VJ0805Y102KFBAC [VISHAY]
CAP CER 1000PF 100V X7R 0805;
| 型号： | VJ0805Y102KFBAC |
| 厂家： | 
VISHAY |
| 描述： | CAP CER 1000PF 100V X7R 0805 |
| 文件： | 总18页 (文件大小：598K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Muꢀtꢁꢀꢂꢃer Cerꢂmꢁc Cꢄꢁp Cꢂpꢂcꢁtors
PRODUCTS:
• Basic Commodity (BME Technology)
• Commercial (NME Technology)
• Automotive
• Board Flex Sensitive, Including Polymer Termination
• Surface Arc-Over Prevention for High Voltages
• Non-Magnetic Series
• High Reliability, Medical, and Military/Aerospace
• RF Capacitors
RESOURCES
• For more information please visit
http://www.vishay.com/capacitors/ceramic-multilayer-smd/
• For technical questions email mlcc@vishay.com
A
OF
WORLD
SOLUTIONS
VMN-SG2120-1603
www.vishay.com
SELECTOR GUIDE
1/18
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
Cꢂpꢂcꢁtors - MlCC
VJ hVarc Guꢂrd®
FEaTURES
0805
1206
1210
2220
2225
0805
1206
1210
1808
1812
390 pF
1.5 nF
2.7 nF
5.6 nF
8.2 nF
3.3 nF
47 nF
• Surface-mount multilayer ceramic chip capacitors
• Prevents surface arc-over in high-voltage
applications
10 pF
1500
1000
• Higher capacitance and smaller case sizes
• Voltage breakdown as much as twice that of
competitors’ products
• Available with polymer terminations in X7R for
increased resistance to board flex cracking
• Wet build process
• Reliable Noble Metal Electrode (NME) system
• Worldwide patent technology
aPPliCaTiONS
C0G (NP0)
470 pF
470 pF
2500
630
• DC/DC converters (buck and boost)
• Voltage multipliers for flyback converters
• Power supplies
X7R
1000
250
82 nF
220 pF
100 nF
270 nF
VJ Non-Mꢂgnetꢁc
FEaTURES
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
0402
0603
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
100
180 pF
1.8 nF
3.3 nF
10 nF
• Surface-mount multilayer ceramic chip capacitors
• Manufactured with non-magnetic materials:
Copper / AgPd
10
16
200
500
600
500
0.5 pF
10 pF
• Safety screened for magnetic properties
• Wet build process
• Reliable Noble Metal Electrode (NME) system
12 nF
C0G (NP0)
aPPliCaTiONS
10 nF
• Magnetic resonance imaging (MRI)
• Medical test and diagnostic equipment
• Navigation and electronic test equipment
• Audio amplifiers
3000
22 nF
25
15 pF
100 pF
120 pF
27 nF
39 nF
1000
47 nF
56 nF
16
100 nF
150 nF
22 nF
X5R
6.3
6.3
120 nF
100 pF
270 pF
390 pF
680 pF
1.0 nF
220 pF
270 pF
10 nF
6.3
10
16
100
200
500
100 nF
390 nF
1.0 µF
1.0 µF
270 nF
1.0 µF
2.7 µF
2.2 µF
4.7 µF
6.8 µF
X7R
3000
1000
3000
2000
500
25
1.0 nF
5.6 nF
15 nF
SELECTOR GUIDE
2/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
FEaTURES
VJ hiFREQ Serꢁes
•
•
Surface-mount multilayer ceramic chip capacitor
Made with a combination of design, materials, and
tight
0402
0603
0805
200
82 pF
470 pF
1.5 nF
process control to achieve very high field reliability
Available with tin-lead terminations (min.4 % lead)
Available with AgPd terminations for silver epoxy
bonding
Available with non-magnetic copper terminations for
reflow soldering
Excellent aging characteristics
Wet build process
Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
Broadband wireless communication
Satellite communication
WiFi (802.11) and WiMax (802.16)
VolP networks and cellular base stations
Subscriber-based wireless devices
•
•
•
•
•
•
HIFREQ
C0G (NP0)
25
0.1 pF
250
•
•
•
•
•
FEaTURES
VJ QUaD hꢁFREQ
Serꢁes
•
Surface-mount multilayer ceramic chip capacitor for
high-frequency applications
0505
1111
2525
3838
200
300
300
500
250
0.1 pF
0.2 pF
1.0 pF
1.0 pF
100 pF
1000 pF
2700 pF
5100 pF
•
•
•
•
Case sizes 0505, 1111, 2525, and 3838
Lead (Pb)-free termination code “X”
Available with tin-lead termination code “L”
Available with non-magnetic copper termination code
“C” for reflow soldering
Excellent aging characteristics
Ultra-stable, high-Q dielectric material
Reliable Noble Metal Electrode (NME) system
1500
3600
7200
•
•
•
HIFREQ
C0G (NP0)
aPPliCaTiONS
• MRI coils and generators
•
•
•
•
RF instruments
Lasers, CATV, UHF / microwave RF power amplifiers
Filter networks, timing circuits
Mixers, oscillators, impedance matching networks
FEaTURES
2008
2012
2220
2008
2012
2008
2012
2220
2008
2012
2220
10 pF
18 pF
47 pF
10 pF
18 pF
82 pF
150 pF
270 pF
82 pF
150 pF
270 pF
220 pF
470 pF
1.0 nF
390 pF
470 pF
1.0 nF
1.2 nF
4.7 nF
2.7 nF
5.6 nF
12 nF
VJ Sꢂfetꢃ Certꢁfꢁed
Cꢂpꢂcꢁtors
•
