VJ0603Q1R8DXBCW1BC_技术文档

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

FEATURES

• Ultra stable class 1 dielectric

• High Q and low ESR at high frequency

• Four standard sizes

RoHS

COMPLIANT

• High capacitance per unit volume

• Supplied in tape on reel

• For high frequency applications

• Ni-barrier with 100 % tin terminations

APPLICATIONS

• Mobile telecommunication

GENERAL SPECIFICATIONS

NOTE: Electrical characteristics values -

temperature at 20 1 °C, pressure at 86 to 106 Kpa and

humidity at 63 to 67 % unless otherwise stated

Rated Voltage U_R(DC): 16 V; 25 V; 50 V; 100 V

Capacitance Range: 0.5 pF to 3300 pF

Tolerance on Capacitance:

• WLAN

• RF modules

• Tuner

C < 10 pF = 0.1 pF; 0.5 pF; 0.25 pF

Temperature Coefficient: 30 ppm/ °C

C ≥ 10 pF = 1 %; 2 %; 5 %

Q < 30 pF = Q ≥ 400 + 20C

Q ≥ 30 pF = Q ≥ 1000

Insulation Resistance after 120 seconds at U_R(DC):

10 GΩ minimum or 500 ΩF minimum, whichever is less

Climatic Category (IEC 68): 55/125/56

DIMENSIONS in inches [millimeters]

SIZE

CODE

T

L

W

MB

MAX.

0.040 0.002 0.020 0.002

[1.0 0.05] [0.5 0.05]

0.022

[0.55]

0.010 + 0.002/- 0.004

[0.25 + 0.05/- 0.10]

W

T

0402

MB

L

0.063 0.004 0.030 0.004

0.035

[0.87]

0.015 0.006

[0.40 0.15]

0603

[1.6 0.10]

[0.8 0.10]

ORDERING INFORMATION

VJ0402

Q

101

F

X

J

C

W1BC

SIZE CODE DIELECTRIC

CAPACITANCE

TOLERANCE

TERMINATION VOLTAGE

PACKAGING PROCESSCODEFOR

VISHAY BCC

PRODUCTS

0402

0603

Q = High Q

expressed in pF

two significant digits

followed by the

Cap. value < 10 pF X = Ni Barrier

J = 16 V

X = 25 V

A = 50 V

B = 100 V

C = 7 inches

reel/paper

B = 0.10 pF

C = 0.25 pF

D = 0.50 pF

Cap. value ≥ 10 pF

F = 1 %

100% tin

termination

P = 13 inches

reel/paper

number of zeros:

1R0 = 1.0 pF

101 = 100 pF

G = 2 %

J = 5 %

www.vishay.com

39

For technical questions, contact: MLCC@vishay.com

Document Number 28534

Revision 16-Jul-07

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

SELECTION CHART FOR 16/25/50 AND 100 V

DIELECTRIC

NP0

EIA CAP

CODE

0R5

EIA SIZE

CAP

0.5 pF

0402

0603

16V

25V

N

50V

N

100V

16V

25V

S

50V

S

100V

S

1R0

1R2

1R5

1R8

2R2

2R7

3R3

3R9

4R7

5R6

6R8

8R2

100

120

150

180

220

270

330

390

470

560

680

820

101

121

151

181

221

271

331

391

471

561

681

821

102

122

152

182

222

272

332

472

562

682

822

103

1.0

1.2

N

S

1.5

1.8

2.2

2.7

3.3

3.9

4.7

5.6

6.8

8.2

10 pF

12

15

18

22

27

33

39

47

56

68

82

100 pF

120

150

180

220

270

330

390

470

560

680

820

1000 pF

1200

1500

1800

2200

2700

3300

4700

5600

6800

8200

10 000 pF

N

S

Letters indicate product thickness, see packaging quantities

Document Number 28534

Revision 16-Jul-07

For technical questions, contact: MLCC@vishay.com

www.vishay.com

40

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

PACKAGING QUANTITIES

AMOUNT PER REEL

Δ180 mm; 7 inch

THICKNESS

CLASSIFICATION

(mm)

