TSOP13330DF1P [VISHAY]
Linear Output Photo IC,;
| 型号： | TSOP13330DF1P |
| 厂家： | 
VISHAY |
| 描述： | Linear Output Photo IC, |
| 文件： | 总12页 (文件大小：543K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TSOP131..DF1P, TSOP133..DF1P, TSOP135..DF1P
www.vishay.com
Vishay Semiconductors
IR Receiver Modules for Remote Control Systems
FEATURES
• Improved dark sensitivity
• Improved immunity against optical noise
• Improved immunity against Wi-Fi noise
• Low supply current
• Photo detector and preamplifier in one package
• Internal filter for PCM frequency
• Supply voltage: 2.5 V to 5.5 V
• Insensitive to supply voltage ripple and noise
• Material categorization: for definitions of
compliance please see www.vishay.com/doc?99912
22911
MECHANICAL DATA
Pinning for TSOP13...DF1P:
1 = OUT, 2 = GND, 3 = VS
ADDITIONAL RESOURCES
3
D
3D Models
DESCRIPTION
The TSOP13...DF1P series devices are the latest generation miniaturized IR receiver modules for infrared remote control
systems. This series provides improvements in sensitivity to remote control signals in dark ambient as well as in sensitivity in
the presence of optical disturbances e.g. from CFLs. The robustness against spurious pulses originating from Wi-Fi signals has
been enhanced.
The devices contain a PIN diode and a preamplifier assembled on a lead frame. The epoxy package contains an IR filter. The
demodulated output signal can be directly connected to a microprocessor for decoding.
The TSOP131..DF1P, TSOP133..DF1P, and TSOP135..DF1P series devices are designed to receive short burst codes (6 or
more carrier cycles per burst). The third digit designates the AGC level (AGC1, AGC3, or AGC5) and the last two digits designate
the band-pass frequency (see table below). The higher the AGC, the better noise is suppressed, but the lower the code
compatibility. AGC1 provides basic noise suppression, AGC3 provides enhanced noise suppression and AGC5 provides
maximized noise suppression. Generally, we advise to select the highest AGC that satisfactorily receives the desired remote
code.
These components have not been qualified to automotive specifications.
PARTS TABLE
BASIC NOISE SUPPRESSION
(AGC1)
ENHANCED NOISE
SUPPRESSION (AGC3)
MAXIMIZED NOISE
SUPPRESSION (AGC5)
AGC
30 kHz
33 kHz
36 kHz
38 kHz
40 kHz
56 kHz
TSOP13130DF1P
TSOP13133DF1P
TSOP13136DF1P
TSOP13138DF1P
TSOP13140DF1P
TSOP13156DF1P
TSOP13330DF1P
TSOP13333DF1P
TSOP13336DF1P (1)
TSOP13338DF1P (2)(4)
TSOP13340DF1P
TSOP13356DF1P (3)
Minimold
TSOP13530DF1P
TSOP13533DF1P
TSOP13536DF1P
TSOP13538DF1P
TSOP13540DF1P
TSOP13556DF1P
Carrier
frequency
Package
Pinning
1 = OUT, 2 = GND, 3 = VS
5.4 W x 6.35 H x 4.9 D
Leaded
Dimensions (mm)
Mounting
Application
Remote control
Best choice for
(1) RCMM (2) RECS-80 Code (3) r-map (4) XMP-1, XMP-2
Note
30 kHz and 33 kHz only available on written request
•
Rev. 1.0, 23-Oct-2019
Document Number: 82881
1
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSOP131..DF1P, TSOP133..DF1P, TSOP135..DF1P
www.vishay.com
Vishay Semiconductors
BLOCK DIAGRAM
APPLICATION CIRCUIT
16833-13
17170-11
R1
C1
3
Transmitter
with
TSALxxxx
IR receiver
30 kΩ
VS
+ VS
1
μC
OUT
Band
pass
Demo-
dulator
Input
AGC
VO
GND
GND
2
PIN
Control circuit
R1 and C1 recommended to reduce supply ripple for VS < 2.8 V
ABSOLUTE MAXIMUM RATINGS
PARAMETER
TEST CONDITION
SYMBOL
VS
VALUE
UNIT
V
Supply voltage
-0.3 to +6
Supply current
IS
3
mA
V
Output voltage
VO
-0.3 to (VS + 0.3)
Output current
IO
5
100
mA
°C
Junction temperature
Storage temperature range
Operating temperature range
Power consumption
Soldering temperature
Tj
Tstg
Tamb
Ptot
Tsd
-25 to +85
-25 to +85
10
°C
°C
Tamb ≤ 85 °C
mW
°C
t ≤ 10 s, 1 mm from case
260
Note
•
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only
and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification
is not implied. Exposure to absolute maximum rating conditions for extended periods may affect the device reliability
ELECTRICAL AND OPTICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
Ev = 0, VS = 3.3 V
Ev = 40 klx, sunlight
SYMBOL
MIN.
