TM8R106K010UBA [VISHAY]
CAPACITOR, TANTALUM, SOLID, POLARIZED, 10 V, 10 uF, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT;型号: | TM8R106K010UBA |
厂家: | VISHAY |
描述: | CAPACITOR, TANTALUM, SOLID, POLARIZED, 10 V, 10 uF, SURFACE MOUNT, 0805, CHIP, ROHS COMPLIANT 电容器 |
文件: | 总18页 (文件大小:424K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TM8
Vishay Sprague
www.vishay.com
Solid Tantalum Chip Capacitors
M
ICROTAN® High Reliability, Low DC Leakage, Leadframeless Molded
FEATURES
• High reliability solid surface mount tantalum
capacitors
Available
• Low DC leakage for extended battery life
Available
• Small sizes for space constrained applications
• L-shaped face-down terminations for superior board
mounting
• Suitable for medical implantable applications with
additional screening
PERFORMANCE CHARACTERISTICS
www.vishay.com/doc?40170
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
Note
*
Operating Temperature: -55 °C to +125 °C
(above 85 °C, voltage derating is required)
This datasheet provides information about parts that are
RoHS-compliant and / or parts that are non RoHS-compliant. For
example, parts with lead (Pb) terminations are not RoHS-compliant.
Please see the information / tables in this datasheet for details
Capacitance Range: 0.33 μF to 47 μF
Capacitance Tolerance: 10 ꢀ and 20 ꢀ standard
Voltage Range: 2 VDC to 40 VDC
ORDERING INFORMATION
TM8
R
106
M
016
E
B
A
MODEL CASE CAPACITANCE CAPACITANCE
DC VOLTAGE
RATING AT +85 °C
TERMINATION /
PACKAGING
RELIABILITY
LEVEL
SURGE
CURRENT
CODE
TOLERANCE
See
Ratings
and
Case
Codes
table
This is
expressed in
picofarads.
The first two
digits are the
significant
figures. The
third is the
number of
zeros to
K = 10 ꢀ
M = ꢀ0 ꢁ
This is expressed
in volts. To complete
the three-digit block,
zeros precede the
voltage rating.
A decimal point is
indicated by an “R”
(6R3 = 6.3 V).
Sn / Pb solder
E = 7" (178 mm) reels
L = 7" (178 mm) reels,
½ reel
R = 7" (178 mm)
300 pcs. qty.
B = 0.1 ꢁ
weibull FRL
S = hi-rel std. B = 10 cycles
(40 h burn-in)
Z = non-
A = 10 cycles
at ꢀ5 °C
at -55 °C /
+85 °C
Z = none
established
reliability
100 ꢁ tin
C = 7" (178 mm) reels
H = 7" (178 mm) reels,
½ reel
follow.
U = 7" (178 mm)
300 pcs. qty.
Gold
A = 7" (178 mm) reels
G = 7" (178 mm) reels,
½ reel
P = 7" (178 mm)
300 pcs. qty.
Revision: 09-Mar-17
Document Number: 40133
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TM8
Vishay Sprague
www.vishay.com
DIMENSIONS in inches [millimeters]
Anode Polarity Bar
Cathode Termination
Anode Termination
W
C
H
P1
P2
P1
L
CASE CODE
L
W
H
P1
Pꢀ (REF.)
C
0.045 0.002
[1.14 0.05]
0.026 0.002
[0.66 0.05]
0.024 max.
[0.61 max.]
0.010 0.004
[0.25 0.1]
0.020 min.
[0.51 min.]
0.015 0.004
[0.38 0.1]
K
0.063 0.006
[1.60 0.15]
0.033 0.006 0.033 0.006
0.020 0.004
[0.51 0.1]
0.019 min.
[0.48 min.]
0.024 0.004
[0.61 0.1]
M
G
W
R
P
[0.84 0.15]
[0.84 0.15]
0.063 0.006
[1.60 0.15]
0.033 0.006
[0.84 0.15]
0.047 max.
[1.2 max.]
0.020 0.004
[0.51 0.1]
0.019 min.
[0.48 min.]
0.024 0.004
[0.61 0.1]
0.081 0.006
[2.06 0.15]
0.053 0.006
[1.35 0.15]
0.047 max.
[1.2 max.]
0.020 0.004
[0.51 0.1]
0.028 min.
[0.71 min.]
0.035 0.004
[0.90 0.1]
0.081 0.006
[2.06 0.15]
0.053 0.006 0.058 0.004
0.020 0.004
[0.51 0.1]
0.028 min.
[0.71 min.]
0.035 0.004
[0.90 0.1]
[1.35 0.15]
[1.47 0.10]
0.096 0.006
[2.45 0.15]
0.059 0.006
[1.5 0.15]
0.049 max.
[1.25 max.]
0.020 0.004
[0.51 0.1]
0.043 min.
[1.1 min.]
0.035 0.004
[0.90 0.1]
0.126 0.008
[3.2 0.2]
0.063 0.008
[1.6 0.2]
0.071 max.
[1.8 max.]
0.031 0.004
[0.8 0.1)
0.063 min.
[1.60 min.]