0402

0603

0805

1206

N =

S =

X =

A =

B =

C =

D =

J =

0.50 0.05

0.8 0.07

0.8 + 0.15/ - 0.10

0.6 0.1

0.8 0.1

0.95 0.1

1.25 0.1

1.15 0.15

1.25 0.2

1.60 + 0.30/- 0.10

1.60 0.2

Paper 10 Kp/Reel

-

Paper 4 Kp/Reel

-

Paper 4 Kp/Reel

Plastic 3 Kp/Reel

-

Plastic 3 Kp/Reel

-

Plastic 3 Kp/Reel

I =

P =

G =

-

Plastic 2 Kp/Reel

PACKAGING QUANTITIES

AMOUNT PER REEL

Δ330 mm; 13 inch

THICKNESS

CLASSIFICATION

(mm)

0402

0603

0805

1206

N =

S =

X =

A =

B =

C =

D =

J =

I =

0.50 0.05

0.8 0.07

0.8 + 0.15/ - 0.10

0.6 0.1

0.8 0.1

0.95 0.1

1.25 0.1

1.15 0.15

1.25 0.2

1.60 + 0.30/- 0.10

1.60 0.2

Paper 50 Kp/Reel

-

Paper 15 Kp/Reel

-

Paper 15 Kp/Reel

Plastic 10 Kp/Reel

-

Plastic 10 Kp/Reel

-

Plastic 10 Kp/Reel

-

P =

G =

-

COVER TAPE (POLYESTER - ANTISTATIC)

PROPERTIES OF COVER TAPE

CARRIER TAPE (POLYCARBONATE)

PROPERTIES OF CARRIER TAPE

WIDTH

PARAMETER

5.5 0.1 mm

PARAMETER

8.1 0.2 mm

190 to 280 µm

> 60 N/mm²

100 to 150 %

> 10¹²Ω/sq.

Breaking force

Elongation at break

Surface resistance

Softening point

Thickness

≥ 10.7 N

≥ 63 %

< 10¹⁰Ω/sq.

71 5 °C

62 μm

Thickness

Tensile strength at break

Elongation at break

Surface resistance

PAPER TAPE SPECIFICATIONS

DIMENSIONS OF PAPER TAPE in millimeters

P

0

PRODUCT SIZE CODE

P

D

2

0

SYMBOL

0402

0603

0805

1206

E

SIZE TOL. SIZE TOL. SIZE TOL. SIZE TOL.

A₀

B₀

W

E

0.62

1.12

8.00

1.75

3.50

1.55

4.00

2.00

0.05 1.02

0.05 1.82

0.10 8.00

0.05 1.75

0.05 3.50

0.05 1.55

0.10 4.00

0.05 4.00

0.05 2.00

0.05 1.50

0.05 2.30

0.10 8.00

0.05 1.75

0.05 3.50

0.05 1.55

0.10 4.00

0.05 2.00

0.10 2.00

0.10 3.50

0.10 8.00

0.05 1.75

0.05 3.50

0.05 1.50

0.10 4.00

0.05 2.00

0.10

0.05

0.10

0.05

F

W

B

0

F

D₀

P₀

P₁

P₂

A

0

P

1

www.vishay.com

41

For technical questions, contact: MLCC@vishay.com

Document Number 28534

Revision 16-Jul-07

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

BLISTER TAPE SPECIFICATIONS

DIMENSIONS OF BLISTER TAPE in millimeters

K

P

0

T

PRODUCT

D

P

2

DIMENSION

TOLERANCE

0

0805

< 1.57

1206

< 2.00

A₀

B₀

W

E

-

E

F

< 2.45

8.00

1.75

3.50

1.50

1.00

4.00

2.00

< 3.60

8.00

1.75

3.50

1.50

1.00

4.00

2.00

0.10

0.05

0.10

0.05

cover tape

W

F

B

0

D₀

D₁

P₀

P₁

P₂

A

D

1

T

1

0

direction of unreeling

T

P

1

2

REEL SPECIFICATIONS

D

C

A

B

REEL DIMENSIONS AND TAPE WIDTH in millimeters

Ø 180 mm; 7 inch

Ø 330 mm; 13 inch

13.0 0.5

A

B

C

D

13.0 1.0

9.0 1.0

178.0 1.0

60.5 1.0

330.0 1.0

100.0 1.0

METHOD OF MOUNTING AND DIMENSIONS OF SOLDER LANDS

For normal use the capacitors may be mounted on printed-circuit boards or ceramic substrates by applying wave soldering and

reflow soldering.