Surface-mount multilyer ceramic chip capacitor,
saftey certified
Qualified to IEC 60384-14
Wet build process
Reliable Noble Metal Electrode (NME) system
C0G (NP0)
(X1 / Y2)
•
•
•
C0G (NP0)
(X2)
aPPliCaTiONS
•
•
•
•
•
•
Power supplies
250
250
Facsimile and telephone
AC equipment and appliances
Lighting strike and voltage surge protection
EMI and AC line filtering
Isolators
X7R
(X1 / Y2)
X7R
(X2)
SELECTOR GUIDE
3/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
VJ…SE
Source Energꢃ
Cꢂpꢂcꢁtor (SEC)
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
FEaTURES
1812
1825
2225
3040
3640
4044
4.7 nF
10 nF
18 nF
33 nF
47 nF
27 nF
• Surface-mount multilayer ceramic chip capacitor
• Low-electrostrictive ceramic formulation for
repeated charge and discharge cycles
• High pulse discharge currents
• Made with a combination of design, materials,
and tight process control to achieve very high
field reliability
• Available with tin-lead terminations (min. 4% lead)
• Excellent reliability and high-voltage performance
• Wet build process
56 nF
100 nF
220 nF
330 nF
X7R
1000
1500
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Power supplies
• Converter
• Voltage multiplier
100 nF
33 nF
560 nF
220 nF
FEaTURES
•
VJ Controꢀꢀed
Dꢁscꢄꢂrge
Cꢂpꢂcꢁtor (CDC)
Surface-mount multilyer ceramic chip capacitor with
integrated resistor
Low-electrostrictive ceramic formulation for repeated
charge and discharge cycles
3040
3640
4044
•
•
•
High pulse discharge currents
Made with a combination of design, materials,
and tight process control to achieve very high field
reliability
Available with tin-lead terminations (min. 4% lead)
Excellent reliability and high-voltage performance
Wet build process
47 nF
330 nF
X7R (Y5P)
1000
1500
•
•
•
•
Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
•
•
•
Detonation devices (munitions, pyrotechnic, blasting)
Down hole drilling
100 nF
1.0 pF
560 nF
Electronic fuzing
VJ 31/34
automotꢁve Serꢁes
FEaTURES
0402
0603
0805
1206
1210
1812
0402
0603
0805
1206
1210
1812
0402
0603
0805
1206
1210
25
50
100
200
500
220 pF
1.0 nF
3.9 nF
10 nF
12 nF
22 nF
47 nF
150 nF
470 nF
• Surface-mount multilayer ceramic chip capacitors
• AEC-Q200-qualified with PPAP available
• C0G (NP0) offers ultra-stable dielectric and low
power dissipation factor
• X7R operating temperature up to +150 °C, above
+125 °C with derating
• X8R maintains capacitance at high temperature
• AgPd terminations available for silver epoxy
bonding
• Polymer terminations in C0G (NP0)/X7R/X8R
available for increased resistance to board flex
cracking for size 0603 and larger
• Wet build process
C0G (NP0)
630
100 pF
12 pF
3000
100
200
500
120 pF
330 pF
16
50
25
X7R
X8R
220 pF
390 pF
10 nF
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
630
1.0 µF
• Timing and tuning circuits
• Filtering and decoupling
• Sensor and scanner applications
• Power supplies
330 pF
6.8 nF
33 nF
100
50
470 pF
100 nF
220 nF
390 nF
1.0 nF
10 nF
SELECTOR GUIDE
4/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
VJ 31X RohS
automotꢁve Serꢁes
FEaTURES
0402
0603
0805
1206
1210
1812
0402
0603
0805
1206
1210
1812
0402
0603
0805
1206
1210
0402
25
100
200
500
220 pF
1.0 nF
3.9 nF
10 nF
12 nF
22 nF
47 nF
150 nF
470 nF
• Surface-mount multilayer ceramic chip capacitors
• AEC-Q200-qualified with PPAP available
• Compliant with ELV directive
1.0 pF
C0G
(NP0)
50
• C0G (NP0) offers ultra-stable dielectric and low
power dissipation factor
• X7R operating temperature up to +150 °C, above
+125 °C with derating
• X8R maintains capacitance at high temperature
• Polymer terminations in C0G(NP0)/X7R/X8R
available for increased resistance to board flex
cracking for size 0603 and larger
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Timing and tuning circuits
• Filtering and decoupling
• Sensor and scanner applications
• Power supplies
630
100 pF
12 pF
3000
100
120 pF
200
330 pF
16
50
25
25
250
X7R
X8R
1000
220 pF
390 pF
10 nF
1.0 µF
630
100
50
330 pF
6.8 nF
33 nF
470 pF
100 nF
220 nF
220 nF
220 pF
1.0 nF
10 nF
Ga.. 34G
automotꢁve Serꢁes
agPd Termꢁnꢂtꢁon
FEaTURES
100
200
500
• Surface-mount multilayer ceramic chip capacitors
• AgPd termination for conductive epoxy assembly
• AEC-Q200-qualified with PPAP available
• Compliant with ELV directive
• Vishay “Green” product