0.047 0.004
[1.2 0.1]
A
0.138 0.004
[3.5 0.1]
0.110 0.004
[2.80 0.1]
0.047 max.
[1.2 max.]
0.0335 0.004
[0.85 0.1]
0.065 min.
[1.65 min.]
0.094 0.004
[2.4 0.10]
N
T
0.138 + 0.004 / - 0.008 0.110 0.004
[3.505 + 0.101 / - 0.203] [2.80 0.10]
0.063 max.
[1.57 max.]
0.031 + 0.004 / - 0.006 0.088 0.010 0.091 + 0.009 / - 0.001
[0.80 + 0.1 / - 0.15]
[2.24 0.25]
[2.3 + 0.23 / - 0.025]
RATINGS AND CASE CODES
μF
0.33
0.68
1.0
2.2
3.3
4.7
6.8
7.5
10
ꢀ V
4 V
6.3 V
10 V
16 V
ꢀ0 V
ꢀ5 V
40 V
K
M
K
K
M
M
M
M
R
M / W
R
P
P
M
M
M / G
M
R
R
R
W
N
A
K
M
M
M
R
R / A
15
M / R
R
22
A
33
P
P
P
47
P / T
T
Revision: 09-Mar-17
Document Number: 40133
ꢀ
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TM8
Vishay Sprague
www.vishay.com
MARKING
K-Case
M, G-Case
P, R, W-Case
Polarity bar
Voltage code
Polarity bar
Polarity bar
Voltage Capacitance
code
code
A
CW
A-Case
N, T-Case
Polarity bar Capacitance Voltage
Voltage Capacitance
Polarity bar
code code
47 10
A226
Vishay marking
(if space allows)
2
VOLTAGE CODE
CAPACITANCE CODE
V
CODE
CAP, μF
0.68
1.0
CODE
6.3
10
16
20
25
40
J
A
C
D
E
g
w
A
J
2.2
3.3
N
S
W
X
a
4.7
6.8
7.5
10
15
e
22
j
47
s
STANDARD RATINGS
MAX. ESR
MAX. DCL
AT +ꢀ5 °C
(μA)
MAX. DF
AVAILABLE
RELIABILITY
LEVELS
CAPACITANCE
(μF)
CASE
CODE
AT +ꢀ5 °C
100 kHz STD.
()
PART NUMBER
AT +ꢀ5 °C
(ꢁ)
ꢀ VDC AT +85 °C; 1.4 VDC AT +1ꢀ5 °C
10
K
TM8K106M002(2)(4)(6)
0.50
20
20.0
Z
4 VDC AT +85 °C; ꢀ.7 VDC AT +1ꢀ5 °C
1.0
10
15
33
47
K
M
M
P
TM8K105(1)004(2)(3)(6)
0.20
0.20
0.30
0.66
0.94
8
8
20.0
5.0
5.0
6.0
3.0
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
TM8M106(1)004(2)(3)(5)
TM8M156(1)004(2)(3)(5)
TM8P336(1)004(2)(3)(5)
TM8P476(1)004(2)(3)(5)
8
30
22
P
Note
•
Part number definitions:
(1) Capacitance tolerance: K, M
(2) Termination and packaging: E, L, R, C, H, U, A, G, P
(3) Reliability level: Z, S, B
(4) Reliability level: Z only
(5) Surge current: Z, A, B
(6) Surge current: Z only
Revision: 09-Mar-17
Document Number: 40133
3
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TM8
Vishay Sprague
www.vishay.com
STANDARD RATINGS
MAX. ESR
MAX. DCL
AT +ꢀ5 °C
(μA)
MAX. DF
AT +ꢀ5 °C
(ꢁ)
AVAILABLE
RELIABILITY
LEVELS
CAPACITANCE
(μF)
CASE
CODE
AT +ꢀ5 °C
100 kHz STD.
