TSMS3700-GS18 [VISHAY]

Infrared LED, 950nm;
TSMS3700-GS18
型号: TSMS3700-GS18
厂家: VISHAY    VISHAY
描述:

Infrared LED, 950nm

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TSMS3700  
Vishay Semiconductors  
VISHAY  
GaAs Infrared Emitting Diode in SMT Package  
Description  
TSMS3700 is a standard GaAs infrared emitting  
diode in a miniature PLCC-2 package.  
Its flat window provides a wide aperture, making it  
ideal for use with external optics.  
The diode is case compatible to the TEMT3700 pho-  
totransistor, allowing the user to assemble his own  
optical interrupters.  
Features  
• SMT IRED with high radiant power  
• Low forward voltage  
Applications  
Infrared source in tactile keyboards  
IR diode in low space applications  
• Compatible with automatic placement equipment  
• EIA and ICE standard package  
• Suitable for infrared, vapor phase and wavesolder  
process  
Matching with phototransistor TEMT3700 in reflective  
sensors  
• Available in 8 mm tape  
PCB mounted infrared sensors  
• Suitable for DC and high pulse current operation  
• Wide angle of half intensity ϕ = ꢀ0°  
• Peak wavelength λp = 950 nm  
• High reliability  
Infrared emitter for miniature light barriers  
• Matching to TEMT3700 phototransistor  
• Lead-free device  
Parts Table  
Part  
Ordering code  
Remarks  
TSMS3700  
TSMS3700-GS08  
TSMS3700-GS18  
MOQ: 7500 pcs  
MOQ: 8000 pcs  
Absolute Maximum Ratings  
T
= 25 °C, unless otherwise specified  
Parameter  
amb  
Test condition  
Symbol  
Value  
5
Unit  
V
Reverse Voltage  
V
R
Forward current  
I
100  
200  
mA  
mA  
A
F
Peak Forward Current  
Surge Forward Current  
Power Dissipation  
t /T = 0.5, t = 100 µs  
I
FM  
p
p
t = 100 µs  
I
1.5  
p
FSM  
P
170  
mW  
°C  
V
Junction Temperature  
Operating Temperature Range  
T
100  
j
T
- 55 to + 100  
°C  
amb  
Document Number 81037  
Rev. 1.7, 22-Jun-04  
www.vishay.com  
1
TSMS3700  
Vishay Semiconductors  
VISHAY  
Parameter  
Test condition  
Symbol  
Value  
Unit  
°C  
Storage Temperature Range  
T
- 55 to + 100  
stg  
Soldering Temperature  
t 10 sec  
on PC board  
T
2ꢀ0  
450  
°C  
sd  
Thermal Resistance Junction/  
Ambient  
R
K/W  
thJA  
Electrical Characteristics  
T
= 25 °C, unless otherwise specified  
amb  
Parameter  
Test condition  
Symbol  
Min  
Typ.  
1.3  
Max  
1.7  
Unit  
V
Forward Voltage  
I
I
I
= 100 mA, t = 20 ms  
V
V
F
F
F
p
F
F
= 1 A, t = 100 µs  
1.8  
V
mV/K  
µA  
p
Temp. Coefficient of V  
Reverse Current  
= 100 mA  
= 5 V  
TK  
I
- 1.3  
F
VF  
V
V
100  
R
R
Junction capacitance  
= 0 V, f = 1 MHz, E = 0  
C
30  
pF  
R
j
Optical Characteristics  
T
= 25 °C, unless otherwise specified  
amb  
Parameter  
Test condition  
Symbol  
Min  
1.ꢀ  
Typ.  
4.5  
Max  
Unit  
Radiant Intensity  
I
I
I
I
= 100 mA, t = 20 ms  
I
8
mW/sr  
F
F
F
F
p
e
e
= 1.5 A, t = 100 µs  
I
35  
15  
mW/sr  
mW  
p
Radiant Power  
= 100 mA, t = 20 ms  
φ
e
p
Temp. Coefficient of φ  
= 100 mA  
TK  
- 0.8  
%/K  
e
φe  
Angle of Half Intensity  
Peak Wavelength  
ϕ
ꢀ0  
deg  
nm  
I
I
I
I
I
I
I
= 100 mA  
= 100 mA  
= 100 mA  
= 20 mA  
= 1 A  
λ
950  
F
F
F
F
F
F
F
p
Spectral Bandwidth  
∆λ  
TK  
50  
nm  
nm/K  
ns  
Temp. Coefficient of λ  
0.2  
p
λp  
Rise Time  
t
t
800  
400  
800  
400  
0.5  
r
r
ns  
Fall Time  
= 20 mA  
= 1 A  
t
t
ns  
f
f
ns  
Virtual Source Diameter  
mm  
Typical Characteristics (Tamb = 25 °C unless otherwise specified)  
Figure 1. Power Dissipation vs. Ambient Temperature  
250  
200  
150  
100  
50  
R
thJA  
0
0
20  
40  
60  
80  
100  
T
amb  
- Ambient Temperature ( °C )  
94 8029  
www.vishay.com  
2
Document Number 81037  
Rev. 1.7, 22-Jun-04  
TSMS3700  
Vishay Semiconductors  
VISHAY  
125  
100  
1.2  
1.1  
I
= 10 mA  
F
75  
50  
25  
1.0  
0.9  
0.8  
0.7  
R
thJA  
0
0
0
20  
40  
60  
80  
100  
20  
40  
60  
80  
100  
T
- Ambient Temperature (°C )  
94 7916  
T
amb  
- Ambient Temperature ( °C )  
94 7990  
amb  
