TR8M106K010C2000 [VISHAY]
CAPACITOR, TANTALUM, SOLID, POLARIZED, 10 V, 10 uF, SURFACE MOUNT, 0603, CHIP, GREEN;
| 型号： | TR8M106K010C2000 |
| 厂家： | 
VISHAY |
| 描述： | CAPACITOR, TANTALUM, SOLID, POLARIZED, 10 V, 10 uF, SURFACE MOUNT, 0603, CHIP, GREEN 电容器 |
| 文件： | 总9页 (文件大小：149K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TR8
Vishay Sprague
Solid Tantalum Chip Capacitors
MICROTAN™ Low ESR, Leadframeless Molded
FEATURES
• 0603 and 0805 footprint
• Lead (Pb)-free face-down terminations
• 8 mm tape and reel packaging available per
EIA-481-1 and reeling per IEC 286-3
7" [178 mm] standard
• Low ESR
PERFORMANCE CHARACTERISTICS
Operating Temperature: - 55 °C to + 85 °C
Capacitance Range: 1 µF to 220 µF
(To + 125 °C voltage derating)
Capacitance Tolerance: 20 ꢀ standard
Voltage Range: 4 WVDC to 16 WVDC
ORDERING INFORMATION
TR8
M
336
M
6R3
C
1500
TYPE CASE CODE
CAPACITANCE
CAPACITANCE
TOLERANCE
DC VOLTAGE RATING
AT + 85 °C
TERMINATION
ESR
See Ratings
and Case
Code table
This is expressed in
picofarads. The first two
digits are the significant
figures. The third is the
number of zeros to follow.
K = 10 ꢀ
M = ꢁ0 ꢀ
This is expressed in volts.
To complete the three-digit
block, zeros precede the
voltage rating. A decimal point
is indicated by an “R”
C = 100 ꢀ Tin
Maximum
100 kHz ESR
in (mΩ).
See note
below.
(6R3 = 6.3 V).
Note
We reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size.
Voltage substitutions will be marked with the higher voltage rating. The EIA and CECC standars for low ESR solid tantalum chip capacitors,
allow delta ESR of 1.25 times the data sheet limit after mounting.
DIMENSIONS in inches [millimeters]
Anode Polarity Bar
Cathode Termination
Anode Termination
W
C
H
P1
Pꢁ
P1
L
CASE
L
W
H
P1
Pꢁ
C
0.063 0.004
[1.60 0.1]
0.033 0.004
[0.85 0.1]
0.031 0.004
[0.80 0.1]
0.020 0.004
[0.50 0.1]
0.024 0.004
[0.60 0.1]
0.024 0.004
[0.60 0.1]
M
0.094 0.004
[2.4 0.1]
0.057 0.004
[1.45 0.1]
0.043 0.004
[1.10 0.1]
0.020 0.004
[0.50 0.1]
0.057 0.004
[1.40 0.1]
0.035 0.004
[0.90 0.1]
P
** Please see document “Vishay Green and Halogen-Free Definitions (5-2008)”: http://www.vishay.com/doc?99902
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38
For technical questions, contact: tantalum@vishay.com
Document Number: 40114
Revision: 22-Apr-09
TR8
Solid Tantalum Chip Capacitors
MICROTAN™ Low ESR, Leadframeless Molded
Vishay Sprague
MARKING
RATINGS AND CASE CODES
M-Case
P-Case
µF
1.0
2.2
3.3
4.7
6.8
10
ꢁ.5 V
4 V
6.3 V
10 V
16 V
Capacitance
Code
Voltage
Code
Polarity Bar
Voltage Code
Polarity Bar
M
A
M*
GJ
M
M
M
Volts
4
6.3
10
16
20
Code
G
J
A
C
D
E
Cap, µF
Code
15
33
47
n
s
22
M
M
68
w
A
E
J
33
M
M
100
150
220
47
P*
25
220
P*
Note
* Preliminary values, contact factory for availability.