()
PART NUMBER
6.3 VDC AT +85 °C; 4 VDC AT +1ꢀ5 °C
1.0
3.3
4.7
10
15
15
33
47
47
K
M
M
M
M
R
TM8K105(1)6R3(2)(3)(6)
0.20
0.20
0.20
0.32
0.47
0.47
1.00
1.50
1.50
8
8
20.0
6.0
6.0
5.0
5.0
5.0
6.0
3.0
0.5
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
TM8M335(1)6R3(2)(3)(5)
TM8M475(1)6R3(2)(3)(5)
TM8M106(1)6R3(2)(3)(5)
TM8M156(1)6R3(2)(3)(5)
TM8R156(1)6R3(2)(3)(5)
TM8P336(1)6R3(2)(3)(5)
TM8P476(1)6R3(2)(3)(5)
TM8T476(1)6R3(2)(3)(5)
8
8
8
8
P
30
22
8
P
T
10 VDC AT +85 °C; 7 VDC AT +1ꢀ5 °C
1.0
2.2
3.3
4.7
3.3
7.5
6.8
10
M
M
M
M
G
W
R
TM8M105(1)010(2)(3)(5)
0.20
0.20
0.20
0.24
0.20
0.38
0.34
0.50
0.75
1.10
2.35
6
10
8
12.0
10.0
6.0
6.0
6.0
8.0
6.0
6.0
5.0
1.5
1.0
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
TM8M225(1)010(2)(3)(5)
TM8M335(1)010(2)(3)(5)
TM8M475(1)010(2)(3)(5)
TM8G335(1)010(2)(3)(5)
TM8W755(1)010(2)(3)(5)
TM8R685(1)010(2)(3)(5)
TM8R106(1)010(2)(3)(5)
TM8R156(1)010(2)(3)(5)
TM8A226(1)010(2)(3)(5)
TM8T476(1)010(2)(3)(5)
8
8
8
6
R
8
15
R
8
22
A
8
47
T
8
16 VDC AT +85 °C; 10 VDC AT +1ꢀ5 °C
1.0
2.2
3.3
6.8
10
M
M
R
R
R
A
TM8M105(1)016(2)(3)(5)
0.20
0.20
0.26
0.54
0.80
0.80
6
10
8
12.0
10.0
8.0
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
TM8M225(1)016(2)(3)(5)
TM8R335(1)016(2)(3)(5)
TM8R685(1)016(2)(3)(5)
TM8R106(1)016(2)(3)(5)
TM8A106(1)016(2)(3)(5)
6
6.0
8
6.0
10
8
3.0
ꢀ0 VDC AT +85 °C; 13 VDC AT +1ꢀ5 °C
0.33
0.68
1.0
1.0
3.3
7.5
10
K
M
M
W
R
TM8K334(1)020(2)(3)(6)
0.20
0.20
0.20
0.20
0.33
0.75
1.00
6
6
6
8
8
8
8
100.0
20.0
12.0
8.0
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
Z, S, B
TM8M684(1)020(2)(3)(5)
TM8M105(1)020(2)(3)(5)
TM8W105(1)020(2)(3)(5)
TM8R335(1)020(2)(3)(5)
TM8N755(1)020(2)(3)(5)
TM8A106(1)020(2)(3)(5)
8.0
N
A
6.0
3.0
ꢀ5 VDC AT +85 °C; 17 VDC AT +1ꢀ5 °C
1.0
4.7
R
P
TM8R105(1)025(2)(3)(5)
TM8P475(1)025(2)(3)(5)
0.20
0.59
6
6
10.0
6.0
Z, S, B
Z, S, B
40 VDC AT +85 °C; ꢀ7 VDC AT +1ꢀ5 °C
TM8P105(1)040(2)(3)(5) 0.20
1.0
P
8
10.0
Z, S, B
Note
•
Part number definitions:
(1) Capacitance tolerance: K, M
(2) Termination and packaging: E, L, R, C, H, U, A, G, P
(3) Reliability level: Z, S, B
(4) Reliability level: Z only
(5) Surge current: Z, A, B
(6) Surge current: Z only
Revision: 09-Mar-17
Document Number: 40133
4
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TM8
Vishay Sprague
www.vishay.com
TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“M” Case
“M” Case
1000
100
10
1000
100
10
IMPEDANCE
ESR
IMPEDANCE
ESR
4.7 μF - 10 V
1
10 μF - 6 V
100
1
0.1
0.1
1
10
100
1000
0.1
1
10
1000
FREQUENCY, kHz
FREQUENCY, kHz
“P” Case
“M” Case
1000.0
100.0
10 000
IMPEDANCE
ESR
IMPEDANCE
ESR
1000
100
10
10.0
1.0
1 μF - 16 V
4.7 μF - 25 V
1
0.1
0.1
0.1
1000
10
100
1
1
10
100
1000
FREQUENCY, kHz
FREQUENCY, kHz
STANDARD PACKAGING QUANTITY
QUANTITY (PCS/REEL)
CASE CODE
7" REEL
½ REEL
2500
2000
1500
1250
1250
1500
1000
1250
1250
PARTIAL REEL
K
M
G
W
R
P
5000
4000
3000
2500
2500
3000
2000
2500
2500
300
300
300
300
300
300
300
300
300
A
N
T
Revision: 09-Mar-17
Document Number: 40133
5
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TM8
Vishay Sprague
www.vishay.com
POWER DISSIPATION
MAXIMUM PERMISSIBLE
POWER DISSIPATION AT +ꢀ5 °C (W) IN FREE AIR
CASE CODE
K
M
G
W
R
P
0.015
0.025
0.025
0.040
0.045
0.045
0.075
0.075
0.084
A
N
T
PRODUCT INFORMATION
Micro Guide
Pad Dimensions
www.vishay.com/doc?40115
Packaging Dimensions
Moisture Sensitivity
www.vishay.com/doc?40135
www.vishay.com/doc?40170
Typical Performance Characteristics
SELECTOR GUIDES
Solid Tantalum Selector Guide
Solid Tantalum Chip Capacitors
FAQ
www.vishay.com/doc?49053
www.vishay.com/doc?40091
Frequently Asked Questions
www.vishay.com/doc?40110
Revision: 09-Mar-17
Document Number: 40133
6
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Micro Guide
Vishay Sprague
www.vishay.com
Guide for Leadframeless Molded Tantalum Capacitors
Rating for rating, tantalum capacitors tend to have as much
as three times better capacitance / volume efficiency than
aluminum electrolytic capacitors. An approximation of the
capacitance / volume efficiency of other types of capacitors
may be inferred from the following table, which shows the
dielectric constant ranges of the various materials used in
each type. Note that tantalum pentoxide has a dielectric
constant of 26, some three times greater than that of
aluminum oxide. This, in addition to the fact that extremely
thin films can be deposited during the electrolytic process
mentioned earlier, makes the tantalum capacitor extremely
efficient with respect to the number of microfarads available
per unit volume. The capacitance of any capacitor is
determined by the surface area of the two conducting
plates, the distance between the plates, and the dielectric
constant of the insulating material between the plates.
