VJ0603Q1R8CXXCW1BC [VISHAY]
CAPACITOR, CERAMIC, MULTILAYER, 25V, C0G, 0.0000018uF, SURFACE MOUNT, 0603, CHIP,ROHS COMPLIANT;型号: | VJ0603Q1R8CXXCW1BC |
厂家: | VISHAY |
描述: | CAPACITOR, CERAMIC, MULTILAYER, 25V, C0G, 0.0000018uF, SURFACE MOUNT, 0603, CHIP,ROHS COMPLIANT |
文件: | 总11页 (文件大小:186K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
FEATURES
• Ultra stable class 1 dielectric
• High Q and low ESR at high frequency
• Four standard sizes
RoHS
COMPLIANT
• High capacitance per unit volume
• Supplied in tape on reel
• For high frequency applications
• Ni-barrier with 100 % tin terminations
APPLICATIONS
• Mobile telecommunication
GENERAL SPECIFICATIONS
NOTE: Electrical characteristics values -
temperature at 20 1 °C, pressure at 86 to 106 Kpa and
humidity at 63 to 67 % unless otherwise stated
Rated Voltage UR (DC): 16 V; 25 V; 50 V; 100 V
Capacitance Range: 0.5 pF to 3300 pF
Tolerance on Capacitance:
• WLAN
• RF modules
• Tuner
C < 10 pF = 0.1 pF; 0.5 pF; 0.25 pF
Temperature Coefficient: 30 ppm/ °C
C ≥ 10 pF = 1 %; 2 %; 5 %
Q < 30 pF = Q ≥ 400 + 20C
Q ≥ 30 pF = Q ≥ 1000
Insulation Resistance after 120 seconds at UR (DC):
10 GΩ minimum or 500 ΩF minimum, whichever is less
Climatic Category (IEC 68): 55/125/56
DIMENSIONS in inches [millimeters]
SIZE
CODE
T
L
W
MB
MAX.
0.040 0.002 0.020 0.002
[1.0 0.05] [0.5 0.05]
0.022
[0.55]
0.010 + 0.002/- 0.004
[0.25 + 0.05/- 0.10]
W
T
0402
MB
MB
L
0.063 0.004 0.030 0.004
0.035
[0.87]
0.015 0.006
[0.40 0.15]
0603
[1.6 0.10]
[0.8 0.10]
ORDERING INFORMATION
VJ0402
Q
101
F
X
J
C
W1BC
SIZE CODE DIELECTRIC
CAPACITANCE
TOLERANCE
TERMINATION VOLTAGE
PACKAGING PROCESSCODEFOR
VISHAY BCC
PRODUCTS
0402
0603
Q = High Q
expressed in pF
two significant digits
followed by the
Cap. value < 10 pF X = Ni Barrier
J = 16 V
X = 25 V
A = 50 V
B = 100 V
C = 7 inches
reel/paper
B = 0.10 pF
C = 0.25 pF
D = 0.50 pF
Cap. value ≥ 10 pF
F = 1 %
100% tin
termination
P = 13 inches
reel/paper
number of zeros:
1R0 = 1.0 pF
101 = 100 pF
G = 2 %
J = 5 %
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39
For technical questions, contact: MLCC@vishay.com
Document Number 28534
Revision 16-Jul-07
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
SELECTION CHART FOR 16/25/50 AND 100 V
DIELECTRIC
NP0
EIA CAP
CODE
0R5
EIA SIZE
CAP
0.5 pF
0402
0603
16V
25V
N
50V
N
100V
16V
25V
S
50V
S
100V
S
1R0
1R2
1R5
1R8
2R2
2R7
3R3
3R9
4R7
5R6
6R8
8R2
100
120
150
180
220
270
330
390
470
560
680
820
101
121
151
181
221
271
331
391
471
561
681
821
102
122
152
182
222
272
332
472
562
682
822
103
1.0
1.2
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
N
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
S
1.5
1.8
2.2
2.7
3.3
3.9
4.7
5.6
6.8
8.2
10 pF
12
15
18
22
27
33
39
47
56
68
82
100 pF
120
150
180
220
270
330
390
470
560
680
820
1000 pF
1200
1500
1800
2200
2700
3300
4700
5600
6800
8200
10 000 pF
N
N
N
N
S
S
S
S
S
S
Letters indicate product thickness, see packaging quantities
Document Number 28534
Revision 16-Jul-07
For technical questions, contact: MLCC@vishay.com
www.vishay.com
40