0603
0805
1206
1210
1812
0402
0603
0805
1206
1210
1812
0402
0603
0805
1206
1210
1.0 nF
3.9 nF
10 nF
12 nF
22 nF
47 nF
150 nF
470 nF
1.0 pF
C0G
(NP0)
50
630
• C0G (NP0) offers ultra-stable dielectric and low
power dissipation factor
• X7R operating temperature up to +150 °C, above
+125 °C with derating
• X8R maintains capacitance at high temperature
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Timing and tuning circuits
• Filtering and decoupling
• Sensor and scanner applications
• Power supplies
100 pF
12 pF
3000
100
200
250
120 pF
330 pF
16
50
25
X7R
X8R
220 pF
390 pF
10 nF
630
1.0 µF
330 pF
6.8 nF
33 nF
100
50
470 pF
100 nF
220 nF
220 nF
1.0 nF
10 nF
SELECTOR GUIDE
5/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
VJ OMD
(Open-Mode
Desꢁgn)
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
FEaTURES
1206
1210
1808
1812
1825
2220
2225
0805
1206
1210
1808
1812
1825
2220
2225
1500
2000
4.7 nF
8.2 nF
• Surface-mount multilayer ceramic chip capacitors
• Reduce risk of shorts or leakage in board-flex-
sensitive applications
• Polymer terminations available for intensive board
flex requirements
• AgPd terminations available for silver epoxy
bonding
• High voltage breakdown compared to standard
design
10 pF
Commercꢁꢂꢀ Serꢁes
3000
50
C0G (NP0)
18 nF
33 nF
39 nF
47 nF
220 nF
680 nF
1.0 µF
18 nF
1.2 µF
1.5 µF
15 pF
1000
630
270 pF
• Wet build process
• Reliable Noble Metal Electrode (NME) system
470 pF
270 pF
390 pF
220 pF
100 pF
5.6 nF
1.0 nF
5.6 nF
aPPliCaTiONS
16
2000
• Demanding boardflex applications
• Input/output filter capacitors
• Snubber capacitor applications
• Power supplies
630
3000
50
X7R
100
50
2000
3000
2000
1.8 µF
100
hV…hV
hꢁgꢄ-Voꢀtꢂge
Serꢁes
FEaTURES
• Surface-mount multilayer ceramic chip capacitor
• Excellent reliability and thermal shock
performance
1812
1825
2220
2225
180 pF
330 pF
390 pF
470 pF
3.9 nF
• High voltage breakdown compared to standard
design
• High-reliability serial electrode design
• Protective surface coating may be required to
prevent arcing over
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Input filter capacitors
• Output filer capacitors
• Snubber capacitors reduce MOSFET voltage
spikes
X7R
3000
5000
10 nF
15 nF
• Filtering for switching power supplied
• For lighting and other AC applications please
contact : mlcc@vishay.com
SELECTOR GUIDE
6/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
VJ Commercꢁꢂꢀ
Serꢁes
FEaTURES
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
25
100
200
500
220 pF
1.0 nF
4.7 nF
10 nF
12 nF
10 nF
22 nF
39 nF
47 nF
56 nF
47 nF
150 nF
470 nF
1.0 µF
1.0 µF
270 nF
1.0 µF
2.7 µF
2.2 µF
4.7 µF
6.8 µF
• Surface-mount multilayer ceramic chip capacitors
• C0G (NP0) offers ultra-stable dielectric and low
power dissipation
1.0 pF
• Polymer terminations available with C0G (NP0)/
X7R for board flex requirements for size 0603 and
larger
• AgPd terminations available for silver epoxy
bonding
• Wet build process
• Reliable Noble Metal Electrode (NME)system
aPPliCaTiONS
• Timing and tuning circuits
• Filtering and decoupling
• Sensor and scanner applications
• Surge suppression
630
56 pF
18 pF
39 pF
100 pF
C0G (NP0)
50
1000
500
1000
270 pF
120 pF
100
200
250
• Power supplies
16
330 pF
630
390 pF
470 pF
1.0 nF
10 nF
15 nF
33 nF
27 nF
X7R
50
25
50
25
1000
500
1000
500
VJ hꢁgꢄ Q
Dꢁeꢀectrꢁc
Commercꢁꢂꢀ Serꢁes
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• High Q at high frequencies
• Low ESR and dissipation factor
• AgPd terminations available for silver epoxy
bonding
0603
0805
100
200
100 pF
220 pF
High-Q
C0G (NP0)
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Timing and tuning circuits
• Filtering and decoupling
• Sensor applications
50
1.0 pF
X8R Dꢁeꢀectrꢁc
VJ hꢁgꢄ
Temperꢂture
FEaTURES
0402
0603
0805
1206
1210
330 pF
470 pF
6.8 nF
33 nF
• Surface-mount multilayer ceramic chip capacitors
• High-operating-temperature dielectric
• Maintains capacitance at high temperature
• AgPd terminations available for silver epoxy
bonding
100
50
X8R
25
100 nF
220 nF
220 nF
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• High-temperature modules
1.0 nF
10 nF
SELECTOR GUIDE
7/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
[Mꢁn. V] [Mꢂx. V]
100
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn.]
[Mꢂx.]