INTRODUCTION
Tantalum electrolytic capacitors are the preferred choice in
applications where volumetric efficiency, stable electrical
parameters, high reliability, and long service life are primary
considerations. The stability and resistance to elevated
temperatures of the tantalum / tantalum oxide / manganese
dioxide system make solid tantalum capacitors an
appropriate choice for today’s surface mount assembly
technology.
Vishay Sprague has been a pioneer and leader in this field,
producing a large variety of tantalum capacitor types for
consumer, industrial, automotive, military, and aerospace
electronic applications.
Tantalum is not found in its pure state. Rather, it is
commonly found in a number of oxide minerals, often in
combination with Columbium ore. This combination is
known as “tantalite” when its contents are more than
one-half tantalum. Important sources of tantalite include
Australia, Brazil, Canada, China, and several African
countries. Synthetic tantalite concentrates produced from
tin slags in Thailand, Malaysia, and Brazil are also a
significant raw material for tantalum production.
COMPARISON OF CAPACITOR DIELECTRIC
CONSTANTS
e
DIELECTRIC
DIELECTRIC CONSTANT
Air or Vacuum
Paper
1.0
Electronic applications, and particularly capacitors,
consume the largest share of world tantalum production.
Other important applications for tantalum include cutting
tools (tantalum carbide), high temperature super alloys,
chemical processing equipment, medical implants, and
military ordnance.
2.0 to 6.0
2.1 to 6.0
2.2 to 2.3
2.7 to 2.8
3.8 to 4.4
4.8 to 8.0
5.1 to 5.9
5.4 to 8.7
8.4
Plastic
Mineral Oil
Silicone Oil
Quartz
Vishay Sprague is a major user of tantalum materials in the
form of powder and wire for capacitor elements and rod and
sheet for high temperature vacuum processing.
Glass
Porcelain
Mica
THE BASICS OF TANTALUM CAPACITORS
Aluminum Oxide
Tantalum Pentoxide
Ceramic
Most metals form crystalline oxides which are
non-protecting, such as rust on iron or black oxide on
copper. A few metals form dense, stable, tightly adhering,
electrically insulating oxides. These are the so-called “valve”
metals and include titanium, zirconium, niobium, tantalum,
hafnium, and aluminum. Only a few of these permit the
accurate control of oxide thickness by electrochemical
means. Of these, the most valuable for the electronics
industry are aluminum and tantalum.
26
12 to 400K
In the tantalum electrolytic capacitor, the distance between
the plates is very small since it is only the thickness of the
tantalum pentoxide film. As the dielectric constant of the
tantalum pentoxide is high, the capacitance of a tantalum
capacitor is high if the area of the plates is large:
eA
C = ------
t
Capacitors are basic to all kinds of electrical equipment,
from radios and television sets to missile controls and
automobile ignitions. Their function is to store an electrical
charge for later use.
where
C = capacitance
Capacitors consist of two conducting surfaces, usually
metal plates, whose function is to conduct electricity. They
are separated by an insulating material or dielectric. The
dielectric used in all tantalum electrolytic capacitors is
tantalum pentoxide.
e = dielectric constant
A = surface area of the dielectric
t = thickness of the dielectric
Tantalum capacitors contain either liquid or solid
electrolytes. In solid electrolyte capacitors, a dry material
(manganese dioxide) forms the cathode plate. A tantalum
lead is embedded in or welded to the pellet, which is in turn
connected to a termination or lead wire. The drawings show
the construction details of the surface mount types of
tantalum capacitors shown in this catalog.
Tantalum pentoxide compound possesses high-dielectric
strength and a high-dielectric constant. As capacitors are
being manufactured, a film of tantalum pentoxide is applied
to their electrodes by means of an electrolytic process. The
film is applied in various thicknesses and at various voltages
and although transparent to begin with, it takes on different
colors as light refracts through it. This coloring occurs on the
tantalum electrodes of all types of tantalum capacitors.
Revision: 12-Sep-17
Document Number: 40115
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Micro Guide
Vishay Sprague
www.vishay.com
SOLID ELECTROLYTE TANTALUM CAPACITORS
TANTALUM CAPACITORS FOR ALL DESIGN
CONSIDERATIONS
Solid electrolyte capacitors contain manganese dioxide,
which is formed on the tantalum pentoxide dielectric layer
by impregnating the pellet with a solution of manganous
nitrate. The pellet is then heated in an oven, and the
manganous nitrate is converted to manganese dioxide.
Solid electrolyte designs are the least expensive for a given
rating and are used in many applications where their very
small size for a given unit of capacitance is of importance.
