VLMG31L1M2-GS08 [VISHAY]
Standard SMD LED in PLCC-2; 在PLCC - 2标准的SMD LED
| 型号： | VLMG31L1M2-GS08 |
| 厂家： | 
VISHAY |
| 描述： | Standard SMD LED in PLCC-2 |
| 文件： | 总8页 (文件大小：170K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VLMG31..
Vishay Semiconductors
Standard SMD LED in PLCC-2
FEATURES
• Lead (Pb)-free product-RoHS compliant
• SMD LEDs with exceptional brightness
• Luminous intensity categorized
• Compatible with automatic placement
equipment
e3
• EIA and ICE standard package
• Compatible with IR reflow, vapor phase and wave
solder processes according to CECC 00802 and
J-STD-020C
94 8553
• Available in 8 mm tape
• Low profile package
• Non-diffused lens: excellent for coupling to light
pipes and backlighting
• Low power consumption
• Luminous intensity ratio in one packaging unit
I
/I
≤ 1.6
Vmax Vmin
• Preconditioning: acc. to JEDEC level 2a
•
ESD-withstand voltage:
up to 2 kV according to JESD22-A114-B
DESCRIPTION
APPLICATIONS
These devices have been designed to meet the
increasing demand for surface mounting technology.
• Automotive: backlighting in dashboards and
switches
The package of the VLMG31-series is the PLCC-2.
• Telecommunication: indicator and backlighting in
telephone and fax
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is
filled up with clear epoxy.
• Indicator and backlight for audio and video
equipment
• Indicator and backlight in office equipment
• Flat backlight for LCDs, switches and symbols
• General use
PRODUCT GROUP AND PACKAGE DATA
• Product group: LED
• Package: SMD PLCC-2
• Product series: standard
• Angle of half intensity: 60°
PARTS TABLE
PART
COLOR, LUMINOUS INTENSITY
Green, IV = (7.1 to 18) mcd
TECHNOLOGY
GaP on GaP
GaP on GaP
GaP on GaP
GaP on GaP
GaP on GaP
GaP on GaP
VLMG31K1L2-GS08
VLMG31K1L2-GS18
VLMG31K1M2-GS08
VLMG31K1M2-GS18
VLMG31L1M2-GS08
VLMG31L1M2-GS18
Green, IV = (7.1 to 18) mcd
Green, IV = (7.1 to 28) mcd
Green, IV = (7.1 to 28) mcd
Green, IV = (11.2 to 28) mcd
Green, IV = (11.2 to 28) mcd
Document Number 81323
Rev. 1.1, 06-Sep-07
www.vishay.com
1
VLMG31..
Vishay Semiconductors
1)
ABSOLUTE MAXIMUM RATINGS VLMG31..
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
V
Reverse voltage2)
DC forward current
VR
6
30
Tamb ≤ 60 °C
tp ≤ 10 µs
IF
IFSM
PV
mA
A
Surge forward current
Power dissipation
0.5
100
mW
°C
Junction temperature
Tj
100
Operating temperature range
Storage temperature range
Tamb
Tstg
- 40 to + 100
- 40 to + 100
°C
°C
Thermal resistance junction/
ambient
mounted on PC board
(pad size > 16 mm2)
RthJA
400
K/W
Note:
1)
T
= 25 °C, unless otherwise specified
amb
2) Driving LED in reverse direction is suitable for short term application.
1)
OPTICAL AND ELECTRICAL CHARACTERISTICS VLMG31.., GREEN
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN
TYP.
MAX
UNIT
IV
mcd
VLMG31K1L2
VLMG31K1M2
VLMG31L1M2
7.1
18
28
Luminous intensity2)
IF = 10 mA
IV
IV
mcd
mcd
nm
nm
deg
V
7.1
11.2
562
28
IF = 10 mA
IF = 10 mA
λd
λp
Dominant wavelength
Peak wavelength
575
565
60
IF = 10 mA
Angle of half intensity
Forward voltage
ϕ
IF = 20 mA
VF
VR
Cj
2.2
15
2.8
IR = 10 µA
Reverse voltage
6
V
VR = 0, f = 1 MHz
Junction capacitance
15
pF
Note:
1)
T
= 25 °C, unless otherwise specified
amb
2) in one packing unit IVmax/IVmin ≤ 1.6
LUMINOUS INTENSITY CLASSIFICATION
COLOR CLASSIFICATION
GROUP
STANDARD
K
LIGHT INTENSITY (MCD)
GROUP
GREEN
OPTIONAL
MIN
7.1
MAX
9
DOM. WAVELENGTH (NM)
1
2
1
2
1
2
MIN.