An improper combination of soldering, substrate and chip size can lead to a damaging of the component. The risk increases with

the chip size and with temperature fluctuations (> 100 °C) Therefore, it is advised to use the smallest possible size and follow the

dimensional recommendations given.

Document Number 28534

Revision 16-Jul-07

For technical questions, contact: MLCC@vishay.com

www.vishay.com

42

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

SOLDERING GRAPHS

IR REFLOW WITH SnPb SOLDER

IR REFLOW WITH SnAgCu SOLDERING

300

250

200

150

100

50

300

Max.Temperature

250

> 215 °C: 20 ~ 40 seconds

200

Sn-Ag-Cu solder paste

150

Min.Temperature

100

SnPB Eutectic Solder Paste

50

0

30 ~ 60

sec.

Time

30 ~ 60 sec.

Time

60 - 120 sec.

WAVE SOLDERING

REFLOW SOLDERING

300

250

200

150

100

50

300

250

200

150

100

50

10 s

260 °C

~

~ 245 °C

235 °C to 260 °C

First Wave

Second Wave

10 s

215 °C

~

~ 5 K/s

180 °C

40 s

~

~ 2 K/s

~

~ 200 K/s

130 °C

100 °C to 130 °C

Forced

Cooling

2 K/s

~

~ 2 K/s

0

100

150

200

250

0

50

0

50

100

200

150

250

t (s)

RECOMMENDED DIMENSIONS OF SOLDER LANDS in millimeters

Solder Land

Solder Paste

pattern

Solder resist

pattern

D

G

Occupied Area

Tracks

E

C

B

A

F

www.vishay.com

43

For technical questions, contact: MLCC@vishay.com

Document Number 28534

Revision 16-Jul-07

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

REFLOW SOLDERING

FOOTPRINT DIMENSIONS in mm

SIZE

PLACEMENT

PROCESSING REMARKS

CODE

ACCURACY

0.15

A

B

C

D

E

F

G

0.95

1.40

1.85

2.25

0402

0603

0805

1206

1.50

0.50 0.50

0.70 0.80

1.00 0.90

2.20 0.90

0.50 0.10 1.75

0.80 0.20 2.55

1.30 0.40 3.08

1.60 1.60 4.25

2.30

2.80

4.00

0.25

IR or hot plate soldering

WAVE SOLDERING

FOOTPRINT DIMENSIONS in mm

PROPOSED NUMBER AND DIMENSIONS

PLACEMENT

ACCURACY

(mm)

SIZE

CODE

OF DUMMY TRACKS

(mm)

A

B

C

D

E

F

G

0603

0805

1206

2.40

3.20

4.80

1.00 0.70 0.80 0.20 3.10 1.90

1.40 0.90 1.30 0.36 4.10 2.50

2.30 1.25 1.70 1.25 5.90 3.20

1 x (0.2 x 0.8)

1 x (0.3 x 1.3)

3 x (0.25 x 1.7)

0.10

0.15

0.25

TEST CONDITIONS IN STATIC SOLDER BATH

PARAMETER

DESCRIPTION

SOLDERABILITY

95 % covered with smooth and bright solder coating

CECC requirement: 235 5 °C for 2 0.5 seconds

IEC requirement: 215 3 °C for 3 0.3 seconds

RESISTANCE TO LEACHING

10 % of the metallization of the edges of the head face may be missing

(inner electrodes are not visible)

260 5 °C for 30 1 second

TEST PROCEDURES AND REQUIREMENTS

TEST

PROCEDURE

REQUIREMENTS

1) Visual and

mechanical

• No remarkable defect.

• Dimensions should confirm to individual specification sheet.

2) Capacitance

Class I: NP0

Cap 1000 pF; 1.0 0.2 V_rms; 1 MHz 10 %

Cap > 1000 pF; 1.0 0.2 V_rms; 1 kHz 10 %

• Shall not exceed the limits given in the detailed specification.

≤

3) Q/D.F

(Dissipation Factor)

NP0: Cap

≥

30 pF: Q

≥

1000

400 + 20 C.

Cap < 30 pF: Q

X7R, X5R:

Rated Vol.