0.55
-
TYP.
0.70
0.80
-
MAX.
0.90
-
UNIT
mA
mA
V
ISD
ISH
VS
Supply current
Supply voltage
2.5
5.5
Ev = 0, test signal see Fig. 1,
IR diode TSAL6200, IF = 50 mA
Transmission distance
d
-
-
30
-
-
m
I
OSL = 0.5 mA, Ee = 0.7 mW/m2,
test signal see Fig. 1
Output voltage low
Minimum irradiance
VOSL
100
mV
Pulse width tolerance:
pi - 3.0/f0 < tpo < tpi + 3.5/f0,
test signal see Fig. 1
t
Ee min.
-
0.08
0.15
mW/m2
tpi - 3.0/f0 < tpo < tpi + 3.5/f0,
test signal see Fig. 1
Maximum irradiance
Directivity
Ee max.
30
-
-
-
-
W/m2
deg
Angle of half transmission
distance
ϕ1/2
45
Rev. 1.0, 23-Oct-2019
Document Number: 82881
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSOP131..DF1P, TSOP133..DF1P, TSOP135..DF1P
www.vishay.com
Vishay Semiconductors
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
Optical Test Signal
(IR diode TSAL6200, IF = 0.1 A, N = 6 pulses, f = f0, T = 10 ms)
Axis Title
10000
Ee
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
ton
t
(1)
1000
tpi
toff
T
(1)
t
≥ 6/f0
pi
Output Signal
100
VO
(2) 4/f0 < td < 10/f0
(3)
t
- 3.0/f0 < tpo < tpi + 3.5/f0
λ = 950 nm,
optical test signal, Fig. 3
pi
VOH
10
10 000
0.1
1
10
100
1000
VOL
(2)
(3)
t
td
tpo
Ee - Irradiance (mW/m2)
14337-3
Fig. 1 - Output Delay and Pulse-Width
Fig. 4 - Pulse-Width vs. Irradiance in Dark Ambient
Axis Title
Axis Title
0.30
0.25
0.20
0.15
0.10
0.05
0
10000
1.2
1.0
0.8
0.6
0.4
0.2
0
10000
Output pulse width
1000
100
10
1000
100
10
AGC3, AGC5
AGC1
Input burst length
f = f0 5 %
λ = 950 nm,
optical test signal, Fig. 1
AGC1: ∆f (3 dB) = f0/7
AGC3, AGC5: ∆f (3 dB) = f0/10
0.1
10
1000
100 000
0.7
0.9
1.1
1.3
Ee - Irradiance (mW/m2)
f/f0 - Relative Frequency
Fig. 2 - Pulse-Width vs. Irradiance in Dark Ambient
Fig. 5 - Frequency Dependence of Responsivity
Axis Title
Optical Test Signal
3
2
1
0
10000
Ee
Correlation with ambient light sources:
10 W/m2 = 1.4 klx (std. ilum. A, T = 2855 K)
10 W/m2 = 8.2 klx (daylight, T = 5900 K)
Wavelength of ambient
illumination: λ = 950 nm
1000
100
10
t
600 µs
600 µs
t = 60 ms
94 8134
Output Signal, (see Fig. 4)
VO
VOH
VOL
0.01
0.1
1
10
100
t
ton
toff
Ee - Ambient DC Irradiance (W/m2)
Fig. 3 - Test Signal
Fig. 6 - Sensitivity in Bright Ambient
Rev. 1.0, 23-Oct-2019
Document Number: 82881
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TSOP131..DF1P, TSOP133..DF1P, TSOP135..DF1P