562
564
566
568
570
572
MAX.
565
567
569
571
573
575
9
11.2
14.0
18.0
22.4
28.0
3
4
5
6
7
8
L
11.2
14.0
18.0
22.4
M
Note:
Luminous intensity is tested at a current pulse duration of 25 ms and
an accuracy of 11 ꢀ.
Note:
Wavelengths are tested at a current pulse duration of 25 ms and an
accuracy of 1 nm.
The above Type Numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel). In
order to ensure availability, single brightness groups will not be
orderable.
CROSSING TABLE
In a similar manner for colors where wavelength groups are
measured and binned, single wavelength groups will be shipped on
any one reel.
VISHAY
OSRAM
VLMG31K1L2
VLMG31K1M2
VLMG31L1M2
LGT670-K1L2
LGT670-K1M2
LGT670-L1M2
In order to ensure availability, single wavelength groups will not be
orderable.
www.vishay.com
2
Document Number 81323
Rev. 1.1, 06-Sep-07
VLMG31..
Vishay Semiconductors
TYPICAL CHARACTERISTICS
T
= 25 °C, unless otherwise specified
amb
60
50
1.2
1.0
green
40
30
20
10
0
0.8
0.6
0.4
0.2
0
0
20
40
60
80
100
620
520
540
560
580
600
95 10905
λ - Wavelength (nm)
Tamb - Ambient Temperature (°C)
95 10038
Figure 1. Forward Current vs. Ambient Temperature
Figure 4. Relative Intensity vs. Wavelength
10000
100
Tamb < 60 °C
t p /T = 0.005
green
0.01
1000
0.02
10
1
0.05
100
0.2
0.5
DC
0.1
10
1
0.1
100
0.01
0.1
1
10
0
1
2
3
4
5
tp - Pulse Length (ms)
95 9985
V
- Forward Voltage (V)
95 9986
F
Figure 2. Pulse Forward Current vs. Pulse Duration
Figure 5. Forward Current vs. Forward Voltage
0°
10°
20°
2.4
30°
40°
green
2.0
1.6
1.2
0.8
1.0
0.9
50°
60°
0.8
70°
0.4
0
0.7
80°
I
F (mA)
10
1
20
50
100
200
500
0.6
0.6 0.4 0.2
0
0.2 0.4
95 10319
tp/T
0.5
0.2 0.1
0.05
0.02
95 10263
Figure 3. Rel. Luminous Intensity vs. Angular Displacement
Figure 6. Specific Luminous Intensity vs. Forward Current
Document Number 81323
Rev. 1.1, 06-Sep-07
www.vishay.com
3
VLMG31..
Vishay Semiconductors
2.0
green
1.6
1.2
0.8
0.4
0
0
20
40
60
80
100
T
- Ambient Temperature (°C)
95 10320
amb
Figure 7. Rel. Luminous Intensity vs. Ambient Temperature
PACKAGE DIMENSIONS in millimeters
3.5 0.2
technical drawings
according to DIN
specifications
Mounting Pad Layout
Pin identification
1.2
area covered with
solder resist
C
A
4
1.6 (1.9)
?
2.4
+ 0.15
3
Drawing-No.: 6.541-5025.01-4
Issue: 8; 22.11.05
95 11314-1
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4
Document Number 81323
Rev. 1.1, 06-Sep-07
VLMG31..
Vishay Semiconductors
METHOD OF TAPING/POLARITY AND TAPE
AND REEL
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERRED
SMD LED (VLM3 - SERIES)
10.4
8.4
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component
insertion. The blister tape is a plastic strip with
impressed component cavities, covered by a top tape.
120°
4.5
3.5
13.00
12.75
2.5
1.5
62.5
60.0
Identification
Label:
Vishay
Type
Group
Adhesive Tape
Tape Code
Production
Code
14.4 max.