VJ hꢁ-Reꢀ Serꢁes
FEaTURES
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
0402
0603
0402
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
180 nF
1.5 nF
3.3 nF
• MIL-PRF-55681-qualified production line
• Available with group A and C screening
• Available with only group A screening
• Available with only voltage conditioning
• Available with tin-lead terminations (min. 4 %
lead)
• AgPd terminations available for silver epoxy
bonding
• Customized testing and certification available
• Wet build process
10
200
500
600
1.0 pF
16
10 nF
C0G (NP0)
22 pF
39 pF
22 nF
33 nF
25
500
• Reliable Noble Metal Electrode (NME) system
100 pF
aPPliCaTiONS
• System-critical medical applications
• Mission-critical military and aerospace
applications
120 pF
27 nF
39 nF
47 nF
16
X5R
6.3
120 nF
100 pF
270 pF
150 pF
680 pF
150 nF
22 nF
6.3
100
200
100 nF
390 nF
10
16
1.0 µF
1.0 nF
3.3 nF
X7R
270 nF
1.0 µF
2.7 µF
2.2 µF
4.7 µF
6.8 µF
180 pF
4.7 nF
270 pF
22 nF
500
25
10 nF
15 nF
10 pF
Mil-PRF-55681
(CDR)
FEaTURES
BP
BX
BP
BX
BP
BX
BP
BX
100
50
CDR01
(0805)
• Surface-mount multilayer ceramic chip capacitors
• Federal stock control number CAGE CODE 2770A
• MIL-PRF-55681-qualified products
• High reliabilty tested per MIL-PRF-55681
• Available with tin-lead terminations (min. 4 %
lead)
• Available with lead (Pb)-free terminations
• Available with AgPd terminations for silver epoxy
bonding
120 pF
220 pF
3.9 nF
330 pF
12 nF
100
50
CDR02
(1805)
100
50
100
50
1.0 nF
68 nF
CDR03
(1808)
100
50
1.2 nF
39 nF
3.3 nF
180 nF
CDR04
(1812)
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Avionic systems
• Sonar systems
• Satellite systems
CDR06
(2225)
BX
50
50
390 nF
470 nF
BP
BX
BP
BX
BP
BX
BP
BX
BP
BX
1.0 pF
470 pF
1.0 pF
4.7 nF
1.0 nF
15 nF
2.2 nF
27 nF
4.7 nF
56 nF
680 pF
18 nF
CDR31
(0805)
• Missiles applications
• Geographical information systems
• Global positioning systems
2.2 nF
39 nF
CDR32
(1206)
3.3 nF
100 nF
10 nF
CDR33
(1210)
100
CDR34
(1812)
180 nF
22 nF
CDR35
(1825)
470 nF
SELECTOR GUIDE
8/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
Mil-PRF-123
FEaTURES
CKS51
(0805)
BP
BP
BP
BP
BP
BP
100
100
100
100
100
100
50
1.0 pF
1.0 pF
680 pF
• Space-level reliability
• Military-qualified products
• Federal stock control number, CAGE CODE
2770A
• High reliability tested per MIL-PRF-123
• Lead-bearing (min. 4 %) termination finish “Z”
• Guarded termination finish “S”
• Wet build process
• Reliable Noble Metal Electrode (NME) system
• Material categorization: for definitions of
compliance
aPPliCaTiONS
• Space systems
• Satellite systems
• Avionic systems
CKS55
(1206)
2200 pF
3300 pF
1000 pF
CKS52
(1210)
300 pF
300 pF
1200 pF
3600 pF
1100 pF
330 pF
4700 pF
5600 pF
5600 pF
CKS53
(1808)
CKS56
(1812)
10 000
pF
CKS57
(1825)
22 000
pF
CKS54
(2225)
10 000
pF
• Sonar systems
• Missiles applications
• Global positioning systems
BP
BX
CKS51
(0805)
18 000
pF
100
100
100
100
100
100
CKS55
(1206)
39 000
pF
BX
BX
BX
BX
BX
CKS52
(1210)
100 000
pF
CKS53
(1808)
100 000
pF
CKS56
(1812)
27 000
pF
56 000
pF
CKS57
(1825)
56 000
pF
470 000
pF
DSCC 03029
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• Made with a combination of design, materials,
and tight process control to achieve very high
field reliability
BP
BR
100
1.0 pF
180 pF
10 nF
• US defense supply center approved
• Federal stock control number CAGE CODE 2770A
• Available with tin-lead terminations (min. 4 %
lead)
• Available with AgPd terminations for silver epoxy
bonding
0402
6.3
• Excellent aging characteristic
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
50
100 pF
• Broadband wireless communication
• Satellite communication
• WiFi (802.11) and WiMax (802.16)
• Subscriber-based wireless devices
• Microwave systems
BX
8.2 nF
SELECTOR GUIDE
9/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
DSCC 03028
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• Made with a combination of design, materials,
and tight process control to achieve very high
field reliability
BP
BR
BX
1.0 pF
1.0 nF
• US defense supply center approved
• Federal stock control number CAGE CODE 2270A
• Available with tin-lead terminations (min. 4 %
lead)
• Available with AgPd terminations for silver epoxy
bonding
• Excellent aging characteristic
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Broadband wireless communication
• Satellite communication
• WiFi (802.11) and WiMax (802.16)
• Subscriber-based wireless devices
• Microwave systems
0603
6.3
100
100 pF
100 nF
DSCC 05001
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• Made with a combination of design, materials,
and tight process control to achieve very high
field reliability
• US defense supply center approved
• Federal stock control number CAGE CODE 2270A
• Available with tin-lead terminations (min. 4 %
lead)
• Available with AgPd terminations for silver epoxy
bonding
0805
BP
50
250