Class II: X7R, X5R, Y5V

Cap

≤ 10 µF; 1.0 0.2 V_rms; 1 kHz 10 %

D.F.

Exception of D.F.

Cap > 10 µF; 0.5 0.2 V_rms; 120 Hz 20 %

0603

1206

≥

0.047 µF, 0805

0.47 µF

≥ 0.18 µF,

≥

50 V

≤

2.5 %

3.5 %

≤

3 %

≤

5 %

7 %

0805

0603

≥

1µF, 1210

0.33 µF

≥ 10 µF

25 V

16 V

0201

0603

1206

≥

0.0047 µF, 0402

0.15 µF, 0805

2.2 µF

≥

0.033 µF,

≤

3.5 %

≤

5 %

≥ 0.68 µF,

10 V

6.3 V

Y5 V:

≤

5.0 %

10 %

−

≤

15 %

0805

≥

10 µF

Rated Vol.

D.F.

Exception of D.F.

≥

50 V

≤

5.0 %

−

0603

1206

≥

0.1µF, 0805

1µF

≥

0.33 µF,

≤

7 %

≥

25 V

≤

5.0 %

≤

9 %

−

0402

0.068 µF

16 V (C < 1 µF)

16 V (C

≤

7.0 %

9.0 %

12.5 %

20 %

≤

≥

1 µF)

−

≤

10 V

6.3 V

−

Document Number 28534

Revision 16-Jul-07

For technical questions, contact: MLCC@vishay.com

www.vishay.com

44

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

TEST PROCEDURES AND REQUIREMENTS

TEST

PROCEDURE

REQUIREMENTS

4) Dielectric strength

• To apply voltage (

≤

50 V) 250 %.

• No evidence of damage or flash-over during test.

• Duration: 1 to 5 seconds.

• Charge and discharge current less than 50

mA.

• To apply voltage:

100 V

≥

3 times V DC

2 times V DC

1.5 times V DC

1.2 times V DC

200 V ~ 300 V

500 V ~ 999 V

1000 V ~ 3000 V

• Cut-off, set at 10mA

• TEST = 15 seconds

• RAMP = 0

5) Insulation resistance To apply rated voltage for max. 120 seconds

≥

10 G

Ω

or R x C

≥

500

Ω

F whichever is smaller.

Rated voltage:

100 ~ 500 V

To apply rated voltage

10 G

.

for

60 seconds

Rated voltage:

> 500 V

To apply 500 V for

60 seconds

≥

10 GΩ.

6) Temperature

coefficient

With no electrical load:

T.C.

Operating Temp

T.C.

Capacitance Change

Within 30 ppm/°C

Within 120 ppm/°C

Within 15 %

NP0 (C0G)

NP0 (C0J)

X7R

- 55 ~ 125 °C at 25 °C NP0 (C0G)

- 55 ~ 125 °C at 25 °C NP0 (C0J)

- 55 ~ 125 °C at 25 °C X7R

X5R

- 55 ~ 85 °C at 25 °C

- 25 ~ 85 °C at 20 °C

X5R

Y5V

Within 15 %

Y5V

Within + 30 %/- 80 %

7) Adhesive strength of • Pressurizing force:

• No remarkable damage or removal of the terminations.

termination

0201: 2N

0402 and 0603: 5 N

> 0603: 10 N

• Test time 10 1 second.

8) Vibration resistance • Vibration frequency: 10 to 55 Hz/minute.

• Total amplitude: 1.5 mm.

• No remarkable damage.

• Capacitance change and Q/D.F.: To meet initial specification.

• Test time: 6 hours (2 hours each in 3 mutually

perpendicular directions).

9) Solderability

• Solder temperature: 235 5 °C.

• Dipping time: 0.5 seconds

95 % minimum coverage of all metallized area.

2

.

10) Bending test

• The middle part of the substrate shall be

pressurized by means of the pressurizing rod

at a

rate of about 1 mm per second until the

deflection

• No remarkable damage

• Capacitance change:

NP0: within 5.0 % or 0.5 pF whichever is larger.

X7R, X5R: within 12.5 %

Y5V: within 30 %

becomes 1 mm and then the pressure shall be

maintained for 5 1 seconds.

• Measurement to be made after keeping at

room

(This capacitance change means the change of capacitance under specified

flexure of substrate from the capacitance measured before the test)

temperature for 24 2 hours.

