VSMF3710-GS18 [VISHAY]
High Speed Infrared Emitting Diode, 890 nm RoHS Compliant, Released for Lead (Pb)-free Solder Process; 高速红外发光二极管， 890纳米符合RoHS ，发布的铅（Pb ）无铅焊接工艺
| 型号： | VSMF3710-GS18 |
| 厂家： | 
VISHAY |
| 描述： | High Speed Infrared Emitting Diode, 890 nm RoHS Compliant, Released for Lead (Pb)-free Solder Process |
| 文件： | 总8页 (文件大小：142K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
VSMF3710
Vishay Semiconductors
High Speed Infrared Emitting Diode, 890 nm
RoHS Compliant, Released for Lead (Pb)-free Solder Process
Description
VSMF3710 is a high speed infrared emitting diode in
GaAlAs double hetero (DH) technology in a miniature
PLCC-2 SMD package.
DH technology combines high speed with high radiant
power at wavelength of 890 nm.
Features
94 8553
• High radiant power
• High speed: t = 30 ns
r
• High modulation band width: f = 12 MHz
c
e3
• Peak wavelength: λ = 890 nm
Applications
• High speed IR data transmission
p
• High reliability
• Low forward voltage
• High power emitter for low space applications
• Suitable for high pulse current application
• Wide angle of half intensity
• High performance transmissive or reflective
sensors
• Compatible with automatic placement equipment
• EIA and ICE standard package
• 8 mm tape and reel standard: GS08 or GS18
• Lead (Pb)-free reflow soldering
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
Order Instructions
Part
Ordering code
VSMF3710-GS08
VSMF3710-GS18
Remarks
VSMF3710
MOQ: 7500 pcs, 1500 pcs per reel
MOQ: 8000 pcs, 8000 pcs per reel
VSMF3710
Absolute Maximum Ratings
Tamb = 25 °C, unless otherwise specified
Parameter
Reverse voltage
Forward current
Test condition
Symbol
VR
Value
Unit
V
5
100
IF
IFM
IFSM
PV
mA
mA
A
tp/T = 0.5, tp = 100 µs
tp = 100 µs
Peak forward current
Surge forward current
Power dissipation
200
1
170
mW
°C
Tj
Junction temperature
Operating temperature range
Storage temperature range
Soldering temperature
100
Tamb
Tstg
Tsd
- 40 to + 85
- 40 to + 100
260
°C
°C
acc. figure 8, J-STD-020B
°C
Thermal resistance
junction / ambient
RthJA
400
K/W
Document Number 81241
Rev. 1.5, 25-Jan-07
www.vishay.com
1
VSMF3710
Vishay Semiconductors
180
120
100
80
60
40
20
0
160
RthJA = 400 K/W
140
120
100
RthJA = 400 K/W
80
60
40
20
0
0
10 20 30 40 50 60 70 80 90 100
Tamb- Ambient Temperature (°C)
0
10 20 30 40 50 60 70 80 90 100
Tamb- Ambient Temperature (°C)
20140
20141
Figure 1. Power Dissipation Limit vs. Ambient Temperature
Figure 2. Forward Current Limit vs. Ambient Temperature
Basic Characteristics
Tamb = 25 °C, unless otherwise specified
Parameter
Forward voltage
Test condition
Symbol
VF
Min
Typ.
1.4
Max
1.6
Unit
V
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
IF = 100 mA
VF
TKVF
IR
2.3
V
Temp. coefficient of VF
Reverse current
- 2.1
mV/K
µA
VR = 5 V
10
22
VR = 0 V, f = 1 MHz, E = 0
IF = 100 mA, tp = 20 ms
IF = 1 A, tp = 100 µs
IF = 100 mA, tp = 20 ms
IF = 100 mA
Cj
Junction capacitance
Radiant intensity
125
10
pF
Ie
6
mW/sr
mW/sr
mW
%/K
deg
nm
Ie
100
40
φe
Radiant power
Temp. coefficient of φe
Angle of half intensity
Peak wavelength
TKφe
- 0.35
60
ϕ
IF = 100 mA
IF = 100 mA
IF = 100 mA
IF = 100 mA
IF = 100 mA
λp
890
40
Spectral bandwidth
Temp. coefficient of λp
Δλ
TKλp
tr
nm
0.25
30
nm/K
ns
Rise time
tf
Fall time
30
ns
Virtual source size
∅
0.44
mm
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2
Document Number 81241
Rev. 1.5, 25-Jan-07
VSMF3710
Vishay Semiconductors
Typical Characteristics
Tamb = 25 °C, unless otherwise specified
1.25
1.0
10000
Tamb < 60 °C
t p /T = 0.005
0.01
1000
100
0.02
0.05
0.75
0.5
0.25
0
0.2
0.5
DC
0.1
10
1
1000
800
900
100
0.01
0.1
1
10
20082
λ - Wavelength (nm)
tp - Pulse Length (ms)
95 9985
Figure 3. Pulse Forward Current vs. Pulse Duration
Figure 6. Relative Radiant Power vs. Wavelength
0°
10°
20°
1000
100
30°
40°
1.0
0.9
t
t
= 100 µs
/ T = 0.001
50°
60°
p
p
10
1
0.8
70°
0.7
80°
0
1
2
3
4
0.6
0.6 0.4 0.2
0
0.2
0.4
94 8013
18873_1
V
- Forward Voltage (V)
F
Figure 4. Forward Current vs. Forward Voltage
Figure 7. Relative Radiant Intensity vs. Angular Displacement
100
10
tp = 100 µs
1
0.1
1
10
IF - Forward Pulse Current (mA)
100
1000
18874
Figure 5. Radiant Intensity vs. Forward Pulse Current
Document Number 81241
Rev. 1.5, 25-Jan-07
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3
VSMF3710
Vishay Semiconductors
Package Dimensions
Mounting Pad Layout
1.2
area covered with
solder resist
4
1.6 (1.9)
20541_1
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4
Document Number 81241
Rev. 1.5, 25-Jan-07
VSMF3710
Vishay Semiconductors
Solder Profile
Tape and Reel
PLCC-2 components are packed in antistatic blister
tape (DIN IEC (CO) 564) for automatic component
insertion. Cavities of blister tape are covered with
adhesive tape.