1.0 pF
100 pF
• Excellent aging characteristic
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Broadband wireless communication
• Satellite communication
• WiFi (802.11) and WiMax (802.16)
• Subscriber-based wireless devices
• Microwave systems
DSCC 05002
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• Made with a combination of design, materials,
and tight process control to achieve very high
field reliability
• US defense supply center approved
• Federal stock control number CAGE CODE 2270A
• Available with tin-lead terminations (min. 4 %
lead)
• Available with AgPd terminations for silver epoxy
bonding
0603
BP
50
250
1.0 pF
100 pF
• Excellent aging characteristic
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Broadband wireless communication
• Satellite communication
• WiFi (802.11) and WiMax (802.16)
• Subscriber-based wireless devices
• Microwave systems
SELECTOR GUIDE
10/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
DSCC 05003
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• Made with a combination of design, materials,
and tight process control to achieve very high
field reliability
• US defense supply center approved
• Federal stock control number CAGE CODE 2270A
• Available with tin-lead terminations (min. 4 %
lead)
• Available with AgPd terminations for silver epoxy
bonding
0402
BP
50
100
1.0 pF
27 pF
• Excellent aging characteristic
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Broadband wireless communication
• Satellite communication
• WiFi (802.11) and WiMax (802.16)
• Subscriber-based wireless devices
• Microwave systems
DSCC 05006
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• Made with a combination of design, materials,
and tight process control to achieve very high
field reliability
BP
BR
BX
BP
BR
BX
200
100
200
100
1.0 pF
100 pF
1.0 pF
820 pF
3.3 nF
220 nF
180 nF
6.8 nF
560 nF
470 nF
• US defense supply center approved
• Federal stock control number CAGE CODE 2270A
• Available with tin-lead terminations (min. 4 %
lead)
• Available with AgPd terminations for silver epoxy
bonding
• Excellent aging characteristic
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Broadband wireless communication
• Satellite communication
• WiFi (802.11) and WiMax (802.16)
• Subscriber-based wireless devices
• Microwave systems
0805
10
DSCC 05007
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• Made with a combination of design, materials,
and tight process control to achieve very high
field reliability
16
• US defense supply center approved
• Federal stock control number CAGE CODE 2270A
• Available with tin-lead terminations (min. 4 %
lead)
• Available with AgPd terminations for silver epoxy
bonding
• Excellent aging characteristic
• Wet build process
• Reliable Noble Metal Electrode (NME) system
aPPliCaTiONS
• Broadband wireless communication
• Satellite communication
• WiFi (802.11) and WiMax (802.16)
• Subscriber-based wireless devices
• Microwave systems
1206
10
SELECTOR GUIDE
11/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
VJ....W1BC
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
FEaTURES
0402
0603
0805
1206
0402
0603
0805
1206
1210
0402
0603
0805
1206
1210
0402
0603
0805
1206
1210
1.0 nF
3.3 nF
12 nF
39 nF
10 µF
22 µF
47 µF
100 µF
220 µF
1.0 µF
2.2 µF
10 µF
22 µF
47 µF
1.0 µF
4.7 µF
10 µF
22 µF
100 µF
• Surface-mount multilayer ceramic chip capacitors
• Ultra-stable dielectric C0G (NP0)
• High capacitance per unit volume X5R/X7R/Y5V
• 100 % matte tin terminations
• Dry sheet technology process
• Base Metal Electrode system (BME)
aPPliCaTiONS
Bꢂsꢁc Commodꢁtꢃ
0.5 pF
C0G (NP0)
10
100
50
1.5 pF
47 nF
220 nF
• Consumer electronics
6.3
X5R
• Telecommunications
• Mobile applications
• Data processing
1.5 µF
4
6.3
50
100 pF
X7R
Y5V
10
100
150 pF
1.0 nF
6.3
6.3
50
10
10 nF
100
6.3
VJ....W1BC
hꢁgꢄ Q,
Bꢂsꢁc Commodꢁtꢃ
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• Ultra-stable dielectric C0G (NP0)
• High Q and low ESR at high frequency
• 100 % matte tin terminations
• Dry sheet technology process
• Base Metal Electrode system (BME)
aPPliCaTiONS
0402
0603
50
470 pF
3.3 nF
High Q
C0G (NP0)
16
0.5 pF
• Mobile telecommunications
• WLAN applications
• RF modules
100
• Tuner
VJ....W1BC
FEaTURES
• Surface-mount multilayer ceramic chip capacitors
• Ultra stable dielectric C0G (NP0)
• High Q and low ESR at high frequency
• 100 % matte tin terminations
• Dry sheet technology process
• Base Metal Electrode system (BME)
aPPliCaTiONS
0201
0402
0603
0805
10
50
25
33 pF
22 pF
47 pF
100 pF
Uꢀtrꢂ-hꢁgꢄ Q/
low ESR, Bꢂsꢁc
Commodꢁtꢃ
0.1 µF
0.3 pF
100
Ultra-
High Q
C0G (NP0)
• Mobile telecommunications
• WLAN applications
• RF modules
250
• Tuner
SELECTOR GUIDE
12/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
Voꢀtꢂge
Cꢂpꢂcꢁtꢂnce
Cꢂse
Sꢁze
TC ꢂnd
Dꢁeꢀectrꢁc
Serꢁes
Descrꢁptꢁon
[Mꢁn. V] [Mꢂx. V]
[Mꢁn.]
[Mꢂx.]
