VLMW3102K [VISHAY]
Visible LED, SURFACE-MOUNT/AXIAL LED LAMP,WHITE,CLEAR,LED-8D;型号: | VLMW3102K |
厂家: | VISHAY |
描述: | Visible LED, SURFACE-MOUNT/AXIAL LED LAMP,WHITE,CLEAR,LED-8D |
文件: | 总9页 (文件大小:176K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
VLMW3102K
Vishay Semiconductors
High Intensity SMD LED
FEATURES
• High efficient InGaN technology
• Chromaticity Coordinate categorized
according to CIE1931 per packing unit
• Typical color temperature 5500 K
• EIA and ICE standard package
e3
• ESD-withstand voltage up to 1 kV according to
JESD22-A114-B
• Compatible with IR-reflow, vapor phase and wave
solder processes to CECC 00802 and JST-D-020C
• Available in 8 mm tape reel
19225
• Lead (Pb)-free device
• Preconditioning: according to JEDEC Level 2a
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
DESCRIPTION
APPLICATIONS
This device has been designed to meet the increasing
demand for white SMD LED.
• Automotive: Backlighting in dashboards and
switches
• Telecommunication: Indicator and backlighting in
telephone and fax
• Backlighting for audio and video equipment
• Backlighting in office equipment
The package of the VLMW3102K is the PLCC-2.
It consists of a lead frame which is embedded in a
white thermoplast. The reflector inside this package is
filled with a mixture of epoxy and TAG phosphor.
The TAG phosphor converts the blue emission par-
tially to yellow, which mixes with the remaining blue to
give white.
• Indoor and outdoor message boards
• Flat backlight for LCDs, switches and symbols
• Illumination purposes, alternative to incandescent
lamps
• General use
PARTS TABLE
PART
COLOR, LUMINOUS INTENSITY ANGLE OF HALF INTENSITY ( ϕ)
TECHNOLOGY
White, IV = (140 to 280) mcd
VLMW3102K-GS08
60°
InGaN/TAG on SiC
1)
ABSOLUTE MAXIMUM RATINGS VLMW3102K
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
V
Reverse voltage2)
VR
5
Tamb ≤ 70 °C
tp ≤ 10 µs
IF
IFSM
PV
DC Forward current
20
0.1
mA
A
Surge forward current
Power dissipation
85
mW
°C
Tj
Junction temperature
Storage temperature range
Operating temperature range
100
Tstg
Tamb
- 40 to + 100
- 40 to + 100
°C
°C
Thermal resistance junction/
ambient
mounted on PC board
(pad size > 16 mm2)
RthJA
350
K/W
1)
T
= 25 °C, unless otherwise specified
amb
2) Driving the LED in reverse direction is suitable for short term application
Document Number 81267
Rev. 1.1, 11-Aug-06
www.vishay.com
1
VLMW3102K
Vishay Semiconductors
1)
OPTICAL AND ELECTRICAL CHARACTERISTICS , VLMW3102K, WHITE
PARAMETER
TEST CONDITION
PART
SYMBOL
MIN
TYP.
MAX
UNIT
IF = 20 mA
IV
Luminous intensity
VLMW3102K
140
280
mcd
Chromaticity coordinate x acc.
to CIE 1931
I
I
F = 20 mA
F = 20 mA
x
y
0.315
0.25
0.33
0.33
0.34
0.36
Chromaticity coordinate y acc.
to CIE 1931
IF = 20 mA
F = 20 mA
Angle of half intensity
Forward voltage
ϕ
60
deg
V
I
VF
3.5
4.2
IR = 10 µA
IF = 20 mA
IF = 20 mA
VR
Reverse voltage
5
V
Temperature coefficient of VF
Temperature coefficient of IV
TCVF
TCIV
- 4
mV/K
ꢀ/K
- 0.5
1)
T
= 25 °C, unless otherwise specified
amb
LUMINOUS INTENSITY CLASSIFICATION
CHROMATICITY COORDINATE
CLASSIFICATION
GROUP
STANDARD
R
LIGHT INTENSITY [MCD]
OPTIONAL
MIN
140
180
224
MAX
180
224
280
X
Y
GROUP
2
1
2
MIN
MAX
MIN
MAX
4c
4d
0.3150 0.3275 Y = 1.4 x - 0.171 Y = 1.4 x - 0.121
0.3275 0.3400 Y = 1.4 x - 0.171 Y = 1.4 x - 0.121
S
Note:
Luminous intensity is tested at a current pulse duration of 25 ms and
an accuracy of 11 ꢀ.