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
PACKAGING QUANTITIES
AMOUNT PER REEL
Δ180 mm; 7 inch
THICKNESS
CLASSIFICATION
(mm)
0402
0603
0805
1206
N =
S =
X =
A =
B =
C =
D =
J =
0.50 0.05
0.8 0.07
0.8 + 0.15/ - 0.10
0.6 0.1
0.8 0.1
0.95 0.1
1.25 0.1
1.15 0.15
1.25 0.2
1.60 + 0.30/- 0.10
1.60 0.2
Paper 10 Kp/Reel
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Paper 4 Kp/Reel
Paper 4 Kp/Reel
-
-
-
-
-
-
-
-
Paper 4 Kp/Reel
Paper 4 Kp/Reel
Paper 4 Kp/Reel
Plastic 3 Kp/Reel
Plastic 3 Kp/Reel
Plastic 3 Kp/Reel
-
-
Plastic 3 Kp/Reel
-
Plastic 3 Kp/Reel
I =
P =
G =
-
-
Plastic 2 Kp/Reel
Plastic 2 Kp/Reel
PACKAGING QUANTITIES
AMOUNT PER REEL
Δ330 mm; 13 inch
THICKNESS
CLASSIFICATION
(mm)
0402
0603
0805
1206
N =
S =
X =
A =
B =
C =
D =
J =
I =
0.50 0.05
0.8 0.07
0.8 + 0.15/ - 0.10
0.6 0.1
0.8 0.1
0.95 0.1
1.25 0.1
1.15 0.15
1.25 0.2
1.60 + 0.30/- 0.10
1.60 0.2
Paper 50 Kp/Reel
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
Paper 15 Kp/Reel
Paper 15 Kp/Reel
-
-
-
-
-
-
-
-
Paper 15 Kp/Reel
Paper 15 Kp/Reel
Paper 15 Kp/Reel
Plastic 10 Kp/Reel
Plastic 10 Kp/Reel
Plastic 10 Kp/Reel
-
Plastic 10 Kp/Reel
-
Plastic 10 Kp/Reel
-
-
-
P =
G =
-
-
COVER TAPE (POLYESTER - ANTISTATIC)
PROPERTIES OF COVER TAPE
CARRIER TAPE (POLYCARBONATE)
PROPERTIES OF CARRIER TAPE
WIDTH
WIDTH
PARAMETER
5.5 0.1 mm
PARAMETER
8.1 0.2 mm
190 to 280 µm
> 60 N/mm2
100 to 150 %
> 1012 Ω/sq.
Breaking force
Elongation at break
Surface resistance
Softening point
Thickness
≥ 10.7 N
≥ 63 %
< 1010 Ω/sq.
71 5 °C
62 μm
Thickness
Tensile strength at break
Elongation at break
Surface resistance
PAPER TAPE SPECIFICATIONS
DIMENSIONS OF PAPER TAPE in millimeters
P
0
PRODUCT SIZE CODE
P
D
2
0
SYMBOL
0402
0603
0805
1206
E
SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL.
A0
B0
W
E
0.62
1.12
8.00
1.75
3.50
1.55
4.00
2.00
2.00
0.05 1.02
0.05 1.82
0.10 8.00
0.05 1.75
0.05 3.50
0.05 1.55
0.10 4.00
0.05 4.00
0.05 2.00
0.05 1.50
0.05 2.30
0.10 8.00
0.05 1.75
0.05 3.50
0.05 1.55
0.10 4.00
0.10 4.00
0.05 2.00
0.10 2.00
0.10 3.50
0.10 8.00
0.05 1.75
0.05 3.50
0.05 1.50
0.10 4.00
0.10 4.00
0.05 2.00
0.10
0.10
0.10
0.10
0.05
0.05
0.10
0.10
0.05
F
W
B
0
F
D0
P0
P1
P2
A
0
P
1
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For technical questions, contact: MLCC@vishay.com
Document Number 28534
Revision 16-Jul-07
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
BLISTER TAPE SPECIFICATIONS
DIMENSIONS OF BLISTER TAPE in millimeters
K
P
0
0
T
PRODUCT
D
P
2
DIMENSION
TOLERANCE
0
0805
< 1.57
1206
< 2.00
A0
B0
W
E
-
-
E
F
< 2.45
8.00
1.75
3.50
1.50
1.00
4.00
4.00
2.00
< 3.60
8.00
1.75
3.50
1.50
1.00
4.00
4.00
2.00
0.10
0.10
0.05
0.05
0.10
0.10
0.10
0.05
cover tape
W
F
B
0
D0
D1
P0
P1
P2
A
D
1
T
1
0
direction of unreeling
T
P
1
2
REEL SPECIFICATIONS
D
C
A
B
REEL DIMENSIONS AND TAPE WIDTH in millimeters
Ø 180 mm; 7 inch
Ø 330 mm; 13 inch
13.0 0.5
A
B
C
D
13.0 1.0
9.0 1.0
9.0 1.0
178.0 1.0
60.5 1.0
330.0 1.0
100.0 1.0
METHOD OF MOUNTING AND DIMENSIONS OF SOLDER LANDS
For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering and
reflow soldering.