www.vishay.com
Vishay Semiconductors
Axis Title
Axis Title
10000
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10000
1000
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1000
100
10
f = f0
f = 30 kHz
f = 10 kHz
f = 100 Hz
10
1000
1
10
100
750
850
950
1050
1150
∆VS RMS - AC Voltage on DC Supply Voltage (mV)
λ - Wavelength (nm)
Fig. 7 - Sensitivity vs. Supply Voltage Disturbances
Fig. 10 - Relative Spectral Sensitivity vs. Wavelength
Axis Title
Axis Title
0°
10°
20°
30°
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
10000
f = 38 kHz, Ee = 2 mW/m2
40°
50°
1.0
1000
100
10
TSOP131..DF1P
0.9
0.8
60°
70°
80°
TSOP133..DF1P
0.7
TSOP135..DF1P
0
20
40
60
80
100 120 140
0.6
0.4
0.2
0
0.2
0.4
0.6
drel. - Relative Transmission Distance
Burst Length (Number of Cycles/Burst)
Fig. 8 - Max. Envelope Duty Cycle vs. Burst Length
Fig. 11 - Directivity
Axis Title
Axis Title
0.2
0.15
0.1
10000
0.2
0.15
0.1
10000
1000
100
1000
100
10
0.05
0
0.05
0
10
-30
-10
10
30
50
70
90
1.5
2.5
3.5
4.5
5.5
Tamb - Ambient Temperature (°C)
VS - Supply Voltage (V)
Fig. 9 - Sensitivity vs. Ambient Temperature
Fig. 12 - Sensitivity vs. Supply Voltage
Rev. 1.0, 23-Oct-2019
Document Number: 82881
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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TSOP131..DF1P, TSOP133..DF1P, TSOP135..DF1P
www.vishay.com
Vishay Semiconductors
SUITABLE DATA FORMAT
Axis Title
10000
This series is designed to suppress spurious output pulses
due to noise or disturbance signals. The devices can
distinguish data signals from noise due to differences in
frequency, burst length, and envelope duty cycle. The data
signal should be close to the device’s band-pass center
frequency (e.g. 38 kHz) and fulfill the conditions in the table
below.
7
6
5
4
3
2
1
0
1000
100
10
When a data signal presented to the device in the
presence of a disturbance, the sensitivity of the receiver is
automatically reduced by the AGC to insure that no spurious
pulses are present at the receiver’s output. Some examples
which are suppressed are:
• DC light (e.g. from tungsten bulbs sunlight)
• Continuous signals at any frequency
0
5
10
15
20
Time (ms)
16920
• Strongly or weakly modulated patterns from fluorescent
lamps with electronic ballasts (see Fig. 13 or Fig. 14).