VJ0201...W1BC
Uꢀtrꢂ-Smꢂꢀꢀ Serꢁes,
Bꢂsꢁc Commodꢁtꢃ
FEaTURES
C0G
(NP0)
• Surface-mount multilayer ceramic chip capacitors
• Ultra-small size
16
0.5 pF
100 pF
120 pF
• High capacitance per unit volume
• 100 % matte tin terminations
• Dry sheet technology process
• Base Metal Electrode system (BME)
aPPliCaTiONS
• Microwave modules
• Portable equipment (mobile phone, PDA)
• RF modules
0201
X5R
X7R
6.3
10
50
2.2 µF
10 nF
VJ06C4...W1BC
MlCC Cꢄꢁp arrꢂꢃ,
Bꢂsꢁc Commodꢁtꢃ
FEaTURES
C0G
• Surface-mount multilayer ceramic chip capacitors
• 4 capacitors per unit
50
16
50
10 pF
180 pF
10 nF
470 pF
(NP0)
• 100 % matte tin terminations
• Dry sheet technology process
• Base Metal Electrode system (BME)
aPPliCaTiONS
• Bypass for digital and analog singal lines
• Computer motherboards and peripherals
0612
X7R
Y5V
50
100 nF
SELECTOR GUIDE
13/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
(7)
PART NUMBERING / ORDERING INFORMATION
VJ
0805
y
102
K
X
a
a
C
2l
CaPaCiTaNCE
NOMiNal CODE
TOlERaNCE TERMiNaTiON DC VOlTaGE
MaRKiNG
OPTiON (2)
PaCKaGiNG
PROCESS
CODE (6)
SERiES
iD
CaSE
CODE (5)
DiElECTRiC
CODE (1)
RaTiNG
VJ
HV
GA
0201
0402
0505
0603
06C4 (3)
0805
1111
1206
1210
1808
1812
1825
2008
2012
2220
2225
2525
3040
3640
3838
4044
A =
Expressed in
V = 0.05 pF
X = Ni barrier
Y = 6.3 VDC
Q = 10 VDC
J = 16 VDC
A = unmarked
T = 7” reel /
plastic tape
00, 54 =
standard
picofarad (pF). The B = 0.10 pF 100 % matte tin
C0G (NP0)
first two digits are C = 0.25 pF
plate finish
M = marking
vendor ID +
2-character
cap. code
(size 0805 /
1206)
significant, the
third is a multiplier.
An “R” indicates a
decimal point.
D = 0.50 pF
F = 1 %
G = 2 %
H = 3 %
J = 5 %
K = 10 %
M = 20 %
Z = - 20 %/+
80 %
X = 25 VDC
Z = 35 VDC
A = 50 VDC
B = 100 VDC
K = 150 VDC
C = 200 VDC
P = 250 VDC
D = 300 VDC
T = 400 VDC
E = 500 VDC
L = 630 VDC
I = 800 VDC
C = 7” reel /
paper tape
31, 34,
Y = X7R
G = X5R
H = X8R
Q = high Q
V = Y5V
B = polymer
100 % matte tin
plate finish
31X, 34G =
automotive
O = 7” reel /
flamed paper tape
used for AgPd
termination
4X, 5H =
Example:
0R3 = 0.3 pF
4R7 = 4.7 pF
102 = 1000 pF
473 = 47 000 pF
F, E = AgPd (4)
open mode
B = marking
L = Ni barrier
tin / lead plate
min. 4 % lead
for automotive 0402 / 0603 / 0805 HV = high
VJ....31 /
VJ....31X
vendor ID +
date code
(size 0805 /
1206)
voltage
J = 7” reel
(low quantity)
5Z, 5ZL =
HVArc
Guard®
N =
non-magnetic (7) G = 1000 VDC
E = 7” reel /
plastic tape
only used
L =
R = 1500 VDC
ultra-high Q,
low ESR
C = copper
barrier 100 %
matte tin
F = 2000 VDC
O = 2500 VDC
H = 3000 VDC
W = 3600 VDC
V = 4000 VDC
M = 5000 VDC
S = 7200 VDC
S = 4 VDC
X1, X2 =
Q = marking
vendor ID
automotive
safety caps
VJ...31 / VJ...34
plate finish
+ tolerance
+ 3-character
cap. code
(size 0505 /
1111 / 2525 /
3838)
SE =
Source
Energy
Capacitor
(SEC)
D = HIFREQ
(non-magnetic)
R =
(7)
11 1/4” / 13” reel /
plastic tape
only for
P =
VJ...W1BC
series
U = 250 VAC
11 1/4” / 13” reel /
paper tape
8R =
S = marking
for safety
caps
Controlled
Discharge
Capacitor
(CDC)
I =
11 1/4” / 13” reel /
flamed paper tape
used for AgPd
termination
2L, 2M,
2MP, 68,
5G =
0402 / 0603 / 0805
high-rel.
M =
11 1/4” / 13” reel /
plastic tape
W1BC =
basic
only used
commodity
automotive
VJ...31 / VJ...34
W = waffle pack
Notes
(1) For details see individual datasheets
(2) Marking option is not available in process code W1BC
(3) Chip array size 0612 including 4 capacitors VJ06C4...W1BC, only Basic Commodity Series
(4) Termination code “E” for conductive epoxy assembly, contact mlcc@vishay.com for availability
(5) Case size designator may be replaced by a four-digit drawing number
(6) Customer-specific process codes are also possible
(7) For non-magnetic termination, “C” is recommended for solder assembly, and “N” for conductive epoxy assembly
SELECTOR GUIDE
14/18
VMN-SG2120-1603
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
(1)
PART NUMBERING/ORDERING INFORMATION MILITARY PRODUCTS
CDR31
BX
103
a
K
Z
P
a
T
CaPaCiTaNCE
DC VOlTaGE
RaTiNG
TOlERaNCE
CODE
TERMiNaTiON
FailURE
RaTE
MaRKiNG
OPTiON
PaCKaGiNG
MiliTaRy
STylE
DiElECTRiC
CDR01
CDR02
CDR03
CDR04
CDR06
CDR31
CDR32
CDR33
CDR34
BP
BX
Expressed in
picofarad (pF). The
first two digits are
significant, the
third is a multiplier.
