VS-MURB1620CTPBF [VISHAY]

Rectifier Diode, 1 Phase, 2 Element, 8A, 200V V(RRM), Silicon, HALOGEN FREE AND ROHS COMPLIANT, D2PAK-3;
VS-MURB1620CTPBF
型号: VS-MURB1620CTPBF
厂家: VISHAY    VISHAY
描述:

Rectifier Diode, 1 Phase, 2 Element, 8A, 200V V(RRM), Silicon, HALOGEN FREE AND ROHS COMPLIANT, D2PAK-3

快速恢复大电源 超快恢复二极管 快速恢复二极管 超快恢复大功率电源 高功率电源
文件: 总9页 (文件大小:263K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
VS-MURB1620CTPbF, VS-MURB1620CT-1PbF  
www.vishay.com  
Vishay Semiconductors  
Ultrafast Rectifier, 2 x 8 A FRED Pt®  
FEATURES  
• Ultrafast recovery time  
• Low forward voltage drop  
• Low leakage current  
• 175 °C operating junction temperature  
TO-263AB (D2PAK)  
TO-262AA  
• Meets MSL level 1, per J-STD-020, LF maximum  
peak of 260 °C  
Base  
common  
cathode  
Base  
common  
cathode  
• AEC-Q101 qualified  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
2
2
DESCRIPTION / APPLICATIONS  
1
2
3
1
2
3
MUR.. series are the state of the art ultrafast recovery  
rectifiers specifically designed with optimized performance  
of forward voltage drop and ultrafast recovery time.  
The planar structure and the platinum doped life time  
control, guarantee the best overall performance,  
ruggedness and reliability characteristics.  
These devices are intended for use in the output rectification  
stage of SMPS, UPS, DC/DC converters as well as  
freewheeling diode in low voltage inverters and chopper  
motor drives.  
Anode Common Anode  
cathode  
Anode Common Anode  
cathode  
1
2
1
2
VS-MURB1620CTPbF  
VS-MURB1620CT-1PbF  
PRODUCT SUMMARY  
Package  
TO-263AB (D2PAK), TO-262AA  
IF(AV)  
2 x 8 A  
200 V  
VR  
Their extremely optimized stored charge and low recovery  
current minimize the switching losses and reduce over  
dissipation in the switching element and snubbers.  
VF at IF  
trr  
0.895 V  
35 ns  
TJ max.  
Diode variation  
175 °C  
Common cathode  
ABSOLUTE MAXIMUM RATINGS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MAX.  
200  
UNITS  
Peak repetitive reverse voltage  
VRRM  
V
per leg  
total device  
8.0  
Average rectified forward current  
IF(AV)  
Rated VR, TC = 150 °C  
16  
A
Non-repetitive peak surge current per leg  
Peak repetitive forward current per leg  
Operating junction and storage temperatures  
IFSM  
IFM  
100  
Rated VR, square wave, 20 kHz, TC = 150 °C  
16  
TJ, TStg  
-65 to +175  
°C  
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Breakdown voltage,  
blocking voltage  
VBR  
VR  
,
IR = 100 μA  
IF = 8 A  
200  
-
-
V
-
-
-
-
-
-
-
-
0.975  
Forward voltage  
VF  
IR  
IF = 8 A, TJ = 150 °C  
0.895  
VR = VR rated  
-
5
250  
-
Reverse leakage current  
μA  
TJ = 150 °C, VR = VR rated  
VR = 200 V  
-
Junction capacitance  
Series inductance  
CT  
LS  
25  
8.0  
pF  
nH  
Measured lead to lead 5 mm from package body  
-
Revision: 10-Jul-15  
Document Number: 94519  
1
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-MURB1620CTPbF, VS-MURB1620CT-1PbF  
www.vishay.com  
Vishay Semiconductors  
DYNAMIC RECOVERY CHARACTERISTICS (TJ = 25 °C unless otherwise specified)  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
IF = 1.0 A, dIF/dt = 50 A/μs, VR = 30 V  
IF = 0.5 A, IR = 1.0 A, IREC = 0.25 A  
TJ = 25 °C  
MIN.  
TYP.  
MAX.  
UNITS  
-
-
-
-
-
-
-
-
-
35  
25  
-
-
Reverse recovery time  
trr  
ns  
20  
34  
1.7  
4.2  
23  
75  
TJ = 125 °C  
-
IF = 8 A  