They will typically withstand up to about 10 % of the rated
DC working voltage in a reverse direction. Also important
are their good low temperature performance characteristics
and freedom from corrosive electrolytes.
The pellet is next coated with graphite, followed by a layer
of metallic silver, which provides a conductive surface
between the pellet and the leadframe.
Vishay Sprague patented the original solid electrolyte
capacitors and was the first to market them in 1956. Vishay
Sprague has the broadest line of tantalum capacitors and
has continued its position of leadership in this field. Data
sheets covering the various types and styles of Vishay
Sprague capacitors for consumer and entertainment
electronics, industry, and military applications are available
where detailed performance characteristics must be
specified.
Molded chip tantalum capacitor encases the element in
plastic resins, such as epoxy materials. After assembly, the
capacitors are tested and inspected to assure long life and
reliability. It offers excellent reliability and high stability for
consumer and commercial electronics with the added
feature of low cost.
Surface mount designs of “Solid Tantalum” capacitors use
lead frames or lead frameless designs as shown in the
accompanying drawings.
Side Cathode
Termination (-)
Voltage Code
Excluding 0402 (1005 metric)
case size
Epoxy Resin
Encapsulation
Polarity Bar Marking
Sintered
Tantalum Pellet
Side Anode
Termination (+)
MnO /Carbon/
2
Silver Coating
Bottom Cathode
Termination (-)
Silver Adhesive Epoxy
Glass Reinforced
Epoxy Resin
BottomAnode
Termination (+)
Fig. 1 - Leadframeless Molded Capacitors, All Types
Revision: 12-Sep-17
Document Number: 40115
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Micro Guide
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SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED
SERIES
TL8
298D
298W
TR8
PRODUCT IMAGE
TYPE
Solid tantalum leadframeless molded chip capacitors
Small size including 0603 and 0402 foot print
FEATURES
Industrial grade,
Industrial grade
Ultra low profile
Low ESR
extended range
Operating Temperature: Operating Temperature: Operating Temperature: Operating Temperature:
-55 °C to +125 °C
(above 40 °C, voltage
derating is required)
-55 °C to +125 °C
(above 85 °C, voltage
derating is required)
-55 °C to +125 °C
(above 40 °C, voltage
derating is required)
-55 °C to +125 °C
(above 85 °C, voltage
derating is required)
TEMPERATURE RANGE
CAPACITANCE RANGE
VOLTAGE RANGE
0.68 μF to 220 μF
4 V to 25 V
0.33 μF to 220 μF
2.5 V to 50 V
2.2 μF to 220 μF
4 V to 16 V
1 μF to 220 μF
2.5 V to 25 V
CAPACITANCE TOLERANCE
DISSIPATION FACTOR
CASE CODES
20 %, 10 %
6 % to 80 %
W9, A0, B0
100 % tin
6 % to 80 %
30 % to 80 %
K, M, Q
6 % to 80 %
K, M, R, P, Q, A, S, B
M, R, P, Q, A, B
TERMINATION
100 % tin or gold plated
SOLID TANTALUM CAPACITORS - LEADFRAMELESS MOLDED
SERIES
TP8
TM8
DLA 11020
T42
PRODUCT IMAGE
TYPE
Solid tantalum leadframeless molded chip capacitors
Small size including 0603 and 0402 foot print
Built in fuse,
double-stacked
FEATURES
High performance,
automotive grade
High reliability,
DLA approved
High reliability,
ultra-low ESR
High reliability
Operating Temperature:
-55 °C to +125 °C (above 85 °C, voltage derating is required)
TEMPERATURE RANGE
CAPACITANCE RANGE
VOLTAGE RANGE
1 μF to 100 μF
6.3 V to 40 V
0.68 μF to 47 μF
2 V to 40 V
1 μF to 47 μF
6.3 V to 40 V
10 μF to 470 μF
16 V to 75 V
CAPACITANCE TOLERANCE
DISSIPATION FACTOR
CASE CODES
20 %, 10 %
6 % to 30 %
6 % to 20 %
6 % to 8 %
6 % to 15 %
M2
M, W, R, P, A, N, T, B
K, M, G, W, R, P, A, N, T
M, W, R, P, A, N, T
Tin / lead solder plated,
100 % tin and gold plated
Tin / lead solder plated
or gold plated
Tin / lead solder plated
or 100 % tin
TERMINATION
100 % tin
Revision: 12-Sep-17
Document Number: 40115
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Micro Guide
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PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 0.004
[4.0 0.10]
10 pitches cumulative
tolerance on tape
0.008 [0.200]
Tape thickness
Deformation
between
embossments
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
Embossment
0.014
[0.35]
max.
0.079 0.002
[2.0 0.05]
0.069 0.004
[1.75 0.10]
Top
cover
tape
A0
0.030 [0.75]
min. (3)
20°
F
W
B1 (max.) (6)
K0
Maximum
component
rotation
B0
P1
0.030 [0.75]
min. (4)
Top cover
tape
(Side or front sectional view)
Center lines
of cavity
0.004 [0.10]
max.
For tape feeder
reference only
including draft.