An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with
the chip size and with temperature fluctuations (> 100 °C) Therefore, it is advised to use the smallest possible size and follow the
dimensional recommendations given.
Document Number 28534
Revision 16-Jul-07
For technical questions, contact: MLCC@vishay.com
www.vishay.com
42
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
SOLDERING GRAPHS
IR REFLOW WITH SnPb SOLDER
IR REFLOW WITH SnAgCu SOLDERING
300
250
200
150
100
50
300
Max.Temperature
Max.Temperature
250
> 215 °C: 20 ~ 40 seconds
200
Sn-Ag-Cu solder paste
150
Min.Temperature
Min.Temperature
100
SnPB Eutectic Solder Paste
50
0
0
30 ~ 60
sec.
Time
30 ~ 60 sec.
30 ~ 60 sec.
30 ~ 60 sec.
Time
60 - 120 sec.
60 - 120 sec.
60 - 120 sec.
WAVE SOLDERING
REFLOW SOLDERING
300
250
200
150
100
50
300
250
200
150
100
50
10 s
10 s
260 °C
~
~ 245 °C
235 °C to 260 °C
First Wave
Second Wave
10 s
215 °C
~
~ 5 K/s
180 °C
40 s
~
~ 2 K/s
~
~ 200 K/s
130 °C
100 °C to 130 °C
Forced
Cooling
2 K/s
~
~ 2 K/s
0
0
100
150
200
250
0
50
0
50
100
200
150
250
t (s)
t (s)
RECOMMENDED DIMENSIONS OF SOLDER LANDS in millimeters
Solder Land
Solder Paste
pattern
Solder resist
pattern
D
G
Occupied Area
Tracks
E
C
B
A
F
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For technical questions, contact: MLCC@vishay.com
Document Number 28534
Revision 16-Jul-07
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
REFLOW SOLDERING
FOOTPRINT DIMENSIONS in mm
SIZE
PLACEMENT
PROCESSING REMARKS
CODE
ACCURACY
0.15
A
B
C
D
E
F
G
0.95
1.40
1.85
2.25
0402
0603
0805
1206
1.50
0.50 0.50
0.70 0.80
1.00 0.90
2.20 0.90
0.50 0.10 1.75
0.80 0.20 2.55
1.30 0.40 3.08
1.60 1.60 4.25
2.30
2.80
4.00
0.25
0.25
0.25
IR or hot plate soldering
WAVE SOLDERING
FOOTPRINT DIMENSIONS in mm
PROPOSED NUMBER AND DIMENSIONS
PLACEMENT
ACCURACY
(mm)
SIZE
CODE
OF DUMMY TRACKS
(mm)
A
B
C
D
E
F
G
0603
0805
1206
2.40
3.20
4.80
1.00 0.70 0.80 0.20 3.10 1.90
1.40 0.90 1.30 0.36 4.10 2.50
2.30 1.25 1.70 1.25 5.90 3.20
1 x (0.2 x 0.8)
1 x (0.3 x 1.3)
3 x (0.25 x 1.7)
0.10
0.15
0.25
TEST CONDITIONS IN STATIC SOLDER BATH
PARAMETER
DESCRIPTION
SOLDERABILITY
95 % covered with smooth and bright solder coating
CECC requirement: 235 5 °C for 2 0.5 seconds
IEC requirement: 215 3 °C for 3 0.3 seconds
RESISTANCE TO LEACHING
10 % of the metallization of the edges of the head face may be missing
(inner electrodes are not visible)
260 5 °C for 30 1 second
TEST PROCEDURES AND REQUIREMENTS
TEST
PROCEDURE
REQUIREMENTS
1) Visual and
mechanical
• No remarkable defect.