dIF/dt = 200 A/μs  
TJ = 25 °C  
-
Peak recovery current  
IRRM  
A
TJ = 125 °C  
-
V
R = 160 V  
TJ = 25 °C  
-
Reverse recovery charge  
Qrr  
nC  
TJ = 125 °C  
-
THERMAL - MECHANICAL SPECIFICATIONS  
PARAMETER  
SYMBOL  
TEST CONDITIONS  
MIN.  
TYP.  
MAX.  
UNITS  
Maximum junction and  
storage temperature range  
TJ, TStg  
-65  
-
175  
°C  
Thermal resistance,   
junction to case per leg  
RthJC  
RthJA  
RthCS  
-
-
-
-
-
3.0  
50  
-
Thermal resistance,   
junction to ambient per leg  
°C/W  
Thermal resistance,   
case to heatsink  
Mounting surface, flat, smooth and  
greased  
0.5  
-
-
2.0  
-
-
g
Weight  
0.07  
oz.  
6.0  
(5.0)  
12  
(10)  
kgf · cm  
(lbf · in)  
Mounting torque  
Marking device  
-
Case style TO-263AB (D2PAK)  
Case style TO-262  
MURB1620CT  
MURB1620CT-1  
Revision: 10-Jul-15  
Document Number: 94519  
2
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-MURB1620CTPbF, VS-MURB1620CT-1PbF  
www.vishay.com  
Vishay Semiconductors  
100  
10  
100  
TJ = 175 °C  
10  
TJ = 150 °C  
TJ = 125 °C  
TJ = 100 °C  
1
TJ = 175 °C  
TJ = 150 °C  
0.1  
0.01  
TJ = 25 °C  
1
TJ = 25 °C  
0.1  
0.001  
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8  
0
50  
100  
150  
200  
250  
VF - Forward Voltage Drop (V)  
VR - Reverse Voltage (V)  
Fig. 1 - Typical Forward Voltage Drop Characteristics  
Fig. 2 - Typical Values of Reverse Current vs.  
Reverse Voltage  
1000  
100  
TJ = 25 °C  
10  
1
10  
100  
1000  
VR - Reverse Voltage (V)  
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage  
10  
1
PDM  
D = 0.50  
D = 0.20  
D = 0.10  
D = 0.05  
D = 0.02  
t1  
t2  
0.1  
Single pulse  
(thermal resistance)  
D = 0.01  
Notes:  
1. Duty factor D = t1/t2  
2. Peak TJ = PDM x ZthJC + TC  
0.01  
0.00001  
0.0001  
0.001  
0.01  
0.1  
1
t1 - Rectangular Pulse Duration (s)  
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics  
Revision: 10-Jul-15  
Document Number: 94519  
3
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-MURB1620CTPbF, VS-MURB1620CT-1PbF  
www.vishay.com  
Vishay Semiconductors  
180  
170  
160  
150  
140  
130  
60  
VR = 160 V  
TJ = 125 °C  
TJ = 25 °C  
IF = 30 A  
IF = 15 A  
IF = 8 A  
50  
40  
30  
20  
10  
DC  
Square wave (D = 0.50)  
Rated VR applied  
See note (1)  
0
3
6
9
12  
100  
1000  
IF(AV) - Average Forward Current (A)  
dIF/dt (A/μs)  
Fig. 7 - Typical Reverse Recovery Time vs. dIF/dt  
Fig. 5 - Maximum Allowable Case Temperature vs.  
Average Forward Current  
10  
8
200  
VR = 160 V  
TJ = 125 °C  
TJ = 25 °C  
160  
120  
80  
40  
0
IF = 30 A  
IF = 15 A  
IF = 8 A  
6
4
2
0
RMS limit  
D = 0.01  
D = 0.02  
D = 0.05  
D = 0.10  
D = 0.20  
D = 0.50  
DC  
0
3
6
9
12  
100  
1000  
IF(AV) - Average Forward Current (A)  
Fig. 6 - Forward Power Loss Characteristics  
dIF/dt (A/μs)  
Fig. 8 - Typical Stored Charge vs. dIF/dt  
Note  
(1)  
Formula used: TC = TJ - (Pd + PdREV) x RthJC;  
Pd = Forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);  
PdREV = Inverse power loss = VR1 x IR (1 - D); IR at VR1 = Rated VR  
Revision: 10-Jul-15  
Document Number: 94519  
4
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-MURB1620CTPbF, VS-MURB1620CT-1PbF  
www.vishay.com  
Vishay Semiconductors  
VR = 200 V  
0.01 Ω  
L = 70 μH  
D.U.T.  
D
dIF/dt  
adjust  
IRFP250  
G
S
Fig. 9 - Reverse Recovery Parameter Test Circuit  
(3)  
trr  
IF  
ta  