The above type Numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel). In or-
der to ensure availability, single brightness groups will not be order-
able.
In a similar manner for colors where wavelength groups are mea-
sured and binned, single wavelength groups will be shipped on any
one reel.
In order to ensure availability, single wavelength groups will not be
orderable.
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2
Document Number 81267
Rev. 1.1, 11-Aug-06
VLMW3102K
Vishay Semiconductors
TYPICAL CHARACTERISTICS
Tamb = 25 °C, unless otherwise specified
100
90
80
70
60
50
40
30
20
10
0
25
20
15
10
5
0
0
10 20 30 40 50 60 70 80 90 100
- Ambient Temperature (°C)
400 450 500 550 600 650 700 750 800
16196
λ - Wavelength (nm)
16192
T
amb
Figure 1. Forward Current vs. Ambient Temperature
Figure 4. Relative Intensity vs. Wavelength
2.0
10
1
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
0.1
0.01
0
10 20 30 40 50 60 70 80 90 100
- Ambient Temperature (°C)
1
10
100
T
amb
16197
16194
I
- Forward Current (mA)
F
Figure 2. Relative Luminous Intensity vs. Forward Current
Figure 5. Rel. Luminous Intensity vs. Ambient Temperature
0.345
100
White
0.340
X
0.335
0.330
10
Y
0.325
0.320
0.315
1
2.0
0
10
I
20
30
40
50
60
2.5
3.0
V - Forward Voltage (V)
F
3.5
4.0
4.5
5.0
16198
- Forward Current (mA)
16195
F
Figure 3. Forward Current vs. Forward Voltage
Figure 6. Chromaticity Coordinate Shift vs. Forward Current
Document Number 81267
Rev. 1.1, 11-Aug-06
www.vishay.com
3
VLMW3102K
Vishay Semiconductors
0.44
0.42
0.40
0.38
0.36
0.34
0.32
0.30
0.28
0.26
0.24
0.22
3.95
3.90
3.85
3.80
3.75
3.70
3.65
3.60
3.55
3.50
3.45
5b
5d
5a
5c
4b
4d
4a
4c
3b
3d
3a
3c
0
10 20 30 40 50 60 70 80 90 100
- Ambient Temperature (°C)
0.28 0.29 0.30 0.31 0.32 0.33 0.34 0.35 0.36 0.37
19037
16199
X Coordinates
T
amb
Figure 7. Forward Voltage vs. Ambient Temperature
Figure 9. Coordinates of Colorgroups
0°
10°
20°
30°
40°
1.0
0.9
50°
60°
0.8
0.7
70°
80°
0.6
0.6
0.4
0.2
0
0.2
0.4
95 10319
Figure 8. Rel. Luminous Intensity vs. Angular Displacement
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4
Document Number 81267
Rev. 1.1, 11-Aug-06
VLMW3102K
Vishay Semiconductors
PACKAGE DIMENSIONS IN MM
3.5 0.2
technical drawings
according to DIN
specifications
Mounting Pad Layout
Pin identification
1.2
area covered with
solder resist
C
A
4
1.6 (1.9)
Ø
2.4
Dimensions: IR Reflow and Vaporphase
(Wave Soldering)
+ 0.15
3
Drawing-No. : 6.541-5025.01-4
Issue: 8; 22.11.05
95 11314-1
METHOD OF TAPING/POLARITY AND TAPE AND REEL
SMD LED (VLM.3 - SERIES)
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with
DIN IEC 40 (CO) 564) for automatic component inser-
tion. The blister tape is a plastic strip with impressed
component cavities, covered by a top tape.
10.0
9.0
120°
4.5
3.5
13.00
12.75
2.5
1.5
63.5
60.5
Adhesive Tape
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
Blister Tape
14.4 max.
180
178
Quantity
94 8665
Figure 11. Reel dimensions - GS08
94 8670
Component Cavity
REEL PACKAGE DIMENSION IN MM FOR
SMD LEDS, TAPE OPTION GS18
(= 8000 PCS.) PREFERED
TAPING OF VLM.3...
3.5
3.1
2.2
2.0
Anode
10.4
8.4
120°
5.75
5.25
4.5
3.5
4.0
3.6
13.00
12.75
2.5
1.5
8.3
7.7
3.6
3.4
62.5
60.0
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
1.85
1.65
0.25
1.6
1.4
4.1
3.9
4.1
3.9
14.4 max.