11) Resistance to

soldering heat

• Solder temperature: 270 5 °C.

• Dipping time: 10 1 second.

• Preheating: 120 to 150 °C for 1 minute before

immerse the capacitor in a eutectic solder.

• Before initial measurement (Class II only):

Perform 150 + 0/ - 10 °C for 1 hour and then

set for

48 4 hours at room temperature.

• Measurement to be made after keeping at

room

• No remarkable damage

• Capacitance change:

NP0: within 2.5 % or 0.25 pF whichever is larger.

X7R, X5R: within 7.5 %

Y5V: within 20 %

• Q/D.F., I.R. and dielectric strength: To meet initial requirements.

• 25 % maximum leaching on each edge.

temperature for 24 2 hours (Class I) or 48

4

hours (Class II).

www.vishay.com

45

For technical questions, contact: MLCC@vishay.com

Document Number 28534

Revision 16-Jul-07

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

TEST PROCEDURES AND REQUIREMENTS

TEST

PROCEDURE

REQUIREMENTS

12) Temperature

cycle

• Conduct the 5 cycles according to the

temperatures and time.

• No remarkable damage

• Capacitance change:

NP0: within 2.5 % or 0.25 pF whichever is larger.

X7R, X5R: within 7.5 %

Time

Min. operating temp. + 0/- 3 30

Room temperature 2 ~ 3

Min. operating temp. + 3/- 0 30

Room temperature 2 ~ 3

Step Temperature (°C)

1

2

3

4

3

Y5V: within 20 %

• Q/D.F., I.R. and dielectric strength: To meet initial requirements.

• Before initial measurement (Class II only):

Perform 150 + 0/- 10 °C for 1 hour and then

set for

48 4 hours at room temperature.

• Measurement to be made after keeping at

room

temperature for 24 2 hours (Class I) or 48

4

hours (Class II).

13) Humidity

(steady state)

• Test temperature: 40 2 °C.

• Humidity: 90 ~ 95 % RH.

• No remarkable damage

• Capacitance change:

• Test time: 500 + 24/− 0 hours.

• Measurement to be made after keeping at

room

NP0: within 5.0 % or 0.5 pF whichever is larger.

X7R, X5R: ≥ 10 V, within 12.5 %

6.3 V, within 25 %

temperature for 24 2 hours (Class I) or

Y5V: within 30 %

48

4

• Q/D.F. value: NP0: Cap ≥ 30 pF: Q ≥ 350

10pF ≤ Cap < 30 pF: Q ≥ 275 + 2.5C

Cap < 10pF: Q ≥ 200 + 10C

X7R, X5R:

hours (Class II).

Rated Vol.

D.F.

Exception of D.F.

0603 ≥ 0.047 µF, 0805 ≥ 0.18 µF,

1206 ≥ 0.47 µF

≥ 50 V

≤ 3.0 %

≤ 6 %

≤ 10 % 0805 ≥ 1 µF, 1210 ≥ 10 µF

≤ 14 % 0603 ≥ 0.33 µF

25 V

16 V

10 V

≤ 5.0 %

0402 ≥ 0.033 µF, 0603 ≥ 0.15 µF,

0805 ≥ 0.68 µF, 1206 ≥ 2.2 µF

≤ 10 %

0402 ≥ 0.056 µF, 0603 ≥ 0.33 µF,

0805 ≥ 2.2 µF, 1206 ≥ 2.2 µF

≤ 7.5 % ≤ 15 %

6.3 V

≤ 15 %

≤ 30 % 0805 ≥ 10 µF

Y5 V:

Rated Vol.

≥ 50 V

D.F.

Exception of D.F.

≤ 7.5 %

−

0603 ≥ 0.1 µF, 0805 ≥ 0.33 µF,

1206 ≥ 1 µF

≤ 10 %

25 V

≤ 7.5 %

≤ 12.5 % 0402 ≥ 0.068 µF

16 V (C <

16 V (C ≥

10 V

≤ 10 %

≤ 12.5 %

≤ 15 %

≤ 30 %

≤ 12.5 % 0402 ≥ 0.068 µF

−

≤ 6.3 V

• I.R.: ≥ 1 GΩ or R x C ≥ 50 ΩF whichever is smaller

Document Number 28534

Revision 16-Jul-07

For technical questions, contact: MLCC@vishay.com

www.vishay.com

46

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

TEST PROCEDURES AND REQUIREMENTS

TEST

PROCEDURE

REQUIREMENTS

14) Humidity load

(damp heat)

• Test temperature: 40 2 °C.

