VLMC3100 [VISHAY]
Low Current SMD LED PLCC-2; 低电流SMD LED PLCC- 2型号: | VLMC3100 |
厂家: | VISHAY |
描述: | Low Current SMD LED PLCC-2 |
文件: | 总8页 (文件大小:196K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
VLMC310.
Vishay Semiconductors
Low Current SMD LED PLCC-2
FEATURES
• SMD LED with exceptional brightness
• Compatible with automatic placement
equipment
e3
• EIA and ICE standard package
• Compatible with infrared, vapor phase and
wave solder processes according to CECC 00802
and J-STD-020C
19225
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Very low power consumption
• Luminous intensity ratio in one packaging unit
I
/I
≤ 2.0
Vmax Vmin
• Lead (Pb)-free device
• Preconditioning: according to Jedec level 2a
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
DESCRIPTION
APPLICATIONS
These new devices have been designed to meet the
increasing demand for low current SMD LEDs.
• Automotive: backlighting in dashboards and
switches
The package of the VLMC310. is the PLCC-2
(equivalent to a size B tantalum capacitor).
• Telecommunication: indicator and backlighting in
telephone and fax
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is
filled up with clear epoxy.
• Indicator and backlight for audio and video
equipment
• Indicator and backlight for battery driven equipment
• Small indicator for outdoor applications
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches and symbols
• General use
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: low current
• Angle of half intensity: 60°
PARTS TABLE
PART
COLOR, LUMINOUS INTENSITY
Green, IV > 0.71 mcd
Green, IV > 1.12 mcd
TECHNOLOGY
GaP on GaP
GaP on GaP
VLMC3100
VLMC3101
Document Number 81649
Rev. 1.1, 18-Sep-07
www.vishay.com
1
VLMC310.
Vishay Semiconductors
1)
ABSOLUTE MAXIMUM RATINGS VLMC310.
PARAMETER
Reverse voltage2)
TEST CONDITION
SYMBOL
VALUE
UNIT
V
VR
6
IF
IFSM
PV
DC Forward current
7
0.5
mA
A
tp ≤ 10 µs
Surge forward current
Power dissipation
20
mW
°C
Tj
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
100
Tamb
Tstg
Tsd
- 40 to + 100
- 40 to + 100
260
°C
°C
t ≤ 5 s
°C
Thermal resistance junction/
ambient
mounted on PC board
(pad size > 16 mm2)
RthJA
500
K/W
Note:
1)
T
= 25 °C unless otherwise specified
amb
2) Driving the LED in reverse direction is suitable for a short term application
1)
OPTICAL AND ELECTRICAL CHARACTERISTICS VLMC310., GREEN
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN
0.71
1.12
562
TYP.
1.6
MAX
575
2.4
UNIT
mcd
mcd
nm
nm
deg
V
IV
VLMC3100
VLMC3101
Luminous intensity 2)
IF = 2 mA
IV
λd
λp
1.6
IF = 2 mA
IF = 2 mA
Dominant wavelength
Peak wavelength
565
60
IF = 2 mA
Angle of half intensity
Forward voltage
ϕ
IF = 2 mA
VF
VR
Cj
1.9
15
IR = 10 µA
Reverse voltage
6
V
VR = 0, f = 1 MHz
Junction capacitance
50
pF
Note:
1)
T
= 25 °C unless otherwise specified
amb
2) in one Packing Unit IVmax/IVmin ≤ 2.0
LUMINOUS INTENSITY CLASSIFICATION
COLOR CLASSIFICATION
GROUP
LIGHT INTENSITY (MCD)
GREEN
STANDARD
OPTIONAL
MIN
0.71
0.90
1.12
MAX
0.90
1.12
1.40
GROUP
DOM. WAVELENGTH (NM)
E1
E2
F1
1
2
1
MIN.
562
564
566
568
570
572
MAX.
565
567
569
571
573
575
3
4
5
6
7
8
Note:
Luminous intensity is tested at a current pulse duration of 25 ms and
an accuracy of 11 ꢀ.
The above Type Numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel). In or-
der to ensure availability, single brightness groups will not be order-
able.
Note:
Wavelengths are tested at a current pulse duration of 25 ms and an
accuracy of 1 nm.
In a similar manner for colors where wavelength groups are mea-
sured and binned, single wavelength groups will be shipped on any
one reel.
In order to ensure availability, single wavelength groups will not be
orderable.
www.vishay.com
2
Document Number 81649
Rev. 1.1, 18-Sep-07
VLMC310.