321
329
Quantity
18857
2.05
1.95
94 8668
Figure 12. Reel dimensions - GS18
Figure 10. Tape dimensions in mm for PLCC-2
Document Number 81267
Rev. 1.1, 11-Aug-06
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5
VLMW3102K
Vishay Semiconductors
SOLDERING PROFILE
BARCODE-PRODUCT-LABEL
EXAMPLE:
IR Reflow Soldering Profile for lead (Pb)-free soldering
Preconditioning acc. to JEDEC Level 2a
300
250
200
150
100
50
max. 260 °C
245 °C
255
255 °C
240 °C
217 °C
106
A
H
max. 30 s
max. 100 s
VISHAY
37
max. 120 s
max. Ramp Down 6 °C/s
max. Ramp Up 3 °C/s
B
C
D
E
F
G
19797
0
0
50
100
150
200
250
300
Time (s)
max. 2 cycles allowed
19885
Figure 13. Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020C)
A) Type of component
B) Manufacturing Plant
C) SEL - Selection Code (Bin):
948626-1
TTW Soldering (acc. to CECC00802)
5 s
300
250
e.g.: R1= Code for Luminous Intensity Group
5L = Code for Color Group
Lead Temperature
second
wave
235 °C...260 °C
first wave
full line: typical
D) Date Code year/week
E) Day Code (e.g. 1: Monday)
F) Batch No.
dotted line: process limits
200
150
100
ca. 2 K/s
ca. 200 K/s
100 °C...130 °C
G) Total quantity
H) Company Code
ca. 5 K/s
2 K/s
forced cooling
50
0
0
100
Time (s)
250
50
150
200
Figure 14. Double wave soldering of opto devices (all packages)
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6
Document Number 81267
Rev. 1.1, 11-Aug-06
VLMW3102K
Vishay Semiconductors
DRY PACKING
L
E V E L
The reel is packed in an anti-humidity bag to protect
the devices from absorbing moisture during transpor-
tation and storage.
CAUTION
This bag contains
MOISTURE –SENSITIVE DEVICES
2a
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
Aluminium bag
3. Devices require baking before mounting if:
a)
b)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
2a or 2b is not met.
4. If baking is required, devices may be baked for:
Label
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
or
96 hours at 60 5oCand <5%RH
24 hours at 100 5°C
For all device containers
Not suitable for reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Reel
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
19786
Example of JESD22-A112 Level 2a label
15973
ESD PRECAUTION
Proper storage and handling procedures should be fol-
lowed to prevent ESD damage to the devices espe-
cially when they are removed from the Antistatic
Shielding Bag. Electro-Static Sensitive Devices warn-
ing labels are on the packaging.
FINAL PACKING
The sealed reel is packed into a cardboard box. A sec-
ondary cardboard box is used for shipping purposes.
VISHAY SEMICONDUCTORS STANDARD
BAR-CODE LABELS
The Vishay Semiconductors standard bar-code labels
are printed at final packing areas. The labels are on
each packing unit and contain Vishay Semiconductors
specific data.
RECOMMENDED METHOD OF STORAGE
Dry box storage is recommended as soon as the alu-
minium bag has been opened to prevent moisture
absorption. The following conditions should be
observed, if dry boxes are not available:
• Storage temperature 10 °C to 30 °C
• Storage humidity ≤ 60 ꢀ RH max.
After more than 672 hours under these conditions
moisture content will be too high for reflow soldering.
In case of moisture absorption, the devices will recover
to the former condition by drying under the following
condition:
192 hours at 40 °C + 5 °C/- 0 °C and < 5 ꢀ RH
(dry air/nitrogen) or
96 hours at 60 °C + 5 °C and < 5 ꢀ RH for all device
containers or
24 hours at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC Standard JESD22-A112 Level 2a label
is included on all dry bags.
Document Number 81267
Rev. 1.1, 11-Aug-06
www.vishay.com
7
VLMW3102K
Vishay Semiconductors
OZONE DEPLETING SUBSTANCES POLICY STATEMENT
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as their
impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as
ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and
forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban
on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of
ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each customer
application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or
unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs,
damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death
associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
www.vishay.com
8
Document Number 81267
Rev. 1.1, 11-Aug-06
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
www.vishay.com
1
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