tb  
0
(4)  
Qrr  
(2)  
IRRM  
0.5 IRRM  
(5)  
dI(rec)M/dt  
0.75 IRRM  
dIF/dt  
(1)  
(4) Qrr - area under curve defined by trr  
(1) dIF/dt - rate of change of current  
and IRRM  
through zero crossing  
trr x IRRM  
(2) IRRM - peak reverse recovery current  
Qrr  
=
2
(3) trr - reverse recovery time measured  
from zero crossing point of negative  
going IF to point where a line passing  
through 0.75 IRRM and 0.50 IRRM  
extrapolated to zero current.  
(5) dI(rec)M/dt - peak rate of change of  
current during tb portion of trr  
Fig. 10 - Reverse Recovery Waveform and Definitions  
Revision: 10-Jul-15  
Document Number: 94519  
5
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
VS-MURB1620CTPbF, VS-MURB1620CT-1PbF  
www.vishay.com  
Vishay Semiconductors  
ORDERING INFORMATION TABLE  
Device code  
VS- MUR  
B
16  
20  
CT  
-1 TRL  
P
1
2
3
4
5
6
7
8
9
1
2
3
4
5
6
7
-
-
-
-
-
-
-
Vishay Semiconductors product  
Ultrafast MUR series  
B = D2PAK/TO-262  
Current rating (16 = 16 A)  
Voltage rating (20 = 200 V)  
CT = center tap (dual)  
None = D2PAK  
-1 = TO-262  
-
-
8
9
None = tube (50 pieces)  
TRL = tape and reel (left oriented, for D2PAK package)  
TRR = tape and reel (right oriented, for D2PAK package)  
PbF = lead (Pb)-free (for TO-262 and D2PAK tube)  
P = lead (Pb)-free (for D2PAK TRR and TRL)  
LINKS TO RELATED DOCUMENTS  
www.vishay.com/doc?95014  
www.vishay.com/doc?95008  
www.vishay.com/doc?95032  
Dimensions  
Part marking information  
Packaging information  
Revision: 10-Jul-15  
Document Number: 94519  
6
For technical questions within your region: DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  
Outline Dimensions  
Vishay Semiconductors  
D2PAK, TO-262  
DIMENSIONS - D2PAK in millimeters and inches  
Conforms to JEDEC outline D2PAK (SMD-220)  
B
A
Pad layout  
A
(2)(3)  
E
A
(E)  
c2  
110ꢀꢀ  
MIN0  
(ꢀ0ꢁ3)  
(3)  
D
L1  
2
9065  
MIN0  
(ꢀ038)  
(D1) (3)  
Detail A  
1709ꢀ (ꢀ07ꢀ)  
150ꢀꢀ (ꢀ0625)  
H
(2)  
1
3
3081  
MIN0  
L2  
(ꢀ015)  
B
B
2032  
MIN0  
(ꢀ0ꢀ8)  
A
B
206ꢁ (ꢀ01ꢀ3)  
20ꢁ1 (ꢀ0ꢀ96)  
(3)  
E1  
2 x b2  
2 x b  
C
c
View A - A  
ꢀ0ꢀꢀꢁ M  
Base  
Metal  
ꢀ0ꢀ1ꢀ M  
M
B
A
Plating  
(ꢁ)  
b1, b3  
2 x  
e
H
Gauge  
plane  
(ꢁ)  
c1  
(c)  
B
ꢀ° to 8°  
L3  
Seating  
plane  
Lead assignments  
A1  
Lead tip  
(b, b2)  
L
Diodes  
Lꢁ  
Detail “A”  
Rotated 9ꢀ °CW  
Scale: 8:1  
Section B - B and C - C  
Scale: None  
10 - Anode (two die)/open (one die)  
20, ꢁ0 - Cathode  
30 - Anode  
MILLIMETERS  
SYMBOL  
INCHES  
MILLIMETERS  
INCHES  
NOTES  
SYMBOL  
NOTES  
MIN.  
4.06  
0.00  
0.51  
0.51  
1.14  
1.14  
0.38  
0.38  
1.14  
8.51  
MAX.  
4.83  
0.254  
0.99  
0.89  
1.78  
1.73  
0.74  
0.58  
1.65  
9.65  
MIN.  
0.160  
0.000  
0.020  
0.020  
0.045  
0.045  
0.015  
0.015  
0.045  
0.335  
MAX.  
0.190  
0.010  
0.039  
0.035  
0.070  
0.068  
0.029  
0.023  
0.065  
0.380  
MIN.  
6.86  
9.65  
7.90  
MAX.  
8.00  
MIN.  
MAX.  
0.315  
0.420  
0.346  
A
A1  
b
D1  
E
0.270  
0.380  
0.311  
3
2, 3  
3
10.67  
8.80  
E1  
e
b1  
b2  
b3  
c
4
4
4
2
2.54 BSC  
0.100 BSC  
H
14.61  
1.78  
-
15.88  
2.79  
1.65  
1.78  
0.575  
0.070  
-
0.625  
0.110  
0.066  
0.070  
L
L1  
L2  
L3  
L4  
3
c1  
c2  
D
1.27  
0.050  
0.25 BSC  
0.010 BSC  
4.78  
5.28  
0.188  
0.208  
Notes  
(1)  
(7)  
Dimensioning and tolerancing per ASME Y14.5 M-1994  
Dimension D and E do not include mold flash. Mold flash shall  
