TSOP5700TR [VISHAY]
Photo IC,;
| 型号： | TSOP5700TR |
| 厂家： | 
VISHAY |
| 描述： | Photo IC, 光电 光电集成电路 远程控制 数据通信 输出元件 数据传输 PC |
| 文件： | 总19页 (文件大小：751K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TSOP5700
Vishay Semiconductors
VISHAY
IR Receiver for High Data Rate PCM at 455 kHz
Description
The TSOP5700 is a miniaturized SMD IR receiver for
infrared remote control and IR data transmission. PIN
diode and preamplifier are assembled on lead frame,
the epoxy package is designed as IR filter.
The demodulated output signal can directly be
decoded by a microprocessor. The main benefit is the
operation with high data rates and long distances.
Features
• Photo detector and preamplifier in one package
• Internal Bandfilter for PCM frequency
• Internal shielding against electrical field
disturbance
• Short settling time after power on
• High envelope duty cycle can be received
• TTL and CMOS compatibility
• Output active low
• Enhanced immunity against disturbance from
energy saving lamps
• Small size package
• Taping available for topview and sideview
assembly
Special Features
• Data rate 20 kbit/s
• Supply voltage 2.7 - 5.5 V
Mechanical Data
Pinning:
1 = GND, 2 = NC, 3 = OUT, 4 = VS
Block Diagram
Application Circuit
16840
4
16843
VS
R1 = 47 Ω
10 kΩ
Transmitter
TSOPxxxx
R2 >=
with
3
VS
+VS
C1
=
1 kΩ
TSHFxxxx
OUT
4.7 µF
Band Demo-
dulator
Input
AGC
µC
Pass
OUT
GND
VO
GND
1
PIN
GND
Control
Circuit
R1 + C1 recommended to suppress power supply
disturbances.
R2 optional for improved pulse forming.
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
1
TSOP5700
Vishay Semiconductors
VISHAY
Absolute Maximum Ratings
T
= 25 °C, unless otherwise specified
amb
Parameter
Test condition
Symbol
Value
Unit
V
Supply Voltage
Pin 4
Pin 3
V
- 0.3 to + 6.0
S
Voltage at output to supply
V
- V
- 0.3 to
V
S
O
(V + 0.3)
S
Supply Current
Pin 4
Pin 3
Pin 3
I
5
- 0.3 to + 6.0
15
mA
V
S
Output Voltage
V
O
Output Current
I
mA
°C
O
Junction Temperature
Storage Temperature Range
Operating Temperature Range
Power Consumption
T
100
j
T
- 40 to + 85
- 25 to + 85
50
°C
stg
T
°C
amb
T
≤ 85 °C
P
mW
amb
tot
Electrical and Optical Characteristics
T
= 25 °C, unless otherwise specified
amb
Parameter
Test condition
Symbol
Min
2.7
Typ.
2.0
Max
2.7
Unit
mA
Supply Current (Pin 4)
Dark ambient
I
I
SD
SH
E = 40 klx, sunlight
2.3
5
mA
V
v
Supply Voltage (Pin 4)
Transmission Distance
V
5.5
S
λ = 870 nm,
d
15
m
p
max
IR Diode TSHF5400,
I
= 300 mA
F
λ = 950 nm,
d
9
m
p
max
IR Diode TSAL6400,
I
= 300 mA
F
2
Threshold Irradiance
λ = 870 nm,
E
1.5
2.5
p
e min
mW/m
optical test signal of Fig.1
Optical test signal of Fig.1
2
Maximum Irradiance
E
30
e max
W/m
Output Voltage Low (Pin 3)
Output Voltage High (Pin 3)
1 kΩ external pull up resistor
V
100
mV
V
QL
No external pull-up resistor,
test signal see fig. 1
V
V
- 0.25
S
QH
Bandpass filter quality
Q
10
Out-Pulse width tolerance
Optical test signal of Fig.1,
∆
- 15
15
+ 5
+ 15
36
µs
µs
tpo
2
2
2.5 mW/m ≤ E ≤ 30 W/m
e
Delay time of output pulse
Optical test signal of Fig.1,
t
don
2
E > 2.5 mW/m
e
Receiver start up time
Falling time
Valid data after power on
t
50
0.4
12
µs
µs
V
Leading edge of output pulse
No external pull up resistor
1 kΩ external pull up resistor
t
f
Rise time
t
µs
r
t
1.2
50
µs
r
Directivity
Angle of half transmission
distance
ϕ
deg
1/2
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2