• Dimensions should confirm to individual specification sheet.
2) Capacitance
Class I: NP0
Cap 1000 pF; 1.0 0.2 Vrms; 1 MHz 10 %
Cap > 1000 pF; 1.0 0.2 Vrms; 1 kHz 10 %
• Shall not exceed the limits given in the detailed specification.
≤
3) Q/D.F
(Dissipation Factor)
NP0: Cap
≥
30 pF: Q
≥
≥
1000
400 + 20 C.
Cap < 30 pF: Q
X7R, X5R:
Rated Vol.
Class II: X7R, X5R, Y5V
Cap
≤ 10 µF; 1.0 0.2 Vrms; 1 kHz 10 %
D.F.
Exception of D.F.
Cap > 10 µF; 0.5 0.2 Vrms; 120 Hz 20 %
0603
1206
≥
≥
0.047 µF, 0805
0.47 µF
≥ 0.18 µF,
≥
50 V
≤
≤
2.5 %
3.5 %
≤
3 %
≤
≤
5 %
7 %
0805
0603
≥
≥
1µF, 1210
0.33 µF
≥ 10 µF
25 V
16 V
0201
0603
1206
≥
≥
≥
0.0047 µF, 0402
0.15 µF, 0805
2.2 µF
≥
0.033 µF,
≤
3.5 %
≤
5 %
≥ 0.68 µF,
10 V
6.3 V
Y5 V:
≤
≤
5.0 %
10 %
−
−
≤
15 %
0805
≥
10 µF
Rated Vol.
D.F.
Exception of D.F.
≥
50 V
≤
5.0 %
−
−
0603
1206
≥
0.1µF, 0805
1µF
≥
0.33 µF,
≤
7 %
≥
≥
≥
25 V
≤
5.0 %
≤
9 %
9 %
−
0402
0402
0.068 µF
0.068 µF
16 V (C < 1 µF)
16 V (C
≤
≤
≤
≤
7.0 %
9.0 %
12.5 %
20 %
≤
≥
1 µF)
−
−
−
≤
≤
10 V
6.3 V
−
−
Document Number 28534
Revision 16-Jul-07
For technical questions, contact: MLCC@vishay.com
www.vishay.com
44
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
TEST PROCEDURES AND REQUIREMENTS
TEST
PROCEDURE
REQUIREMENTS
4) Dielectric strength
• To apply voltage (
≤
50 V) 250 %.
• No evidence of damage or flash-over during test.
• Duration: 1 to 5 seconds.
• Charge and discharge current less than 50
mA.
• To apply voltage:
100 V
≥
≥
≥
≥
3 times V DC
2 times V DC
1.5 times V DC
1.2 times V DC
200 V ~ 300 V
500 V ~ 999 V
1000 V ~ 3000 V
• Cut-off, set at 10mA
• TEST = 15 seconds
• RAMP = 0
5) Insulation resistance To apply rated voltage for max. 120 seconds
≥
≥
10 G
Ω
Ω
or R x C
≥
500
Ω
F whichever is smaller.
Rated voltage:
100 ~ 500 V
To apply rated voltage
10 G
.
for
60 seconds
Rated voltage:
> 500 V
To apply 500 V for
60 seconds
≥
10 GΩ.
6) Temperature
coefficient
With no electrical load:
T.C.
Operating Temp
T.C.
Capacitance Change
Within 30 ppm/°C
Within 120 ppm/°C
Within 15 %
NP0 (C0G)
NP0 (C0J)
X7R
- 55 ~ 125 °C at 25 °C NP0 (C0G)
- 55 ~ 125 °C at 25 °C NP0 (C0J)
- 55 ~ 125 °C at 25 °C X7R
X5R
- 55 ~ 85 °C at 25 °C
- 25 ~ 85 °C at 20 °C
X5R
Y5V
Within 15 %
Y5V
Within + 30 %/- 80 %
7) Adhesive strength of • Pressurizing force:
• No remarkable damage or removal of the terminations.
termination
0201: 2N
0402 and 0603: 5 N
> 0603: 10 N
• Test time 10 1 second.