not exceed 0.127 mm (0.005") per side. These dimensions are  
measured at the outmost extremes of the plastic body  
Thermal pad contour optional within dimension E, L1, D1 and E1  
Dimension b1 and c1 apply to base metal only  
Outline conforms to JEDEC outline TO-263AB  
(2)  
(3)  
(4)  
(5)  
(6)  
Datum A and B to be determined at datum plane H  
Controlling dimension: inch  
Document Number: 95014  
Revision: 31-Mar-09  
For technical questions within your region, please contact one of the following:  
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
www.vishay.com  
1
Outline Dimensions  
Vishay Semiconductors  
D2PAK, TO-262  
DIMENSIONS - TO-262 in millimeters and inches  
Modified JEDEC outline TO-262  
(2) (3)  
E
A
(Datum A)  
B
A
c2  
E
A
(3)  
L1  
D
Seating  
plane  
D1(3)  
1
2
3
C
C
L2  
B
B
L (2)  
A
c
(3)  
E1  
3 x b2  
3 x b  
A1  
Section A - A  
2 x e  
Base  
metal  
(ꢁ)  
b1, b3  
Plating  
c
M
M
B
ꢀ0ꢀ1ꢀ  
A
Lead assignments  
c1  
(ꢁ)  
Diodes  
10 - Anode (two die)/open (one die)  
20, ꢁ0 - Cathode  
30 - Anode  
(b, b2)  
Lead tip  
Section B - B and C - C  
Scale: None  
MILLIMETERS  
INCHES  
SYMBOL  
NOTES  
MIN.  
4.06  
2.03  
0.51  
0.51  
1.14  
1.14  
0.38  
0.38  
1.14  
8.51  
6.86  
9.65  
7.90  
MAX.  
4.83  
3.02  
0.99  
0.89  
1.78  
1.73  
0.74  
0.58  
1.65  
9.65  
8.00  
10.67  
8.80  
MIN.  
0.160  
0.080  
0.020  
0.020  
0.045  
0.045  
0.015  
0.015  
0.045  
0.335  
0.270  
0.380  
0.311  
MAX.  
0.190  
0.119  
0.039  
0.035  
0.070  
0.068  
0.029  
0.023  
0.065  
0.380  
0.315  
0.420  
0.346  
A
A1  
b
b1  
b2  
b3  
c
4
4
4
c1  
c2  
D
2
3
D1  
E
2, 3  
3
E1  
e
2.54 BSC  
0.100 BSC  
L
13.46  
-
14.10  
1.65  
3.71  
0.530  
-
0.555  
0.065  
0.146  
L1  
L2  
3
3.56  
0.140  
Notes  
(1)  
(6)  
Dimensioning and tolerancing as per ASME Y14.5M-1994  
Dimension D and E do not include mold flash. Mold flash shall  
not exceed 0.127 mm (0.005") per side. These dimensions are  
measured at the outmost extremes of the plastic body  
Thermal pad contour optional within dimension E, L1, D1 and E1  
Dimension b1 and c1 apply to base metal only  
Outline conform to JEDEC TO-262 except A1 (maximum), b  
(minimum) and D1 (minimum) where dimensions derived the  
actual package outline  
(2)  
(3)  
(4)  
(5)  
Controlling dimension: inches  
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2
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Document Number: 95014  
Revision: 31-Mar-09  
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Disclaimer  
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE  
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.  
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other  
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statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a  
particular product with the properties described in the product specification is suitable for use in a particular application.  
Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over  
time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s  
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including but not limited to the warranty expressed therein.  
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© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED  
Revision: 08-Feb-17  
Document Number: 91000  
1