Document Number 82166
Rev. 5, 14-Aug-03
TSOP5700
Vishay Semiconductors
VISHAY
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
30
N=10 cycles/burst
Optical Test Signal (f=455kHz, 10 cycles/burst)
25
t
= 22 ∝s
2.2 ∝s
E
e
pi
20
15
10
5
Jitter – t
po
> 48.6 ∝s
t
(min. duty cycle)
t
don
16563
Output Signal of TSOP5700
V
t
Q
po
V
QH
90%
10%
50%
Jitter – t
don
0
V
QL
t
t
r
t
f
t
= t
pi
15 ∝s
ı
1
10
100 1000 10000 100000
0.1
2
po
16791
16751
16558
E
e
– Irradiance (mW/m )
Figure 1. Output Function
Figure 4. Jitter of Output Pulse
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
Optical Test Signal
(IR diode TSHF5400,
870 nm, I = 300 mA, f = 455 kHz, 10 cycles/burst)
F
p
t
pi
= 22 ∝s
E
e
t
Output Signal of TSOP5700
t
don
16565
t
po
V
O
V
OH
V
OL
t
j
j
tdon
300 350 400 450 500 550 600
f – Frequency ( kHz )
tpo
jitter of leading edge
jitter of output pulse width
Figure 2. Output Fucntion (mit Jitter)
Figure 5. Frequency Dependence of Responsivity
14
35
30
25
20
15
10
5
Output pulse width – t
po
Correlation with ambient light sources:
2
10W/m 1.4klx (Std.illum.A,T= 2855 K)
2
12
10
8
10W/m
8.2klx (Daylight,T = 5900K)
ı
ı
Delay time – t
don
6
Ambient, = 950 nm
4
2
N = 10 cycles/burst
0
0.1
0
1.0
10
100
0.1
110100100010000100000
2
2
E - DC Irradiance (W/m
)
16790
E – Irradiance (mW/m )
e
Figure 3. Output Pulse Diagram (t , t
)
Figure 6. Sensitivity in Bright Ambient
don po
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
3
TSOP5700
Vishay Semiconductors
VISHAY
1.2
1.0
0.8
0.6
0.4
0.2
0.0
3.0
2.8
Sensitivity in dark ambient
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
2
3
S
4
5
6
750 800 850 900 950 1000 10501100 1150
λ - Wavelength ( nm )
16559
16788
16754
V
- Supply Voltage ( V )
16789
Figure 7. Sensitivity vs. Supply Voltage
Figure 10. Relative Spectral Sensitivity vs. Wavelength
0°
10°
20°
1.1
1.0
0.9
0.8
0.7
0.6
0.5
30°
40°
1.0
0.9
0.8
50°
60°
70°
80°
0.7
8
10 12 14 16 18 20 22 24 26 28
N - Burstlength ( carriercycles/burst )
0.6
0.6 0.4 0.2
0
0.2
0.4
d
- Relative Transmission Distance
16801
rel
Figure 8. Rel. Sensitivity vs. Burstlength
Figure 11. Directivity
2.3
2.2
2.1
2.0
1.9
1.8
1.7
1.6
1.5
V
S
= 5.5 V
V
S
= 2.7 V
-25 -15 -5
5
15 25 35 45 55 65 75 85
T
amb
- Ambient Temperature ( °C )
Figure 9. Supply Current vs. Ambient Temperature
www.vishay.com
4
Document Number 82166
Rev. 5, 14-Aug-03
TSOP5700
Vishay Semiconductors
VISHAY
Recommendation for Suitable Data
Formats
The circuit of the TSOP5700 is designed in that way
that disturbance signals are identified and unwated
output pulses due to noise or disturbances are
avoided. A bandpass filter, an automatic gain control
and an integrator stage is used to suppress such dis-
turbances. The distinguishing marks between data
signal and disturbance are carrier frequency, burst
length and the envelope duty cycle.
The data signal should fulfill the following conditions:
• The carrier frequency should be close to 455 kHz.
• The burstlength should be at least 22 µs (10 cycles
of the carrier signal) and shorter than 500 µs.
• The separation time between two consecutive
bursts should be at least 26 µs.
• If the data bursts are longer than 500 µs then the
envelope duty cycle is limited to 25 %
• The duty cycle of the carrier signal (455 kHz) may be
between 50 % (1.1 µs pulses) and 10 % (0.2 µs
pulses). The lower duty cycle may help to save bat-
tery power.