An “R” indicates
a decimal point.
Example:
A = 50 V
B = 100 V
C = 0.25 pF
D = 0.50 pF
F = 1 %
J = 5 %
K = 10 %
M = 20 %
M = Silver
palladium
M = 1.0 %
P = 0.1 %
R = 0.01 %
S = 0.001 %
A =
Unmarked
T = 7” reel /
plastic tape
Y = Ni barrier
100 % tin plate
matte finish
J = 7” reel (low qty.)
Consult factory
for failure rate
status
C = 7” reel /
paper tape
W = Ni barrier
100 % tin plate
matte finish
4R7 = 4.7 pF
102 = 1000 pF
R =
11 1/4” / 13” reel /
plastic tape
Z = Ni barrier
100 % tin/lead
plate min. 4 %
P =
11 1/4” / 13” reel /
paper tape
U = Ni barrier -
solder coated
min. 4 % lead
B = bulk
Notes
• For details of ratings, see individual datasheet
(1)
PART NUMBERING/ORDERING INFORMATION DSCC PRODUCTS
03028-
BX
102
a
K
Z
C
J
DSCC STylE DiElECTRiC
CaPaCiTaNCE
DC VOlTaGE
RaTiNG
TOlERaNCE
CODE
TERMiNaTiON
GROUP TESTiNG
PaCKaGiNG
03028-
03029-
05006-
05007-
BP
BX
BR
Expressed
in picofarad
(pF). The first
two digits are
significant,
X = 10 V
Y = 16 V
Z = 25 V
A = 50 V
B = 100 V
C = 200 V
C = 0.25 pF
D = 0.50 pF
F = 1 %
M = silver
palladium
C = Full group C
L = 2000 h life test only
M = 1000 h life test only
H = Low-voltage
T = 7” reel /
plastic tape
J = 7” reel (low qty.)
C = 7” reel /
G = 2 %
Z = Ni barrier
tin /
J = 5 %
humidity test only
paper tape
the third is a
multiplier.
K = 10 %
M = 20 %
lead plate
min. 4 % lead
- = Group A test only
O = 7” reel /
flamed paper tape
R = 11 1/4” / 13” reel /
plastic tape
An “R” indicates
a decimal point.
Example:
U = Ni barrier -
solder coated
min. 4 % lead
P = 11 1/4” / 13” reel /
paper tape
4R7 = 4.7 pF
102 = 1000 pF
I = 11 1/4” / 13” reel /
flamed paper tape
B = bulk
Notes
• For details of ratings, see individual datasheet
SELECTOR GUIDE
15/18
VMN-SG2120-1603
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
(1)
PART NUMBERING/ORDERING INFORMATION DSCC PRODUCTS
05001-
4R7
a
C
Z
C
J
DC VOlTaGE
RaTiNG
TOlERaNCE
CODE
TERMiNaTiON
GROUP TESTiNG
PaCKaGiNG
DSCC STylE
CaPaCiTaNCE
05001-
05002-
05003-
Expressed in
picofarad (pF). The
first two digits are
significant, the third
is a multiplier.
An “R” indicates
a decimal point.
Example:
A = 50 V
B = 100 V
C = 200 V
K = 250 V
B = 0.10 pF
C = 0.25 pF
D = 0.50 pF
F = 1 %
M = Silver
palladium
C = full group C
L = 2000 h life test only
M = 1000 h life test only
H = low-voltage
T = 7” reel/plastic tape
J = 7” reel/(low qty.)
C = 7” reel/paper tape
O = 7” reel/flamed paper tape
R = 11 1/4”/13”
Z = Ni barrier
tin/lead plate
min. 4 % lead
G = 2 %
humidity test only
J = 5 %
- = group A test only
reel/plastic tape
K = 10 %
M = 20 %
P = 11 1/4”/13”
reel/paper tape
4R7 = 4.7 pF
I = 11 1/4”/13” reel/
flamed paper tape
B = Bulk
Notes
• For details of ratings, see individual datasheet
• Contact mlcc@vishay.com for availability
PART NUMBERING / ORDERING INFORMATION MIL-PRF-123
M123a
10
BX
B
103
K
Z
T
DiElECTRiC DC VOlTaGE
RaTiNG
CaPaCiTaNCE
TOlERaNCE
CODE
TERMiNaTiON
PaCKaGiNG
MiliTaRy
STylE
SlaSh ShEET
Mil-PRF-123 10: CKS51 (0805)
11: CKS52 (1210)
BP
BX
B = 50 V
Expressed in picofarad (pF).
The first two digits are
significant, the third is a
multiplier. “R” denotes
decimal place.