8) Vibration resistance • Vibration frequency: 10 to 55 Hz/minute.
• Total amplitude: 1.5 mm.
• No remarkable damage.
• Capacitance change and Q/D.F.: To meet initial specification.
• Test time: 6 hours (2 hours each in 3 mutually
perpendicular directions).
9) Solderability
• Solder temperature: 235 5 °C.
• Dipping time: 0.5 seconds
95 % minimum coverage of all metallized area.
2
.
10) Bending test
• The middle part of the substrate shall be
pressurized by means of the pressurizing rod
at a
rate of about 1 mm per second until the
deflection
• No remarkable damage
• Capacitance change:
NP0: within 5.0 % or 0.5 pF whichever is larger.
X7R, X5R: within 12.5 %
Y5V: within 30 %
becomes 1 mm and then the pressure shall be
maintained for 5 1 seconds.
• Measurement to be made after keeping at
room
(This capacitance change means the change of capacitance under specified
flexure of substrate from the capacitance measured before the test)
temperature for 24 2 hours.
11) Resistance to
soldering heat
• Solder temperature: 270 5 °C.
• Dipping time: 10 1 second.
• Preheating: 120 to 150 °C for 1 minute before
immerse the capacitor in a eutectic solder.
• Before initial measurement (Class II only):
Perform 150 + 0/ - 10 °C for 1 hour and then
set for
48 4 hours at room temperature.
• Measurement to be made after keeping at
room
• No remarkable damage
• Capacitance change:
NP0: within 2.5 % or 0.25 pF whichever is larger.
X7R, X5R: within 7.5 %
Y5V: within 20 %
• Q/D.F., I.R. and dielectric strength: To meet initial requirements.
• 25 % maximum leaching on each edge.
temperature for 24 2 hours (Class I) or 48
4
hours (Class II).
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For technical questions, contact: MLCC@vishay.com
Document Number 28534
Revision 16-Jul-07
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
TEST PROCEDURES AND REQUIREMENTS
TEST
PROCEDURE
REQUIREMENTS
12) Temperature
cycle
• Conduct the 5 cycles according to the
temperatures and time.
• No remarkable damage
• Capacitance change:
NP0: within 2.5 % or 0.25 pF whichever is larger.
X7R, X5R: within 7.5 %
Time
Min. operating temp. + 0/- 3 30
Room temperature 2 ~ 3
Min. operating temp. + 3/- 0 30
Room temperature 2 ~ 3
Step Temperature (°C)
1
2
3
4
3
3
Y5V: within 20 %
• Q/D.F., I.R. and dielectric strength: To meet initial requirements.
• Before initial measurement (Class II only):
Perform 150 + 0/- 10 °C for 1 hour and then
set for
48 4 hours at room temperature.
• Measurement to be made after keeping at
room
temperature for 24 2 hours (Class I) or 48
4
hours (Class II).
13) Humidity
(steady state)
• Test temperature: 40 2 °C.
• Humidity: 90 ~ 95 % RH.
• No remarkable damage
• Capacitance change:
• Test time: 500 + 24/− 0 hours.
• Measurement to be made after keeping at
room
NP0: within 5.0 % or 0.5 pF whichever is larger.
X7R, X5R: ≥ 10 V, within 12.5 %
6.3 V, within 25 %
temperature for 24 2 hours (Class I) or
Y5V: within 30 %
48
4
• Q/D.F. value: NP0: Cap ≥ 30 pF: Q ≥ 350
10pF ≤ Cap < 30 pF: Q ≥ 275 + 2.5C
Cap < 10pF: Q ≥ 200 + 10C
X7R, X5R:
hours (Class II).
Rated Vol.
D.F.
Exception of D.F.
0603 ≥ 0.047 µF, 0805 ≥ 0.18 µF,
1206 ≥ 0.47 µF
≥ 50 V
≤ 3.0 %
≤ 6 %
≤ 10 % 0805 ≥ 1 µF, 1210 ≥ 10 µF
≤ 14 % 0603 ≥ 0.33 µF
25 V
16 V
10 V
≤ 5.0 %
≤ 5.0 %
0402 ≥ 0.033 µF, 0603 ≥ 0.15 µF,
0805 ≥ 0.68 µF, 1206 ≥ 2.2 µF
≤ 10 %
0402 ≥ 0.056 µF, 0603 ≥ 0.33 µF,
0805 ≥ 2.2 µF, 1206 ≥ 2.2 µF
≤ 7.5 % ≤ 15 %
6.3 V
≤ 15 %
≤ 30 % 0805 ≥ 10 µF
Y5 V:
Rated Vol.