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
5
TSOP5700
Vishay Semiconductors
VISHAY
Package Dimensions in mm
16776
www.vishay.com
6
Document Number 82166
Rev. 5, 14-Aug-03
TSOP5700
Vishay Semiconductors
VISHAY
Taping Version TSOP5700..TT
16584
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
7
TSOP5700
Vishay Semiconductors
VISHAY
Taping Version TSOP5700..TR
16585
www.vishay.com
8
Document Number 82166
Rev. 5, 14-Aug-03
TSOP5700
Vishay Semiconductors
VISHAY
Reel Dimensions
16734
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
9
TSOP5700
Vishay Semiconductors
VISHAY
Leader and Trailer
Trailer
Leader
no devices
devices
no devices
End
Start
min. 200
min. 400
96 11818
Cover Tape Peel Strength
According to DIN EN 60286-3
0.1 to 1.3 N
300 10 mm/min
165 ° - 180 ° peel angle
Label
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard pack-
ing units are labeled with standard bar code labels
before transported as finished goods to warehouses.
The labels are on each packing unit and contain
Vishay Semiconductor GmbH specific data.
www.vishay.com
10
Document Number 82166
Rev. 5, 14-Aug-03
TSOP5700
Vishay Semiconductors
VISHAY
Vishay Semiconductor GmbH standard bar code product label (finished goods)
Length
18
Plain Writing
Item-Description
Abbreviation
–
INO
SEL
BATCH
COD
8
Item-Number
Selection-Code
LOT-/ Serial-Number
Data-Code
3
10
3 (YWW)
Plant-Code
Quantity
Accepted by:
PTC
QTY
2
8
–
–
–
ACC
PCK
Packed by:
Mixed Code Indicator
MIXED CODE
+
xxxxxxx
Company Logo
Origin
Length
Long Bar Code Top
Item-Number
Type
N
N
8
2
Plant-Code
X
N
–
3
Sequence-Number
Quantity
8
21
Total Length
Short Bar Code Bottom
Selection–Code
Data-Code
Length
3
Type
X
N
3
10
1
X
–
–
Batch-Number
Filter
17
Total Length
16942
Dry Packing
Final Packing
The reel is packed in an anti-humidity bag to protect The sealed reel is packed into a cardboard box. A
the devices from absorbing moisture during transpor- secondary cardboard box is used for shipping pur-
tation and storage.
poses.
Aluminium bag
Label
Reel
15973
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
11
TSOP5700
Vishay Semiconductors
VISHAY
Recommended Method of Storage
Dry box storage is recommended as soon as the alu-
minium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
16962
• Storage humidity ≤ 60 % RH max.
After more than 72 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
following condition:
Operating Instructions
Reflow Soldering
• Reflow soldering must be done within 48 hours
stored under max. 30 °C, 80 % RH after opening
envelop
• Recommended soldering paste (composition: SN 63
%, Pb 37 %)
192 hours at 40 °C + 5 °C/ -0 °C and < 5 % RH (dry
air/ nitrogen) or
96 hours at 60 °C +5 °C and < 5 % RH for all device
containers or
24 hours at 125 °C +5 °C not suitable for reel or
tubes.
Melting temperature 178 °C to 192 °C
• Apply solder paste to the specified soldering pads,
by using a dispenser or by screen printing.
An EIA JEDEC Standard JESD22-A112 Level 4 label
is included on all dry bags.
• Recommended thickness of metal mask is 0.2 mm
for screen printing.
• The recommended reflow furnace is a combination-
type with upper and lower heaters.
• Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230 °C. The
following temperature profile means the tempera ture
at the device surface. Since temperature difference
occurs between the work and the surface of the circuit
board depending on the pes of circuit board or reflow
furnace, the operating conditions should be verified
prior to start of operation.
• Handling after reflow should be done only after the
work surface has been cooled off.
16943
Manual Soldering
• Use the 6/4 solder or the solder containing silver.
Example of JESD22-A112 Level 4 label
• Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 °C.
• Finish soldering within three seconds.
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices espe-
cially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warn-
ing labels are on the packaging.
• Handle products only after the temperature is cooled
off.
Cleaning
• Perform cleaning after soldering strictly in conform-
ance to the following conditions:
Vishay Semiconductors Standard
Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconduc-
tors specific data.
Cleaning agent:
2-propanol (isopropyl alcohol).
Commercially available grades (industrial use) should
be used.
www.vishay.com
12
Document Number 82166
Rev. 5, 14-Aug-03
TSOP5700
Vishay Semiconductors
VISHAY
Demineralized or distilled water having a resistivity of Manual Soldering
not less than 500 mΩ corresponding to a conductivity
• Use the 6/4 solder or the solder containing silver.
of 2 mS/m.
• Use a soldering iron of 25 W or smaller. Adjust the
temperature of the soldering iron below 300 °C.