STANDARD RATINGS
MAX. DC
LEAKAGE
AT + ꢁ5 °C
(µA)
MAX. ESR
AT + ꢁ5 °C
100 kHz
(Ω)
MAX. RIPPLE
100 kHz
Irms
MAX. DF
AT + ꢁ5 °C
(ꢀ)
ΔC/C*
(ꢀ)
CAPACITANCE CASE
PART
NUMBER
(µF)
CODE
(A)
4 WVDC AT + 85 °C, . . . ꢁ.7 WVDC AT + 1ꢁ5 °C
33
47
M
M
P
TR8M336M004C1500
TR8M476M004C1500
TR8P227M004C1000
2.6
3.8
15
20
30
1.5
1.5
1.0
0.129
0.129
0.212
20
30
30
220
17.6
6.3 WVDC AT + 85 °C, . . . 4 WVDC AT + 1ꢁ5 °C
10
22
33
M
M
M
TR8M106M6R3C2000
TR8M226M6R3C1500
TR8M336M6R3C1500
0.6
2.8
4.2
8.0
20
30
2.0
1.5
1.5
0.112
0.129
0.129
10
15
30
10 WVDC AT + 85 °C, . . . 7 WVDC AT + 1ꢁ5 °C
10
15
47
M
M
P
TR8M106M010C2000
TR8M156M010C3000
TR8P476M010C0800
1.0
1.5
4.7
20
20
22
2.0
3.0
0.8
0.112
0.091
0.237
15
20
20
16 WVDC AT + 85 °C, . . . 10 WVDC AT + 1ꢁ5 °C
1
M
M
TR8M105M016C9500
TR8M475M016C4000
0.5
0.8
6.0
8.0
9.5
4.0
0.050
0.079
15
15
4.7
Note
* See Performance Characteristics tables, page 41.
Document Number: 40114
Revision: 22-Apr-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
39
TR8
Solid Tantalum Chip Capacitors
MICROTAN™ Low ESR, Leadframeless Molded
Vishay Sprague
CAPACITORS PERFORMANCE CHARACTERISTICS
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM
PERFORMANCE CHARACTERISTICS
Category Temperature Range
Capacitance Tolerance
Dissipation Factor (at 120 Hz)
ESR (100 kHz)
- 55 °C to + 85 °C (to + 125 °C with voltage derating)
20 ꢀ, 10 ꢀ (at 120 Hz) 2 Vrms at + 25 °C using a capacitance bridge
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 120 Hz.
Limits per Standard Ratings Table. Tested via bridge method, at 25 °C, 100 kHz.
After application of rated voltage applied to capacitors for 5 minutes using a steady source of power with
1 kΩ resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in.
See graph below for the appropriate adjustment factor.
Leakage Current
Reverse Voltage
Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 ꢀ of the DC
5 ꢀ of the DC rating at + 85 °C
Vishay does not recommended intentional or repetitive application of reverse voltage
If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or voltage
Temperature Derating
1.0 at + 25 °C
0.9 at + 85 °C
Operating Temperature
+ 85 °C RATING
+ 1ꢁ5 °C RATING
WORKING VOLTAGE
SURGE VOLTAGE
WORKING VOLTAGE
SURGE VOLTAGE
4
5.2
8
2.7
4
7
10
13
17
23
33
3.4
5
8
12
16
20
28
40
6.3
10
16
20
25
35
50
13
20
26
32
46
65
TYPICAL LEAKAGE CURRENT FACTOR RANGE
100
+ 1ꢁ5 °C
+ 85 °C
+ 55 °C
10
1.0
+ ꢁ5 °C
0 °C
0.1
- 55 °C
0.01
0.001
0
10 ꢁ0 30 40 50 60 70 80 90 100
PERCENT OF RATED VOLTAGE
Notes
• At + ꢁ5 °C, the leakage current shall not exceed the value listed in the Standard Ratings Table.
• At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings Table.
• At + 1ꢁ5 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings Table.