D1 (min.) for components
(5)
.
0.079 x 0.047 [2.0 x 1.2] and larger
USER DIRECTION
OF FEED
Maximum
(5)
cavity size (1)
Concentric around B0
Cathode (-)
Anode (+)
DIRECTION OF FEED
3.937 [100.0]
0.039 [1.0]
20° maximum
component rotation
max.
Typical
component
cavity
center line
Tape
0.039 [1.0]
max.
Tape and Reel Specifications: all case sizes are
available on plastic embossed tape per EIA-481.
Standard reel diameter is 7" [178 mm].
B0
0.9843 [250.0]
Typical
Camber
component
center line
(Top view)
A0
Allowable camber to be 0.039/3.937 [1/100]
Non-cumulative over 9.843 [250.0]
(Top view)
Notes
•
Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
(1)
A0, B0, K0, are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°.
(2)
(3)
(4)
(5)
(6)
Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum.
This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less.
This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less.
The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of
embossement location shall be applied independent of each other.
B1 dimension is a reference dimension tape feeder clearance only.
CARRIER TAPE DIMENSIONS in inches [millimeters] FOR 298D, 298W, TR8, TP8, TL8
CASE CODE
TAPE SIZE
B1 (MAX.) (1)
0.075 [1.91]
0.112 [2.85]
0.098 [2.46]
0.108 [2.75]
0.153 [3.90]
-
0.157 [4.0]
0.126 [3.20]
0.181 [4.61]
D1 (MIN.)
0.02 [0.5]
F
K0 (MAX.)
0.043 [1.10]
0.053 [1.35]
0.066 [1.71]
0.054 [1.37]
0.078 [2.00]
0.049 [1.25]
0.087[2.22]
0.045 [1.15]
0.049 [1.25]
P1
W
M (2)
W
R
P
A
A0, Q
B
W9, S
B0
8 mm
8 mm
8 mm
8 mm
8 mm
8 mm
8 mm
8 mm
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.217 [5.5]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.472 [12.0]
0.039 [1.0]
0.039 [1.0]
0.02 [0.5]
0.039 [1.0]
0.02 [0.5]
0.039 [1.0]
0.029 [0.75]
0.059 [1.5]
12 mm
Notes
(1)
For reference only
Packaging of M case in plastic tape is available per request
(2)
Revision: 12-Sep-17
Document Number: 40115
4
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Micro Guide
Vishay Sprague
www.vishay.com
CARRIER TAPE DIMENSIONS in inches [millimeters] FOR TM8
CASE CODE
TAPE SIZE
B1 (MAX.) (1)
0.075 [1.91]
0.077 [1.96]
0.112 [2.85]
0.098 [2.46]
0.108 [2.75]
0.153 [3.90]
0.154 [3.90]
0.154 [3.90]
D1 (MIN.)
0.02 [0.5]
0.02 [0.5]
0.039 [1.0]
0.039 [1.0]
0.02 [0.5]
0.039 [1.0]
0.059 [1.5]
0.059 [1.5]
F
K0 (MAX.)
0.043 [1.10]
0.051 [1.30]
0.053 [1.35]
0.066 [1.71]
0.054 [1.37]
0.078 [2.00]
0.051 [1.30]
0.067 [1.70]
P1
W
M
G
W
R
P
8 mm
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.138 [3.5]
0.216 [5.5]
0.216 [5.5]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.157 [4.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.315 [8.0]
0.472 [12.0]
0.472 [12.0]
8 mm
8 mm
8 mm
8 mm
A
8 mm
N
T
12 mm
12 mm
Notes
(1)
For reference only
CARRIER TAPE DIMENSIONS in inches [millimeters] FOR T42
CASE CODE
TAPE SIZE
B1 (MAX.) (1)
D1 (MIN.)
F
K0 (MAX.)
P1
W
M2
16 mm
0.404 [10.3]
0.059 [1.5]
0.295 [7.5]
0.176 [4.5]
0.472 [12.0]
0.630 [16.0]
Note
(1)
For reference only
PAPER TAPE AND REEL PACKAGING in inches [millimeters]
FOR 298D, 298W, TR8, TP8, TL8, TM8 (K case only)
[10 pitches cumulative tolerance on tape 0.2 mm]
P2
T
E1
Ø D0
P0
A0
F
Bottom cover
tape
W
B0
E2
Top
cover tape
Anode
Cavity size (1)
P1
Bottom cover tape
G
Cavity center lines
USER FEED DIRECTION
CASE TAPE
SIZE SIZE
A
0
B
0
D
0
P
0
P
1
P
2
E
F
W
T
0.033 0.002 0.053 0.002 0.06 0.004 0.157 0.004 0.078 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.03 0.002
K
8 mm
8 mm
[0.85 0.05] [1.35 0.05] [1.5 0.1]
0.041 0.002 0.071 0.002 0.06 0.004 0.157 0.004 0.157 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.037 0.002
[1.05 0.05] [1.8 0.05] [1.5 0.1] [4.0 0.1] [4.0 0.1] [2.0 0.05] [1.75 0.1] [3.5 0.05] [8.0 0.2] [0.95 0.05]
[4.0 0.1]
[2.0 0.1]
[2.0 0.05]
[1.75 0.1]
[3.5 0.05]
[8.0 0.2]
[0.75 0.05]
M
Note
(1)
A0, B0 are determined by the maximum dimensions to the ends of the terminals extending from the component body and / or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent rotation
of the component within the cavity of not more than 20°.