321
329
Quantity
18857
Blister Tape
Figure 10. Reel Dimensions - GS18
SOLDERING PROFILE
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC Level 2a
94 8670
Component Cavity
300
250
200
150
100
50
max. 260 °C
255 °C
245 °C
TAPING OF VLM.3..
240 °C
217 °C
3.5
3.1
2.2
2.0
max. 30 s
5.75
5.25
max. 100 s
max. 120 s
4.0
3.6
8.3
7.7
3.6
3.4
max. ramp down 6 °C/s
max. ramp up 3 °C/s
1.85
1.65
0
0
50
100
150
200
250
300
0.25
1.6
1.4
4.1
3.9
4.1
3.9
Time (s)
max. 2 cycles allowed
19885
2.05
1.95
94 8668
Figure 11. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
Figure 8. Tape Dimensions in mm for PLCC-2
948626-1
TTW Soldering (acc. to CECC00802)
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
300
250
5 s
Lead Temperature
second
235 °C...260 °C
full line: typical
dotted line: process limits
wave
first wave
200
150
100
10.0
ca. 2 K/s
9.0
120°
ca. 200 K/s
100 °C...130 °C
4.5
3.5
13.00
12.75
2.5
1.5
ca. 5 K/s
2 K/s
forced cooling
50
0
63.5
60.5
Identification
Label:
Vishay
Type
Group
0
100
Time (s)
250
50
150
200
Tape Code
Production
Code
Figure 12. Double Wave Soldering of Opto Devices (all Packages)
14.4 max.
180
178
Quantity
94 8665
Figure 9. Reel Dimensions - GS08
Document Number 81323
Rev. 1.1, 06-Sep-07
www.vishay.com
5
VLMG31..
Vishay Semiconductors
BAR CODE PRODUCT LABEL
EXAMPLE:
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the
aluminium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
106
A
H
• Storage temperature 10 °C to 30 °C
VISHAY
• Storage humidity ≤ 60 ꢀ RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
37
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
192 h at 40 °C + 5 °C/- 0 °C and < 5 ꢀ RH
(dry air/ nitrogen) or
B
C
D
E
F
G
19788
A) Type of component
B) Manufacturing plant
C) SEL - selection code (bin):
96 h at 60 °C + 5 °C and < 5 ꢀ RH for all device
containers or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label
is included on all dry bags.
e.g.: K1 = code for luminous intensity group
4 = code for color group
D)Date code year/week
E) Day code (e.g. 2: Tuesday)
F) Batch no.
G) Total quantity
H) Company code
L
E V E L
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
2a
DRY PACKING
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during
transportation and storage.
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
3. Devices require baking before mounting if:
a)
b)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
2a or 2b is not met.
Aluminum bag
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
or
96 hours at 60 5oCand <5%RH
24 hours at 100 5°C
For all device containers
Not suitable for reels or tubes
Label
Bag Seal Date: ______________________________
(If blank, see bar code label)
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
19786
Example of JESD22-A112 level 2a label
Reel
15973
ESD PRECAUTION
Proper storage and handling procedures should be
followed to prevent ESD damage to the devices
especially when they are removed from the antistatic
shielding bag. Electro-static sensitive devices warning
labels are on the packaging.
FINAL PACKING
The sealed reel is packed into a cardboard box. A
secondary cardboard box is used for shipping
purposes.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABELS
The Vishay Semiconductors standard bar code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors
specific data.
www.vishay.com
6
Document Number 81323
Rev. 1.1, 06-Sep-07
VLMG31..
Vishay Semiconductors
OZONE DEPLETING SUBSTANCES POLICY STATEMENT
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs,
damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death
associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 81323
Rev. 1.1, 06-Sep-07
www.vishay.com
7
Legal Disclaimer Notice
Vishay
Disclaimer
All product specifications and data are subject to change without notice.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf
(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
document or by any conduct of Vishay.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless
otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such
applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting
from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding
products designed for such applications.
Product names and markings noted herein may be trademarks of their respective owners.
Document Number: 91000
Revision: 18-Jul-08
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1
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