Fig. 13 - IR Disturbance from Fluorescent Lamp
With Low Modulation
• 2.4 GHz and 5 GHz Wi-Fi
Axis Title
40
10000
1000
100
20
0
-20
-40
-60
10
0
5
10
15
20
Time (ms)
16921
Fig. 14 - IR Disturbance from Fluorescent Lamp
With High Modulation
TSOP131..DF1P
TSOP133..DF1P
TSOP135..DF1P
Minimum burst length
6 cycles/burst
6 cycles/burst
6 cycles/burst
After each burst of length
A gap time is required of
6 to 70 cycles
≥ 10 cycles
6 to 35 cycles
≥ 10 cycles
6 to 24 cycles
≥ 10 cycles
For bursts greater than
a minimum gap time in the data
stream is needed of
70 cycles
> 1 x burst length
1800
35 cycles
> 6 x burst length
2800
24 cycles
> 25 ms
1800
Maximum number of continuous
short bursts/second
RCMM code
XMP-1 code
r-map code
Yes
Yes
Yes
Preferred
Preferred
Preferred
Yes
Yes
Yes
Suppression of interference from
fluorescent lamps
Fig. 13
Fig. 13 and Fig. 14
Fig. 13 and Fig. 14
Note
• For data formats with long bursts (more than 10 carrier cycles) please see the datasheet for TSOP132..DF1P, TSOP134..DF1P,
TSOP136..DF1P
Rev. 1.0, 23-Oct-2019
Document Number: 82881
5
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSOP131..DF1P, TSOP133..DF1P, TSOP135..DF1P
www.vishay.com
Vishay Semiconductors
BENT LEADS: H = 11.4 mm, W = 5.4 mm, X = 8.85 mm
“W”
22911
20258
NAME
LENS AXIS (X)
VIEW
TYPE
HEIGHT (H)
WIDTH (W)
DEPTH (D)
DF1P
8.85
-
Bend
11.4
5.4
-
MECHANICAL DIMENSIONS in millimeters
5.4
5
2.25
R2.5
Marking area
0.95
c
0.1
(3 x)
0.85 max.
1
2
3
(3 x)
0.6 0.1
(3 x)
2.54 nom.
(1)
5.08 nom.
Not indicated tolerances 0.2
Proposed pad layout
from component side
(for reference only)
Technical drawings
according to DIN
specification
R2.5
Optical axis
(3 x) 0.8
(3 x)
Drawing-No.: 6.550-5343.01-4
Issue: 2; 02.07.19
2.54
2.54
Rev. 1.0, 23-Oct-2019
Document Number: 82881
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSOP131..DF1P, TSOP133..DF1P, TSOP135..DF1P
www.vishay.com
Vishay Semiconductors
ASSEMBLY INSTRUCTIONS
Reflow Soldering
Manual Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handle products only after the temperature has cooled
off
• Handling after reflow should be done only after the work
surface has been cooled off
VISHAY LEAD (Pb)-FREE REFLOW SOLDER PROFILE
Axis Title
300
250
200
150
100
50
10000
max. 260 °C
255 °C
240 °C
245 °C
217 °C
1000
100
10
max. 20 s
max. 120 s
max. 100 s
Max. ramp up 3 °C/s Max. ramp down 6 °C/s
Max. 2 cycles allowed
0
0
50
100
150
200
250
300
Time (s)
19800
Rev. 1.0, 23-Oct-2019
Document Number: 82881
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TSOP131..DF1P, TSOP133..DF1P, TSOP135..DF1P
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Vishay Semiconductors
PACKAGING DIMENSIONS in millimeters
Drawing-No.: 9.700-5399.01-4
Issue: 2; 29.06.18
Item
A0
B0
K0
P0
4.0 0.10
D1
P1
12.0 0.10
W
P2
T
Dimensions
Item
6.08 0.10
E
11.75 0.10
F
5.25 0.10
D0
2.0 0.10
10P0
0.40 0.05
Dimensions
1.75 0.10
11.50 0.10
1.55 0.05
1.5 min.
24.0 +0.30 / -0.10
40.0 0.20
Rev. 1.0, 23-Oct-2019
Document Number: 82881
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
Vishay Semiconductors
REEL DIMENSIONS in millimeters
+3
-0
24.4
Technical drawing
according to DIN
specifications
Form of the leave open of the wheel is supplier specific.