B = 0.10 pF
C = 0.25 pF
D = 0.50 pF
F = 1 %
J = 5 %
K = 10 %
M = 20 %
For BP:
Z = Ni barrier
with tin / lead
plate min. 4 % lead
S = guarded
Plastic tape:
T = 7” reel
R = 11 1/4” /
13” reel
C = 100 V
12: CKS53 (1808)
13: CKS54 (2225)
21: CKS55 (1206)
termination
22: CKS56 (1812)
Examples:
Low quantity:
J = 7” reel
23: CKS57 (1825)
1R0 = 1.0 pF
103 = 10 000 pF
104 = 100 000 pF
B, C, D, J, K
For BX:
Bulk packaging:
B = bulk
K, M
Notes
• For details of ratings, see individual datasheet
• Contact mlcc@vishay.com for availability
Notes
(1) For details of ratings, see individual datasheet
SELECTOR GUIDE
16/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
lꢁnks ꢂnd Promotꢁonꢂꢀ informꢂtꢁon
PRODUCT ShEETS
RF Applications
HiFREQ:.............................................................................................................................................. www.vishay.com/doc?45071
QUAD HiFREQ: .................................................................................................................................. www.vishay.com/doc?45221
COMMODITY APPLICATIONS:
VJ....W1BC High Q:............................................................................................................................ www.vishay.com/doc?49751
VJ....W1BC Ultra-High Q/Low ESR:................................................................................................... www.vishay.com/doc?49022
VJ0201....W1BC:................................................................................................................................ www.vishay.com/doc?49706
VJ06C4....W1BC Chip Array:.............................................................................................................. www.vishay.com/doc?49714
HIGH-VOLTAGE APPLICATIONS:
HVArc Guard®:.................................................................................................................................... www.vishay.com/doc?49667
BOARDFLEX SENSITIVE APPLICATIONS:
VJ OMD Series:.................................................................................................................................. www.vishay.com/doc?49614
AUTOMOTIVE APPLICATIONS:
Automotive Instructional Guide:......................................................................................................... www.vishay.com/doc?49794
TECh NOTES
VISHAY BASIC COMMODITY SERIES:
Test procedures and requirements:.................................................................................................... www.vishay.com/doc?28545
Soldering and footprint:...................................................................................................................... www.vishay.com/doc?45017
VISHAY VITRAMON:
End Terminations:............................................................................................................................... www.vishay.com/doc?45063
Soldering recommendations: ............................................................................................................. www.vishay.com/doc?45034
lEaD (PB)-FREE iNFORMaTiON
How to get lead (Pb)-free: ................................................................................................................www.vishay.com/how/leadfree
Capacitor lead (Pb)-free matrix: ......................................................................................................... www.vishay.com/doc?49322
SELECTOR GUIDE
17/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VISHAY INTERTECHNOLOGY, INC.
MUlTilayER CERaMiC ChiP CaPaCiTORS
SEMICONDUCTORS
PASSIVE COMPONENTS
MOSFETs Segment
Resistors and Inductors Segment
MOSFETs
Film Resistors
Low-Voltage TrenchFET® Power MOSFETs
Medium-Voltage Power MOSFETs
High-Voltage Planar MOSFETs
High-Voltage Superjunction MOSFETs
Automotive-Grade MOSFETs
ICs
Metal Film Resistors
Thin Film Resistors
Thick Film Resistors
Power Thick Film Resistors
Metal Oxide Film Resistors
Carbon Film Resistors
Wirewound Resistors
Power Management and Power Control ICs
Smart Load Switches
Analog Switches and Multiplexers
Vitreous, Cemented, and Housed Resistors
Braking and Neutral Grounding Resistors
Custom Load Banks
Diodes Segment
Power Metal Strip® Resistors
Rectifiers
Battery Management Shunts
Crowbar and Steel Blade Resistors
Thermo Fuses
Chip Fuses
Pyrotechnic Initiators/Igniters
Schottky Rectifiers
Ultrafast Recovery Rectifiers
Standard and Fast Recovery Rectifiers
High-Power Rectifiers/Diodes
Bridge Rectifiers
Small-Signal Diodes
Variable Resistors
Schottky and Switching Diodes
Zener Diodes
Tuner/Capacitance Diodes
Bandswitching Diodes
RF PIN Diodes
Cermet Variable Resistors
Wirewound Variable Resistors
Conductive Plastic Variable Resistors
Contactless Potentiometers
Hall Effect Position Sensors
Precision Magnetic Encoders
Networks/Arrays
Non-Linear Resistors
NTC Thermistors
PTC Thermistors
Varistors
Protection Diodes
TVS Diodes or TRANSZORB®
(unidirectional, bidirectional)
ESD Protection Diodes (including arrays)
Thyristors/SCRs
Phase-Control Thyristors
Fast Thyristors
Magnetics
IGBTs
Inductors
Power Modules
Wireless Charging Coils
Transformers
Connectors
Input Modules (diodes and thyristors)
Output and Switching Modules (contain
MOSFETs, IGBTs, and diodes)
Custom Modules
Capacitors Segment
Tantalum Capacitors
Optoelectronic Components Segment
Infrared Emitters and Detectors
Optical Sensors
Infrared Remote Control Receivers
Optocouplers
Molded Chip Tantalum Capacitors
Molded Chip Polymer Tantalum Capacitors
Coated Chip Tantalum Capacitors
Solid Through-Hole Tantalum Capacitors
Wet Tantalum Capacitors
Ceramic Capacitors
Phototransistor, Photodarlington
Linear
Phototriac
Multilayer Chip Capacitors
Multilayer Chip RF Capacitors
Disc Capacitors
High-Speed
Film Capacitors
Power Capacitors
IGBT and MOSFET Driver
Solid-State Relays
Heavy-Current Capacitors
Aluminum Capacitors
ENYCAP™ Energy Storage Capacitors
LEDs and 7-Segment Displays
Infrared Data Transceiver Modules
Custom Products
SELECTOR GUIDE
18/18
VMN-SG2120-1603
www.vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND
THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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