300
max. 260 °C
245 °C
255°C
240 °C
217 °C
250
200
150
100
50
max. 30 s
max. 100 s
max. 120 s
Adhesive Tape
max. Ramp Down 6 °C/s
max. Ramp Up 3 °C/s
0
Blister Tape
0
50
100
150
200
250
300
19841
Time (s)
Figure 8. Lead (Pb)-free Reflow Solder Profile acc. J-STD-020B
for Preconditioning acc. to JEDEC, Level 2a
948626-1
Lead Temperature
TTW Soldering (acc. to CECC00802)
94 8670
Component Cavity
300
250
5 s
Figure 10. Blister Tape
second
235 °C...260 °C
first wave
full line: typical
dotted line: process limits
wave
200
150
100
ca. 2 K/s
ca. 200 K/s
100 °C...130 °C
3.5
3.1
2.2
2.0
ca. 5 K/s
2 K/s
forced cooling
50
0
5.75
5.25
0
100
Time (s)
250
50
150
200
4.0
3.6
8.3
7.7
3.6
3.4
Figure 9. Double Wave Solder Profile for Opto Components
1.85
1.65
Drypack
0.25
1.6
1.4
4.1
3.9
4.1
3.9
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a des-
iccant.
2.05
1.95
94 8668
Figure 11. Tape Dimensions in mm for PLCC-2
Floor Life
Floor life (time between soldering and removing from
MBB) must not exceed the time indicated on MBB
label:
Floor Life: 4 weeks
Conditions: T
< 30 °C, RH < 60 %
amb
Moisture Sensitivity Level 2a, acc. to J-STD-020B.
Drying
In case of moisture absorption devices should be
baked before soldering. Conditions see J-STD-020 or
Label. Devices taped on reel dry using recommended
conditions 192 h at 40 °C (+ 5 °C), RH < 5 %.
Document Number 81241
Rev. 1.5, 25-Jan-07
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5
VSMF3710
Vishay Semiconductors
Missing Devices
10.4
A maximum of 0.5 % of the total number of compo-
nents per reel may be missing, exclusively missing
components at the beginning and at the end of the
reel. A maximum of three consecutive components
may be missing, provided this gap is followed by six
consecutive components.
8.4
120°
4.5
3.5
13.00
12.75
2.5
1.5
62.5
60.0
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
14.4 max.
De-reeling direction
321
329
94 8158
Quantity
18857
Figure 14. Dimensions of Reel-GS18
> 160 mm
Cover Tape Removal Force
40 empty
compartments
min. 75 empty
compartments
The removal force lies between 0.1 N and 1.0 N at a
removal speed of 5 mm/s. In order to prevent compo-
nents from popping out of the bliesters, the cover tape
must be pulled off at an angle of 180° with regard to
the feed direction.
Tape leader
Carrier leader
Carrier trailer
Figure 12. Beginning and End of Reel
The tape leader is at least 160 mm and is followed by
a carrier tape leader with at least 40 empty comparte-
ments. The tape leader may include the carrier tape
as long as the cover tape is not connected to the car-
rier tape. The least component is followed by a carrier
tape trailer with a least 75 empty compartements and
sealed with cover tape.
10.0
9.0
120°
4.5
3.5
13.00
12.75
2.5
1.5
63.5
60.5
Identification
Label:
Vishay
Type
Group
Tape Code
Production
Code
14.4 max.
180
178
Quantity
94 8665
Figure 13. Dimensions of Reel-GS08
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6
Document Number 81241
Rev. 1.5, 25-Jan-07
VSMF3710
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 81241
Rev. 1.5, 25-Jan-07
www.vishay.com
7
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000
Revision: 08-Apr-05
www.vishay.com
1
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