相关型号:

VS-MURB1620CTTRLP

Rectifier Diode, 1 Phase, 2 Element, 8A, 200V V(RRM), Silicon, HALOGEN FREE AND ROHS COMPLIANT, D2PAK-3

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VS-MURB1620CTTRLPBF

Rectifier Diode, 1 Phase, 2 Element, 8A, 200V V(RRM), Silicon, TO-263AB, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SMD-220, D2PAK-3/2

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VS-MURB1620CTTRRPBF

Rectifier Diode, 1 Phase, 2 Element, 8A, 200V V(RRM), Silicon, TO-263AB, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, SMD-220, D2PAK-3/2

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VS-MURB2020CT-1HM3

Rectifier Diode, 1 Phase, 2 Element, 10A, 200V V(RRM), Silicon, TO-262AA,

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VS-MURB2020CT-1PbF

Ultrafast Rectifier, 2 x 10 A FRED Pt®

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VS-MURB2020CTHM3

Rectifier Diode, 1 Phase, 2 Element, 10A, 200V V(RRM), Silicon, TO-263AB, D2PAK-3/2

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VS-MURB2020CTLHM3

Low forward voltage drop

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VS-MURB2020CTPBF

Rectifier Diode, 1 Phase, 2 Element, 10A, 200V V(RRM), Silicon, HALOGEN FREE AND ROHS COMPLIANT, D2PAK-3

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VS-MURB2020CTRHM3

Low forward voltage drop

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VS-MURB2020CTTRLP

Ultrafast Rectifier, 2 x 10 A FRED Pt

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VISHAY

VS-MURB2020CTTRLPBF

Rectifier Diode, 1 Phase, 2 Element, 10A, 200V V(RRM), Silicon, HALOGEN FREE AND ROHS COMPLIANT, D2PAK-3

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VS-MURB2020CTTRRP

暂无描述

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