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For technical questions, contact: tantalum@vishay.com
Document Number: 40114
Revision: 22-Apr-09
TR8
Solid Tantalum Chip Capacitors
MICROTAN™ Low ESR, Leadframeless Molded
Vishay Sprague
ENVIRONMENTAL PERFORMANCE CHARACTERISTICS
ITEM
CONDITION
POST TEST PERFORMANCE
Life Test at + 85 °C
1000 hours application of rated voltage at
85 °C with a 3 Ω series resistance,
MIL-STD 202G Method 108A
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 ꢀ of initial
Not to exceed 200 ꢀ of initial
Humidity Tests
Thermal Shock
At 40 °C/90 ꢀ RH 500 hours, no voltage
applied. MIL-STD 202G Method 103B
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 ꢀ of initial
Not to exceed 200 ꢀ of initial
At - 55 °C/+ 125 °C, 30 minutes each,
for 5 cycles. MIL-STD 202G Method 107G
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 ꢀ of initial
Not to exceed 200 ꢀ of initial
MECHANICAL PERFORMANCE CHARACTERISTICS
TEST CONDITION
CONDITION
POST TEST PERFORMANCE
Terminal Strength
Apply a pressure load of 5 N for 10 1 seconds
horizontally to the center of capacitor side body.
AECQ-200 rev. C Method 006
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Substrate Bending
(Board flex)
With parts soldered onto substrate test board,
apply force to the test board for a deflection
of 1 mm. AECQ-200 rev. C Method 005
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
Vibration
MIL-STD-202G, Method 204D,
10 Hz to 2000 Hz, 20 G Peak
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Shock
Mil-Std-202G, Method 213B, Condition I,
100G Peak
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Initial specified value or less
Initial specified value or less
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to Solder
Heat
At 260 °C, for 10 seconds, reflow
Capacitance Change
Dissipation Factor
Leakage Current
Refer to Standard Ratings Table
Not to exceed 150 ꢀ of initial
Not to exceed 200 ꢀ of initial
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Solderability
MIL-STD-202G, Method 208H, ANSI/J-Std-002,
Test B. Applies only to Solder and tin plated
terminations. Does not apply to gold terminations.
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Resistance to
Solvents
MIL-STD-202, Method 215D
There shall be no mechanical or visual damage to capacitors
post-conditioning.
Flammability
Encapsulation materials meet UL94 VO with an
oxygen index of 32 ꢀ.
Document Number: 40114
Revision: 22-Apr-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
41
TR8
Solid Tantalum Chip Capacitors
MICROTAN™ Low ESR, Leadframeless Molded
Vishay Sprague
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
0.157 0.004
[4.0 0.10]
10 pitches cumulative
tolerance on tape
0.008 [0.ꢁ00]
Tape Thickness
0.014
[0.35]
MAX.
Deformation
Between
Embossments
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
Embossment
0.069 0.004
[1.75 0.10]
0.079 0.00ꢁ
[ꢁ.0 0.05]
Top
Cover
Tape
A0
ꢁ0°
0.030 [0.75]
MIN.(Note 3)
F
W
Maximum
Component
Rotation
B
1 MAX.
K0
(Note 6)
B0
Top
Cover
Tape
0.030 [0.75]
MIN.(Note 4)
(Side or Front Sectional View)
0.004 [0.1]
MAX.
Center Lines
of Cavity
P1
For Tape Feeder
Reference only
including draft.
Concentric around B
(Note 5)
D
1 MIN. For Components
0.079 x 0.047 [ꢁ.0 x 1.ꢁ] and Large.r
Maximum (Note 5)
Cavity Size
USER DIRECTION OF FEED
0
(Note 1)
Cathode (-)
Anode (+)
Direction of Feet
Tape and Reel Specifications: All case sizes are available on
plastic embossed tape per EIA-481-1. Tape reeling per IEC 286-3
is also available. Standard reel diameter is 7" [178 mm],
13" [330 mm] reels are available and recommended as the most
cost effective packaging method.
3.937 [100.0]
0.039 [1.0]
MAX.
ꢁ0° Maximum
Component Rotation
Typical
Component
Cavity
Tape
B
0
0.039 [1.0]
MAX.