• Humidity: 90 ~ 95 % RH.

• Test time: 500 + 24/− 0 hours.

• To apply voltage: rated voltage (Max 500V).

• Measurement to be made after keeping at

room

• No remarkable damage

• Capacitance change:

NP0: within 7.5 % or 0.75 pF whichever is larger.

X7R, X5R: ≥ 10V, within 12.5 %

6.3V, with 25 %

Y5V: ≥ 10V, within 30 %

6.3V, within + 30 to - 40 %

temperature for 24 2 hours (Class I) or

48 4 hours (Class II).

• Q/D.F. value: NP0: Cap ≥ 30 pF: Q ≥ 200

Cap < 30 pF: Q ≥ 100 + 10/3C

X7R, X5R:

Rated Vol.

D. F.

Exception of D. F.

0603 ≥ 0.047 µF, 0805 ≥ 0.18 µF,

1206 ≥ 0.47 µF

≥ 50 V

≤ 3.0 %

≤ 6 %

0805 ≥ 1 µF, 1210 ≥ 10 µF

0603 ≥ 0.33 µF

0402 ≥ 0.033 µF, 0603 ≥ 0.15 µF,

0805 ≥ 0.68 µF, 1206 ≥ 2.2 µF

0402 ≥ 0.056 µF, 0603 ≥ 0.33 µF,

0805 ≥ 2.2 µF, 1206 ≥ 2.2 µF

≤ 10 %

≤ 14 %

25 V

16 V

10 V

≤ 5.0 %

≤ 10 %

≤ 7.5 % ≤ 15 %

6.3 V

≤ 15 %

≤ 30 % 0805 ≥ 10 µF

Y5 V:

Rated Vol.

≥ 50 V

D. F.

≤ 7.5 %

Exception of D. F.

−

0603 ≥ 0.1 µF, 0805 ≥ 0.33 µF,

10 %

1206 ≥ 1 µF

25 V

≤ 7.5 %

12.5 % 0402 ≥ 0.068 µF

16 V (C < 1 µF) ≤ 10 %

16 V (C ≥ 1 µF) ≤ 12.5 %

−

10 V

≤ 15 %

≤ 30 %

6.3 V

• I.R.: ≥ 500 MΩ or R x C ≥ 25 ΩF whichever is smaller

15) High temperature • Test temperature:

• No remarkable damage

• Capacitance change:

load (endurance)

NP0, X7R: 125 3 °C

X5R, Y5V: 85 3 °C.

• To apply voltage:

(1) 6.3 V or C ≥ 10µF (for X7R, X5R):

150% of rated voltage.

(2) 6.3 V < V < 500 V and C < 10 µF

(for X7R, X5R):

200 % of rated voltage.

(3) 500 V:

150 % of rated voltage.

(4) V ≥ 630 V:

NP0: within 3.0 % or 0.3 pF whichever is larger.

X7R, X5R: ≥ 10V, within 12.5 %

6.3V, with 25 %

Y5V: ≥ 10V, within 30 %

6.3V, within + 30 to - 40 %

• Q/D.F. value: NP0: Cap ≥ 30 pF: Q ≥ 350

10 pF ≤ Cap < 30 pF: Q ≥ 275 + 2.5C

Cap < 10 pF: Q ≥ 200 + 10C

X7R, X5R:

Rated Vol.

D. F.

Exception of D. F.

120 % of rated voltage. (Max. 3600 V)

• Test time: 1000 + 24/− 0 hours.

• Measurement to be made after keeping at

room

temperature for 24 2 hours (Class I)

or 48 4 hours (Class II).