Revision: 12-Sep-17
Document Number: 40115
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Micro Guide
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RECOMMENDED REFLOW PROFILES
Capacitors should withstand reflow profile as per J-STD-020 standard, three cycles.
TP
tp
Max. Ramp Up Rate = 3 °C/s
Max. Ramp Down Rate = 6 °C/s
TL
tL
TSmax.
Preheat Area
TSmin.
tS
25
Time 25 °C to Peak
Time
PROFILE FEATURE
PREHEAT AND SOAK
Temperature min. (TSmin.
SnPb EUTECTIC ASSEMBLY
LEAD (Pb)-FREE ASSEMBLY
)
100 °C
150 °C
150 °C
200 °C
Temperature max. (TSmax.
)
Time (tS) from (TSmin. to TSmax.
)
60 s to 90 s
60 s to 150 s
RAMP UP
Ramp-up rate (TL to Tp)
Liquidus temperature (TL)
Time (tL) maintained above TL
3 °C/s maximum
60 s to 150 s
183 °C
217 °C
Peak package body temperature (Tp) max.
Time (tp) within 5 °C of the peak max. temperature
RAMP DOWN
235 °C
20 s
260 °C
30 s
Ramp-down rate (Tp to TL)
6 °C/s maximum
Time from 25 °C to peak temperature
6 min maximum
8 min maximum
PAD DIMENSIONS in inches [millimeters]
D
C
B
A
CASE CODE
A (NOM.)
0.021 [0.53]
0.024 [0.61]
0.035 [0.89]
0.035 [0.89]
0.035 [0.89]
0.047 [1.19]
0.094 [2.39]
0.094 [2.39]
0.315 [8.00]
B (MIN.)
C (NOM.)
0.022 [0.55]
0.025 [0.64]
0.041 [1.05]
0.037 [0.95]
0.054 [1.37]
0.065 [1.65]
0.072 [1.82]
0.065 [1.65]
0.197 [5.00]
D (MIN.)
K
M, G
R, W9, S
W
0.016 [0.41]
0.027 [0.70]
0.029 [0.74]
0.029 [0.74]
0.029 [0.74]
0.042 [1.06]
0.044 [1.11]
0.044 [1.11]
0.098 [2.50]
0.054 [1.37]
0.080 [2.03]
0.099 [2.52]
0.095 [2.41]
0.112 [2.84]
0.148 [3.76]
0.159 [4.03]
0.152 [3.86]
0.394 [10.0]
P
A, Q, A0
B, B0
N, T
M2
Revision: 12-Sep-17
Document Number: 40115
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Micro Guide
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TYPICAL LEAKAGE CURRENT FACTOR RANGE
100
+ 125 °C
+ 85 °C
10
1.0
+ 55 °C
+ 25 °C
0 °C
0.1
- 55 °C
0.01
0.001
0
10
20
30
40
50
60
70
80
90
100
PERCENT OF RATED VOLTAGE
Notes
•
•
•
At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table
At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table
At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table
TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“M” Case
“M” Case
100
10
1
100
10
1
IMPEDANCE
IMPEDANCE
ESR
ESR
47 μF - 4 V
22 μF - 4 V
0.1
0.1
1
10
100
1000
0.1
1
10
100
1000
FREQUENCY, kHz
FREQUENCY, kHz
“M” Case
“M” Case
1000
100
10
1000
100
10
IMPEDANCE
IMPEDANCE
ESR
ESR
4.7 μF - 10 V
1
10 μF - 6 V
100 1000
1
0.1
0.1
0.1
1
10
100
1000
1
10
FREQUENCY, kHz
FREQUENCY, kHz
Revision: 12-Sep-17
Document Number: 40115
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Micro Guide
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TYPICAL CURVES AT +25 °C, IMPEDANCE AND ESR VS. FREQUENCY
“M” Case
“M” Case
10 000
1000
100
10
1000
100
10
IMPEDANCE
IMPEDANCE
ESR
ESR
1 μF - 16 V
10 μF - 10 V
1
1
0.1
1
1
1
10
100
1000
0.1
0.1
0.1
1
1
1
10
100
1000
FREQUENCY, kHz
FREQUENCY, kHz
“P” CASE
“P” CASE
100.0
10.0
1.0
1000.0
100.0
10.0
1.0
IMPEDANCE
IMPEDANCE
ESR
ESR
4.7 μF - 25 V
33 μF - 10 V
0.1
0.1
0.1
1000
10
100
1000
10
100
FREQUENCY, kHz
FREQUENCY, kHz
“P” CASE
“P” CASE
100.0
10.0
1.0
IMPEDANCE
ESR
IMPEDANCE
ESR
10.0
1.0
47 μF - 10 V
220 μF - 4 V
0.1
0.1
0.1
10
100
1000
10
100
1000
FREQUENCY, kHz
FREQUENCY, kHz
Revision: 12-Sep-17
Document Number: 40115
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Micro Guide
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GUIDE TO APPLICATION
1.