• Finish soldering within three seconds.
• Temperature and time: 30 seconds under the tem-
perature below 50 °C or 3 minutes below 30 °C.
• Ultrasonic cleaning: Below 20 W.
• Handle products only after the temperature is cooled
off.
Reflow Solder Profile
Cleaning
• Perform cleaning after soldering strictly in conform-
ance to the following conditions:
Cleaning agent:
240
220
200
180
160
140
120
100
80
10 s max.
@ 230 °C
2-propanol (isopropyl alcohol)
Commercially available grades (industrial use) should
be used.
2 °C - 4 °C/s
Demineralized or distilled water having a resistivity of
not less than 500 mΩ corresponding to a conductivity
of 2 mS/m.
120 s - 180 s
90 s max
• Temperature and time: 30 seconds under the tem-
perature below 50 °C or 3 minutes below 30 °C.
2 °C - 4 °C/s
60
40
• Ultrasonic cleaning: Below 20 W.
20
0
0
50
100
150
200
250
300
350
Reflow Solder Profile
Time ( s )
16735
240
Assembly Instructions
Reflow Soldering
• Reflow soldering must be done within 72 hours
stored under max. 30 °C, 60 % RH after opening
envelop
• Recommended soldering paste (composition: SN 63
%, Pb 37 %) Melting temperature 178 °C to 192 °C
10 s max.
@ 230 qC
220
200
180
160
140
120
100
80
60
40
20
0
2 qC - 4 qC/s
120 s - 180 s
90 s max
2 qC - 4 qC/s
• Apply solder paste to the specified soldering pads,
by using a dispenser or by screen printing.
0
50
100 150 200 250 300 350
• Recommended thickness of metal mask is 0.2 mm
for screen printing.
Time ( s )
16944
• The recommended reflow furnace is a combination-
type with upper and lower heaters.
• Set the furnace temperatures for pre-heating and
heating in accordance with the reflow temperature
profile as shown below. Excercise extreme care to
keep the maximum temperature below 230 °C. The
following temperature profile means the tempera ture
at the device surface. Since temperature differ ence
occurs between the work and the surface of the circuit
board depending on the pes of circuit board or reflow
furnace, the operating conditions should be verified
prior to start of operation.
• Handling after reflow should be done only after the
work surface has been cooled off.
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
13
TSOP5700
Vishay Semiconductors
VISHAY
Taping Version TSOP..TT
www.vishay.com
14
Document Number 82166
Rev. 5, 14-Aug-03
TSOP5700
Vishay Semiconductors
VISHAY
Taping Version TSOP..TR
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
15
TSOP5700
Vishay Semiconductors
VISHAY
Reel Dimensions
www.vishay.com
16
Document Number 82166
Rev. 5, 14-Aug-03
TSOP5700
Vishay Semiconductors
VISHAY
Leader and Trailer
Cover Tape Peel Strength
According to DIN EN 60286-3
0.1 to 1.3 N
300 10 mm/min
165 ° - 180 ° peel angle
Label
Standard bar code labels for finished goods
The standard bar code labels are product labels and
used for identification of goods. The finished goods
are packed in final packing area. The standard pack-
ing units are labeled with standard bar code labels
before transported as finished goods to warehouses.
The labels are on each packing unit and contain
Vishay Semiconductor GmbH specific data.
Dry Packing
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transpor-
tation and storage.
Final Packing
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping pur-
poses.
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
17
TSOP5700
Vishay Semiconductors
VISHAY
Recommended Method of Storage
Dry box storage is recommended as soon as the alu-
minium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 % RH max.
After more than 72 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will
recover to the former condition by drying under the
following condition:
192 hours at 40 °C + 5 °C/ -0 °C and < 5 % RH (dry
air/ nitrogen) or
96 hours at 60 °C +5 °C and < 5 % RH for all device
containers or
24 hours at 125 °C +5 °C not suitable for reel or
tubes.
An EIA JEDEC Standard JESD22-A112 Level 4 label
is included on all dry bags.
Example of JESD22-A112 Level 4 label
ESD Precaution
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices espe-
cially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warn-
ing labels are on the packaging.
Vishay Semiconductors Standard
Bar-Code Labels
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Telefunken
specific data.
www.vishay.com
18
Document Number 82166
Rev. 5, 14-Aug-03
TSOP5700
Vishay Semiconductors
VISHAY
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and
operatingsystems with respect to their impact on the health and safety of our employees and the public, as
well as their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the
use of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423
Document Number 82166
Rev. 5, 14-Aug-03
www.vishay.com
19
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