Dimensions according to IEC EN 60 286-3
Tape width: 24
Drawing-No.: 9.800-5052.V3-4
Issue: 1; 17.12.02
Reel hub 2:1
LEADER AND TRAILER DIMENSIONS in millimeters
Trailer
Leader
no devices
devices
no devices
End
Start
min. 200
min. 400
96 11818
COVER TAPE PEEL STRENGTH
According to DIN EN 60286-3
0.1 N to 1.3 N
300 mm/min. 10 mm/min.
165° to 180° peel angle
Rev. 1.0, 23-Oct-2019
Document Number: 82881
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TSOP131..DF1P, TSOP133..DF1P, TSOP135..DF1P
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Vishay Semiconductors
ORDERING INFORMATION
T
S
O
P
d
d
d
d
d
D
F
1
P
Product series
(2 or 3 digits)
Frequency
Holder type
Note
•
d = “digit”, please consult the list of available series on the previous page to create a valid part number
Example: TSOP13538DF1P
PACKAGING QUANTITY
• 1100 pieces per reel
• 1 reel per box
LABEL
Standard bar code labels for finished goods
The standard bar code labels are product labels and used
for identification of goods. The finished goods are packed in
final packing area. The standard packing units are labeled
with standard bar code labels before transported as finished
goods to warehouses. The labels are on each packing unit
and contain Vishay Semiconductor GmbH specific data.
VISHAY SEMICONDUCTOR GmbH STANDARD BAR CODE PRODUCT LABEL (finished goods)
PLAIN WRITING
Item-description
Item-number
Selection-code
LOT-/serial-number
Data-code
ABBREVIATION
LENGTH
-
18
INO
8
SEL
3
BATCH
10
COD
3 (YWW)
Plant-code
PTC
2
Quantity
QTY
8
Accepted by
ACC
-
Packed by
PCK
-
Mixed code indicator
Origin
MIXED CODE
-
xxxxxxx+
Company logo
LONG BAR CODE TOP
Item-number
Plant-code
TYPE
LENGTH
N
8
N
2
Sequence-number
Quantity
X
3
N
8
Total length
-
21
SHORT BAR CODE BOTTOM
Selection-code
Data-code
TYPE
LENGTH
X
N
X
-
3
3
Batch-number
Filter
10
1
Total length
-
17
Rev. 1.0, 23-Oct-2019
Document Number: 82881
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Vishay Semiconductors
DRY PACKING
ESD PRECAUTION
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
Aluminum bag
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
Label
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
Reel
15973
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
22645
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 h under these conditions moisture
content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 125 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC® standard J-STD-020 level 4 label is included
on all dry bags.
LEVEL
CAUTION
This bag contains
MOISTURE-SENSITIVE DEVICES
4
1. Shelf life in sealed bag: 12 months at < 40 °C and < 90 % relative
humidity (RH)
2. After this bag is opened, devices that will be subjected to soldering
reflow or equivalent processing (peak package body temp. 260 °C)
must be
2a. Mounted within 72 hours at factory condition of < 30 °C/60 % RH or
2b. Stored at < 5 % RH
3. Devices require baking befor mounting if:
Humidity Indicator Card is > 10 % when read at 23 °C 5 °C or
2a. or 2b. are not met.
4. If baking is required, devices may be baked for:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 % RH (dry air/nitrogen) or
96 hours at 60 °C 5 °C and < 5 % RH for all device containers or
24 hours at 125 °C 5 °C not suitable for reels or tubes
Bag Seal Date:
(If blank, see barcode label)
Note: Level and body temperature defined by EIA JEDEC Standard J-STD-020
22522
EIA JEDEC standard J-STD-020 level 4 label
is included on all dry bags
Rev. 1.0, 23-Oct-2019
Document Number: 82881
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of
typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding
statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a
particular product with the properties described in the product specification is suitable for use in a particular application.
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk.
Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for
such applications.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document
or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.
© 2019 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED
Revision: 01-Jan-2019
Document Number: 91000
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