Center Line
The most efficient packaging quantities are full reel increments on
a given reel diameter. The quantities shown allow for the sealed
empty pockets required to be in conformance with EIA-481-1. Reel
size and packaging orientation must be specified in the Vishay
Sprague part number.
0.9843 [ꢁ50.0]
Typical
Component
Center Line
Camber
(Top View)
A
0
Allowable Camber to be 0.039/3.937 [1/100]
Non-Cumulative Over 9.843 [ꢁ50.0]
(Top View)
Note:
Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
CASE
CODE
TAPE
SIZE
B1
(MAX.)
D1
(MIN.)
K0
(MAX.)
P1
F
W
ꢁ98D/TR8
0.108
[2.75]
0.039
[1.0]
0.138 0.002
[3.5 0.05]
0.054
[1.37]
0.157 0.004
[4.0 1.0]
0.315 0.0118/- 0.0039
[8.0 0.30/- 0.10]
P
8 mm
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For technical questions, contact: tantalum@vishay.com
Document Number: 40114
Revision: 22-Apr-09
TR8
Solid Tantalum Chip Capacitors
MICROTAN™ Low ESR, Leadframeless Molded
Vishay Sprague
PAPER TAPE AND REEL PACKAGING IN INCHES [millimeters]
[10 pitches cumulative tolerance
on tape 0.ꢁ mm]
Pꢁ
T
E1
Ø D0
P0
A0
F
Bottom Cover
Tape
W
B0
Eꢁ
Top
Cover Tape
Anode
P1
Bottom Cover Tape
G
Cavity Center Lines
Cavity Size
Note 1
User Feed Direction
Figure ꢁ
ꢁ98D/TR8
CASE TAPE
SIZE SIZE
A0
B0
D0
P0
P1
Pꢁ
E
F
W
T
0.033 0.002 0.053 0.002 0.06 0.004 0.157 0.004 0.078 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.03 0.002
K
8 mm
8 mm
[0.85 0.05] [1.35 0.05]
[1.5 0.1]
[4.0 0.1]
[2.0 0.1]
[2.0 0.05]
[1.75 0.1]
[3.5 0.05]
[8.0 0.2]
[0.75 0.05]
0.041 0.002 0.071 0.002 0.06 0.004 0.157 0.004 0.157 0.004 0.079 0.002 0.069 0.004 0.0138 0.002 0.315 0.008 0.037 0.002
M
[1.05 0.05] [1.8 0.05]
[1.5 0.1]
[4.0 0.1]
[4.0 0.1]
[2.0 0.05]
[1.75 0.1]
[3.5 0.05]
[8.0 0.2]
[0.95 0.05]
STANDARD PACKAGING QUANTITY
QTY (PCS/REEL)
SERIES
CASE CODE
7" REEL
13" REEL
N/a
K
M
P
10 000
4000
ꢁ98D/TR8
N/a
3000
N/a
RECOMMENDED VOLTAGE DERATING GUIDELINES
STANDARD CONDITIONS: FOR EXAMPLE: OUTPUT FILTERS
Capacitor Voltage Rating
Operating Voltage
4.0
2.5
3.6
6.0
10
12
15
24
28
6.3
10
16
20
25
35
50
SEVERE CONDITIONS: FOR EXAMPLE: INPUT FILTERS
Capacitor Voltage Rating
Operating Voltage
4.0
6.3
10
16
20
25
35
50
2.5
3.3
5.0
8.0
10
12
15
24
Document Number: 40114
Revision: 22-Apr-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
43
TR8
Solid Tantalum Chip Capacitors
MICROTAN™ Low ESR, Leadframeless Molded
Vishay Sprague
POWER DISSIPATION
MAXIMUM PERMISSIBLE
POWER DISSIPATION AT + ꢁ5 °C (W) IN FREE AIR
CASE CODE
K
M
P
0.015
0.025
0.045
ꢁ98D/TR8
RECOMMENDED REFLOW PROFILES
Tp °C
(tp)
TL °C
Ts MAX. °C
Ts MAX. °C
(tL)
Preheat (ts)
ꢁ5 °C
All Case Codes
TS
MAX.