Vishay Semiconductors
TYPICAL CHARACTERISTICS
T
= 25 °C, unless otherwise specified
amb
10
8
1.6
1.2
0.8
0.4
Green
6
4
2
0
I
= 2 mA
F
0
0
20
40
60
80
100
100
0
20
40
60
80
Tamb - Ambient Temperature (°C)
95 10057
95 10842
Tamb - Ambient Temperature (°C)
Figure 1. Forward Current vs. Ambient Temperature
Figure 4. Rel. Luminous Intensity vs. Ambient Temperature
0°
10°
20°
2.4
30°
40°
green
2.0
1.6
1.2
1.0
0.9
50°
60°
0.8
0.4
0
0.8
70°
0.7
80°
I /mA
t /T
p
10
1
20
0.5
50
0.2
100 200
0.1 0.05
500
0.02
0.6
F
0.6 0.4 0.2
0
0.2 0.4
95 10319
16486
Figure 2. Rel. Luminous Intensity vs. Angular Displacement
Figure 5. Rel. Lumin. Intensity vs. Forw. Current/Duty Cycle
100
100
Green
10
Green
10
1
1
0.1
t /T= 0.001
p
t = 10 µs
p
0.01
0.1
0.1
100
4
5
1
10
0
1
2
3
IF - Forward Current (mA)
VF - Forward Voltage (V)
95 10059
95 10056
Figure 3. Forward Current vs. Forward Voltage
Figure 6. Relative Luminous Intensity vs. Forward Current
Document Number 81649
Rev. 1.1, 18-Sep-07
www.vishay.com
3
VLMC310.
Vishay Semiconductors
1.2
green
1.0
0.8
0.6
0.4
0.2
0
620
520
540
560
580
600
λ - Wavelength (nm)
95 10038
Figure 7. Relative Intensity vs. Wavelength
PACKAGE DIMENSIONS in millimeters
Mounting Pad Layout
1.2
area covered with
solder resist
4
1.6 (1.9)
20541
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4
Document Number 81649
Rev. 1.1, 18-Sep-07
VLMC310.
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE
AND REEL
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
SMD LED (VLM3 - SERIES)
10.4
8.4
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component inser-
tion. The blister tape is a plastic strip with impressed
component cavities, covered by a top tape.
120°
4.5
3.5
13.00
12.75
2.5
1.5
62.5
60.0
Identification
Label:
Vishay
Type
Adhesive Tape
Group
Tape Code
Production
Code
Blister Tape
14.4 max.
321
329
Quantity
18857
Figure 10. Reel Dimensions - GS18
SOLDERING PROFILE
94 8670
Component Cavity
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC Level 2a
TAPING OF VLM.3..
300
250
200
150
100
50
3.5
3.1
2.2
2.0
max. 260 °C
255 °C
245 °C
240 °C
217 °C
5.75
5.25
max. 30 s
4.0
3.6
8.3
7.7
3.6
3.4
max. 100 s
max. 120 s
1.85
1.65
max. ramp down 6 °C/s
max. ramp up 3 °C/s
0.25
1.6
1.4
4.1
3.9
4.1
3.9
2.05
1.95
0
0
50
100
150
200
250
300
94 8668
Time (s)
max. 2 cycles allowed
19885
Figure 8. Tape Dimensions in mm for PLCC-2
Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
948626-1
Lead Temperature
TTW Soldering (acc. to CECC00802)
300
250
5 s
10.0
second
235 °C...260 °C
full line: typical
dotted line: process limits
wave
9.0
first wave
120°
200
150
100
ca. 2 K/s
ca. 200 K/s
4.5
3.5
100 °C...130 °C
13.00
12.75
2.5
1.5
63.5
60.5
ca. 5 K/s
2 K/s
forced cooling
50
0
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
0
100
Time (s)
250
50
150
200
14.4 max.
Figure 12. Double Wave Soldering of Opto Devices (all Packages)
180
178
Quantity
94 8665
Figure 9. Reel Dimensions - GS08
Document Number 81649
Rev. 1.1, 18-Sep-07
www.vishay.com
5
VLMC310.
Vishay Semiconductors
BAR CODE PRODUCT LABEL
EXAMPLE:
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the alu-
minium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 ꢀ RH max.
106
A
H
VISHAY
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
37
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
20127
B
C
D
E
F
G
192 h at 40 °C + 5 °C/ - 0 °C and < 5 ꢀ RH (dry air/
nitrogen) or
A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):
96 h at 60 °C + 5 °C and < 5 ꢀ RH for all device con-
tainers or
e.g.: J1 = code for luminous intensity group
D) Date code year/week
E) Day code (e.g. 3: Wednesday)
F) Batch no.
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label
is included on all dry bags.
L
E V E L
G) Total quantity
H) Company code
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
2a
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
DRY PACKING
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transpor-
tation and storage.
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
3. Devices require baking before mounting if:
a)
b)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
2a or 2b is not met.
Aluminum bag
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
or
96 hours at 60 5oCand <5%RH
24 hours at 100 5°C
For all device containers
Not suitable for reels or tubes
Label
Bag Seal Date: ______________________________
(If blank, see bar code label)
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
19786
Reel
Example of JESD22-A112 level 2a label
15973
ESD PRECAUTION
Proper storage and handling procedures should be fol-
lowed to prevent ESD damage to the devices espe-
cially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warn-
ing labels are on the packaging.
FINAL PACKING
The sealed reel is packed into a cardboard box. A sec-
ondary cardboard box is used for shipping purposes.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors
specific data.
www.vishay.com
6
Document Number 81649
Rev. 1.1, 18-Sep-07
VLMC310.
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs,
damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death
associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 81649
Rev. 1.1, 18-Sep-07
www.vishay.com
7
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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1
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