AC Ripple Current: the maximum allowable ripple
6.
Printed Circuit Board Materials: molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
current shall be determined from the formula:
P
IRMS
=
------------
RESR
7.
Attachment:
7.1
Solder Paste: the recommended thickness of the
where,
P =
solder paste after application is 0.007"
0.001"
power dissipation in watts at +25 °C (see
paragraph number 5 and the table Power
Dissipation as given in the tables in the
product datasheets)
[0.178 mm 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
RESR = the capacitor equivalent series resistance at
the specified frequency
2.
AC Ripple Voltage: the maximum allowable ripple
voltage shall be determined from the formula:
P
VRMS = Z ------------
RESR
7.2
Soldering: capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time / temperature conditions
for soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per s.
or, from the formula:
VRMS = IRMS x Z
Attachment with
a
soldering iron is not
where,
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
P =
power dissipation in watts at +25 °C (see
paragraph number 5 and the table Power
Dissipation as given in the tables in the
product datasheets)
7.2.1 Backward and Forward Compatibility: capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
RESR = the capacitor equivalent series resistance at
the specified frequency
the capacitor impedance at the specified
frequency
Z =
8.
Cleaning (Flux Removal) After Soldering: molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC / ODS products are not used in the production
of these devices and are not recommended.
Solvents containing methylene chloride or other
epoxy solvents should be avoided since these will
attack the epoxy encapsulation material.
2.1
2.2
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+25 °C.
Reverse Voltage: these capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at +25 °C, 5 % of the
DC rating at +25 °C, 5 % of the DC rating at +85 °C,
and 1 % of the DC rating at +125 °C.
Temperature Derating: if these capacitors are to be
operated at temperatures above +25 °C, the
permissible RMS ripple current shall be calculated
using the derating factors as shown:
3.
4.
8.1
9.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This
vibration can cause cracking or a decrease in the
adherence of the termination. DO NOT EXCEED 9W/l
at 40 kHz for 2 min.
Recommended Mounting Pad Geometries: proper
mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and /
or circuit board design.
TEMPERATURE
+25 °C
DERATING FACTOR
1.0
0.9
0.4
+85 °C
+125 °C
5.
Power Dissipation: power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
be established when calculating permissible
operating levels. (Power Dissipation calculated using
+25 °C temperature rise.)
Revision: 12-Sep-17
Document Number: 40115
9
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Typical Performance Characteristics
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Vishay Sprague
®
Solid Tantalum Chip Capacitors MICROTAN
High Reliability Leadframeless Molded Capacitors
TM8 and DLA 11020
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM
PERFORMANCE CHARACTERISTICS
Category temperature range
Capacitance tolerance
Dissipation factor
ESR
-55 °C to +85 °C (to +125 °C with voltage derating)
20 %, 10 %, tested via bridge method, at 25 °C, 120 Hz
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz.
Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz.
Leakage current
After application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k
resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in
Standard Ratings table. Note that the leakage current varies with temperature and applied voltage. See
graph below for the appropriate adjustment factor.
Reverse voltage
Capacitors are capable of withstanding peak voltages in the reverse direction equal to:
10 % of the DC rating at +25 °C
5 % of the DC rating at +85 °C
1 % of the DC rating at +125 °C
Vishay does not recommend intentional or repetitive application of reverse voltage.
Ripple current and
For maximum permissible ripple current (IRMS) or/and voltage (VRMS) please refer to product datasheet and
Temperature derating
Guide to Application. If capacitors are to be used at temperatures above +25 °C, the permissible RMS
ripple current or voltage shall be calculated using the derating factors:
1.0 at +25 °C
0.9 at +85 °C
0.4 at +125 °C
TYPICAL LEAKAGE CURRENT FACTOR RANGE
100
+125 °C
+85 °C
+55 °C
10
1.0
+25 °C
0 °C
0.1
-55 °C
0.01
0.001
0
10 20 30 40 50 60 70 80 90 100
Percent of Rated Voltage
Notes
•
•
•
At +25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table.
At +85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table.
At +125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table.
Revision: 16-Jan-14
Document Number: 40170
1
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Typical Performance Characteristics
www.vishay.com
Vishay Sprague
ENVIRONMENTAL AND MECHANICAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Vibration
Thermal shock
Resistance to solder heat
Moisture resistance
Stability at low and high
temperatures
In accordance with MIL-PRF-55365
(as for style CWR15)
In accordance with MIL-PRF-55365
Surge voltage
Life test
Solderability
Resistance to solvents
Terminal strength/
Shear stress test
Method: AEC-Q200-006, conditions:
Pressure load of 5 N for 10 s 1 s
There shall be no mechanical or visual damage and
the components shall meet the original electrical
requirements.
Flammability
Encapsulation materials meet UL 94 V-0 with an
oxygen index of 32 %.
Note
All measurements to be performed after 24 h conditioning at room temperature.
•
Revision: 16-Jan-14
Document Number: 40170
2
For technical questions, contact: tantalum@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 08-Feb-17
Document Number: 91000
1
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