≥ 50 V
D.F.
Exception of D.F.
≤ 7.5 %
−
−
0603 ≥ 0.1 µF, 0805 ≥ 0.33 µF,
1206 ≥ 1 µF
≤ 10 %
25 V
≤ 7.5 %
≤ 12.5 % 0402 ≥ 0.068 µF
16 V (C <
16 V (C ≥
10 V
≤ 10 %
≤ 12.5 %
≤ 15 %
≤ 30 %
≤ 12.5 % 0402 ≥ 0.068 µF
−
−
−
−
−
−
≤ 6.3 V
• I.R.: ≥ 1 GΩ or R x C ≥ 50 ΩF whichever is smaller
Document Number 28534
Revision 16-Jul-07
For technical questions, contact: MLCC@vishay.com
www.vishay.com
46
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
TEST PROCEDURES AND REQUIREMENTS
TEST
PROCEDURE
REQUIREMENTS
14) Humidity load
(damp heat)
• Test temperature: 40 2 °C.
• Humidity: 90 ~ 95 % RH.
• Test time: 500 + 24/− 0 hours.
• To apply voltage: rated voltage (Max 500V).
• Measurement to be made after keeping at
room
• No remarkable damage
• Capacitance change:
NP0: within 7.5 % or 0.75 pF whichever is larger.
X7R, X5R: ≥ 10V, within 12.5 %
6.3V, with 25 %
Y5V: ≥ 10V, within 30 %
6.3V, within + 30 to - 40 %
temperature for 24 2 hours (Class I) or
48 4 hours (Class II).
• Q/D.F. value: NP0: Cap ≥ 30 pF: Q ≥ 200
Cap < 30 pF: Q ≥ 100 + 10/3C
X7R, X5R:
Rated Vol.
D. F.
Exception of D. F.
0603 ≥ 0.047 µF, 0805 ≥ 0.18 µF,
1206 ≥ 0.47 µF
≥ 50 V
≤ 3.0 %
≤ 6 %
0805 ≥ 1 µF, 1210 ≥ 10 µF
0603 ≥ 0.33 µF
0402 ≥ 0.033 µF, 0603 ≥ 0.15 µF,
0805 ≥ 0.68 µF, 1206 ≥ 2.2 µF
0402 ≥ 0.056 µF, 0603 ≥ 0.33 µF,
0805 ≥ 2.2 µF, 1206 ≥ 2.2 µF
≤ 10 %
≤ 14 %
25 V
16 V
10 V
≤ 5.0 %
≤ 5.0 %
≤ 10 %
≤ 7.5 % ≤ 15 %
6.3 V
≤ 15 %
≤ 30 % 0805 ≥ 10 µF
Y5 V:
Rated Vol.
≥ 50 V
D. F.
≤ 7.5 %
Exception of D. F.
−
−
0603 ≥ 0.1 µF, 0805 ≥ 0.33 µF,
10 %
1206 ≥ 1 µF
25 V
≤ 7.5 %
12.5 % 0402 ≥ 0.068 µF
16 V (C < 1 µF) ≤ 10 %
16 V (C ≥ 1 µF) ≤ 12.5 %
−
−
−
−
−
−
−
−
10 V
≤ 15 %
≤ 30 %
6.3 V
• I.R.: ≥ 500 MΩ or R x C ≥ 25 ΩF whichever is smaller
15) High temperature • Test temperature:
• No remarkable damage
• Capacitance change:
load (endurance)
NP0, X7R: 125 3 °C
X5R, Y5V: 85 3 °C.
• To apply voltage:
(1) 6.3 V or C ≥ 10µF (for X7R, X5R):
150% of rated voltage.
(2) 6.3 V < V < 500 V and C < 10 µF
(for X7R, X5R):
200 % of rated voltage.
(3) 500 V:
150 % of rated voltage.