0603 ≥ 0.047 µF, 0805 ≥ 0.18 µF,

≥ 50 V

≤ 3.0 %

≤ 6 %

1206 ≥ 0.4 7µF

0805 ≥ 1 µF, 1210 ≥ 10 µF

0603 ≥ 0.33 µF

0402 ≥ 0.033 µF, 0603 ≥ 0.15 µF,

0805 ≥ 0.68 µF, 1206 ≥ 2.2 µF

0402 ≥ 0.056 µF, 0603 ≥ 0.33 µF,

0805 ≥ 2.2 µF, 1206 ≥ 2.2 µF

≤ 10 %

≤ 14 %

25 V

16 V

10 V

≤ 5.0 %

≤ 10 %

≤ 7.5 % ≤ 15 %

6.3 V

≤ 15 %

≤ 30 % 0805 ≥ 10 µF

Y5V:

Rated Vol.

≥ 50 V

D. F.

≤ 7.5 %

Exception of D. F.

−

0603 ≥ 0.1 µF, 0805 ≥ 0.33 µF,

10 %

1206 ≥ 1 µF

25 V

≤ 7.5 %

12.5 % 0402 ≥ 0.068 µF

16 V (C < 1 µF) ≤ 10 %

16 V (C ≥ 1 µF) ≤ 12.5 %

−

≤ 10 V

≤ 15 %

≤ 30 %

6.3 V

• I. R.: ≥ 1 GΩ or R x C ≥ 50 ΩF whichever is smaller

www.vishay.com

47

For technical questions, contact: MLCC@vishay.com

Document Number 28534

Revision 16-Jul-07

Class 1 High Q 16/25/50/100V

Vishay BCcomponents

Surface Mount Multilayer Chip Capacitors

ELECTRICAL CHARACTERISTICS

Q VALUE CRITERIA vs. SPECIFIC FREQUENCY

SIZE 0402

Q VALUE CRITERIA vs. SPECIFIC FREQUENCY

SIZE 0603

10 000

1 GHz

500 MHz

100 MHz

1GHz

500 MHz

100 MHz

1000

100

1000

100

10

1

minimum (solid line)

typical (broken line)

10

1

minimum (solid line)

typical (broken line)

0.1

1

10

Capacitance (pF)

100

1

10

Capacitance (pF)

0.1

100

TYPICAL ESR vs. FREQUENCY

SIZE 0402

TYPICAL ESR vs. FREQUENCY

SIZE 0603

1

1pF

100 pF

5 pF

1 pF

1

10 pF

4.7 pF

10 pF

0.1

68 pF

0.01

10 000

100

1000

10 000

1000

Frequency (MHz)

TYPICAL IMPEDANCE vs. FREQUENCY

SIZE 0603

TYPICAL IMPEDANCE vs. FREQUENCY

SIZE 0402

100

100 000

10 000

100

1 pF

1000

100

10

1 pF

4.7 pF

10 pF

100

1

4.7 pF

68 pF

1

100 pF

10 pF

0.1

100

1000

10 000

100

1000

Frequency (MHz)

10

10 000

Frequency (MHz)

SRF vs. CAPACITANCE

10 000

0402

1000

100

0603

1

10

Capacitance (pF)

100

Document Number 28534

Revision 16-Jul-07

For technical questions, contact: MLCC@vishay.com

www.vishay.com

48

Legal Disclaimer Notice

Vishay

Notice

Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,

or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.

Information contained herein is intended to provide a product description only. No license, express or implied, by

estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's

terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express

or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness

for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.

The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.

Customers using or selling these products for use in such applications do so at their own risk and agree to fully

indemnify Vishay for any damages resulting from such improper use or sale.

Document Number: 91000

Revision: 08-Apr-05

www.vishay.com

1


型号：	VJ0603Q1R8DXBCW1BC
厂家：	VISHAY
描述：	CAPACITOR, CERAMIC, MULTILAYER, 100V, C0G, 0.0000018uF, SURFACE MOUNT, 0603, CHIP,ROHS COMPLIANT
文件：	总11页 (文件大小：186K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

VJ0603Q1R8DXBCW1BC [VISHAY]

相关型号：

VJ0603Q1R8DXBPW1BC

VJ0603Q1R8DXCA0603

VJ0603Q1R8DXCA0805

VJ0603Q1R8DXCAC

VJ0603Q1R8DXCAP

VJ0603Q1R8DXCAPU

VJ0603Q1R8DXCAT

VJ0603Q1R8FFAAT

VJ0603Q1R8FFBAT

VJ0603Q1R8FFCAT

VJ0603Q1R8FXAA0603

VJ0603Q1R8FXAA0805