Figure 2. Forward Current vs. Ambient Temperature  
Figure 5. Relative Forward Voltage vs. Ambient Temperature  
10000  
1000  
100  
T
< 60°C  
amb  
t
/T = 0.005  
p
0.01  
0.02  
10  
1
0.05  
100  
0.2  
0.5  
DC  
0.1  
10  
1
0.1  
100  
0.01  
0.1  
1
10  
0
1
2
3
4
10  
10  
I - Forward Current ( mA )  
F
10  
10  
10  
t
- Pulse Length ( ms )  
95 9985  
94 7956  
p
Figure 3. Pulse Forward Current vs. Pulse Duration  
Figure ꢀ. Radiant Intensity vs. Forward Current  
4
10  
1000  
3
2
1
0
10  
10  
10  
10  
100  
10  
1
-1  
0.1  
10  
0
1
F
2
3
4
0
1
2
3
4
10  
10  
I - Forward Current ( mA )  
F
10  
10  
10  
V
- Forward Voltage ( V )  
94 7996  
94 8012  
Figure 4. Forward Current vs. Forward Voltage  
Figure 7. Radiant Power vs. Forward Current  
Document Number 81037  
Rev. 1.7, 22-Jun-04  
www.vishay.com  
3
TSMS3700  
Vishay Semiconductors  
VISHAY  
1.6  
1.2  
I
= 20 mA  
F
0.8  
0.4  
0
140  
-10  
0
10  
50  
- Ambient Temperature (°C )  
amb  
100  
T
94 7993  
Figure 8. Rel. Radiant Intensity/Power vs. Ambient Temperature  
1.25  
1.0  
0.75  
0.5  
0.25  
I
= 100 mA  
950  
F
0
1000  
900  
-
94 7994  
Wavelength ( nm )  
Figure 9. Relative Radiant Power vs. Wavelength  
0°  
10°  
20°  
30°  
40°  
1.0  
0.9  
0.8  
50°  
60°  
70°  
80°  
0.7  
0.6  
0.6 0.4 0.2  
0
0.2  
0.4  
94 8013  
Figure 10. Relative Radiant Intensity vs. Angular Displacement  
www.vishay.com  
4
Document Number 81037  
Rev. 1.7, 22-Jun-04  
TSMS3700  
Vishay Semiconductors  
VISHAY  
Package Dimensions in mm  
3.5 0.2  
technical drawings  
according to DIN  
specifications  
Mounting Pad Layout  
Pin identification  
1.2  
area covered with  
solder resist  
C
A
4
1.6 (1.9)  
2.4  
Dimensions: IR and Vaporphase  
(Wave Soldering)  
+ 0.15  
3
Drawing-No. : 6.541-5025.01-4  
Issue: 7; 05.04.04  
95 11314  
Document Number 81037  
Rev. 1.7, 22-Jun-04  
www.vishay.com  
5
TSMS3700  
Vishay Semiconductors  
VISHAY  
Ozone Depleting Substances Policy Statement  
It is the policy of Vishay Semiconductor GmbH to  
1. Meet all present and future national and international statutory requirements.  
2. Regularly and continuously improve the performance of our products, processes, distribution and  
operatingsystems with respect to their impact on the health and safety of our employees and the public, as  
well as their impact on the environment.  
It is particular concern to control or eliminate releases of those substances into the atmosphere which are  
known as ozone depleting substances (ODSs).  
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs  
and forbid their use within the next ten years. Various national and international initiatives are pressing for an  
earlier ban on these substances.  
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the  
use of ODSs listed in the following documents.  
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments  
respectively  
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental  
Protection Agency (EPA) in the USA  
3. Council Decision 88/540/EEC and 91/ꢀ90/EEC Annex A, B and C (transitional substances) respectively.  
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting  
substances and do not contain such substances.  
We reserve the right to make changes to improve technical design  
and may do so without further notice.  
Parameters can vary in different applications. All operating parameters must be validated for each  
customer application by the customer. Should the buyer use Vishay Semiconductors products for any  
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all  
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal  
damage, injury or death associated with such unintended or unauthorized use.  
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany  
Telephone: 49 (0)7131 ꢀ7 2831, Fax number: 49 (0)7131 ꢀ7 2423  
www.vishay.com  
Document Number 81037  
Rev. 1.7, 22-Jun-04  

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