(4) V ≥ 630 V:
NP0: within 3.0 % or 0.3 pF whichever is larger.
X7R, X5R: ≥ 10V, within 12.5 %
6.3V, with 25 %
Y5V: ≥ 10V, within 30 %
6.3V, within + 30 to - 40 %
• Q/D.F. value: NP0: Cap ≥ 30 pF: Q ≥ 350
10 pF ≤ Cap < 30 pF: Q ≥ 275 + 2.5C
Cap < 10 pF: Q ≥ 200 + 10C
X7R, X5R:
Rated Vol.
D. F.
Exception of D. F.
120 % of rated voltage. (Max. 3600 V)
• Test time: 1000 + 24/− 0 hours.
• Measurement to be made after keeping at
room
temperature for 24 2 hours (Class I)
or 48 4 hours (Class II).
0603 ≥ 0.047 µF, 0805 ≥ 0.18 µF,
≥ 50 V
≤ 3.0 %
≤ 6 %
1206 ≥ 0.4 7µF
0805 ≥ 1 µF, 1210 ≥ 10 µF
0603 ≥ 0.33 µF
0402 ≥ 0.033 µF, 0603 ≥ 0.15 µF,
0805 ≥ 0.68 µF, 1206 ≥ 2.2 µF
0402 ≥ 0.056 µF, 0603 ≥ 0.33 µF,
0805 ≥ 2.2 µF, 1206 ≥ 2.2 µF
≤ 10 %
≤ 14 %
25 V
16 V
10 V
≤ 5.0 %
≤ 5.0 %
≤ 10 %
≤ 7.5 % ≤ 15 %
6.3 V
≤ 15 %
≤ 30 % 0805 ≥ 10 µF
Y5V:
Rated Vol.
≥ 50 V
D. F.
≤ 7.5 %
Exception of D. F.
−
−
0603 ≥ 0.1 µF, 0805 ≥ 0.33 µF,
10 %
1206 ≥ 1 µF
25 V
≤ 7.5 %
12.5 % 0402 ≥ 0.068 µF
16 V (C < 1 µF) ≤ 10 %
16 V (C ≥ 1 µF) ≤ 12.5 %
−
−
−
−
−
−
−
−
≤ 10 V
≤ 15 %
≤ 30 %
6.3 V
• I. R.: ≥ 1 GΩ or R x C ≥ 50 ΩF whichever is smaller
www.vishay.com
47
For technical questions, contact: MLCC@vishay.com
Document Number 28534
Revision 16-Jul-07
Class 1 High Q 16/25/50/100V
Vishay BCcomponents
Surface Mount Multilayer Chip Capacitors
ELECTRICAL CHARACTERISTICS
Q VALUE CRITERIA vs. SPECIFIC FREQUENCY
SIZE 0402
Q VALUE CRITERIA vs. SPECIFIC FREQUENCY
SIZE 0603
10 000
10 000
1 GHz
500 MHz
100 MHz
1GHz
500 MHz
100 MHz
1000
100
1000
100
10
1
minimum (solid line)
typical (broken line)
10
1
minimum (solid line)
typical (broken line)
0.1
1
10
Capacitance (pF)
100
1
10
Capacitance (pF)
0.1
100
TYPICAL ESR vs. FREQUENCY
SIZE 0402
TYPICAL ESR vs. FREQUENCY
SIZE 0603
1
1
1pF
100 pF
5 pF
1 pF
1
10 pF
4.7 pF
10 pF
0.1
0.1
68 pF
0.01
0.01
10 000
100
100
1000
10 000
1000
Frequency (MHz)
Frequency (MHz)
TYPICAL IMPEDANCE vs. FREQUENCY
SIZE 0603
TYPICAL IMPEDANCE vs. FREQUENCY
SIZE 0402
100
100
100 000
10 000
100
100
1 pF
1000
100
10
1 pF
4.7 pF
10 pF
100
1
4.7 pF
68 pF
1
100 pF
10 pF
0.1
0.1
100
100
1000
10 000
100
1000
Frequency (MHz)
10
10 000
Frequency (MHz)
SRF vs. CAPACITANCE
10 000
0402
1000
100
0603
1
10
Capacitance (pF)
100
Document Number 28534
Revision 16-Jul-07
For technical questions, contact: MLCC@vishay.com
www.vishay.com
48
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
www.vishay.com
1
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