pꢀ
E
F
W
T
0.033 0.002 0.053 0.002 0.06 0.004 0.157 0.004 0.078 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.03 0.002
K
8 mm
8 mm
[0.85 0.05] [1.35 0.05] [1.5 0.1]
[4.0 0.1]
[2.0 0.1]
[2.0 0.05] [1.75 0.1]
[3.5 0.05]
[8.0 0.2] [0.75 0.05]
0.041 0.002 0.071 0.002 0.06 0.004 0.157 0.004 0.157 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.037 0.002
M
[1.05 0.05] [1.8 0.05]
[1.5 0.1]
[4.0 0.1]
[4.0 0.1]
[2.0 0.05] [1.75 0.1]
[3.5 0.05]
[8.0 0.2] [0.95 0.05]
STANDARD PACKAGING QUANTITY
QTY (PCS/REEL)
1/ꢀ REEL
2500
SERIES
CASE CODE
7" REEL
5000
4000
3000
4000
2500
2500
2500
2500
2500
2500
2500
2500
SMALL REEL
300
K
M
P
Q
D
E
F
2000
300
1500
300
2000
300
1250
300
1250
300
TM8
1250
300
L
1250
300
N
R
T
1250
300
1250
300
1250
300
W
1250
300
POWER DISSIPATION
MAXIMUM PERMISSIBLE
POWER DISSIPATION AT + ꢀ5 °C (W) IN FREE AIR
SERIES
CASE CODE
K
M
P
Q
D
E
F
0.015
0.025
0.045
0.045
0.084
0.090
0.110
0.035
0.075
0.045
0.084
0.040
TM8
L
N
R
T
W
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For technical questions, contact: tantalum@vishay.com
Document Number: 40133
Revision: 22-Jun-10
TM8
Solid Tantalum Chip Capacitors
MICROTANTM High Reliability, Low DCL,
Leadframeless Molded
Vishay Sprague
RECOMMENDED REFLOW PROFILES
Tp °C
(tp)
TL °C
Ts MAX. °C
Ts MAX. °C
(tL)
Preheat (ts)
ꢀ5 °C
t, s
All Case Codes
TP
lead (Pb)-free Sn/Pb
260 °C 225 °C 10
TP
TL
TL
TS MIN.
TSMIN.
TS MAX.
TS MAX.
tS
tS
TYPE
TM8
tP
tL
lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb
217 °C
183 °C
150 °C
100 °C
200 °C
150 °C
60 to 150
60 to 90 60
PAD DIMENSIONS in inches [millimeters]
D
C
B
A
A
B
C
D
CASE CODE
(MIN.)
(NOM.)
(NOM.)
(NOM.)
TM8
K
M
P
Q
D
E
F
0.028 (0.70)
0.039 (1.00)
0.063 (1.60)
0.065 (1.60)
0.115 (2.90)
0.115 (2.90)
0.150 (3.80)
0.059 (1.50)
0.118 (3.00)
0.059 (1.50)
0.118 (3.00)
0.059 (1.50)
0.018 (0.45)
0.028 (0.70)
0.031 (0.80)
0.050 (1.30)
0.070 (1.80)
0.070 (1.80)
0.070 (1.80)
0.031 (0.80)
0.067 (1.70)
0.031 (0.80)
0.067 (1.70)
0.031 (0.80)
0.024 (0.60)
0.24 (0.60)
0.059 (1.50)
0.080 (2.00)
0.110 (2.80)
0.142 (3.60)
0.213 (5.40)
0.260 (6.60)
0.283 (7.20)
0.102 (2.60)
0.185 (4.70)
0.102 (2.60)
0.185 (4.70)
0.102 (2.60)
0.047 (1.20)
0.040 (1.00)
0.070 (1.80)
0.120 (3.00)
0.140 (3.60)
0.039 (1.00)
0.051 (1.30)
0.039 (1.00)
0.051 (1.30)
0.039 (1.00)
L
N
R
T
W
Document Number: 40133
Revision: 22-Jun-10
For technical questions, contact: tantalum@vishay.com
www.vishay.com
45
TM8
Solid Tantalum Chip Capacitors
MICROTANTM High Reliability, Low DCL,
Leadframeless Molded
Vishay Sprague
6.
Printed Circuit Board Materials: Molded capacitors
GUIDE TO APPLICATION
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
1.
A-C Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
P
7.
Attachment:
I
=
---------------
rms
R
ESR
7.1
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" 0.001"
[0.178 mm 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
where,
P =
Power dissipation in watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series resistance
at the specified frequency.
RESR
=
2.
A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
P
7.2
Soldering: Capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time/temperature conditions for
soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
V
= Z ---------------
rms
R
ESR
or, from the formula:
= I
V
× Z
rms
rms
where,
P =
Power dissipation in watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series resistance
at the specified frequency.
RESR
Z =
=
7.2.1 Backward and Forward Compatibility: Capacitors
with SnPb or 100 ꢀ tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
The capacitor impedance at the specified
frequency.
2.1
2.2
3.
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
8.
Cleaning (Flux Removal) After Soldering: Molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack the
epoxy encapsulation material.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 ꢀ of the DC working voltage at + 25 °C.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 ꢀ of the DC rating at + 25 °C, 5 ꢀ of the DC
rating at + 85 °C and 1 ꢀ of the DC rating at + 125 °C.
8.1
9.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l at 40 kHz for
2 minutes.
4.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
TEMPERATURE
+ 25 °C
DERATING FACTOR
Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for successful
solder connections. These dimensions are highly
process sensitive and should be designed to
minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and/or
circuit board design.
1.0
0.9
0.4
+ 85 °C
+ 125 °C
5.
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25 °C temperature
rise.)
www.vishay.com
46
For technical questions, contact: tantalum@vishay.com
Document Number: 40133
Revision: 22-Jun-10
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
www.vishay.com
1
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