Sn/Pb
TP
TP
TL
TL
TS MIN.
TSMIN.
TS MAX.
tS
tS
tP
tL
TYPE
lead (Pb)-free Sn/Pb
lead (Pb)-free Sn/Pb lead (Pb)-free Sn/Pb lead (Pb)-free
lead (Pb)-free Sn/Pb
ꢁ98D/TR8
260 °C
225 °C 10
217 °C
183 °C
150 °C
100 °C
200 °C
150 °C
60 - 150
60 - 90 60
PAD DIMENSIONS in inches [millimeters]
D
C
B
A
A
B
C
D
CASE CODE
(MIN.)
(NOM.)
(NOM.)
(NOM.)
ꢁ98D/TR8
K
M
P
0.028 [0.70]
0.039 [1.00]
0.063 [1.60]
0.018 [0.45]
0.028 [0.70]
0.031 [0.80]
0.024 [0.60]
0.24 [0.60]
0.047 [1.20]
0.059 [1.50]
0.080 [2.00]
0.110 [2.80]
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For technical questions, contact: tantalum@vishay.com
Document Number: 40114
Revision: 22-Apr-09
TR8
Solid Tantalum Chip Capacitors
MICROTAN™ Low ESR, Leadframeless Molded
Vishay Sprague
6.
Printed Circuit Board Materials: Molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
GUIDE TO APPLICATION
1.
A-C Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
7.
Attachment:
P
I
=
---------------
rms
R
7.1
Solder Paste: The recommended thickness of the
solder paste after application is 0.007" 0.001"
[0.178 mm 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should be
as high as practical. The flux (in the paste) must be
active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
ESR
where,
P =
Power dissipation in watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series
resistance at the specified frequency.
RESR
=
2.
A-C Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
7.2
Soldering: Capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time/temperature conditions for
soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per
second. Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
P
V
= Z ---------------
rms
R
ESR
or, from the formula:
= I
V
× Z
rms
rms
where,
P =
Power dissipation in watts at + 25 °C as
given in the table in paragraph number 5
(power dissipation).
The capacitor equivalent series
resistance at the specified frequency.
The capacitor impedance at the specified
frequency.
RESR
Z =
=
7.2.1 Backward and Forward Compatibility: Capacitors
with SnPb or 100 ꢀ tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
2.1
2.2
3.
The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
8.
Cleaning (Flux Removal) After Soldering: Molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack the
epoxy encapsulation material.
The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 ꢀ of the DC working voltage at + 25 °C.
Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 ꢀ of the DC rating at + 25 °C, 5 ꢀ of the DC
rating at + 85 °C and 1 ꢀ of the DC rating at + 125 °C.
8.1
9.
When using ultrasonic cleaning, the board may
resonate if the output power is too high. This vibration
can cause cracking or a decrease in the adherence of
the termination. DO NOT EXCEED 9W/l at 40 kHz for
2 minutes.
4.
Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible rms ripple current or voltage shall be
calculated using the derating factors as shown:
TEMPERATURE
+ 25 °C
DERATING FACTOR
Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for successful
solder connections. These dimensions are highly
process sensitive and should be designed to
minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process and/or
circuit board design.
1.0
0.9
0.4
+ 85 °C
+ 125 °C
5.
Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the mounting
surface. Non-sinusoidal ripple current may produce
heating effects which differ from those shown. It is
important that the equivalent Irms value be established
when calculating permissible operating levels. (Power
Dissipation calculated using + 25 °C temperature
rise.)
Document Number: 40114
Revision: 22-Apr-09
For technical questions, contact: tantalum@vishay.com
www.vishay.com
45
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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相关型号：
TR8M336M6R3C1500
CAPACITOR, TANTALUM, SOLID, POLARIZED, 6.3 V, 33 uF, SURFACE MOUNT, 0603, CHIP, GREEN
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